短碳纤维填充HDPE复合体系的渗流网络与压阻行为

研究了短碳纤维(Shortcarbonfiber,SCF)填充高密度聚乙烯(HDPE)导电复合体系的渗流(Percola-tion)与压阻行为(Piezoresistivebehavior,PRB),发现SCF经物理接触而形成的导电网络是复合材料导电的根源.体系的压阻行为呈现浓度依赖性.受压时SCF间隙的减小与渗流网络的局部破坏-重建过程随填料浓度、载荷大小和力学循环次数的变化而变化,导致PRB表现为电阻负压力系数(NPC)、电阻正压力系数(PPC)或两者兼有的现象.讨论了体系PRB的稳定性,发现由于HDPE基体的塑性永久形变,电阻-时间基线随着压缩循环的进行而发生漂移,多次循环可有效提高体系的压阻稳定性.     

聚氯乙烯/炭黑导电复合体系的压阻行为

研究了聚氯乙烯/炭黑(PVC/CB)导电复合体系在单轴压力作用下的压阻行为,发现CB含量对电阻-机械响应具有显著的影响.当CB含量低于渗流阈值时,PVC/CB复合材料呈现PPC效应;而高于渗流阈值时,呈现NPC效应.在渗流阈值附近,单轴压缩可诱导NPC效应的出现,或者抑制PPC效应.     

单轴压力对高密度聚乙烯/碳黑导电复合材料电阻特性的影响

研究了高密度聚乙烯/炭黑导电复合材料在单轴压力作用下电阻的变化规律.结果表明,在低压力下,复合材料电阻随压力增加而降低;而在较高压力下则随压力增大而升高,分别呈现出所谓的“电阻负压力系数”和“电阻正压力系数”效应.电阻的压力依赖性以及由压缩引起的电阻不可回复性,被认为与外力作用下导电网络的重组与破坏有关.由此提出了导电复合材料单轴压力作用-电阻相互关系的唯象模型.     

基体分子运动对聚偏氟乙烯/碳纤维复合材料的聚合物基正温度系数性能的影响

聚合物基正温度系数(PTC)材料中,基体分子在熔体状态下的运动能力可显著影响填料分布、PTC强度及稳定重复性等,明确其机理有利于高灵敏性且稳定可重复的PTC复合材料的设计与制备.通过探究基体熔体黏度不同的聚偏氟乙烯(PVDF)/碳纤维(CF)的电阻-温度响应行为,可以发现复合材料PTC转变温度区间仅取决于基体化学结构与结晶性,而PTC循环稳定性却受到基体分子运动能力的显著影响.当基体分子运动能力较强时,分子链极易黏附填料在CF表面形成包覆层,导致局部填料间距增大到隧穿距离以上,不利于复合材料导电网络的重建,导致随热循环次数增加,复合材料的室温电阻率有所升高,PTC可重复性略微降低.而对基体分子链缠结明显的PVDF/CF复合材料中,运动能力较弱的分子链不会包覆CF粒子,在多次升温-降温循环后导电通路能恢复到初始状态,复合材料呈现良好的PTC可重复性,将其应用于电路过热保护装置时,复合材料表现出灵敏的温度响应特性及可多次循环的开关特性.     

多壁碳纳米管/氯丁橡胶复合材料的应变感知特性研究

通过多壁碳纳米管(MWCNT)共混改性氯丁橡胶(CR),得到了具有电阻-应变响应特性的复合材料。随着碳纳米管含量增加，材料的强度和刚度显著提升。MWCNT含量的导电渗流阈值为4.75 wt%,含量超过该值，MWCNT在橡胶基体内部形成隧穿导电网络，材料具有导电能力。静态和循环载荷下材料的电阻-应变响应测试分析表明，当MWCNT含量为8 wt%时，材料的电阻-应变响应灵敏系数GF>418,体现出良好的应变感知特性。随着MWCNT含量增加，GF值逐渐减小，同时电阻-应变响应的稳定性下降，并出现肩峰效应，证明过高的碳纳米管含量对导电网络随变形发生的破坏与重构产生不利影响。最终通过数字图像相关法(DIC)和电子遂穿效应理论模型，对上述电阻-应变响应机理进行了分析。     

聚乙烯/炭黑复合材料导电体系的结构形态

将导电填料（例如炭黑）加入绝缘的聚合物基体即得到导电复合材料,两组混全物的电阻率随导电填料体积分数的变化而改变,电阻率与导电填料体积分数的关系称为渗流曲线,可分为三个主要区域：低导电填料含量区域,复合材料的电阻率很大,聚合物的电阻率占主导;渗流区域,导电填料含量少量的增加会引起复合材料电阻率很大的提高;高导电填料区域,复合材料电阻率很大的提高;高导电填料区域,复合材料电阻率主要由导电填料的电阻率决定,对于导电复合材料已有大量的实验和理论工作来解释导电复合材料已有大量的实验和理论工作来解释导电填料含量和复合材料各组分的形貌对电性能的影响,其中有效介质普适方程（GEM方程）已经对大量的渗流曲线进行了精确的拟合。聚乙烯／炭黑复合材料中由于炭黑的大量分布很难观测其微观形貌,本文对不同辐照交联程度和不同环境温度下聚乙烯／炭黑复合材料的渗流曲线进行分析,试图找出GEM方程各参数与复合材料各组分形貌的关系,为导电复合材料的设计和制备提供理论基础。     

镍/聚氨酯复合材料的导电网络在拉伸中的演变

一种独特的电性能形变敏感行为—镍/聚氨酯复合材料的电阻率在20%拉伸应变下呈现近6个数量级的降低,导致该行为的填料网络演变机理仍不清晰.针对该现象,本文通过交流阻抗分析考察了2种具有不同拉伸敏感特性的镍/聚氨酯复合材料体系在不同应变下各种微观参数对频率的依赖性.采用尼奎斯特曲线拟合得到的数据及参数计算了团聚体电阻、团聚体之间电阻在拉伸下的变化,以此推测了2种复合材料体系在拉伸时导电网络不同的变化模式.结果表明,对于27.5 vol%填料含量的复合材料,在拉伸时由于团聚体维度发生变化使得逾渗在拉伸下发生,即拉伸逾渗现象.而25 vol%填料含量的复合材料由于填料含量远低于逾渗区域,即使团聚体维度发生变化也没有连续的导电网络产生.本工作为导电高分子复合材料在拉伸时导电网络的变化提供了新的理解,并为拉伸敏感导电高分子复合材料的网络研究提供新的思路.     

具有高灵敏性且稳定可重复的正温度系数效应的PVDF/CF导电复合材料

以碳纤维(CF)为填料,聚偏氟乙烯(PVDF)为基体,通过熔融共混法制备PVDF/CF导电复合材料.所得复合材料具有显著的正温度系数(PTC)效应,温度上升到聚合物熔点附近时,电阻率对温度变化敏感.在转折温度区间(155.5~171.0oC,(35)(28)15.5oC)内,其体积电阻率的增加速率约为1.3×105?cm K-1.在不同CF含量下,复合材料表现出不同的PTC行为.随着CF含量的增加,其峰值电阻略有下降.高导电粒子含量下,无负温度系数(NTC)效应.在冷却循环过程,导电网络的重构性良好.复合材料即使经过多次热循环,依然表现出良好的PTC特性重现性.     

HDPE/HIPS/CB复合材料的制备及PTC性能

以高抗冲击聚苯乙烯(HIPS)和高密度聚乙烯(HDPE)为基体,炭黑(CB)为导电填料,采用熔融法制备聚合物基正电阻率温度系数效应(PTC)复合材料.通过扫描电子显微镜(SEM)研究了CB在复合材料两相基体中的选择分布,采用热敏电阻温度(RT)曲线测试仪研究复合材料PTC性能随CB含量的变化规律.结果表明,在HIPS/CB体系中加入HDPE后,复合材料的渗流阈值降低,PTC强度增强,耐电压强度有所提高.     

聚甲基乙烯基硅氧烷/炭黑复合体系的电阻弛豫行为

考察了聚甲基乙烯基硅氧烷/炭黑(CB)复合交联体系在恒定压应力作用下以及完全卸载后的导电行为,发现电阻在恒定压应力作用下及完全卸载后均随时间非线性下降,呈现典型的电阻弛豫行为.根据电阻弛豫时间以及最大电阻弛豫幅度,分析了导电网络结构变化与电阻弛豫之间的关联,讨论了炭黑含量对电阻弛豫的影响.结果表明,在恒定压应力2~4MPa下,电阻弛豫具有两个与CB含量无关的弛豫时间,对应不同尺寸导电网络的结构变化.完全卸载后,基体形变回复造成导电网络发生结构弛豫,弛豫时间随CB含量增大而延长.     

多壁碳纳米管填充聚苯乙烯复合体系的动态流变特性

应用两相模型探讨多壁碳纳米管(MWCNTs)填充聚苯乙烯(PS)复合体系的动态流变特性.结果表明,体系线性黏弹行为与PS本体的应变放大效应及MWCNTs填料相的弛豫密切相关.在不同温度下,应变放大因子(Af)随MWCNTs体积分数(φ)的变化规律符合扩散控制的粒子串聚集(CCA)模型.φ＜0.020时,MWCNTs分散...     

Ethylene–acrylic acid copolymer induced electrical conductivity improvements and dynamic rheological behavior changes of polypropylene/carbon black composites

The experimental data reveal that the addition of ethylene–acrylic acid copolymer (EAA) into carbon black (CB)/polypropylene (PP) composites can improve the electrical conductivity of CB/PP composites by two to six orders of magnitude at a comparatively low CB content (φ), and when φ = 2.5 vol %, 60/40 of PP/EAA is an optimum for electrical conductivity improvement. The dynamic rheological data show that with increasing φ there are apparent rheological percolations for CB/PP composites. A modified Kerner–Nielson equation can be used to describe the correlation between electrical percolation and dynamic viscoelastic percolation. The addition of EAA into CB/PP composites leads to apparent changes in dynamic rheological behaviors. When φ = 2.5 vol %, a rheological percolation appears in CB/PP/EAA (CPE) composites with increasing EAA content. The similar rheological behaviors correspond to the similar morphological structures for CPE composites with φ = 5.0 vol %. The appearance of bumps in the van‐Gurp–Palmen plots corresponds to the formation of network structure in CB/PP and CPE composites, and the more perfect the networks, the higher the amplitude of the bumps. All data indicate that the van‐Gurp–Palmen plot is sensitive to the formation of filler particle networks or cocontinuous phase which spans the whole composite. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 1762–1771, 2009     

Monolithic polyimine vitrimer/graphene aerogel composites

Graphene-polymer composites have attracted great attention as sensing materials due to their tailorable electrical conductivity, physicochemical properties, and sensitivity to geometric and functional changes. Herein, we report the first example of cylindrical monolithic polyimine vitrimer/graphene composites with excellent mechanical, compressive, rehealable and recyclable, and piezoresistive properties via simple infiltration of polymer monomers into the pores of graphene aerogel followed by thermal curing. The composites exhibit excellent durable compressibility (negligible reduction in the compression properties even after 3000 consecutive compression cycles), rapid recovery to the original size upon stress released, high compressive strength (up to 1.2 MPa), and high conductivity (up to 79 S/m). Excellent piezoresistive properties were observed, displaying consistent and reliable change of the electrical resistance with the compression ratio. Furthermore, rehealing with ～100% recovery of the compressive strength and electric conductivity was achieved under mild rehealing conditions, which is highly desired but has rarely been reported for electronic materials. The facile strategy for fabrication of rehealable monolithic polymer/GAs can open new possibilities for the sustainable development of composites with high electrical conductivity for various applications such as sensing, health monitoring, and movement detection.     

纤维状填料/HDPE复合体系的导电渗流与流变渗流行为的关系

研究了纤维状导电材料不锈钢纤维(SSF)填充高密度聚乙烯(HDPE)导电复合体系的导电渗流与流变渗流行为之间的关系,并与颗粒状导电颗粒炭黑(CB)/HDPE导电复合体系进行了比较.发现当SSF含量极低(0.3vol%)时,SSF/HDPE体系即发生导电渗流现象,且导电渗流转变区域极窄;而仅当SSF含量达到4.8vol%时,该复合体系才表现出流变渗流现象,这一结果与CB/HDPE体系及纳米级导电纤维填充体系截然不同.此外,通过正温度系数效应的研究发现SSF形成的导电通路稳定性高于CB/HDPE体系.我们认为,SSF/HDPE体系呈现的这些特点均与SSF较大的直径及长径比且其导电通路及流变渗流网络的形成机理不同有关.     

Dynamics of polymer translocation into a circular nanocontainer through a nanopore

Using Langevin dynamics simulations, we investigate the dynamics of polymer translocation into a circular nanocontainer through a nanopore under a driving force F. We observe that the translocation probability initially increases and then saturates with increasing F, independent of φ, which is the average density of the whole chain in the nanocontainer. The translocation time distribution undergoes a transition from a Gaussian distribution to an asymmetric distribution with increasing φ. Moreover, we find a nonuniversal scaling exponent of the translocation time as chain length, depending on φ and F. These results are interpreted by the conformation of the translocated chain in the nanocontainer and the time of an individual segment passing through the pore during translocation.     

炭黑填充聚甲基乙烯基硅氧烷硫化胶的阻温特性与电阻弛豫

研究了炭黑填充硅橡胶硫化胶的热循环以及热处理过程中的导电行为,发现在热循环中阻温关系曲线逐渐向低电阻方向移动,而在恒温下发生电阻弛豫现象;分析了硫化胶的导电机制,讨论了阻温关系发生移动的原因.     

Green solvent approach for printable large deformation thermoplastic elastomer based piezoresistive sensors and their suitability for biomedical applications

Composites based on biocompatible thermoplastic elastomer styrene‐ethylene/butylene‐styrene (SEBS) as matrix and multi‐walled carbon nanotubes (MWCNT) as nanofillers show excellent mechanical and piezoresistive properties from low to large deformations. The MWCNT/SEBS composites have been prepared following a green solvent approach, to extend their range of applicability to biomedical applications. The obtained composites with 2, 4, and 5 wt % MWCNT content provide suitable piezoresistive response up to 80% deformation with a piezoresistive sensibility near 2.7, depending on the applied strain and MWCNT content. Composite sensors were also developed by spray and screen printing and integrated with an electronic data acquisition system with RF communication. The possibility to accurately control the composites properties and performance by varying MWCNT content, viscosity, and mechanical properties of the polymer matrix, shows the large potential of the system for the development of large deformation printable piezoresistive sensors. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016 , 54, 2092–2103