Laser cutting of holes in thick sheet metals: Development of stress field

Laser cutting of hole in a mild steel thick sheet metal is investigated. Temperature and stress fields developed around the cutting section are simulated using the finite element method. An experimental is carried out accommodating the simulation parameters. The residual stress developed in the cutting section is measured using the XRD technique and findings are compared with the predictions. Optical microscopy and SEM are carried out to examine the morphological changes in the cutting sections. It is found that temperature decays sharply in the region of the laser heat source, which results in high temperature gradient in this region. This causes the development of high stress levels around the cut edges. The residual stresses predicted are in agreement with the measured results.     

Laser cutting of sharp edge: Thermal stress analysis

Laser cutting of sharp edge and thermal stress development in the cutting section is examined. The finite element method is used to predict temperature and stress fields while the X-ray diffraction (XRD) technique is used to measure the residual stress around the cut edges. A mild steel sheet with 5 mm thickness is used in the simulations and the experiment. The morphological and metallurgical changes around the edges are examined using the optical microscopy and scanning electron microscopy (SEM). It is found that temperature remains high at the sharp edge when the laser beam is located in this region. This, in turn, lowers the cooling rate and reduces von Mises stress in this region. The magnitude of the residual stress is about 90 MPa at the sharp corner while the maximum von Mises stress is in the order of 280 MPa, which occurs away from sharp corner. In addition, the residual stress predicted agrees with the experimental data.     

Laser hole cutting into bronze: Thermal stress analysis

Laser hole cutting in bronze is carried out and the thermal stress formed in the cutting section is examined using a finite element code. The cut geometry and microstructural changes in the cutting section are examined using optical microscope, scanning electron microscope (SEM), and energy dispersive spectroscopy (EDS). It is found that the high conductivity of bronze increases the cooling rates within the cutting section, which influences the thermal stress field in the cutting region. The residual stress predicted is in the order of 200 MPa within the vicinity of the hole circumference. The striation pattern at the kerf surface changes towards the hole exit, which is associated with the drag forces developed in this region.     

Laser cutting of steel and thermal stress development

In laser cutting of sheet metals, thermal stresses are developed in the region of the cutting section. Depending on the cutting conditions and substrate material properties, the thermal stress levels can attain high values. In the present study, thermal stress developed in the region of the laser cut edges is modeled and temperature as well as stress fields are predicted. Temperature predictions are validated through the experimental results. It was found that the temporal variation of the maximum temperature along y-axis follows the laser heating source. However, temporal variation of von-Mises stress deviates slightly from the temporal variation of temperature along the cutting direction. Increase in scanning speed enhances the von-Mises stress levels due to the attainment of high temperature gradients in the substrate material.     

Laser cutting of rectangular geometry into aluminum alloy: Effect of cut sizes on thermal stress field

Laser cutting of a rectangular geometry into aluminum alloy 2024 is carried out. Temperature and stress fields are predicted in the cutting section using the ABAQUS finite element code in line with the experimental conditions. Effect of the size of the rectangular geometry on the thermal stress fields is examined in the cutting section. Temperature predictions are validated through the thermocouple data. To identify the morphological changes in the cutting section, an experiment is carried out and the resulting cutting sections are examined under optical and scanning electron microscopes. It is found that temperature and stress fields are affected by the size of the rectangular cut geometry. Temperature and von Mises stress attains higher values for small size rectangular geometry as compared to its counterpart corresponding to the large size geometry. Laser cut sections are free from large size asperities including sideways burning and out-off flatness at the cut edges. Locally scattered some small dross attachments are observed at the kerf exit.     

AFM针尖纳米切削晶向和切削方向影响的分子动力学

"建立了AFM针尖切削单晶铜的三维分子动力学模型,研究了工件材料不同晶向和刀具切削方向对切削过程中工件材料变形的影响．采用EAM势计算工件原子之间的作用,采用Morse势计算刀具原子之间的作用．模拟结果表明工件材料晶向和切削方向对纳米切削过程有显著影响．沿[110]方向切削比[100]方向切削产生的切屑结合更紧密,切削工件材料(110)晶向比切削工件材料(100)晶向产生的切屑体积更小,工件材料变形区域更小．研究了工件材料晶向和切削方向组合的不同纳米切削过程中系统势能变化情况．"     

Laser cutting of rectangular geometry into alumina tiles

Laser cutting of rectangular geometry into the 5 mm thick alumina tiles is carried out. Temperature and stress fields, which are developed during the cutting process, are simulated in line with the experimental conditions. The morphological changes in the cutting sections are examined using optical and electron scanning microscopes, energy dispersive spectroscopy, and X-ray diffraction technique. The predictions of surface temperature and the residual stress are validated through the experimental data. It is found that von Mises stress attains high values in the region of the mid-thickness of the workpiece. The laser cut sections are free from major cracks and large scale sideways burning. The predictions of surface temperature and residual stress agree well with their counterparts obtained from the experiment.     

Laser cutting of Kevlar laminates and thermal stress formed at cutting sections

Laser cutting of Kevlar laminates is carried out and thermal stress field developed in the cutting region is predicted using the finite element code. Temperature predictions are validated through the thermocouple data. The morphological changes in the cutting section are examined by incorporating optical and scanning electron microscopes. It is found that temperature predictions agree well with the thermocouple data. High values of von Mises stress are observed at the cutting edges and at the mid-thickness of the Kevlar laminate due to thermal compression formed in this region. The laser cut edges are free from whiskers; however, striation formation and some small sideways burning is observed at the kerf edges.     

基于XRD的镀锌钝化膜残余应力试验研究

利用XRD技术测试了镀锌钝化膜结合界面的残余应力，同时通过电解抛光法检测了其厚度方向残余应力的分布规律，分析了残余应力对镀锌钝化膜结合强度的影响. 试验结果表明，镀锌钝化膜的残余应力均表现为压应力，并随着基体表面残余应力的增大而减小；钝化膜在2—10μm厚度方向的残应力为-274.5—-428.3MPa，其应力为梯度分布；镀锌钝化膜与基体的界面结合强度与其残余应力成反比，减小薄膜残余应力，有利于提高镀锌钝化膜与基体的结合强度. 关键词： X射线衍射法(XRD) 镀锌钝化膜 结合强度 残余应力     

碳化硅反射镜坯体光学加工的残余应力测量与分析

测量并分析了碳化硅反射镜坯体光学加工的残余应力。采用X射线衍射法测定了磨削成形、研磨以及抛光过程引入的表面残余应力的性质和大小;采用逐层抛光法测定了在用120#粒度金刚石砂轮磨削时引入的残余应力层厚度。研究结果表明:在用120#金刚石砂轮磨削加工时沿磨削方向和垂直于磨削方向分别引入了残余拉应力和残余压应力,其大小分别为40MPa和70MPa,应力层深度约为60μm,大于裂纹层深度;在用W7金刚石微粉研磨时引入了残余压应力,在其作用范围内残余应力平均值为60～80MPa;在抛光时理论上会引入残余压应力。在此基础上提出了在碳化硅反射镜坯体的光学加工过程中,可以通过研磨消除磨削引入的裂纹层和残余应力层。     

Laser welding of low carbon steel and thermal stress analysis

Laser welding of mild steel sheets is carried out under nitrogen assisting gas ambient. Temperature and stress fields are computed in the welding region through the finite element method. The residual stress developed in the welding region is measured using the XRD technique and the results are compared with the predictions. Optical microscopy and the SEM are used for the metallurgical examination of the welding sites. It is found that von Mises stress attains high values in the cooling cycle after the solidification of the molten regions. The residual stress predicted agreed well with the XRD results.     

HPHT preparation and Micro-Raman characterization of polycrystalline diamond compact with low residual stress

High quality grown polycrystalline diamond compact (PDC) with low residual stress was prepared using the infiltration method with nickel based alloys as the solvent under high temperature and high pressure (HPHT). Scanning electron microscopy (SEM) was used to observe the micro morphology of the diamond layer and the diamond/WC substrate interface. It was found that dense and interlaced microstructure with diamond-diamond (D-D) direct bonding formed in the diamond layer of PDC. Micro-Raman spectroscopy was used to measure the Raman shift of diamonds in the polycrystalline diamond (PCD) layer and the residual stress was calculated based on the Raman shift of diamonds. Experimental results show that the residual stress of PCD layer is compressive stress, and the range of the residual stress is from 0.075 to 0.250 GPa in the whole PCD layer, much lower than that of other reports (up to 1.400 GPa). Moreover, the distribution of the residual stress from the diamond surface layer to the inner cross-section is homogeneous.     

残余应力的超声横纵波检测方法

基于声弹性原理,研究板材厚度方向、螺栓轴向方向(以下简称z轴方向)宏观残余应力分布的超声无损检测方法。针对被测构件厚度不均匀对应力检测精度的影响非常大、检测原理繁杂不适合工程应用、拉伸实验中拉伸形变对应力系数测量精度的影响很大等问题,采取超声横波、纵波相结合的方法重新推导检测公式,并提出采用一发一收模式进行拉伸实验,通过对实验数据进行拟合,由公式计算出声弹性系数代替应力系数。然后结合插值、互相关等算法,采用VC++编制z轴方向残余应力超声检测软件并搭建检测系统。分别对性能为A2-70,4.8,8.8,长度依次为135 mm,100 mm,100mm的M20的螺栓进行拉伸实验,比对计算拉伸应力与检测拉伸应力,结果表明,该测量系统的绝对误差限为20 MPa,相对误差小于25%,且应力值较大时,相对误差有所减小,当应力值大于100 MPa时,相对误差小于5%,非常实用。     

Regenerative vibration avoidance due to tool tangential dynamics in interrupted turning operations

Linear stability models are often used to predict regenerative vibrations in turning representing continuous operations, simple cutting geometries with constant coefficients and/or dominant modes acting in the feed direction. However, turning of components with interrupted features, such as turbine cases, may lead to large tool overhangs with vibration motions in the cutting speed direction and tool cut-off periods that result in the latter approaches being insufficient. This paper proposes a stability model for chatter in interrupted turning when the dominant vibration is orthogonal to the chip section plane. The method requires the calculation of a dynamic displacement factor that depends on the tool vibration frequency. The simulations of the model are supported by experimental tests for different contact fractions.     

基于飞秒激光的光纤切割加工工艺研究

为了得到理想的光纤切割断面,利用飞秒激光对石英光纤材料进行切割微加工实验。研究激光功率、脉冲频率、扫描速度等加工参数与光纤切割断面质量间的关系,以寻求最理想的加工参数。最后在可调倾角光纤夹具的辅助下,很好地弥补加工过程中产生的端面倾斜角,得到垂直度高达89.56°的光纤切割断面。     

Molecular Dynamics Study of Mechanical Behaviour of Screw Dislocation during Cutting with Diamond Tip on Silicon

By means of Tersoff and Morse potentials, a three-dimensional molecular dynamics simulation is performed to study atomic force microscopy cutting on silicon monocrystal surface. The interatomic forces between the workpiece and the pin tool and the atoms of workpiece themselves are calculated. A screw dislocation is introduced into workpiece Si. It is found that motion of dislocations does not occur during the atomic force microscopy cutting processing. Simulation results show that the shear stress acting on dislocation is far below the yield strength of Si.     

Theoretical and experimental investigations on rotary ultrasonic surface micro-machining of brittle materials

Many brittle materials, such as single-crystal materials, amorphous materials, and ceramics, are widely used in many industries such as the energy industry, aerospace industry, and biomedical industry. In recent years, there is an increasing demand for high-precision micro-machining of these brittle materials to produce precision functional parts. Traditional ultra-precision micro-machining can lead to workpiece cracking, low machined surface quality, and reduced tool life. To reduce and further solve these problems, a new micro-machining process is needed. As one of the nontraditional machining processes, rotary ultrasonic machining is an effective method to reduce the issues generated by traditional machining processes of brittle materials. Therefore, rotary ultrasonic micro-machining (RUμM) is investigated to conduct the surface micro-machining of brittle materials. Due to the small diameter cutting tool (<500 μm) and high accuracy requirements, the impact of input parameters in the rotary ultrasonic surface micro-machining (RUSμM) process on tool deformation and cutting quality is extremely different from that in rotary ultrasonic surface machining (RUSM) with relatively large diameter cutting tool (∼10 mm). Up till now, there is still no investigation on the effects of ultrasonic vibration (UV) and input variables (such as tool rotation speed and depth of cut) on cutting force and machined surface quality in RUSμM of brittle materials. To fill this knowledge gap, rotary ultrasonic surface micro-machining of the silicon wafer (one of the most versatile brittle materials) was conducted in this study. The effects of ultrasonic vibration, tool rotation speed, and depth of cut on tool trajectory, material removal rate (MRR), cutting force, cutting surface quality, and residual stress were investigated. Results show that the ultrasonic vibration could reduce the cutting force, improve the cutting surface quality, and suppress the residual compressive stress, especially under conditions with high tool rotation speed.     

Microstructure and residual stress of laser rapid formed Inconel 718 nickel-base superalloy

The microstructure and residual stress of laser rapid formed (LRFed) nickel-base superalloy Inconel 718 was investigated. The as-deposited microstructure of an LRFed Inconel 718 alloy is composed of columnar dendrites growing epitaxially along the deposition direction, and the columnar dendrites transformed to unevenly distributed equiaxed grains after annealing treatment at high temperature. Residual stress evaluation in microstructure scale by Vickers micro-indentation method indicates that the residual thermal stress is unevenly distributed in the LRFed sample, and it has a significant effect on the recrystallization during solution annealing treatment. The residual stress is introduced by rapid heating and cooling during laser rapid forming. There is an alternative distribution between high residual stress regions and low residual stress regions, within a single deposited layer, resulting in a similar distribution of recrystallized grain size.     

温度和应变速率耦合作用下纳米晶Ni压缩行为研究

本文利用低温力学测试系统研究了电化学沉积纳米晶Ni在不同温度和宽应变速率条件下的压缩行为. 借助应变速率敏感指数、激活体积、扫描电子显微镜及高分辨透射电子显微镜方法, 对纳米晶Ni的压缩塑性变形机理进行了表征. 研究表明, 在较低温度条件下, 纳米晶Ni的塑性变形主要是由晶界位错协调变形主导, 晶界本征位错引出后无阻碍的在晶粒内无位错区运动, 直至在相对晶界发生类似切割林位错行为. 并且, 在协调塑性变形时引出位错的残留位错能够增加应变相容性和减小应力集中; 在室温条件下, 纳米晶Ni的塑性变形机理主要是晶界-位错协调变形与晶粒滑移/旋转共同主导. 利用晶界位错协调变形机理和残留位错运动与温度及缺陷的相关性揭示了纳米晶Ni在不同温度、不同应变速率条件下力学压缩性能差异的内在原因.     

Synthesis surface effects on the stress and deformation of film/substrate system

The closed-form solutions of bending curvature and stress distribution in film/substrate system with the synthesis surface effect are proposed by minimizing the total potential energy. Effects of the roughness and the residual surface stress on stress in film are addressed. Results reveal that, at a given thickness of the substrate, effects of roughness and residual surface stress on the bending curvature become significant with decreasing the film thickness. The roughing surface will enlarge the magnitudes of bending curvature and film stress. The direction change of residual surface stresses can lead to a reversed bending of film/substrate system.