界面态电荷对6H碳化硅N沟MOSFET阈值电压和跨导的影响

针对界面态密度在禁带中的不均匀分布,并且考虑到碳化硅材料中杂质的不完全离化,分析了界面态电荷对N沟6H碳化硅MOSFET阈值电压和跨导的影响.结果显示界面态密度的不均匀分布不仅使阈值电压增大,而且还会导致器件跨导变低,它是影响SiCMOSFET特性的一个重要因素 关键词： 碳化硅 界面态 阈值电压 跨导     

SiC/SiO_2界面粗糙散射对沟道迁移率影响的Monte Carlo研究

提出了一种SiC反型层表面粗糙散射的指数模型 ,并对 6H SiC反型层迁移率进行了单电子的MonteCarlo模拟 ,模拟中考虑了沟道区的量子化效应 .模拟结果表明 ,采用表面粗糙散射的指数模型能够使SiC反型层迁移率的模拟结果和实验值符合得更好 .模拟结果还反映出有效横向电场较高时表面粗糙散射的作用会变得更显著 ,电子的屏蔽效应降低了粗糙散射对沟道迁移率的影响 ,温度升高会引起沟道迁移率降低 .     

应变Si/Si1-xGex n型金属氧化物半导体场效应晶体管反型层中的电子迁移率模型

为了描述生长在弛豫Si_1-xGe_x层上应变Si n型金属氧化物半导体场效应晶体管(nMOSFETs)反型层中电子迁移率的增强机理,提出了一种新型的、基于物理的电子迁移率模型.该模型不仅能够反映声学声子散射迁移率、表面粗糙度散射迁移率与垂直于半导体-绝缘体界面的电场强度之间的依赖关系,而且也能解释不同的锗组分对两种散射机理的抑制情况从而引起电子迁移率增强的机理.该模型数学表达式简单,可以模拟任意锗组分下的迁移率.通过数值分析验证得出,该 关键词： 应变Si/SiGe 电子迁移率 反型层 模型     

SiC/SiO2界面粗糙散射对沟道迁移率影响的Monte Carlo研究

提出了一种SiC反型层表面粗糙散射的指数模型,并对6H-SiC反型层迁移率进行了单电子的Monte Carlo模拟,模拟中考虑了沟道区的量子化效应.模拟结果表明,采用表面粗糙散射的指数模型能够使SiC反型层迁移率的模拟结果和实验值符合得更好.模拟结果还反映出有效横向电场较高时表面粗糙散射的作用会变得更显著,电子的屏蔽效应降低了粗糙散射对沟道迁移率的影响,温度升高会引起沟道迁移率降低. 关键词： 6H-SiC 反型层迁移率 表面粗糙散射 指数模型     

CuPc LB膜与InP接触界面电荷态对Raman光谱的影响

报道Ｃｕｐｃ／ＩｎＰ异质结的整流（Ｊ－Ｖ）特性和电容电压（Ｃ－Ｖ）特性，并研究了界面态对ＣｕＰｃＬＢ膜Ｒａｍａｎ光谱的影响。 关键词：     

表面态对碳化硅功率金-半场效应管特性的影响

分析了4H-SiC射频功率MESFET栅源和栅漏区域内的表面态形成,建立了包含表面态影响的非线性解析模型,理论描述了对器件输出特性的稳态、瞬态响应.本模型具有计算简单、物理概念清晰的特点.     

6H-SiC肖特基源漏MOSFET的模拟仿真研究

给出了一种新型SiC MOSFET——6H-SiC肖特基源漏MOSFET.这种器件结构制备工艺简单，避 免了长期困扰常规SiC MOSFET的离子注入工艺难度大、退火温度高、晶格损伤大，注入激活 率低等问题.分析了该器件的电流输运机理，并通过MEDICI模拟，给出了SiC肖特基源漏MOSF ET伏安特性以及其和金属功函数、栅氧化层厚度和栅长关系. 关键词： 碳化硅 肖特基接触 MOSFET 势垒高度     

化合物半导体-绝缘体界面的界面态(续)

 三、界面态连续体的动态响应和分布多年来的大量研究结果表明把界面态处理为局域在半导体界面平面处的经典理论完全不能够解释化合物半导体-绝缘体界面的行为特点,从而使人们逐渐认识到界面态的空间分布特征.图3为半导体界面的能带结构示意图.在实际的I-S界面上,界面态是在绝缘体-半导体界面附近,在能量上和空间上的连续分布体(如图中点所示). 这里以n型半导体为例,通过绝缘体中的界面态对电子的捕获和发射过程说明界面态动态响应的特点.由于势垒△Ec的存在,空间分布的界面态与电子的作用只能依介量子力学的隧道效应得以进行.     

高电荷态氙离子辐照下的6H碳化硅表面纳米结构变形（英）

高电荷态离子比普通的离子携带较高的势能,势能在材料表面的瞬间释放,能在材料表面形成nm量级的结构损伤。它在纳米刻蚀、小型纳米器件、纳米材料、超小尺寸半导体芯片制作、固体表面处理和固体结构分析等领域具有广泛应用前景。因此对高电荷态重离子（Xeq+）引起半导体材料表面（6H-SiC）纳米结构变形进行了研究。采用Xe18+和Xe26+离子,选取从11014到51015 ionscm-2逐渐递增的剂量,以垂直和倾斜60角两种入射方式辐照6H-SiC薄膜样品, 经原子力显微镜分析表明,辐照后的表面肿胀凸起。对于Xe18+离子辐照的样品,辐照区至未辐照区边界的台阶高度随离子剂量增加而连续增大,而对于Xe26+离子辐照的样品则先增加而后减小。在相同入射角和剂量条件下,Xe26+离子辐照样品形成的台阶高度大于Xe18+离子辐照形成的台阶高度,在相同离子和剂量的条件下,垂直照射时形成的台阶高度大于倾斜照射时形成的台阶高度。根据损伤机理和实验数据,首次初步建立了一个包括势能、电荷态、入射角和剂量等物理量的理论模型来预测高电荷态离子在半导体材料表面形成的纳米结构变形。暗示了高电荷态离子的潜在的应用价值及进一步研究的必要性。     

最小二乘拟合计算有机薄膜晶体管迁移率的研究

本文通过制备了一个基于并五笨为有源层的顶栅底接触OTFT器件获取电流电压实验数据,并运用电流电压特性曲线理论拟合计算方法计算其场效应迁移率.研究发现,采用不同的拟合方法得到的场效应迁移率值有较大的差异.若选取转移特性曲线线性区距中心1/2范围内测试点进行最小二乘拟合计算出的场效应迁移率能减少采用其他拟合方法的固有不准确性,而且与其他方法得到的场效应迁移率最接近. 关键词： 最小二乘拟合 场效应迁移率 有机薄膜晶体管     

Design consideration and fabrication of 1.2-kV 4H-SiC trenched-and-implanted vertical junction field-effect transistors

We present the design consideration and fabrication of 4H-SiC trenched-and-implanted vertical junction field-effect transistors （TI-VJFETs）. Different design factors, including channel width, channel doping, and mesa height, are con- sidered and evaluated by numerical simulations. Based on the simulation result, normally-on and normally-off devices are fabricated. The fabricated device has a 12 μm thick drift layer with 8 × 10^15 cm^-3 N-type doping and 2.6 μm channel length. The normally-on device shows a 1.2 kV blocking capability with a minimum on-state resistance of 2.33 mΩ.cm2, while the normally-off device shows an on-state resistance of 3.85 mΩ.cm2. Both the on-state and the blocking performances of the device are close to the state-of-the-art values in this voltage range.     

Fabrication and characterization of the normally-off N-channel lateral 4H–SiC metal–oxide–semiconductor field-effect transistors

In this paper, the normally-off N-channel lateral 4H–Si C metal–oxide–semiconductor field-effect transistors(MOSFFETs) have been fabricated and characterized. A sandwich-(nitridation–oxidation–nitridation) type process was used to grow the gate dielectric film to obtain high channel mobility. The interface properties of 4H–Si C/SiO_2 were examined by the measurement of HF I–V, G–V, and C–V over a range of frequencies. The ideal C–V curve with little hysteresis and the frequency dispersion were observed. As a result, the interface state density near the conduction band edge of 4H–Si C was reduced to 2 × 10~(11) e V~(-1)·cm~(-2), the breakdown field of the grown oxides was about 9.8 MV/cm, the median peak fieldeffect mobility is about 32.5 cm~2·V~(-1)·s~(-1), and the maximum peak field-effect mobility of 38 cm~2·V~(-1)·s~(-1) was achieved in fabricated lateral 4H–Si C MOSFFETs.     

Thickness dependence of surface morphology and charge carrier mobility in organic field-effect transistors

With the aim of understanding the relationships between organic small molecule field-effect transistors (FETs) and organic conjugated polymer FETs, we investigate the thickness dependence of surface morphology and charge carrier mobility in pentacene and regioregular poly (3-hexylthiophene) (RR-P3HT) field-effect transistors. On the basis of the results of surface morphologies and electrical properties, we presume that the charge carrier mobility is largely related to the morphology of the organic active layer. We observe that the change trends of the surface morphologies (average size and average roughness) of pentacene and RR-P3HT thin films are mutually opposite, as the thickness of the organic layer increases. Further, we demonstrate that the change trends of the field-effect mobilities of pentacene and RR-P3HT FETs are also opposite to each other, as the thickness of the organic layer increases within its limit.     

改进型异质栅对深亚微米栅长碳化硅MESFET特性影响

基于器件物理分析方法,结合高场迁移率、肖特基栅势垒降低、势垒隧穿等物理模型, 分析了改进型异质栅结构对深亚微米栅长碳化硅肖特基栅场效应晶体管沟道电势、 夹断电压以及栅下电场分布的影响.通过与传统栅结构器件特性的对比表明, 异质栅结构在碳化硅肖特基栅场效应晶体管的沟道电势中引入了多阶梯分布,加强了近源端电场; 另一方面,相比于双栅器件,改进型异质栅器件沟道最大电势的位置远离源端, 因此载流子在沟道中加速更快,在一定程度上屏蔽了漏压引起的电势变化,更好抑制了短沟道效应. 此外,研究了不同结构参数的异质栅对短沟道器件特性的影响,获得了优化的设计方案, 减小了器件的亚阈值倾斜因子.为发挥碳化硅器件在大功率应用中的优势,设计了非对称异质栅结构, 改善了栅电极边缘的电场分布,提高了小栅长器件的耐压.     

Effects of gate-buffer combined with a p-type spacer structure on silicon carbide metal-semiconductor field-effect transistors

An improved structure of silicon carbide metal-semiconductor field-effect transistors (MESFET) is proposed for high power microwave applications. Numerical models for the physical and electrical mechanisms of the device are presented, and the static and dynamic electrical performances are analysed. By comparison with the conventional structure, the proposed structure exhibits a superior frequency response while possessing better DC characteristics. A p-type spacer layer, inserted between the oxide and the channel, is shown to suppress the surface trap effect and improve the distribution of the electric field at the gate edge. Meanwhile, a lightly doped n-type buffer layer under the gate reduces depletion in the channel, resulting in an increase in the output current and a reduction in the gate-capacitance. The structural parameter dependences of the device performance are discussed, and an optimized design is obtained. The results show that the maximum saturation current density of 325 mA/mm is yielded, compared with 182 mA/mm for conventional MESFETs under the condition that the breakdown voltage of the proposed MESFET is larger than that of the conventional MESFET, leading to an increase of 79% in the output power density. In addition, improvements of 27% cut-off frequency and 28% maximum oscillation frequency are achieved compared with a conventional MESFET, respectively.     

Effects of gate-buffer combined with a p-type spacer structure on silicon carbide metalben semiconductor field-effect transistors

An improved structure of silicon carbide metal-semiconductor field-effect transistors (MESFET) is proposed for high power microwave applications. Numerical models for the physical and electrical mechanisms of the device are presented, and the static and dynamic electrical performances are analysed. By comparison with the conventional structure, the proposed structure exhibits a superior frequency response while possessing better DC characteristics. A p-type spacer layer, inserted between the oxide and the channel, is shown to suppress the surface trap effect and improve the distribution of the electric field at the gate edge. Meanwhile, a lightly doped n-type buffer layer under the gate reduces depletion in the channel, resulting in an increase in the output current and a reduction in the gate-capacitance. The structural parameter dependences of the device performance are discussed, and an optimized design is obtained. The results show that the maximum saturation current density of 325 mA/mm is yielded, compared with 182 mA/mm for conventional MESFETs under the condition that the breakdown voltage of the proposed MESFET is larger than that of the conventional MESFET, leading to an increase of 79% in the output power density. In addition, improvements of 27% cut-off frequency and 28% maximum oscillation frequency are achieved compared with a conventional MESFET, respectively.     

Vacuum relaxation and annealing-induced enhancement of mobility of regioregular poly（3-hexylthiophene） field-effect transistors

In order to enhance the performance of regioregular poly(3-hexylthiophene) (RR-P3HT) field-effect transistors (FETs), RR-P3HT FETs are prepared by the spin-coating method followed by vacuum placement and annealing. This paper reports that the crystal structure, the molecule interconnection, the surface morphology, and the charge carrier mobility of RR-P3HT films are affected by vacuum relaxation and annealing. The results reveal that the field-effect mobility of RR-P3HT FETs can reach 4.17×10^ - 2~m²/(V.s) by vacuum relaxation at room temperature due to an enhanced local self-organization. Furthermore, it reports that an appropriate annealing temperature can facilitate the crystal structure, the orientation and the interconnection of polymer molecules. These results show that the field-effect mobility of device annealed at 150~℃ for 10 minutes in vacuum at atmosphere and followed by placement for 20 hours in vacuum at room temperature is enhanced dramatically to 9.00×10^ - 2 ~cm²/(V.s).