Dewetting of polymer films by ion implantation

We report dewetting of thermodynamically stable, thick (∼ 100 nm) polystyrene films by titanium ion implantation. The dynamic dewetting patterns in time evolution are recorded. The dewetting mechanism is determined to be heterogeneous nucleation, where the defects and Ti nanoparticles formed by ion implantation serve as the nuclei. In addition, we observe abundant rims with regular polygonal shapes in dewetting patterns. This is attributed to fingering instability, which results from the balance between the driving force arisen from thermally induced surface tension gradient and the resistive forces from the combination of friction force, Laplace pressure and long-range van der Waals interactions. Finally, a model based on mass conservation is used to qualitatively describe the transition from circular to polygonal shaped rims at a critical diameter for holes.     

Femtosecond laser processing of indium-tin-oxide thin films

Micro- and nano-scale crystalline indium-tin-oxide (c-ITO) patterns fabricated from amorphous ITO (a-ITO) thin films on a glass substrate using a (low NA 0.26) femtosecond laser pulse that is not tightly focused are demonstrated. Different types of c-ITO patterns are obtained by controlling the laser pulse energies and pulse repetition rate of a femtosecond laser beam at a wavelength of 1064 nm: periodic micro c-ITO dots with diameters of ~1.4 μm, two parallel c-ITO patterns with/without periodic-like glass nanostructures at a laser scanning path and nano-scale c-ITO line patterns with a line width ~900 nm, i.e. ~1/8 of the focused beam׳s diameter (7 μm at 1/e²).     

Study of range distribution parameters for bismuth-ion implantation in silver gallium diselenide

Range distributions for bismuth ions implanted in AgGaSe₂ in the energy range 80–300 keV were investigated by using 2.1-MeV He²⁺ Rutherford backscattering spectrometry (RBS). A convolution calculation method was used to extract the true distributions of bismuth from the measured RBS spectra. The range distribution parameters, R_p and ΔR_p, were obtained and compared with those obtained from Monte Carlo simulation. The experimental R_p values agree with the Monte Carlo simulation values very well, but the experimental ΔR_p values are systematically larger than those from the theoretical simulation. Received: 28 January 2002 / Accepted: 11 April 2002 / Published online: 10 September 2002 RID="*" ID="*"Corresponding author. Fax: +86-531/856-5167, E-mail: xdliu@sdu.edu.cn     

Spatial distribution profiles of defects in cadmium-mercury-tellurium after ion implantation

Defect spatial distributions are investigated after implantation of ions in Cd_xHg_1−xTe under various sets of conditions (radiation dose, type and energy of ions, ion current density, and dose absorption rate). Distribution profiles of electrically active radiation-induced defects are calculated with allowance for the generation of defect complexes of vacancion nature. Defect profiles are determined in experiments after implantation of hydrogen and iron ions at constant low ion current densities, and after implantation of copper, tungsten, and aluminum ions in the case of pulsed bombardment at high ion current densities. Secondary-ion mass spectrometry, electron-positron annihilation, Rutherford backscattering of ions, and differential Hall measurements are used to obtain distribution profiles of interstitial ions, vacancion and extended defects, and electrically active defects, respectively. The profiles of these defects are analyzed for various ion-implantation conditions. V. D. Kuznetsov Siberian Physicotechnical Institute at Tomsk State University Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 1, pp. 101–116, January, 1998.     

Unidirectional expansion of lattice parameters in GaN induced by ion implantation

This paper reports that the 150-keV Mn ions are implanted into GaN thin film grown on Al2O3 by metal-organic chemical vapour deposition.The X-ray diffraction reciprocal spacing mapping is applied to study the lattice parameter variation upon implantation and post-annealing.After implantation,a significant expansion is observed in the perpendicular direction.The lattice strain in perpendicular direction strongly depends on ion fluence and implantation geometry and can be partially relaxed by post-annealing.While in the parallel direction,the lattice parameter approximately keeps the same as the unimplanted GaN,which is independent of ion fluence,implantation geometry and post-annealing temperature.     

Modeling of the impurity distribution obtained by ion implantation

Models and a suite of programs (TRION, PIRSON, CHAPS, and DYCOD) that make it possible to calculate the impurity distribution for any implantation dose in a target with arbitrary composition are described. Test calculations for each program showed that the results are in good agreement with experimental data and with theoretical calculations performed by other authors. The suite of programs is intended for the development of the physical principals of ion-beam technologies.Translated from Izvstiya Vysshykh Uchebnykh Zavedenii, Fizika, No. 5, pp. 8–22, May, 1994.     

Structure and composition of silicon carbide films synthesized by ion implantation

The mathematical decomposition of the IR absorption spectrum obtained from a Si layer after the C⁺ ion implantation with an energy of 10 or 40 keV or from a homogeneous SiC_0.7 film has demonstrated that fractions of weak elongated Si-C bonds in the amorphous phase, strong shortened Si-C bonds on the surface of small nanocrystals, and tetrahedral Si-C bonds in the crystalline phase (degree of crystallinity) after high-temperature annealing (1250–1400°C) of the layers are equal to 29/29/42, 22/7/71, and 21/31/48%, respectively. A system of SiC_2.0, SiO₂, SiC_0.8, and SiC_0.6 layers in the film on the Si substrate has been identified using X-ray reflectometry and the simulation with the Release software. The reflectometry data on fluctuations of the intensity of X-ray reflections in the region of the main maximum have been interpreted in terms of variations in the density over the depth of the layer with a Gaussian distribution of carbon atoms from 2.55 and 2.90 g/cm³ for the SiC_0.25 and SiC_0.65 layers, respectively, to 3.29 g/cm³ for the SiC_1.36 layer.     

An optical bridge reflectometer for sensitive measurement of ion implantation dose

An instrument is described that can be used to monitor, with unprecedented sensitivity, changes in the optical reflectivity due to crystailine damage incurred during ion implantation. It is shown that at the shot-noise limit, changes in the optical reflectivity of silicon as small as 5·10^–7 can be measured in a 10 Hz bandwidth with a signal-to-noise ratio of 100, corresponding to an extrapolated uniform implantation dose of 5·10⁸ cm^–2 for ¹¹B⁺ at 50 keV in silicon.     

Hole capture in SiO2 films after ion implantation

Thermal oxides were implanted with common dopants (As, P) and inert elements (Ar). After different post-implantation annealing treatments the hole trapping in the samples was characterized by means of avalanche injection. Hole capture is reduced by anneal in an oxidizing ambient, but less for As and P than for Ar samples. It is shown that defect centers are produced by chemical interaction between network formers and the damaged oxide structure and in addition by recoil damage.     

SIMS investigation of gettering centres produced by phosphorus MeV ion implantation

The ion implantation is a well-known standard procedure in electronic device technology for precise and controlled introduction of dopants into silicon. Damages caused by implantation act as effective gettering zones, collecting unwanted metal impurities. In this work, the consequences of high-energy ion implantation into silicon and of subsequently annealing were analysed by means of secondary ion mass spectrometry (SIMS). The differences in impurities gettering behaviour were studied in dependence of the implantation dose and annealing time at T = 900 °C.     

Modification of the magnetic properties of polyimide films by cobalt ion implantation

The magnetic characteristics of polyimide films implanted with Co⁺ ions with an energy of 40 keV in the dose range D = 2.50 × 10¹⁶?1.25 × 10¹⁷ cm^?2 at ion current densities j = 4, 8, and 12 μA/cm² have been investigated. It has been shown that, at implantation doses of less than 5 × 10¹⁶ cm^?2, the superparamagnetic properties of modified samples are described by the Langevin equation. At higher doses, there is an intercluster interaction. It has been found that, with an increase in the ion current, the cluster size decreases. The sizes of the formed clusters are determined and vary in the range from 3.9 to 11.0 nm, depending on the implantation dose.     

离子辐照对聚苯乙烯低温导电特性的影响

室温下用3MeV的硅离子对聚苯乙烯(PS)进行辐照,对辐照后的样品在室温至液氮温度范围的导电特性进行了测量.结果表明,当辐照剂量在1×1012cm-2附近,PS的室温电阻发生突变.随着温度的降低,PS电阻增大,在低辐照剂量下,电阻在155K附近急剧增加.对于高辐射剂量样品,在较高的温度下呈现热激活导电,在低温下电子通过隧穿传导.分析认为,PS电阻随温度的变化是由于不同剂量辐照离子在聚合物中形成的对电子传导有贡献的导电中心密度不同.通过拟合样品的渗流临界特性,分析了样品电阻随辐照剂量的变化 关键词： 聚苯乙烯 硅离子辐照 低温导电     

Experimental investigation of discharge characteristics in enhanced glow discharge plasma immersion ion implantation

In enhanced glow discharge plasma immersion ion implantation (EGD-PIII) that involves a small pointed anode and large area tabular cathode, the high negative substrate bias not only acts as the plasma producer but also supplies the implantation voltage. Consequently, an electric field is created to focus the electrons and the electron focusing field in turn enhances the glow discharge process. In this work, the discharge characteristics of EGD-PIII are investigated experimentally. The discharge initiation and extinction characteristics during pulsed biasing are discussed. The duration of the post pulse-off plasma is explained from the viewpoint of particle motion and experimentally verified by employing an auxiliary disk. Our experiments show that a dual-pulse method may be utilized to determine the remnant plasma.     

等离子体源离子注入过程中半圆形碗状样品的两维温度分布

等离子体源离子注入过程(PSII)中样品温度是一个非常重要的参量。由于注入到样品上的能量很大，导致样品温度很高，所以在实验中获知样品的温度分布有着很重要的意义。本文利用热传导方程建立了半圆形碗状样品内部温度升高模型，研究样品内温度演化过程。以注入离子束流作为能量输入项，热辐射为能量损失项，并考虑了热辐射过程中样品的形状因子的影响。考察了离子注入过程中样品上所施加负偏压的脉冲宽度和频率对样品温度分布的影响。研究结果显示，脉冲频率达到一定值后，样品温度不再随频率增加而升高。     

Zn离子注入和退火对ZnO薄膜光学性能的影响

 利用溶胶凝胶方法在石英玻璃衬底上制备了ZnO薄膜，将能量56 keV、剂量1×10¹⁷ cm^-2的Zn离子注入到薄膜中。离子注入后，薄膜在500~900 ℃的氩气中退火，利用X射线衍射谱、光致发光谱和光吸收谱研究了离子注入和退火对ZnO薄膜结构和光学性质的影响。结果显示：衍射峰在约700 ℃退火后得到恢复；当退火温度小于600 ℃时，吸收边随着退火温度的提高发生蓝移，超过600 ℃时，吸收边随着退火温度的提高发生红移；近带边激子发光和深能级缺陷发光都随退火温度的提高而增强。     

The study of ion mixed amorphous carbon films on single crystal silicon by C ion implantation

Amorphous-carbon (a-C) films were deposited on a single-crystal silicon substrate by vacuum vapor deposition system and these amorphous carbon films were implanted with 110 keV C⁺ at fluences of 1 × 10¹⁷ ions/cm². The effect of ion mixing on the surface morphology, friction behavior and adhesion strengths of amorphous carbon films was examined making use of atomic force microscopy (AFM), ball-on-disk reciprocating friction tester, nano-indentation system and scanning electron microscope (SEM). The changes in chemical composition and structure were investigated by using X-ray photoelectron spectroscopy (XPS). The results show that the anti-wear life and adhesion of amorphous carbon films on the Si substrates were significantly increased by C ion implantation. The SiC chemical bonding across the interface plays a key role in the increase of adhesion strength and the anti-wear life of amorphous carbon film. The friction and wear mechanisms of amorphous carbon film under dry friction condition were also discussed.     

离子注入掺杂锐钛矿TiO2薄膜的光学性能

 在玻璃基体上,采用射频磁控溅射方法在不同的基体温度下制备了TiO₂薄膜,然后在薄膜中注入注量分别为5×1016, 1×1017和5×1017/cm2的N离子以制备N掺杂的TiO₂薄膜。X射线衍射结果表明：制备出的TiO₂薄膜为锐钛矿型。X射线光电子能谱研究结果表明：注入的N离子与TiO₂晶粒相互作用,形成了含氮的TiO_xN_2-x化合物,从而改变了TiO₂薄膜的吸收边;随N离子注量增加,吸收边移动更明显;同时,由于氮离子注入产生的辐照缺陷使TiO₂薄膜在紫外和可见光区的吸收也明显增强。     

Spatial distribution of defects produced by boron ion implantation of silicon

A simple technique for the study of the spatial distribution of the damage produced by ion implantation of silicon has been developed. The damage depth distribution for 40 keV boron ions in silicon has been studied at irradiation doses from 7 × 10¹¹ to 3.9 × 10¹⁴ ions/cm² and the relative defect peak depth R _d/R _p = 0.85 determined. An increase of layer conductivity as the surface part of the implanted layer is removed has been revealed. This effect is caused by the presence of radiation defects in the surface region of the layer. The “electrical” cluster diameter is about 28 A and the overlapping cluster dose is close to 1 × 10¹³ ions/cm².     

Structural modifications of AlInN/GaN thin films by neon ion implantation

To study ion beam induced modifications into MOCVD grown wurtzite AlInN layers, neon ions were implanted on the samples with four doses ranging from 10¹⁴ to 9×10¹⁵ ions/cm²$9\times {10}^{15}\text{ions}/{\text{cm}}^2$. Structural characterization was carried out by X-ray diffraction and Rutherford backscattering spectroscopy (RBS) techniques. XRD analysis revealed that GaN related peak for all samples remains at its usual Bragg position of 2θ=34.56°$2\theta =34.56\mathrm{°}$ whereas a shift in AlInN peak takes place from its position of 2θ=35.51°$2\theta =35.51\mathrm{°}$ for as-grown sample. Rutherford back scattering (RBS) analysis indicated that peak related to Ga atoms in capping layer provided evidence of partial sputtering of GaN cap layers. Moreover, Al peak position is shifted towards lower channel side and width of the signal is increased after implantation, which pointed to the inwards migration of Al atoms away from the AlInN surface. The results suggested that partial sputtering of cap layer has taken place without uncovering the underneath AlInN layer.     

Effects of high-dose Ge ion implantation and post-implantation annealing on ZnO thin films

This paper reports that ion implantation to a dose of 1×10¹⁷ ions/cm² was performed on c-axis-orientated ZnO thin films deposited on (0001) sapphire substrates by the sol-gel technique. After ion implantation, the as-implanted ZnO films were annealed in argon ambient at different temperatures from 600-900℃. The effects of ion implantation and post-implantation annealing on the structural and optical properties of the ZnO films were investigated by x-ray diffraction (XRD), photoluminescence (PL). It was found that the intensities of (002) peak and near band edge (NBE) exitonic ultraviolet emission increased with increasing annealing temperature from 600-900℃. The defect related deep level emission (DLE) firstly increased with increasing annealing temperature from 600- 750℃, and then decreased quickly with increasing annealing temperature. The recovery of the intensities of NBE and DLE occurs at \sim 850℃ and \sim 750℃ respectively. The relative PL intensity ratio of NBE to DLE showed that the quality of ZnO films increased continuously with increasing annealing temperature from 600 - 900℃.