Layer-by-layer growth and growth-mode transition of SrRuO3 thin films on atomically flat single-terminated SrTiO3 (1 1 1) surfaces

We report on growth-mode transitions in the growth of SrRuO₃ thin films on atomically flat Ti⁴⁺ single-terminated SrTiO₃ (1 1 1) substrates, investigated by reflection high-energy electron diffraction and atomic force microscopy. Over the first ~9 unit cells, the dominant growth mode changes from island to layer-by-layer for the growth rate of 0.074 unit cells/s and the growth temperature of 700 °C. Moreover, in the course of growing SrRuO₃ films, the governing growth mode of interest can be manipulated by changing the growth temperature and the growth rate, which change allows for the selection of the desired layer-by-layer mode. The present study thus paves the way for integrations of SrRuO₃ thin layers into (1 1 1)-orientated oxide heterostructures, and hence multi-functional devices, requiring control of the sharp atomic-level interfaces and the layer-by-layer growth mode.     

The growth of GaAs and InAs dots on etched mesas: The effect of substrate temperature on mesa profile and surface morphology on dot distribution

The molecular beam epitaxy (MBE) growth of GaAs and InAs quantum dots on etched mesas has been studied using scanning electron microscopy (SEM) and atomic force microscopy (AFM). The [0 1 1]-oriented mesas are etched into (1 0 0) GaAs substrates, exposing (5 3 3)B sidewall facets. At a substrate temperature of 610 °C a top (1 0 0) plane is seen to evolve on a ridge mesa structure. Alternatively, if the overgrowth is carried out at 630 °C no such facet is seen, and the top ridge remains unchanged during GaAs growth. By controlling the mesa shape, either ordered lines of dots can be grown or the dot density can be varied from <5×10⁸ cm⁻² to >1×10¹¹ cm⁻² on the same substrate in pre-defined regions. The dot distribution observed on the mesa sidewalls and top is discussed in terms of net migration of adatoms from different facets, underlying step density, step height and surface curvature of the mesa top.     

The role of the pressure in pulsed laser deposition of bioactive glass films

Effects of the Ar pressure on the morphology, structure, bonding configuration and deposition rate of the bioglass thin films were investigated by atomic force microscopy (AFM), scanning electron microscopy (SEM), X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR) and crystal lattice monitor. Ar pressure has an influence on the quantity and shapes of the particles generated in the PLD process. The target bonding configuration is not correctly transferred to the films. This effect is attributed to the network rearrangement during the film growth, which is associated to special structure of glass and complex physical mechanisms of PLD. Deposition rate decreases as the pressure increases following a linear dependence.     

First principles studies on In-related nitride semiconductors

In-related nitride semiconductors exhibit characteristic behavior which can be ascribed to the large difference in the covalent radius between In and N atoms. We consider atomic and electronic structures of N mono-vacancies (V_N) in InGaN in detail by the first principles calculations. We find that the second nearest neighbor In–In interactions, which are not important in conventional semiconductors such as Si and InAs, are as crucial as the nearest neighbor In–N interaction in In-related nitride semiconductors. Moreover, we clearly show that the strong second nearest neighbor In–In interactions in InN are the physical origin of the unusually narrow band gap of InN.     

Epitaxial films of metals from the platinum group (Ir,Rh, Pt and Ru) on YSZ-buffered Si(1 1 1)

In the present work we have grown twin-free single crystal metal films of iridium (Ir), rhodium (Rh), platinum (Pt) and ruthenium (Ru) on silicon (1 1 1) substrates via an yttria-stabilized zirconia (YSZ) buffer layer. A prerequisite for the realisation of heteroepitaxial metal films without additional texture components was the twin-free deposition of the YSZ films by pulsed laser deposition (PLD). For the metal films on top, a novel two-step growth process was applied with an extremely low deposition rate for the first 20 nm. For all metals, a drastic texture improvement by up to a factor of 9 could be observed compared to the oxide buffer layer. Minimum values were 0.18° (Ir) and 0.12° (Rh) for tilt and twist, respectively. For all four metals investigated, twin-free epitaxial films could be grown on YSZ/Si(1 1 1) whereas the twinning problem for platinum films was solved by decoupling the Pt-YSZ interface via an additional iridium interlayer. The grown metal/YSZ/Si(1 1 1) multilayer samples offer the possibility to integrate a variety of interesting nanostructures and functional materials on silicon. They are now available in 4 in wafer size.     

Growth of cubic InN films with high phase purity by pulsed laser deposition

Cubic InN films have been grown on MgO (1 0 0) substrates with cubic GaN buffer layers by pulsed laser deposition (PLD). It has been found that cubic InN (1 0 0) films grow on the GaN (1 0 0)/MgO (1 0 0) structure with an in-plane epitaxial relationship of [0 0 1]_InN∥[0 0 1]_GaN∥[0 0 1]MgO. The phase purity of a cubic InN film grown at 440 °C was as high as 99% that can probably be attributed to the enhanced surface migration of film precursors in case of PLD. These results indicate that PLD is a suitable technique for the growth of high-quality cubic InN films, and will makes it possible to fabricate optical and electron devices based on cubic InN films.     

Effects of initial stages on the crystal quality of nonpolar a-plane AlN on r-plane sapphire by low-pressure HVPE

A 4–6 μm thick a-plane (1 1 2¯ 0) AlN was grown on r-plane sapphire substrate by low-pressure hydride vapor phase epitaxy (LP-HVPE), using a direct growth without any nitridation and buffer layer, a single-step nitridation growth, a two-step nitridation growth and a two-step buffer growth method. For the two-step buffer growth procedure, smoother surface is observed with the lower full widths at half maximum (FWHM) of X-ray rocking curves (XRC) compared with the other two kinds of nitridation procedures. A smaller FWHM of in-plane XRC peak anisotropy features are reversed, which is consistent with the smaller in-plane stress anisotropic distribution in a-plane AlN, when the two-step nitridation or buffer growth method is used. In four kinds of initial growth procedures, the two-step buffer method is the suitable method for the growth of a-plane AlN by HVPE with the high crystal quality and more isotropic distribution.     

Influence of off-cut angle of r-plane sapphire on the crystal quality of nonpolar a-plane AlN by LP-HVPE

The effect of the off-cut angle of an r-plane sapphire substrate has been investigated on the growth of a-plane AlN thick layer by low-pressure hydride vapor phase epitaxy (LP-HVPE). The off-cut angle (θ) was changed from +5.0° (close to c-axis) to −5.0° (close to m-axis). Results show that the crystalline quality and surface morphology are very sensitive to the sign of θ off-angle. The plus θ off-angle is found to be dramatically reduce the full-widths at half-maximum (FWHM) of X-ray rocking curves (XRC), compared with the minus θ off-angle. In-plane FWHM anisotropic feature marked as M- or W-shape dependence on azimuth angle was observed for a-plane AlN. The shape and degree of anisotropy depend on the sign of θ off-angle, while the plus of θ off-angle will leads to the W-shape and the decreased anisotropy. The minimum crystal tilts and twists of the films are observed for the vicinal sapphires with the plus off-angles of +0.2° to +1.0°.     

Growth and characterization of GaAs layers on polished Ge/Si by selective aspect ratio trapping

Epitaxial GaAs layers have been deposited on polished Ge film grown on exactly (0 0 1) oriented Si substrate by metal-organic chemical vapor deposition (MOCVD) via aspect ratio trapping (ART) method. Double-crystal X-ray diffraction shows that the full-width at half-maximum (FWHM) of the (4 0 0) reflection obtained from 1 μm GaAs is 140 arcsec. Scanning electron microscopy (SEM) of the GaAs layer surface shows that the amount of antiphase domain defects (APD) raised from GaAs/Ge interface using Ge ART on Si is dramatically reduced compared to GaAs layers grown on exact (0 0 1) Ge substrate. Defect reduction and Ge diffusion at vicinal GaAs/Ge interface were investigated via cross-section transmission electron microscopy (X-TEM) and secondary ion mass spectrometry (SIMS). Film morphology and optical properties were evaluated via SEM and room temperature photoluminescence (PL).     

Growth kinetics of SiGe/Si superlattices on bulk and silicon-on-insulator substrates for multi-channel devices

We have studied in reduced pressure chemical vapor deposition the growth kinetics of Si and Si_0.8Ge_0.2 on bulk Si(0 0 1) and on silicon-on-insulator (145 nm buried oxide/20 nm Si over-layer) substrates. For this, we have grown at 650 °C, 20 Torr 19 periods (Si_0.8Ge_0.2 19 nm/Si 32 nm) superlattices on both types of substrates that we have studied in secondary ion mass spectrometry, X-ray diffraction and cross-sectional transmission electron microscopy. The Si and SiGe growth rates together with the Ge content are steady on bulk Si(0 0 1), with mean values around 9.5 nm min⁻¹ and 20.2%, respectively. In contrast, growth rates decrease from ∼9.5 nm min⁻¹ down to values around 7.0 nm min⁻¹ (SiGe) and 6.3 nm min⁻¹ (Si), when the deposited thickness on SOI increases from 0 up to slightly more than 100 nm. They then go back up to values around 8.8–9.0 nm min⁻¹ as the thickness increases from 100 up to 400 nm. They then slowly decrease to values around 8.4–8.6 nm min⁻¹ as the thickness increases from 400 up to 800 nm. The Ge concentration follows on SOI exactly the opposite trend: an increase from 19.9% (0 nm) up to 20.6% (∼100 nm) followed by a decrease to values around 20.1% (400 nm) then a slow re-increase up to 20.4% (800 nm). These fluctuations are most likely due to the following SOI surface temperature variations: from 650 °C down to 638 °C (100 nm), back up to 648 °C (400 nm) followed by a slow decrease to 646 °C (800 nm). These data curves will be most useful to grow on conventional SOI substrates large number of periods, regular Si/Si_0.8Ge_0.2 superlattices that will serve as the core of multi-channel or three-dimensional nano-wires field effect transistors.     

Effect of NH3 flow rate on m-plane GaN growth on m-plane SiC by metalorganic chemical vapor deposition

This paper reports a study of the effect of NH₃ flow rate on m-plane GaN growth on m-plane SiC with an AlN buffer layer. It is found that a reduced NH₃ flow rate during m-plane GaN growth can greatly improve the recovery of in situ optical reflectance and the surface morphology, and narrow down the on-axis (1 0 1¯ 0) X-ray rocking curve (XRC) measured along the in-plane a-axis. The surface striation along the in-plane a-axis, a result of GaN island coalescence along the in-plane c-axis, strongly depends on the NH₃ flow rate, an observation consistent with our recent study of kinetic Wulff plots. The pronounced broadening of the (1 0 1¯ 0) XRC measured along the c-axis is attributed to the limited lateral coherence length of GaN domains along the c-axis, due to the presence of a high density of basal-plane stacking faults, most of which are formed at the GaN/AlN interface, according to transmission electron microscopy.     

Low-temperature RPCVD of Si,SiGe alloy,and Si1−yCy films on Si substrates using trisilane (Silcore)

Si homo-epitaxial growth by low-temperature reduced pressure chemical vapor deposition (RPCVD) using trisilane (Si₃H₈) has been investigated. The CVD growth of Si films from trisilane and silane on Si substrates are compared at temperatures between 500 and 950 °C. It is demonstrated that trisilane efficiency increases versus silane's one as the surface temperature decreases. Si epilayers from trisilane, with low surface roughness, are achieved at 600 and 550 °C with a growth rate equal to 12.4 and 4.3 nm min⁻¹, respectively. It is also shown that Si_1−xGe_x layers can be deposited using trisilane chemistry.     

Effect of N2/CH4 flow ratio on microstructure and composition of hydrogenated carbon nitride films prepared by a dual DC-RF plasma system

Hydrogenated carbon nitride (a-CN:H) films were deposited on n-type (1 0 0) silicon substrates making use of direct current radio frequency plasma enhanced chemical vapor deposition (DC-RF-PECVD), using a gas mixture of CH₄ and N₂ as the source gas in range of N₂/CH₄ flow ratio from 1/3 to 3/1 (sccm). The deposition rate, composition and bonding structure of the a-CN:H films were characterized by means of X-ray photoelectron spectroscopy (XPS) and Fourier-transform infrared spectrometry (FTIR). The mechanical properties of the deposited films were evaluated using nano-indentation test. It was found that the parameter for the DC-RF-PECVD process had significant effects on the growth rate, structure and properties of the deposited films. The deposition rate of the films decreased clearly, while the N/C ratio in the films increased with increasing N₂/CH₄ flow ratio. CN radicals were remarkably formed in the deposited films at different N₂/CH₄ flow ratio, and their contents are related to the nitrogen concentrations in the deposited films. Moreover, the hardness and Young’s modulus of the a-CN:H films sharply increased at first with increasing N₂/CH₄ flow ratio, then dramatically decreased with further increase of the N₂/CH₄ flow ratio, and the a-CN:H film deposited at 1/1 had the maximum hardness and Young’s modulus. In addition, the structural transformation from sp³-like to sp²-like carbon-nitrogen network in the deposited films also was revealed.     

Mg doping behavior of MOVPE InxGa1−xN (x∼0.4)

The Mg doping behavior of MOVPE indium gallium nitride (InGaN), such as secondary ion mass spectrometry (SIMS) Mg profile, crystalline quality and n–p conversion of the films are described and discussed in this paper. The SIMS analysis reveals that the memory effect of Cp₂Mg as a doping source deteriorates the controllability of Mg doping level and profile, especially for thin (−0.4 μm) InGaN. The high residual donors (10¹⁹–10²⁰ cm⁻³) in InGaN with In content from 0.05 to 0.37 can be compensated by Mg doping and p-type conduction is obtained for those with In content up to 0.2. It is found that a higher Cp₂Mg flow rate is needed to get p-type conduction in InGaN with a higher In content x; for example, Cp₂Mg/(TEG+TMI)≈0.5% for x=0 (GaN), ≈2% for x=0.05 and ≈4% for x=0.2. Such a high Cp₂Mg flow rate is needed due to the high residual donor concentration (10¹⁹–10²⁰ cm⁻³) of InGaN films and the low activation efficiency of Mg. The crystalline quality of InGaN is deteriorated with increasing In content as well as Mg doping level. To achieve a p-type InGaN with a lower Mg doping, it is essential to improve the crystalline quality of non-doped InGaN. For this purpose, the use of a thicker GaN interlayer is effective.     

Structural analysis of Cd-Te-O films prepared by RF reactive sputtering

Crystalline and microcrystalline Cd-Te-O samples have been obtained by RF reactive sputtering from a CdTe target using N₂O as oxidant. The growth conditions were substrate temperatures of 323 K, 573 K and 773 K and cathode voltage of −400 V, corresponding to 30 W of forward power. The samples were studied by micro-Raman spectroscopy, X-ray diffraction and optical transmittance. The films are remarkably transparent in the visible range, with transmittances about 88% at 400 nm and band gap energies above the absorption edge of the glass substrates. Although only the samples prepared at 773 K present defined diffraction peaks, the analysis of the Raman spectra indicate that samples prepared at 323 K and 573 K have a defined microstructure indeed. The spectra fitting performed by comparison with pattern compounds demonstrate that Cd-Te-O films are formed of Te-O units similar to those present in metal oxide-doped tellurite glasses, such as TeO₃ and TeO_3 + 1 linked through Cd-O bonds. As the substrate temperature increases the microstructure evolves from a γ-TeO₂ richer state to Cd_xTe_yO_z. In the crystalline sample the main phase identified was CdTeO₃ even though evidence of other phases was observed.     

Epitaxial growth of InN films on lattice-matched EuN buffer layers

Indium nitride (InN) films have been grown on lattice matched europium nitride (EuN) buffer layers by pulsed laser deposition (PLD) and their structural properties have been investigated. It has been revealed that the growth of EuN films on Al₂O₃ (0 0 0 1) substrates leads to the formation of polycrystalline EuN films, whereas epitaxial EuN (1 1 1) films grow on MgO (1 1 1) substrates at 860 °C. By using the EuN (1 1 1) films as buffer layers for InN growth, we have succeeded in the epitaxial growth of InN (0 0 0 1) films at 490 °C with an in-plane epitaxial relationship of [1 1 2¯ 0]_InN∥[1 1¯ 0]_EuN∥[1 1¯ 0]_MgO, which minimized the lattice mismatch between InN and EuN.     

N-face GaN growth on c-plane sapphire by metalorganic chemical vapor deposition

In this work, we report the growth of smooth, high-quality N-face GaN on c-plane sapphire by metalorganic chemical vapor deposition. It is found that the nitridation temperature of sapphire has a critical effect on the surface morphology of N-face GaN. Sapphire after a severe nitridation gives rise to a high density of hexagonal hillocks during N-face GaN growth. Smooth N-face GaN has been grown on appropriately nitridized sapphire. The N-polarity of the GaN film has been confirmed with no inversion domain by convergent beam electron diffraction. Controlled growth interruption is carried out to study the nucleation evolution during N-face GaN growth, which is found distinctly different from the two-step growth of Ga-face GaN. Atomically smooth N-face GaN has been achieved with comparable structural quality to Ga-face GaN.     

Thermodynamics of GaAs nanowire MBE growth with gold droplets

The thermodynamics of growth conditions of GaAs nanowires using gold droplets is analyzed. Equilibrium conditions for steady-state growth using experimental molecular beam epitaxy (MBE) impinging molecular flows, as previously published, are calculated in the range 793–893 K. These show that: (i) the tie line for Ga liquidus composition in equilibrium with GaAs(s) is in the 0.4–0.6 mole fraction range, close to the GaAu–GaAs pseudo-binary section, (ii) the As content of the droplet is in the 0.2–0.4×10⁻³ mole fraction range and (iii) the growth rate is mainly governed by the contact angle that determines the droplet section. Different cooling conditions are analyzed using the Scheil–Guliver assumptions to compare final phases after solidification, as analyzed by X-ray diffraction (XRD), with our calculations. The agreement is very good and this feature demonstrates that quasi-equilibrium conditions prevail in the growth process of nanowires.     

Preparation of a crack-free AlN template layer on sapphire substrate by hydride vapor-phase epitaxy at 1450 °C

A crack-free aluminum nitride (AlN) template layer was grown on a (0 0 0 1) sapphire substrate at 1450 °C using a thin (100 nm) protective AlN layer grown at 1065 °C by hydride vapor-phase epitaxy (HVPE). Full-width at half-maximum (FWHM) values of X-ray rocking curves (XRCs) for (0 0 0 2) and (1 0 1¯ 0) planes of the AlN layer were 378 and 580 arcsec, respectively. The formation of voids was observed at the interface between the thin protective AlN layer and the sapphire substrate due to decomposition reaction of sapphire during heating up to 1450 °C. The voids relaxed the tensile stress in the AlN layer, which resulted in the suppression of cracks.