1.55-/spl mu/m spot-size converter integrated laser diode with conventional buried-heterostructure laser process

A 1.55-/spl mu/m spot-size converter integrated laser diode is demonstrated with conventional buried-heterostructure laser process. For the spot-size converter, we employed a double-waveguide structure in which a ridge-based passive waveguide was incorporated. The passive waveguide was optically combined with a laterally tapered active waveguide to control mode size. The threshold current was measured to be 5 mA together with high slope efficiency of 0.45 W/A. The beam divergence angles in the horizontal and vertical directions were as small as 9.0/spl deg/ and 7.8/spl deg/, respectively.     

RF noise in 0.18-/spl mu/m and 0.13-/spl mu/m MOSFETs

Studied the gate finger number and gate length dependence on minimum noise figure (NF/sub min/) in deep submicrometer MOSFETs. A lowest NF/sub min/ of 0.93 dB is measured in 0.18-/spl mu/m MOSFET at 5.8 GHz as increasing finger number to 50 fingers, but increases abnormally when above 50. The scaling gate length to 0.13 /spl mu/m shows larger NFmin than the 0.18-/spl mu/m case at the same finger number. From the analysis of a well-calibrated device model, the abnormal finger number dependence is due to the combined effect of reducing gate resistance and increasing substrate loss as increasing finger number. The scaling to 0.13-/spl mu/m MOSFET gives higher NF/sub min/ due to the higher gate resistance and a modified T-gate structure proposed to optimize the NF/sub min/ for further scaling down of the MOSFET.     

An embedded 0.8 V/480 /spl mu/W 6b/22 MHz flash ADC in 0.13-/spl mu/m digital CMOS process using a nonlinear double interpolation technique

For high-data-rate wireless communication, low-voltage baseband converters integrated with DSP in deep submicrometer processes are area- and power-efficient. Through careful architecture selections and circuit techniques, this paper demonstrates a low-voltage (0.8 V), low-power (480 /spl mu/W), 6-b/22-MHz flash-interpolation ADC which occupies 0.3 mm/sup 2/ and achieves 33 dB SNDR and 47 dB SFDR. The power efficiency of this converter is 0.6 pJ/conv-step which compares favorably with all published results. We also introduce a nonlinear double interpolation technique that enables the use of a 0.13-/spl mu/m standard digital CMOS process without special resistors.     

A CMOS V-I converter with 75-dB SFDR and 360-/spl mu/W power consumption

This work describes a method for analysis of voltage-to-current converters (V-I converters or transconductors) and a novel V- I converter circuit with significantly improved linearity. The new circuit utilizes a combination of cross-coupling and local resistive feedback for a significant, simultaneous suppression of the third- and fifth-order harmonic distortion components in the transconductor characteristics. An evaluation of the optimal circuit dimensioning is shown. Simple and robust design rules are derived for the chosen operation conditions. The transistor implementation is presented and a prototype V- I converter is realized in a digital 0.18-/spl mu/m CMOS technology. The measured spurious-free dynamic range is 75 dB in a frequency band of 10 MHz. The circuit occupies less than 0.02 mm/sup 2/ and dissipates 360 /spl mu/W.     

An analog-to-digital converter with Golomb-Rice output codes

An analog-to-digital converter with data compression capabilities is described. By sharing circuits between an integrating converter and a Golomb-Rice encoder it is possible to jointly perform the tasks of quantization and coding. The Golomb-Rice codes are generated during the conversion cycle by employing a shift register and a digital multiplexer. The final codeword is read out serially from the shift register. The converter can also work in a noncompressing mode. This design provides a compact circuit suitable for on-sensor compression. Simulations at the system and transistor level corroborate the validity of the design.     

An analog GFSK modulator in 0.35-/spl mu/m CMOS

An analog Gaussian frequency shift keying (GFSK) modulator designed in 0.35-/spl mu/m CMOS consumes 600 /spl mu/A from a 3-V supply and realizes an analog implementation of the FM differential equation. The modulator operates at baseband and is intended for use in a direct-conversion Bluetooth transmitter. It achieves a frequency deviation of 160 kHz with better than /spl plusmn/3% accuracy. The modulator implements an amplitude control loop to achieve a well-defined output swing. The total output harmonic distortion is less than 1%.     

A low-power 12-b analog-to-digital converter with on-chip precisiontrimming

The design and performance of a 12-b charge redistribution analog-to-digital converter (ADC) is described. The architecture is chosen to minimize power dissipation. Die area is minimized by a modified self-calibration algorithm and nonvolatile memory based on polysilicon fuses. The ADC is fabricated in a 1-μm CMOS process. It converts at a 200-kHz rate with a power dissipation of 10 mW     

0.18-/spl mu/m nondestructive readout FeRAM using charge compensation technique

A nondestructive readout (NDRO) FeRAM using a 0.18-/spl mu/m CMOS technology has been developed. Readout voltages across the ferroelectric lower than the coercive voltage allowed the FeRAM to achieve high read endurance exceeding required performance for system LSIs, 10/sup 16/ read cycles. The NDRO approach uses a newly developed charge compensation technique to correct the process variations in threshold voltage of neighboring readout transistors, leading to a wide NDRO operation margin over a supply voltage range from 1.1 to 1.8 V.     

Bidirectional, subcarrier-multiplexed transmission using 1.3-/spl mu/m Fabry-Perot lasers

We demonstrate a full-duplex, subcarrier-multiplexed, transmission system which employs 1.3-/spl mu/m Fabry-Perot strained layer MQW laser diode transmitters in both directions. Coherent effects are reduced by using lasers with different mode spacing.     

Single transverse-mode filtering utilizing ion implantation: application to 1.48-/spl mu/m unstable-cavity lasers

We demonstrate the relevance of ion implantation of the multiple quantum-well active layer in unstable-cavity lasers as a means of efficiently filtering the parasitic higher order waves by introducing additional propagation loss within the cavity. Several H/sup +/ implantation schemes are proposed and a comparison is successfully made of experiment to a beam propagation method (BPM) model on the basis of modal behavior. The work finally resulted in improved single transverse-mode behavior of those lasers: more than 1.3 W CW of diffraction-limited power at 1.48 /spl mu/m was then obtained utilizing a two-step implantation process.     

A 300 V//spl mu/s monolithic voltage follower

An open-loop, JFET input, high-speed buffer, designed without feedback, is described. Careful biasing of source and emitter followers ensures accurate unity gain and gain linearity with 10 mA of load current. A unique quasi-quad input FET layout provides excellent matching and thermal gradient cancellation and simultaneously optimizes speed performance. Offset voltage is permanently adjusted at wafer test by Zener-zap trimming. The output is capable of driving large capacitive loads with 70 mA of peak current.     

A sub-10-ns 16/spl times/16 multiplier using 0.6-/spl mu/m CMOS technology

A 16/spl times/16-b parallel multiplier fabricated in a 0.6-/spl mu/m CMOS technology is described. The chip uses a modified array scheme incorporated with a Booth's algorithm to reduce the number of adding stages of partial products. The combination of scaled 0.6-/spl mu/m CMOS technology and advanced arithmetic architecture achieves a multiplication time of 7.4 ns while dissipating only 400 mW. This multiplication time is shorter than other MOS high-speed multipliers previously reported and is comparable to those for advanced bipolar and GaAs multipliers.     

Double-stub structure for resonant-type optical modulators using 20-/spl mu/m-thick electrode

We propose a resonant-type LiNbO/sub 3/ optical modulator with low halfwave voltage. We optimize the phase constant of the electric wave with thick electrodes to reduce the halfwave voltage. The halfwave voltage of the fabricated modulator with 20-/spl mu/m-thick electrodes is 5.8 V at 10.6 GHz.     

Low-noise metamorphic HEMTs with reflowed 0.1-/spl mu/m T-gate

A 0.1-/spl mu/m T-gate fabricated using e-beam lithography and thermally reflow process was developed and applied to the manufacture of the low-noise metamorphic high electron-mobility transistors (MHEMTs). The T-gate developed using the thermally reflowed e-beam resist technique had a gate length of 0.1 /spl mu/m and compatible with the MHEMT fabrication process. The MHEMT manufactured demonstrates a cutoff frequency f/sub T/ of 154 GHz and a maximum frequency f/sub max/ of 300 GHz. The noise figure for the 160 /spl mu/m gate-width device is less than 1 dB and the associated gain is up to 14 dB at 18 GHz. This is the first report of a 0.1 /spl mu/m MHEMT device manufactured using the reflowed e-beam resist process for T-gate formation.     

A 4-/spl mu/a quiescent-current dual-mode digitally controlled buck converter IC for cellular phone applications

This paper describes a dual-mode digitally controlled buck converter IC for cellular phone applications. An architecture employing internal power management is introduced to ensure voltage compatibility between a single-cell lithium-ion battery voltage and a low-voltage integrated circuit technology. Special purpose analog and digital interface elements are developed. These include a ring-oscillator-based A/D converter (ring-ADC), which is nearly entirely synthesizable, is robust against switching noise, and has flexible resolution control, and a very low power ring-oscillator-multiplexer-based digital pulse-width modulation (PWM) generation module (ring-MUX DPWM). The chip, which includes an output power stage rated for 400 mA, occupies an active area 2 mm/sup 2/ in 0.25-/spl mu/m CMOS. Very high efficiencies are achieved over a load range of 0.1-400 mA. Measured quiescent current in PFM mode is 4 /spl mu/A.     

A third-order /spl Sigma//spl Delta/ modulator in 0.18-/spl mu/m CMOS with calibrated mixed-mode integrators

This paper describes a third-order sigma-delta (/spl Sigma//spl Delta/) modulator that is designed and implemented in 0.18-/spl mu/m CMOS process. In order to increase the dynamic range, this modulator takes advantage of mixed-mode integrators that consist of analog and digital integrators. A calibration technique is applied to the digital integrator to mitigate mismatch between analog and digital paths. It is shown that the presented modulator architecture can achieve a 12-dB better dynamic range than conventional structures with the same oversampling ratio (OSR). The experimental prototype chip achieves a 76-dB dynamic range for a 200-kHz signal bandwidth and a 55-dB dynamic range for a 5-MHz signal bandwidth. It dissipates 4 mW from 1.8-V supply voltages and occupies 0.7-mm/sup 2/ silicon area.     

A cost-efficient high-speed 12-bit pipeline ADC in 0.18-/spl mu/m digital CMOS

A 12-bit pipeline ADC fabricated in a 0.18-/spl mu/m pure digital CMOS technology is presented. Its nominal conversion rate is 110 MS/s and the nominal supply voltage is 1.8 V. The effective number of bits is 10.4 when a 10-MHz input signal with 2V/sub P-P/ signal swing is applied. The occupied silicon area is 0.86 mm/sup 2/ and the power consumption equals 97 mW. A switched capacitor bias current generator scales the opamp bias currents automatically with the conversion rate, which gives scaleable power consumption and full performance of the ADC from 20 to 140 MS/s.     

1.65 /spl mu/m-band optical amplification with Er/sup 3+/-doped fluorozirconate fibre using 0.8 /spl mu/m upconversion pumping

In order to expand the available bandwidth for wavelength division multiplexing transmission systems, a 1.65 /spl mu/m-band optical fibre amplifier with Er/sup 3+/-doped fluorozirconate fibre using 0.8 /spl mu/m upconversion pumping has been demonstrated. The positive gain, 3.8 dB, is the first ever achieved by means of (/sup 2/H/sub 11/2/, /sup 4/S/sub 3/2/) /spl rarr/ /sup 4/I/sub 9/2/ stimulated emission transition.     

An enhanced fully scaled 1.2-/spl mu/m CMOS process for analog

An n-well CMOS technology has been developed for high-speed/precision 10-V analog operation while retaining VLSI packaging densities and performance. Several enhancements to a fully scaled 1.2-/spl mu/m CMOS process were made to attain performance levels necessary for state-of-the-art data-conversion applications. The technology incorporates components essential for analog circuit design such as high-gain/low-noise n-p-n BJTs, laser trimmable Cr-Si resistors, and extremely accurate interpoly oxide capacitors. Inclusion of an optimized LDD structure on n-channel transistors has permitted 10-V CMOS capabilities down to 2.5-/spl mu/m drawn gate lengths.     

A 1-/spl mu/m Bipolar VLSI Technology

A 1-/spl mu/m VLSI process technology has been developed for the fabrication of bipolar circuits. The process employs electron-beam slicing writing, plasma processing, ion implantation, and low-temperature oxidation/annealing to fabricate bipolar device structures with a minimum feature size of 0.9 /spl mu/m. Both nonisolated I/sup 2/L and isolated Schottky transistor logic (STL) devices and circuits have been fabricated with this process technology. The primary demonstration vehicle is a seated LSI, I/sup 2/L, 4-bit processor chip (SBP0400) with a minimum feature size of 1 /spl mu/m. Scaled SPB0400's have been fabricated that operate at clock speeds 3X higher than their full-size counterparts at 50-mA chip current. Average propagation delay has been measured as a function of minimum feature size for both I/sup 2/L and STL device designs. Power-delay products of 14 fJ for I/sup 2/L and 30 fJ for STL have been measured.