氦对铜钨纳米多层膜界面稳定性的影响

采用射频磁控溅射方法,分别在纯Ar和Ar, He混合气氛下制备了多个不同调制周期的Cu/W纳米多层膜. 利用增强质子背散射(EPBS)、扫描电子显微镜(SEM)、X射线衍射(XRD)分别对Cu/W多层膜中He含量、 截面形貌和相结构进行了分析.结果表明:多层膜的界面稳定性是耐氦损伤的前提和保证. 在适当的调制周期下,纳米多层膜能有抑制氦泡成核及长大的能力.     

界面对ZrN/TaN纳米多层膜固氦性能的影响

采用射频磁控溅射方法, 在混合气氛下制备了ZrN/TaN多层膜. 利用X射线衍射、慢正电子束分析、增强质子背散射、扫描电子显微镜, 分别对ZrN/TaN多层膜中相结构、氦相关缺陷、氦含量、截面形貌等进行了分析. 结果表明, 调制周期为30 nm的ZrN/TaN多层膜在600℃退火后, 氦的保持率仍能达到45.6%. 在适当的调制周期下, ZrN/TaN多层膜能够耐氦损伤并且其界面具有一定的固氦性能. 关键词： ZrN/TaN 纳米多层膜 界面 固氦     

纳米结构影响沸腾换热特性的分子动力学模拟

采用分子动力学方法模拟液体在纳米结构表面的快速沸腾过程.主要研究了纳米结构表面粗糙度以及栏栅形和棋盘形两种排列方式对液体快速沸腾过程以及换热特性的影响.研究结果表明,随着纳米结构表面粗糙度的增加,栏栅形和棋盘形纳米结构表面液体沸腾起始时间均提前.当栏栅形和棋盘形纳米结构表面粗糙度相同时,棋盘形纳米结构表面会进一步缩短液体沸腾起始时间.形成这种现象的原因是纳米结构表面粗糙度的增加,增加了固液接触面积,提高了初始时刻热通量,减小了固液界面热阻,导致表面附近液体动能增大,增大了液体高度方向的温度梯度,有利于液体发生沸腾.当纳米结构表面粗糙度相同时,棋盘形纳米结构表面具有较小的界面热阻,从而缩短了沸腾所需要的时间.     

Ag/Ni和Cu/Ni界面的分子动力学模拟

用分子动力学方法对金属界面在弯曲状态下的力学行为做了模拟计算．在自行设计的两种弯曲模型中，首先比较了Ａｇ／Ｎｉ在不形成界面、形成界面（错配比约为１５％）以及Ｃｕ／Ｎｉ形成界面（错配比约为３％）时在动态弯曲过程中的势能－应变曲线，应力－应变曲线，模量－应变曲线，通过比较得出的结论是：界面的存在影响很大，失配位错影响界面的性质，并且错配比不同界面的力学性质亦不相同．同时，对计算元胞的尺寸效应做了详细的讨论，给出了用于计算机模拟中比较适宜的计算元胞的尺寸．最后，利用圆弧弯曲模型将静态平移周期性边界条件应用于动态 关键词：     

界面和择优取向对TiN/ZrN纳米多层膜硬度变化的影响

利用射频反应磁控溅射方法，制备了调制比约为4，调制周期不同的一系列TiN/ZrN纳米多层膜. 利用X射线衍射仪(XRD)、高分辨电子显微镜(HRTEM)和纳米压痕仪(Nanoindentation)对多层膜的调制结构、界面状态和力学性能进行了表征. 研究结果表明TiN/ZrN多层膜具有很好的调制结构，但是在TiN层和ZrN层之间存在一定厚度的界面混合层. 力学性能分析表明：当调制周期小于15 nm时，TiN/ZrN多层膜的硬度介于单一TiN和ZrN薄膜的硬度之间；当调制周期为15.24 nm时，硬度达到最大，但随着调制周期增加，多层膜的硬度基本上保持为常数. 分析了TiN/ZrN多层膜硬度变化的机制，认为界面厚度和择优取向是导致硬度变化的主要原因. 关键词： TiN/ZrN多层膜 界面宽度 择优取向 硬度变化     

Cu50Ni50合金快速凝固的分子动力学模拟

采用分子动力学模拟的方法研究了Cu₅₀Ni₅₀合金在不同冷却速度下的凝固过程,利用均方位移、径向分布函数和结构可视化等方法分析其微观结构.并对凝固模型进行拉伸模拟,通过应力应变曲线和直观结构变化分析其性能.研究表明：冷却速度对Cu₅₀Ni₅₀合金凝固形成的结构有较大影响,随着冷却速度的升高,凝固形成的结构中晶体含量减少,在较低的冷却速度下,如冷却1×10¹²K/s时,Cu₅₀Ni₅₀合金凝固形成晶体结构;在较高的冷却速度下,如1×10¹⁴K/s时,Cu₅₀Ni₅₀合金凝固形成非晶体结构,且非晶Cu₅₀Ni₅₀合金的抗拉性能要优于晶体Cu₅₀Ni₅₀合金.     

考虑相界效应的Ni基单晶合金纳米压痕模拟

利用分子动力学方法分别模拟金刚石压头压入Ni模型和Ni基单晶合金γ/γ′模型的纳米压痕过程,通过计算得到两种模型[001]晶向的弹性模量及硬度.采用中心对称参数分析不同压入深度时两种模型内部位错形核、长大过程以及Ni基单晶合金γ/γ′(001)相界面错配位错对纳米压痕过程的影响.结果显示:压入深度0.641 nm之前,两种模型的压入载荷-压入深度曲线相似,说明此时相界面处的错配位错对纳米压痕过程的影响很小;压入深度0.995 nm时,在错配位错处发生位错形核,晶体在γ相中沿着{111}面滑移,随即导致Ni基单晶合金γ/γ′模型压入载荷的下降,并在压入深度达到1.487 nm之前低于Ni模型相同压入深度时的压入载荷;压入深度从1.307 nm开始,由于相界面错配位错的阻碍作用,Ni基单晶合金γ/γ′模型压入载荷上升速度较快.     

AlN/NbN纳米结构多层膜的共格异结构外延生长研究

采用射频磁控溅射法制备了NbN,AlN单层膜及不同调制周期的AlN/NbN纳米结构多层膜,采用X射线衍射仪、小角度X射线反射仪和高分辨透射电子显微镜等对薄膜进行了表征.结果表明：单层膜AlN为六方结构,NbN为面心立方结构;AlN/NbN多层膜中AlN为六方结构,NbN为面心立方结构,界面处呈共格状态,其共格关系为c-NbN（111）面平行于h-AlN（0002）面,晶格错配度为013%.热力学计算表明:AlN/NbN多层膜中不论AlN层与NbN层的厚度如何,AlN层均不会形成亚稳的立方AlN,而是形成 关键词： AlN/NbN纳米结构多层膜 共格外延生长 异结构     

Fe/Si多层膜的层间耦合与界面扩散

对以本征Si及重掺杂ｐ型和ｎ型Si作为中间层的Fe/Si多层膜的层间耦合进行研究，并通过退火，增大Fe，Si之间的扩散，分析界面扩散对层间耦合的影响. 实验结果表明，层状结构良好的制备态的多层膜，Fe，Si之间也存在一定程度的扩散，它是影响层间耦合的 主要因素，远远超过了半导体意义上的重掺杂，使不同种类的Si作为中间层的层间耦合基本 一致.进一步还发现，在一定范围内增大Fe，Si之间的扩散，即使多层膜的层状结构已经有了相当的退化，Fe/Si多层膜的反铁磁耦合强度基本保持不变. 关键词： Fe/Si多层膜 层间耦合 界面扩散     

溅射压强对TiN/SiNx纳米多层膜微观结构及力学性能的影响

利用磁控溅射方法在不同溅射压强条件下制备了TiN/SiN_x纳米多层膜.多层膜的微观结构及力学性能分别用X射线衍射仪、原子力显微镜及纳米压痕仪来表征.结果表明随着溅射压强的增大,多层膜的界面变模糊,TiN层的择优取向由(200)晶面过渡到(111)晶面.与此同时,多层膜的表面粗糙度增大,硬度和弹性模量随溅射压强的增大而减小.多层膜力学性能的差异主要是由于薄膜的周期性结构及致密度存在差异所致. 关键词： x多层膜')" href="#">TiN/SiN_x多层膜 界面宽度 表面形貌     

Molecular dynamics study of plastic deformation mechanism in Cu/Ag multilayers

The plastic deformation mechanism of Cu/Ag multilayers is investigated by molecular dynamics(MD) simulation in a nanoindentation process. The result shows that due to the interface barrier, the dislocations pile-up at the interface and then the plastic deformation of the Ag matrix occurs due to the nucleation and emission of dislocations from the interface and the dislocation propagation through the interface. In addition, it is found that the incipient plastic deformation of Cu/Ag multilayers is postponed, compared with that of bulk single-crystal Cu. The plastic deformation of Cu/Ag multilayers is affected by the lattice mismatch more than by the difference in stacking fault energy(SFE) between Cu and Ag. The dislocation pile-up at the interface is determined by the obstruction of the mismatch dislocation network and the attraction of the image force. Furthermore, this work provides a basis for further understanding and tailoring metal multilayers with good mechanical properties, which may facilitate the design and development of multilayer materials with low cost production strategies.     

Synthesis and magnetic properties of multilayer Ni/Cu and NiFe/Cu nanowires

Highly ordered composite nanowires with multilayer Ni/Cu and NiFe/Cu have been fabricated by pulsed electrodeposition into nanoporous alumina membrane. The diameter of wires can be easily varied by pore size of alumina, ranging from 30 to 100 nm. The applied potential and the duration of each potential square pulse determine the thickness of the metal layers. The nanowires have been characterized by transmission electron microscopy (TEM), magnetic force microscopy (MFM), and vibrating sample magnetometer (VSM) measurements. The MFM images indicate that every ferromagnetic layer separated by Cu layer was present as single isolated domain-like magnet. This technique has potential use in the measurement and application of magnetic nanodevices.     

Molecular dynamics study of the mechanical characteristics of Ni/Cu bilayer using nanoindentation

<正>In the present work,a three-dimensional molecular dynamics simulation is carried out to perform the nanoindentation experiment on Ni single crystal.The substrate indenter system is modeled using hybrid interatomic potentials including the many-body potential embedded atom method(EAM),and two-body morse potential.To simulate the indentation process,a spherical indenter(diameter = 80 A,1 A=0.1 nm) is chosen.The results show that the mechanical behaviour of a monolithic Ni is not affected by crystalline orientation.To elucidate the effect of a heterogeneous interface, three bilayer interface systems are constructed,namely Ni(100)/Cu(111),Ni(110)/Cu(111),and Ni(111)/Cu(111).The simulations along these systems clearly describe that mechanical behaviour directly depends on the lattice mismatch. The interface with the smaller mismatch between the specified crystal planes is proved to be harder and vice versa.To describe the relationship between film thickness and interface effect,we choose various values of film thickness ranging from 20 A to 50 A to perform the nanoindentation experiment.It is observed that the interface is significant only for the relatively small thickness of film and the separation between interface and the indenter tip.It is shown that with the increase in film thickness,the mechanical behaviour of the film shifts more toward that of monolithic material.     

The chemical composition of a metal/ceramic interface on an atomic scale: The Cu/MgO {111} interface

The chemical composition profile across a Cu/MgO {111}-type heterophase interface, produced by the internal oxidation of a Cu(Mg) single-phase alloy at 1173 K, is measured via atom-probe field-ion microscopy with a spatial resolution of 0.121 nm; this resolution is equal to the interplanar spacing of the {222} MgO planes. In particular, we demonstrate directly that the bonding across a Cu/MgO {111}-type heterophase interface, along a <111> direction common to both the Cu matrix and an MgO precipitate, has the sequence Cu|O|Mg... and not Cu|Mg|O...; this result is achieved without any deconvolution of the experimental data. Before determining this chemical sequence, it was established, via high-resolution electron microscopy, that the morphology of an MgO precipitate in a Cu matrix is an octahedron faceted on {111} planes with a cube-on-cube relationship between a precipitate and the matrix; that is, {111}_Cu//{222}_MgO and <110>_Cu // <110>_MgO.     

石墨烯/铝基复合材料在纳米压痕过程中位错与石墨烯相互作用机制的模拟研究

石墨烯因其优异的力学性能已成为增强金属基复合材料的理想增强体.然而,目前对石墨烯/金属基复合材料在纳米压痕过程中嵌入石墨烯与位错之间的相互作用仍不清晰.本文采用分子动力学模拟方法,对90°,45°和0°位向的石墨烯/铝基复合材料进行了纳米压痕模拟,研究了压痕加载和卸载过程中石墨烯/铝基复合材料的位错形核及演化,以获取不同位向的石墨烯与位错的相互作用机制,并分析其对塑性区的影响.研究发现,石墨烯可以有效阻碍位错运动,并且石墨烯会沿着位错滑移方向发生弹性变形.在纳米压痕过程中,位错与不同位向石墨烯之间的相互作用差异导致塑性区的变化趋势不同.研究结果表明,在石墨烯/铝基复合材料中,位向不同的石墨烯对位错阻碍强度和方式不同,且石墨烯位向为45°的复合材料的硬度高于其他模型.此外,石墨烯/铝基复合材料的位错线总长度的演化规律与石墨烯位向紧密相关.本文研究可为设计和制备高性能石墨烯/金属基复合材料提供一定的理论指导.     

A simulation study of rapid solidification and crystal configuration of Cu_(70)Ni_(30) alloy

1 Introduction It is well known that the performances of metal materials are mainly determined by their special microcosmic configuration formed in the concreting processes. For under- standing the relationship between the configuration and performance, it is very impor- tant both in theory and practice to find out the form and transition feature of microcos- mic configuration by tracking the concreting processes of liquid metals. Cu-Ni alloy is a completely solid solution or a single-phase al…     

Effect of interface structure on deformation behavior of crystalline Cu/amorphous CuZr sandwich structures

The effect of interface types (namely, sharp interface and graded interface) and its thickness on the deformation behavior of crystalline/amorphous/crystalline sandwich structures (CACSSs) under tensile loading are studied using molecular dynamics simulation. Compared with the CACSSs with sharp interface, the CACSSs with gradient interface consistently exhibit good plasticity when the interface thickness is larger than 6 nm, due to the coupling effects among crystalline layer, amorphous layer and crystalline–amorphous interface. With the increase of interface thickness, the plastic deformation mechanism of CACSSs with gradient interface changes from the local plastic deformation in amorphous layer to the homogeneous plastic deformation.     

Influence of Ni on Cu precipitation in Fe Cu Ni ternary alloy by an atomic study

The early aging Cu precipitations in Fe-3%Cu and Fe-3%Cu-4%Ni ternary alloys are investigated by molecular dynamics （MD） simulations. The results show that the average size of Cu clusters in Fe-3%Cu-4%Ni alloy is larger than that in Fe-3%Cu alloy. The diffusion of Cu is accelerated by Ni according to the mean square displacement （MSD）. Furthermore, the whole formation process of Cu-rich clusters is analyzed in detail, and it is found that the presence of Ni promotes small Cu-rich clusters to be combined into big ones. Ni atoms prefer to stay at the combination positions of small clusters energetically due to a large number of the first nearest neighbor Cu-Ni interactions, which is verified by first-principles calculations based on density functional theory （DFT）.     

Raman analysis of bilayer graphene film prepared on commercial Cu(0.5 at% Ni) foil

This study reports the Raman analysis of bilayer graphene films prepared on commercial dilute Cu(0.5 at% Ni) foils using atmospheric pressure chemical vapor deposition. A bilayer graphene film obtained on Cu foil is known to have small areas of bilayer (islands) with a significant fraction of non‐Bernal stacking, while that obtained on Cu/Ni is known to grow over a large area with Bernal stacking. In the Raman optical microscope images, a wafer‐scale monolayer and large‐area bilayer graphene films were distinguished and confirmed with Raman spectra intensities ratios of 2D to G peaks. The large‐area part of bilayer graphene film obtained was assisted by Ni surface segregation because Ni has higher methane decomposition rate and carbon solubility compared with Cu. The Raman data suggest a Bernal stacking order in the prepared bilayer graphene film. A four‐point probe sheet resistance of graphene films confirmed a bilayer graphene film sheet resistance distinguished from that of monolayer graphene. A relatively higher Ni surface concentration in Cu(0.5 at% Ni) foil was confirmed with time‐of‐flight secondary ion mass spectrometry. The inhomogeneous distribution of Ni in a foil and the diverse crystallographic surface of a foil (confirmed with proton‐induced X‐ray emission and electron backscatter diffraction, respectively) could be a reason for incomplete wafer‐scale bilayer graphene film. The Ni surface segregation in dilute Cu(0.5 at% Ni) foil has a potential to impact on atmospheric pressure chemical vapor deposition growth of large‐area bilayer graphene film. Copyright © 2015 John Wiley & Sons, Ltd.