Characterization of hydrogenated amorphous silicon thin films prepared by magnetron sputtering

Magnetron sputtered hydrogenated amorphous silicon (a-Si:H) thin films have been characterized. Hydrogen (H₂) with argon (Ar) was introduced into the sputtering chamber to create the plasma. A sudden increase in the deposition rate occurred when the hydrogen was added. The maximum hydrogen content of 16 atomic percent (at.%) was achieved and a bandgap of about 2.07 eV was determined from the spectral investigations of the hydrogenated films. The effect of radio frequency (RF) power on the deposition rate, as well as on the hydrogen content was investigated. To change the hydrogen content in the films, the hydrogen flow rate was varied while keeping the argon flow rate constant. The hydrogen content in the films increased with increasing hydrogen flow rate up to the maximum content of 16 at.% and then decreased for further increases in hydrogen flow.     

Structural analysis of Cd-Te-O films prepared by RF reactive sputtering

Crystalline and microcrystalline Cd-Te-O samples have been obtained by RF reactive sputtering from a CdTe target using N₂O as oxidant. The growth conditions were substrate temperatures of 323 K, 573 K and 773 K and cathode voltage of −400 V, corresponding to 30 W of forward power. The samples were studied by micro-Raman spectroscopy, X-ray diffraction and optical transmittance. The films are remarkably transparent in the visible range, with transmittances about 88% at 400 nm and band gap energies above the absorption edge of the glass substrates. Although only the samples prepared at 773 K present defined diffraction peaks, the analysis of the Raman spectra indicate that samples prepared at 323 K and 573 K have a defined microstructure indeed. The spectra fitting performed by comparison with pattern compounds demonstrate that Cd-Te-O films are formed of Te-O units similar to those present in metal oxide-doped tellurite glasses, such as TeO₃ and TeO_3 + 1 linked through Cd-O bonds. As the substrate temperature increases the microstructure evolves from a γ-TeO₂ richer state to Cd_xTe_yO_z. In the crystalline sample the main phase identified was CdTeO₃ even though evidence of other phases was observed.     

Properties of Si-rich SiO2 films by RF magnetron sputtering

Si-rich silicon oxide (SiO_x, 1<x<2) films were prepared by RF magnetron reactive sputtering or co-sputtering on the Si(1 1 1) substrates. X-ray diffraction patterns showed that the peak of silicon nanocrystals (NCs), separated from SiO_x films, had (1 1 1) preferred orientation. The results of scanning electron microscopy indicated the Si NCs uniting into clusters. We demonstrated that the photoluminescence (PL) peaks at 650 nm was caused by defect center. In particular, we discussed the correlation between the PL and the structure of SiO_x films. The mean size of the Si NCs was estimated to be about 3 nm by the PL peak position.     

Characterization of reactive DC magnetron sputtered TiAlN thin films

Thin films of about 1μm Titanium Aluminum Nitride (TiAlN) were deposited onto mild steel substrates by reactive direct current (DC) magnetron sputtering using a target consisting of equal segments of titanium and aluminum. X‐ray diffraction (XRD) analysis showed that the TiAlN phase had preferred orientations along 111 and 200 with the face‐centered cubic structure. Scanning Electron Microscope (SEM) and Atomic Force Microscope (AFM) analyses indicated that the films were uniform and compact. Photoluminescence (PL) spectra reveal that TiAlN thin films are of good optical quality. Laser Raman studies revealed the presence of characteristic peaks of TiAlN at 312.5, 675, and 1187.5 cm^–1. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Deep ultraviolet emission of ZnO films prepared by RF magnetron sputtering at changing substrate temperature

ZnO films with deep ultraviolet emission on (0 0 0 6) sapphire substrates were prepared by RF magnetron sputtering at periodically changing substrate temperature. It is found that the as-prepared ZnO films consist of the obvious multilayered structures from the SEM images of their cross-sections. Room temperature photoluminescence of ZnO films with multilayered structure shows two emissions centered at 332 and 388 nm with 260 nm excited wavelength. The strong deep ultraviolet emission at 332 nm is due to the O 2p dangling-bond state in the multilayered structure of ZnO films. Raman scattering spectrum of sample shows that such structured ZnO film possesses strong compressive stress.     

Orientation control of LaNiO3 thin films by RF magnetron sputtering with different oxygen partial pressure

Highly (1 1 0)- and (1 0 0)-oriented LaNiO₃ (LNO) thin films were successfully grown on Si (1 0 0) substrate using radio frequency (RF) magnetron sputtering at room temperature (RT). Effects of oxygen partial pressures on the orientation, film composition, surface morphology, and electrical properties of the films were investigated. The nearly complete (1 0 0) orientation was first achieved with oxygen partial pressure beyond 15% in the sputtering gas. The preferred (1 0 0) orientation of growing films is determined by uniform distribution of Ni³⁺ and La/Ni ratio in the films caused by oxygen during sputtering, as well as the lowest surface energy of the films in the crystalline process. LNO films with controlled orientation have low resistivity of 7.0×10⁻⁶ Ω m which is a good basis for integrating ferroelectric capacitors.     

Effects of high-temperature annealing on electron spin resonance in SiOx films prepared by R. F. sputtering system

Electron spin resonance (ESR) spectra are investigated in order to analyze paramagnetic defects in amorphous SiO_x films with 0.8 ≤ x ≤ 1.87 prepared by a co-sputtering of Si-wafer chips and a SiO₂ disk target. Effects of the thermal annealing at 900 °C and 1100 °C on the ESR spectra are also investigated. Four types of silicon dangling bond centers with forms of •Si ≡ Si_3 − nO_n (n = 0, 1, 2 or 3) are assumed in order to simulate the ESR spectra. The random bonding model appears to describe the network structure of the films with x ~ 2, that is, near the stochiometric composition of SiO₂. It is suggested that the structural fluctuation around silicon dangling bonds is larger in the sputtered SiO_x films used in the present work in comparison with those prepared by plasma-enhanced chemical vapor deposition.     

Growth and properties of (Pb0.90La0.10)TiO3 thick films prepared by RF magnetron sputtering with a PbO buffer layer

The (Pb_0.90La_0.10)TiO₃ [PLT] thick films (3.0 μm) with a PbO buffer layer were deposited on the Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrates by RF magnetron sputtering method. The PLT thick films comprise five periodicities, the layer thicknesses of (Pb_0.90La_0.10)TiO₃ and PbO in one periodicity are fixed. The PbO buffer layer improves the phase purity and electrical properties of the PLT thick films. The microstructure and electrical properties of the PLT thick films with a PbO buffer layer were studied. The PLT thick films with a PbO buffer layer possess good electrical properties with the remnant polarization (P_r=2.40 μC cm⁻²), coercive field (E_c=18.2 kV cm⁻¹), dielectric constant (ε_r=139) and dielectric loss (tan δ=0.0206) at 1 kHz, and pyroelectric coefficient (9.20×10⁻⁹ C cm⁻² K⁻¹). The result shows the PLT thick film with a PbO buffer layer is a good candidate for pyroelectric detector.     

Effect of the substrate temperature on the crystallization of TiO2 films prepared by DC reactive magnetron sputtering

Titanium oxide (TiO₂) films were deposited on silicon substrates at the temperature in the range 50–600 °C by DC reactive magnetron sputtering. It was found that the anatase and rutile phases co-existed in the TiO₂ films deposited at 450–500 °C, while only the anatase phase existed in those deposited at other temperatures. The mechanism of such a crystallization behavior of TiO₂ films is preliminarily explained.     

The effect of thermal annealing on the structural and mechanical properties of a-C:H thin films prepared by the CFUBM magnetron sputtering method

a-C:H films were prepared by closed-field unbalanced magnetron (CFUBM) sputtering on silicon substrates using argon (Ar) and acetylene (C₂H₂) gases, and the effects of post-annealing temperature on structural and mechanical properties were investigated. Films were annealed at temperatures ranging from 300 °C to 700 °C in increments of 200 °C using rapid thermal annealing equipment in vacuum ambient. Variations in microstructure were examined using Raman spectroscopy and X-ray photoelectron spectroscopy (XPS). Surface and mechanical properties were investigated by atomic force microscopy (AFM), nano-indentation, residual stress tester, and nano-scratch tester. We found that the mechanical properties of a-C:H films deteriorated with increased annealing temperature.     

Microstructure and dielectric properties of La2O3 films prepared by ion beam assistant electron-beam evaporation

Ultrathin La₂O₃ gate dielectric films were prepared on Si substrate by ion assistant electron-beam evaporation. The growth processing, interfacial structure and electrical properties were investigated by various techniques. From XRD results, we found that the La₂O₃ films maintained the amorphous state up to a high annealing temperature of 900 °C for 5 min. From XPS results, we also discovered that the La atoms of the La₂O₃ films did not react with silicon substrate to form any La-compound at the interfacial layer. However, a SiO₂ interfacial layer was formed by the diffusion of O atoms of the La₂O₃ films to the silicon substrate. From the atomic force microscopy image, we disclosed that the surface of the amorphous La₂O₃ film was very flat. Moreover, the La₂O₃ film showed a dielectric constant of 15.5 at 1 MHz, and the leakage current density of the La₂O₃ film was 7.56 × 10⁻⁶ A/cm² at a gate bias voltage of 1 V.     

Spectrometric and ellipsometric studies of (1 − x)TiO2 · xLn2O3 (Ln = Nd, Sm, Gd, Er, Yb) thin films

Spectrometric and ellipsometric studies of (1 − x)TiO₂ · xLn₂O₃ (Ln = Nd, Sm, Gd, Er, Yb; x = 0.33, 0.5) thin films at room temperature were performed. The obtained dispersion dependences of refractive indices are successfully described by the optical-refractometric relation. The dependence of optical pseudogap and refractive indices on composition and molar mass of the films is investigated. The influence of compositional disordering on the energy width of the exponential absorption edge is studied.     

Structural and optical properties of single-crystal ZnMgO thin films grown on sapphire and ZnO substrates by RF magnetron sputtering

High-quality ZnMgO films were grown by the radio frequency (RF) magnetron sputtering technique in pure oxygen ambient. Single-crystal films were obtained, when the Mg concentration was Zn_0.87Mg_0.13O or lower in the case of ZnMgO/Al₂O₃ and when it was Zn_0.65Mg_0.35O or lower in the case of ZnMgO/ZnO. Polycrystalline films were obtained when the growth temperature was lower than 500 °C, regardless of the Mg concentration. Position of the photoluminescence (PL) ultraviolet (UV) peak of the ZnMgO film shifted with the addition of Mg, from 3.33 eV (ZnO) to 3.51 eV (Zn_0.87Mg_0.13O) and 3.70 eV (Zn_0.65Mg_0.35O). It was also observed that growth of the ZnMgO films at higher temperature resulted in higher band-gap energy. It was proposed that this phenomenon is because concentration of the substitutional Mg atoms occupying Zn site is increased as the growth temperature increases.     

Influence of hydrogen on structural and optical properties of low temperature polycrystalline Ge films deposited by RF magnetron sputtering

To improve the properties of polycrystalline Ge thin films, which are a candidate material for the bottom cells of low cost monolithic tandem solar cells, ∼300 nm in situ hydrogenated Ge (Ge:H) thin films were deposited on silicon nitride coated glass by radio-frequency magnetron sputtering. The films were sputtered in a mixture of 15 sccm argon and 10 sccm hydrogen at a variety of low substrate temperatures (T_s)≤450 °C. Structural and optical properties of the Ge:H thin films were measured and compared to those of non-hydrogenated Ge thin films deduced in our previous work. Raman and X-ray diffraction spectra revealed a structural evolution from amorphous to crystalline phase with increase in T_s. It is found that the introduction of hydrogen gas benefits the structural properties of the polycrystalline Ge film, sputtered at 450 °C, although the onset crystallization temperature is ∼90 °C higher than in those sputtered without hydrogen. Compared with non-hydrogenated Ge thin films, hydrogen incorporated in the films leads to broadened band gaps of the films sputtered at different T_s.     

Microstructural characteristics and crystallographic evolutions of Ga-doped ZnO films grown on sapphire substrates at high temperatures by RF magnetron sputtering

The microstructural characteristics and crystallographic evolutions of Ga-doped ZnO (GZO) films grown at high temperatures were examined by X-ray diffraction (XRD) and high-resolution transmission electron microscopy (HRTEM). The GZO films with various film thicknesses were grown on (0 0 0 1) Al₂O₃ substrates at 750 °C by RF magnetron sputtering using a 2 wt% Ga-doped ZnO single target. The (0 0 0 2) ZnO peaks in the XRD patterns shifted to a higher angle with increasing film thickness and an additional (1 0 1¯ 1) ZnO peak was observed in the final stage of film growth. HRTEM showed the epitaxial growth of GZO films in the initial growth stage and the formation of surface protrusions in the intermediate stage due to elastic relaxation. The surface protrusions consisted of {1 0 1¯ 1}, {1 0 1¯ 3}, and {0 0 0 2} planes. After the surface protrusions had formed, a GZO film with many c-axis tilted grains formed due to plastic relaxation, where the tilted grain boundaries had an angle of 62° to the substrate. The formation of the protrusions and c-axis tilted grains was closely related to the strain status of the film induced by Ga incorporation, high-temperature growth and a high film thickness.     

Effect of N2/CH4 flow ratio on microstructure and composition of hydrogenated carbon nitride films prepared by a dual DC-RF plasma system

Hydrogenated carbon nitride (a-CN:H) films were deposited on n-type (1 0 0) silicon substrates making use of direct current radio frequency plasma enhanced chemical vapor deposition (DC-RF-PECVD), using a gas mixture of CH₄ and N₂ as the source gas in range of N₂/CH₄ flow ratio from 1/3 to 3/1 (sccm). The deposition rate, composition and bonding structure of the a-CN:H films were characterized by means of X-ray photoelectron spectroscopy (XPS) and Fourier-transform infrared spectrometry (FTIR). The mechanical properties of the deposited films were evaluated using nano-indentation test. It was found that the parameter for the DC-RF-PECVD process had significant effects on the growth rate, structure and properties of the deposited films. The deposition rate of the films decreased clearly, while the N/C ratio in the films increased with increasing N₂/CH₄ flow ratio. CN radicals were remarkably formed in the deposited films at different N₂/CH₄ flow ratio, and their contents are related to the nitrogen concentrations in the deposited films. Moreover, the hardness and Young’s modulus of the a-CN:H films sharply increased at first with increasing N₂/CH₄ flow ratio, then dramatically decreased with further increase of the N₂/CH₄ flow ratio, and the a-CN:H film deposited at 1/1 had the maximum hardness and Young’s modulus. In addition, the structural transformation from sp³-like to sp²-like carbon-nitrogen network in the deposited films also was revealed.     

Fabrication of Zn/ZnO nanocables through thermal oxidation of Zn nanowires grown by RF magnetron sputtering

Fabrication of Zn/ZnO nanocables by thermal oxidation of Zn nanowires grown by RF magnetron sputtering is reported. Single crystalline Zn nanowires could be grown by controlling supersaturation of source material through the adjustment of temperature and Zn RF power. X-ray diffraction and high-resolution transmission electron microscopy showed that surfaces of these Zn nanowires, grown along the [0 1 0] direction, gradually oxidized inward the Zn core to form coaxial Zn/ZnO nanocables in the subsequent oxidation at 200 °C. In the Zn/ZnO nanocable, epitaxial relations of [1 0 0]_Zn//[1 0 0]_ZnO, and (0 0 1)_Zn//(0 0 1)_ZnO existed at the interface between the Zn core and ZnO shell. A number of dislocations were also observed in the interface region of the Zn/ZnO nanocable, which are attributed to large differences in the lattice constants of Zn and ZnO. With further increasing the oxidation temperature over 400 °C, Zn nanowires were completely oxidized to form polycrystalline ZnO nanowires. The results in this study suggest that coaxial Zn/ZnO nanocable can be fabricated through controlled thermal oxidation of Zn nanowires, yielding various cross-sectional areal fractions of Zn core and ZnO shell.     

1H-1,2,3-triazole,a promising precursor for chemical vapor deposition of hydrogenated carbon nitride

Well-crystallized hydrogenated carbon nitride thin films have been prepared by microwave plasma enhanced chemical vapor deposition (MWPECVD). 1H-1,2,3-triazole+N₂ and Si (1 0 0) were used as precursor and substrate, respectively. Substrate temperature during the deposition was recorded to be 850 °C. The synthesized samples were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and X-ray photo-electron spectroscopy (XPS) analyses. The plasma compositions were checked by optical emission spectroscopy (OES). XRD observation strongly suggests that the films contain polycrystalline carbon nitride with graphitic structure of (1 0 0), (0 0 2), (2 0 0) and (0 0 4). XPS peak quantification reveals that the atomic ratio of the materials C:N:O:Si is 32:41:18:9. X-ray photo-electron peak deconvolution shows that the most dominant peak of C (1s) and N (1s) narrow scans correspond to sp² hybrid structure of C₃N₄. These observations indicate that 1H-1,2,3-triazole favors the formation of hydrogenated carbon nitride with graphitic phase by CVD method and thus is in good agreement with XRD results. SEM of surface and OES of plasma also support the formation of polycrystalline carbon nitride films from 1H-1,2,3-triazole+N₂ by CVD.     

GaN-based nitride semiconductor films deposited on nitrified HfO2/Si substrate by molecular beam epitaxy

Nitrified HfO₂/Si substrate was used to grow GaN-based film with molecular beam epitaxy. Four-period InGaN/GaN layered structure and p/n junction were deposited on the nitrified HfO₂/Si. X-ray photoelectron spectroscopy (XPS) result shows that N was effectively incorporated into the HfO₂. The crystallographic relationship of the GaN/HfO₂/Si is GaN(0 0 0 2)∥HfO₂(1 1 1)∥Si(1 1 1). Temperature-dependent photoluminescence (PL), PL peak wavelength, PL peak intensity, and PL full-width at half-maximum of the p/n junction were investigated. Light-emitting diode was fabricated from the p/n junction. Red light was emitted at low voltage and yellow light was emitted when increasing the voltage.     

Microstructure and percolation threshold characteristics of reactive sputtered Au-TiO2 granular composite films

The Au/TiO₂ composite films were prepared by using reactive co-sputtering technique. The size and shape of the embedded Au particles and the absorption spectra of the composite films were investigated by using SEM, XRD, and UV-VIS-NIR spectrophotometer, respectively. The average size of Au particles and the electrical conductivity decrease as the sputtering pressure increases. The normalized conductivity of the films deposited at five different pressures with the Au concentration in the range of 0.15-0.91 were measured. The percolation threshold increases from 0.21 to 0.90 as the sputtering pressure increases from 2 × 10⁻² Torr to 9.5 × 10⁻² Torr.