Time-temperature-transformation analysis of an acrylic-amino resin system

The curing behaviour of a thermosetting acrylic-amino-formaldehyde resin matrix has been investigated by rheological, thermogravimetric, and thermomechanical analysis. The time-temperature-transformation (TTT) diagram of the solventless resin matrix has been constructed. The gelation curve could be fitted with a power-function of T _gel=118.14·t _gel ^-01238. With the help of this function the conditions for gelation can be calculated, and storability of the matrix can be predicted. The onset temperature of thermooxydative decomposition is 220°C, and the maximum loss of mass belonging to this temperature was found to be 16.3%, corresponding to the ultimate conversion of curing. From iso-T_cure diagrams determined by isothermal thermogravimetric analysis, the iso-curing time (iso-t _cure) and iso-mass loss curves of the TTT diagram have been constructed. The iso-T_cure diagrams determined by TMA measurements, served the construction of the iso-T_cure and iso-glass transition temperature (iso-T _g) diagrams. The T _g of the fully cured system (T _g) was found to be 30°C. The iso-T_g line of 30°C represents the ultimate conversion of the cured system, up to which no degradation takes place. This curve runs below the ultimate conversion determined by thermogravimetric measurements, meaning that above 160°C decomposition takes place simultaneously with curing reactions as supported by the increasing tangent of the straight lines fitted to the last section of thermogravimetric iso-T _cure diagrams. The T _g of the matrix before the cure (T _g0) is less than 0°C. This means that the system is in its rubbery physical state during the curing process.     

Synthesis and properties of phosphorus-containing bio-based epoxy resin from itaconic acid

A phosphorus-containing bio-based epoxy resin (EADI) was synthesized from itaconic acid (IA) and 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO). As a matrix, its cured epoxy network with methyl hexahydrophthalic anhydride (MHHPA) as the curing agent showed comparable glass-transition temperature and mechanical properties to diglycidyl ether in a bisphenol A (DGEBA) system as well as good flame retardancy with UL94 V-0 grade during a vertical burning test. As a reactive flame retardant, its flame-resistant effect on DGEBA/MHHPA system as well as its influence on the curing behavior and the thermal and mechanical properties of the modified epoxy resin were investigated. Results showed that after the introduction of EADI, not only were the flame retardancy determined by vertical burning test, LOI measurement, and thermogravimetric analysis significantly improved, but also the curing reactivity, glass transition temperature (T _g), initial degradation temperature for 5% weight loss (T _d(5%)), and flexural modulus of the cured system improved as well. EADI has great potential to be used as a green flame retardant in epoxy resin systems.     

Cationic concentration effects on electron beam cured of carbon-epoxy composites

Electron beam (e-beam) curing is a technology that offers advantages over the thermal curing process, that usually requires high temperature and are time-consuming. E-beam curing is faster and occurs at low temperatures that help reduce residual mechanical stresses in a thermoset composite. The aim of the present study is to analyze the effects of cationic initiator (diaryliodonium hexafluoroantimonate) ranged from 1 to 3 wt% in DGEBA (diglycidyl ether of bisphenol A) epoxy resin when cured by a 1.5 MeV electron beam. The specimens were cured to a total dose of 200.4 kGy for 40 min. Analyses by dynamic mechanical thermal analysis (DMTA) and differential scanning calorimetry (DSC) show that the e-beam irradiated samples with 2 wt% cationic initiator were 96% cured obtained a glass transition temperature (tan δ) of 167 °C. The same epoxy resin, thermally cured for 16 h with an anhydride hardener, reached a T_g (tan δ) of 136 °C. So, the irradiated sample had its T_g increased approximately 20% and the curing process was much less time consuming.     

Structural collapse of plant materials during freeze-drying

Structural collapse of plant materials, which affects quality of foods, was studied. Fresh and osmotically dehydrated plant materials were freeze-dried at several chamber pressures, to achieve initial sample temperatures that were below (?55?C), near (?45?C), or above (?28?C) their glass transition temperature (T _g=?45?C). Freeze-drying at ?55?C resulted in products retaining their original volume. When the initial sample temperature was increased aboveT _g, the resulting freeze-dried samples collapsed. When the initial sample temperature was increased above the temperature of ice melting (T′_m), the samples collapsed further.     

The glass transition temperature of polystyrene

A round robin test was performed to determine the reliability of values for the glass transition temperatureT _g as determined by DTA on polymers. Ten different instruments were involved. The test material was high molecular weight polystyrene. Values forT _g (midpoint) were reported in the range 107°C±2 K. The respective heat flow curves differed considerably in shape. In the literature aT _g of 100°C is often given for polystyrene. The discrepancy between this value and the value of 107°C found in the round robin test is due to three differences: the thermal history of the sample, the evaluation of the heat flow curves, and the effect of finite sample size.     

Evaluation of processing temperature in the production of fibre reinforced epoxy composites

A group of cyanoethylated amine (CEA) has been synthesized by carefully reacting triethylenetetramine with varying proportions of acrylonitrile. Such CEAs were utilized as hardener for the curing of epoxy resin. The effect of cyanoethylation of amine on their curing reaction with epoxy resin has been studied by differential scanning calorimeter (DSC). The processing temperature for the fabrication of composite is estimated from the DSC analysis with an approach to satisfy the logical selection of temperature for application of pressure during processing of a composite structure. The exotherm of such curing reaction (?H _ex) and the degree of cyanoethylation (CEt) of the amine follow the relation ?H _ex ?=?(324?C68.40?CEt)?J?g^?1.     

Thermal stability and dynamic mechanical thermal analysis of epoxy thermosets possessing N,N′-disubstituted pyromellitimide units

Abstract

In this work, three epoxy resins including diglycidyl ethers of N,N′-bis(2-hydroxyethyl)pyromellitimide (DIDGE), bisphenol-A (BADGE), and polyethylene glycol (PEDGE) were isothermally cured by an amine curing agent possessing N,N′-disubstituted pyromellitimide units (denoted by DIDAM). DIDGE resin was synthesized from the reaction of N,N′-bis(2-hydroxyethyl)pyromellitimide with an excess of epichlorohydrin. Also, DIDAM curing agent was prepared from the reaction of pyromellitic dianhydride with an excess of ethylene diamine. Completion of the isothermal curing processes was approved by both Fourier transform-infrared spectroscopy and non-isothermal differential scanning calorimetry (DSC). The DSC traces showed only the phase transitions related to the thermal degradation of the resulting thermosets. According to the thermogravimetric analyses, the DIDGE/DIDAM thermoset showed higher thermal stability at temperatures above 425?°C than the other two thermosets. While BADGE/DIDAM and PEDGE/DIDAM thermosets showed about 70% weight loss in the thermal range of 400–850?°C, DIDGE/DIDAM thermoset was encountered with only about 40% weight loss. The glass transition temperatures (T_g ) of the resulting thermosets were determined using tan δ vs temperature plots obtained from dynamic mechanical thermal analysis. The T_g values of BADGE/DIDAM, DIDGE/DIDAM, and PEDGE/DIDAM thermosets were found to be 211?°C, 189?°C, and 81?°C, respectively.     

Thermal characterization of carbonate rocks,Kozani area,North-western Macedonia,Greece

The curing of a thermoreactive alkyd-melamine-formaldehyde resin system was investigated by rheologycal, TG and TMA-analysis, in order to construct the time-temperature-transformation diagram. The points of the gelation curve were determined by measuring the increase in viscosity during isothermal curing at different temperatures. A power-function could be fitted to the gelation curve, which is suitable to estimate gelation at any curing conditions, as well as to establish storage conditions. The reaction in the resin matrix was followed by monitoring the loss of mass during isothermal curing at different temperatures. The final section of the resulted iso-curing temperature (iso-T _cure) diagrams could be fitted with logarithmic functions, which may be used for estimating the conditions needed to a given, desirable mass loss, i.e. conversion. The steepness of the curves increases with temperature suggesting the forthcoming of degradation during cure with increasing temperature. From these data the iso-mass loss curves of the TTT-diagram were constructed. For determining the iso-Tg curves of the TTT-diagram isothermal curing was carried out in a drying oven at different temperatures, followed by TMA measurements. The iso-Tcure diagrams served to determine T _{g ￥}, and to construct the iso-T _g curves of the TTT diagram. Vitrification curve is far beyond conditions of storage, curing and degradation, meaning that the resin matrix is in rubbery physical state before, during and after the cure. Curing conditions resulting degradation can also be estimated from the TTT-diagram. This revised version was published online in August 2006 with corrections to the Cover Date.     

Determination of ultra-low glass transition temperature via differential scanning calorimetry

A novel method was developed to determine the ultra-low glass transition temperature (T_g) of materials through physical blending via differential scanning calorimetry. According to the Fox equation for polymer blends, a blend of two fully compatible polymers has only one T_g. The single T_g is a function of the T_gs of the two simple polymers. Thus, the ultra-low T_g of one material can be obtained from the T_gs of another polymer and their blends. The error of T_g measurements depends on the measurement error of the T_gs for the blends and another polymer. The method was successfully applied to determine the T_gs of acetyl tributyl citrate (ATBC), tributyl citrate (TBC) and poly(ethylene glycol)s (PEG)s with different molecular weights. The T_gs for ATBC, TBC, PEG-4000 and PEG-800 were ?57.0 °C, ?62.7 °C, ?76.6 °C and ?83.1 °C, respectively. For all the samples, the standard deviation of measurements was less than 3.3 °C, and the absolute error of measurements was theoretically not more than 5.3 °C. These results indicate that this method has acceptable precision and accuracy.     

Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature T_g and thermal decomposition temperature T_d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol^?1. The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd.     

Synthesis and characterization of biodegradable and weather-durable PET/PEG/NDC copolymers

Polyethylene terephthalate/poly(ethylene glycol)/2, 6-naphthalene dicarboxylate (PET/PEG/NDC) copolymers were synthesized and characterized. The results demonstrated that T _g dramatically decreased—by approximately 20?°C—when 8?wt.% PEG was added to neat PET. However, T _g slightly increased—by around 6?°C—from the reduced value, when a third ingredient, NDC, was incorporated. The melting temperature T _m and fusion enthalpy △H _m decreased when the 8?wt.% PEG was copolymerized. Further incorporation of NDC into the PET/8?% PEG copolymer, after a small initial increase in T _m and △H _m for PET/8?% PEG/2.3?% NDC, caused substantially reduce in both properties for PET/8?% PEG/9.2?% NDC. A mechanical test revealed that PET/8?% PEG/NDC copolymers maintained high mechanical integrity until degradation, verifying that the inclusion of NDC enhances the weatherability of PET/PEG copolymer. The rheological Cole–Cole plots indicated the occurrence of phase separation in PET/PEG melt, but the incorporation of NDC suppressed this incompatibility. The biodegradation results indicated that the degradation comprised two stages—a period of rapid degradation, which was associated with the hydrolysis of PEG segments, and a period of slow degradation, which was caused by erosion of the short aliphatic segments by the microbes.     

Investigations and molecular modeling of some thermophysical properties of polysulfones

Degradation of commercial polysulfones (PSF) was investigated in air and in inert atmosphere (nitrogen) using thermogravimetric (TG) method. It has been found that the degradation of Udel P-1800 PSF is initiated about 400°C, both in air and in nitrogen. The activation energy of degradation of PSF, (E _a), has been calculated by the Kissinger and Ozawa methods. The value ofE _a about 200 kJ·mol^?1 has been found for both air and nitrogen atmosphere. Experimental results concerning thermal properties of PSF (T _g andT _d,1/2) were compared with those obtained by the computer modeling technique, and a good agreement has been found.     

Performance of high-temperature thermosetting polyimide composites modified with thermoplastic polyimide

The preparation of polyimide (PI) resin with high heat resistance and toughness is a significant challenge. In this study, thermoplastic PI (TPI) was used to toughen thermosetting PIs, and toughened PI (TPI/PI) blends were prepared. The modified PI resin system exhibited good thermal stability, excellent heat resistance, and high toughness. The results indicated that the TPI/PI blends maintained the curing behavior and characteristics of the PI oligomer. The T_g of the cured TPI/PI blend exceeded 395 °C, and the T_5% values were in the range of 533–563 °C, suggesting excellent thermal stability and heat resistance. The maximum impact strength was increased by 46% compared with that of pure PI, indicating the excellent toughening effect of the TPI. Carbon fiber-reinforced PI composites were prepared using the toughening system as a matrix. The compression-after-impact values of the carbon fiber-reinforced PI composites were up to 190 MPa, indicating the excellent toughness of the materials.     

Synthesis and thermal behavior of phenylethynyl‐terminated linear and hyperbranched polyphenylquinoxalines

A phenylquinoxaline (PQ) AB monomer mixture was treated with monofunctional and difunctional end‐capping agents and with and without a coupling agent to afford phenylethynyl‐terminated linear PQ oligomers. The resulting PQ oligomers were soluble in common organic solvents and had intrinsic viscosities (IVs) of 0.21–0.30 dL/g. The glass‐transition temperature (T_g) of the diphenylethynyl‐end‐capped PQ oligomer on both sides increased the most, from 215 °C (before curing) to 251 °C (after curing). The PQ AB₂ monomer, which acted as both a coupling agent and a monomer for the hyperbranched polymer, was treated with an AB monomer and end‐capping agents to afford phenylethynyl‐terminated hyperbranched polyphenylquinoxalines (PPQs). They were also soluble in common organic solvents, had IVs of 1.00–1.65 dL/g and T_g's of 251–253 °C, and underwent exothermic cure with maxima around 412–442 °C. The T_g's of the cured hyperbranched PPQs ranged from 258 to 261 °C, depending on the number of phenylethynyl groups on the surface. After further curing, they displayed a T_g of 316 °C in one sample and turned into a fully crosslinked network. The dynamic melt viscosities of a linear oligomer (IV = 0.21 dL/g), a hyperbranched sample (IV = 1.00 dL/g), and a linear reference PPQ (IV = 1.29 dL/g) were compared with respect to the processing temperature. The PQ oligomer and hyperbranched PPQ had low melt viscosities. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 6318–6330, 2004     

Thermal and mechanical properties of epoxy resin toughened with epoxidized soybean oil

A series of new modified epoxy resin (EP) cured products were prepared from epoxidized soybean oil and commercial epoxy resin, with methyl nadic anhydride as curing agent and 1-methylimidazole as promoting agent. The thermal properties of the resins were characterized by DMA and TG; DSC was used to determine the curing process. Fourier transform infrared spectroscopy was utilized to investigate their molecular structures and scanning electron microscopy was used to observe the micro morphology of their impact fracture surfaces. Tensile and impact testing was employed to characterize the mechanical properties of the cured products. The combination of commercial EP with 20 wt% ESO resulted in a bioresin with the optimum set of properties: 130.5 °C T _g, 396.9 °C T _50 %, 74.89 MPa tensile strength, and 48.86 kJ m^?2 impact resistance.     

Epoxy resins (DGEBA): The curing and physical aging process

Differential scanning calorimetry (DSC) and infrared spectroscopy (IR) were used to monitor the degree of cure of partially cured epoxy resin (Epon 828/MDA) samples. The extent of cure, as determined by residual heat of reaction, concurred with that determined by monitoring the infrared radiation absorbance of the epoxide group near 916 cm^?l. The fictive temperature T_{f, g} was found to increase with the degree of cure, increasing rapidly during cure until reaching a value near the cure temperature T_c of 130°C (approximately 80% cure) where the material vitrified. The greatly reduced reaction rate during the final 20% of cure was not only a consequence of vitrification but, as revealed by infrared spectroscopy, the result of the depletion in the number of reactive epoxide groups. The endothermic peak areas and peak temperatures evident during the DSC scans were used as a measure of the extent of “physical aging” which took place during the cure of this resin, and after, fully cured samples were aged 37°C below their ultimate glass temperature for various periods of time. The rate of physical aging slowed as the temperature increment (T_t,g ? T_c) increased. Although an endothermic peak was evident after only 1 h of cure (T_{f, g} = 138.3°C), such a peak did not appear until fully cured samples were aged for 16 h or more. Enthalpy data revealed that for partially cured material, the fictive temperature T_{f, a}, reflecting physical aging, increased with curing time. In contrast, the T_{f, a}, for fully cured samples decreased with sub-T_g aging time. The characteristic jump in the heat capacity ΔC_p which occurred at the T_{f, g} decreased as curing progressed. This decrease appears to be dependent upon the rotational and vibrational degrees of freedom of the glass. Finally, a graphical method of determining the fictive temperature T_{f, a}, of partially and fully cured epoxy material from measured endothermic peak areas was developed.     

Physical aging studies in epoxy resins. I. Kinetics of the enthalpy relaxation process in a fully cured epoxy resin

The physical aging of an epoxy resin based on diglycidyl ether of bisphenol-A cured by a hardener derived from phthalic anhydride has been studied by differential scanning calorimetry. The isothermal curing of the epoxy resin was carried out in one step at 130°C for 8 h, obtaining a fully cured resin whose glass transition was at 98.9°C. Samples were aged at temperatures between 50 and 100°C for periods of time from 15 min to a maximum of 1680 h. The extent of physical aging has been measured by the area of the endothermic peak which appears below and within the glass transition region. The enthalpy relaxation was found to increase gradually with aging time to a limiting value where structural equilibrium is reached. However, this structural equilibrium was reached experimentally only at an aging temperature of T_g-10°C. The kinetics of enthalpy relaxation was analysed in terms of the effective relaxation time τ_eff. The rate of relaxation of the system given by 1/τ_eff decreases as the system approaches equilibrium, as the enthalpy relaxation tends to its limiting value. Single phenomenological approaches were applied to enthalpy relaxation data. Assuming a separate dependence of temperature and structure on τ, three characteristic parameters of the enthalpic relaxation process were obtained (In A = ?333, E_H = 1020 kJ/mol, C = 2.1 g/J). Comparisons with experimental data show some discrepancies at aging temperatures of 50 and 60°C, where sub-T_g peaks appears. These discrepancies probably arise from the fact that the model assumes a single relaxation time. A better fit to aging data was obtained when a Williams-Watts function was applied. The values of the nonexponential parameter β were slightly dependent on temperature, and the characteristic time was found to decrease with temperature. © 1994 John Wiley & Sons, Inc.     

Thermal cured epoxy resins using certain calixarenes and their esterified derivatives as curing agents

The acetyl esterified calixarene (CA) derivatives were prepared from calix[4]resorcinarene (CRA), and p‐tert‐butylcalixarene (BCA[n], n = 4, 6, 8), respectively. Using these CA derivatives as curing agents, the thermal curing reactions of two multifunctional epoxy resins (jER 828, 186 g/equiv., and ESCN, 193.7 g/equiv.) were investigated. The temperatures of glass transition (T_g) and decomposition (T) were measured by DSC and TGA, respectively. Based on the yields, T_gs, and T_ds of the thermal cured jER 828 epoxy resin with CRA‐E100, the curing conditions were optimized to be tetrabutylphosphonium bromide (TBPB) as catalyst in NMP at 160 °C for 15 h. Under this curing condition, the cured materials of jER 828 or ESCN using various CA derivatives as curing agents were prepared. Except for BCA4 derivatives, the yields of thermal curing reaction were higher than 90%. T_gs and Ts of the resultant cured materials were in the range of 113–248 °C and 363–404 °C, respectively. These results mean that the cured epoxy resins with excellent T_gs were successfully formed by using CA derivatives as curing agents. It was also found that the T_gs of cured epoxy resins were strongly affected by the degree of esterification of CA derivatives. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 1931–1942, 2010     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000