Temperature effect on solvent diffusion in rigid and semirigid polyimide films

The diffusion of NMP (n-methyl-pyrrolidinone) solvent in a semirigid rod-like PMDA-ODA (pyromellitic dianhydride-4,4′-oxydianiline) film coated on silicon is found to be case I diffusion at temperatures ranging from 30 to 90°C by the use of a bending beam technique. The diffusion constant increases for the 7.4 μm PMDA-ODA film (which was cured at 300°C) from 3.3 to 318 × 10^?11 cm²/s as the diffusion temperature increases from 30 to 90°C. The corresponding hygroscopic stress in the direction parallel to the film decreases with the increase of temperature, possibly due to the softening of the film at elevated temperatures. The diffusion mechanism, however, changes from case II to case I in a rigid rod-like PMDA-PDA (pyromellitic dianhydride-p-phenylenediamine) film when the diffusion temperature increases. The change in the diffusion mechanism occurs at a higher temperature for thinner films, presumably due to higher ordering and/or orientation in the films. The activation energy for NMP diffusion in the PMDA-ODA films markedly decreases from 93 to 59 kJ/mole as the film thickness increases from 2.2 μm to 11.3 μm. This may also be attributed to decreased ordering in thicker films. © 1994 John Wiley & Sons, Inc.     

Matrix-assisted pulsed laser evaporation of polyimide thin films and the XPS study

Compared with the traditional thin film techniques, the matrix-assisted pulsed laser evaporation (MAPLE) technique has many advantages in the deposition of polymer and organic thin films. It has a wide range of applications in many fields, such as non-linear optics, luminescent devices, electronics, various sensors. We have successfully deposited polyimide thin films by using the MAPLE technique. These films were characterized with XPS. The XPS spectra showed that the single-photon effect is ob-vious at low laser fluence and the chemical bonds will be broken, resulting in decomposition of the films. Contrarily, the single-photon effect will decrease and the multi-photon effect and the photothermal effect will increase at high laser fluence, resulting in the protection of the structure of the polyimide thin films and the obvious decrease in decomposition. High laser fluence is more suitable for the deposition of polymer and organic thin films than low laser fluence.     

Effect of the RF-discharge plasma treatment of thin polyimide films on water diffusion

The effects of the treatment of thin polyimide films of different thickness (2–7.5 µm), which were prepared from poly(amic acid) solutions, in a radiofrequency-discharge plasma on the diffusion of water and the permittivity were studied. It was found that the diffusion coefficients of water in the films increased with film thickness. The increase of the diffusion coefficients by a factor of 4–24 and an increase in the permittivity by a factor of 1.5–2 after the action of an RF discharge on the films was explained by an increase in the amount of polar groups and the formation of an excess negative charge, which was injected from the plasma, in the bulk of the films.__________Translated from Khimiya Vysokikh Energii, Vol. 39, No. 3, 2005, pp. 232–236.Original Russian Text Copyright © 2005 by Zhukova, Zhukov, Drachev.     

Sorption and diffusion of water vapor in polyimide films

Sorption and diffusion of water vapor are investigated gravimetrically for polyimide films. The activity dependence of the solubility and diffusion coefficients, S and D, respectively, is classified under four types: (1) constant S and D type, (2) dual-mode sorption and transport type, (3) dual-mode type followed by a deviation due to a plasticization effect at high vapor activity, and (4) constant S and D type followed by a deviation due to water cluster formation at high activity. For the dual-mode type, the Henry's law component is much larger than the Langmuir component except at low activity, and therefore deviation in behavior from the first type is small. S is larger for polyimides with higher content of polar groups such as carbonyl, carboxyl, and sulfonyl. D is larger for polyimides with a higher fraction of free space, with some exceptions. The polyimide from 3,3′,4,4′-biphenyltetracarboxylic dianhydride and dimethyl-3,7-diaminodibenzothiophene-5, 5-dioxide belongs to the third type and displays both large S and large D. The polyimide from 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride and 4,4′-oxydianiline belongs to the fourth type, and has the largest D but rather small S because of the hydrophobic C(CF₃)₂ groups. © 1992 John Wiley & Sons, Inc.     

Microdeformation in thin films of 3FDA/PMDA polyimide and polyimide nanofoams

Transmission electron microscopy has been used to investigate the microdeformation behavior of thermally imidized thermoplastic pyromellitic dianhydride/1,1-bis(4-amino-phenyl)-1-phenyl-2,2,2 trifluoroethylene (3FDA/PMDA) polyimide films with a T_g of ～ 440°C, prepared by solution casting of a polyamic ester precursor. Failure of the films at room temperature was by unstable cracking at about 5% strain, accompanied by homogeneous shear deformation at the crack tips. As the temperature was raised to above 100°C, zones of mixed shear and crazing were observed, and a stick-slip mode of cracking. Above about 300°C shear was once again the dominant deformation mechanism and the films became fully ductile. In films containing porosity on a scale of a few nanometers, prepared by thermal degradation/imidization of a 3FDA/PMDA/poly α-methyl styrene graft copolymer, film failure at room temperature was also by unstable cracking, but a zone of multiple craze-like features was observed at crack tips, rather than a single shear deformation zone. The increase in extent of this zone of craze-like features as the temperature was raised was again associated with an increase in crack stability. ©1995 John Wiley & Sons, Inc.     

Characterization of vapor deposition polymerized polyimide thin films

Vapor deposition polymerized (VDP) polyimide (PI) thin films were prepared and characterized by using thermogravimetrical analysis (TGA), scanning electron microscopy (SEM), atomic force microscopy (AFM), Fourier transform infrared (FTIR), and bending-beam techniques. The film properties investigated were thermal stability, wet-etching characteristics, surface topology, imidization characteristics, internal stress upon curing and thermal cycling, and hygroscopic stress upon moisture diffusion. Markedly different characteristics are observed for the VDP-PI films when comparing with the conventional ones. They seem denser in film structure and have better mechanical properties, but are somewhat less stable in thermal resistance. © 1996 John Wiley & Sons, Inc.     

Non-fickian diffusion in thin polymer films

Diffusion of penetrants through polymers often does not follow the standard Fickian model. Such anomalous behavior can cause difficulty when designing polymer networks for specific uses. One type of non-Fickian behavior that results is so-called case II diffusion, where Fickian-like fronts initially move like √t with a transition to a non-Fickian concentration profile and front speed for moderate time. A mathematical model is presented that replicates this behavior in thin polymer films, and an analysis is performed that yields relevant dimensionless groups for study. An unusual result is derived: In certain parameter ranges, the concentration profile can change concavity, reflecting Fickian behavior for short times and non-Fickian behavior for moderate times. Asymptotic and numerical results are then obtained to characterize the dependence of such relevant quantities as failure time, front speed, and mass transport on these dimensionless groups. This information can aid in the design of effective polymer protectant films. © 1996 John Wiley & Sons, Inc.     

Water sorption and activation energy in polyimide thin films

The water sorption behavior and the activation energy were investigated for various chemical structure polyimide thin films; BPDA‐PDA, BPDA‐ODA, PMDA‐ODA, and 6FDA‐ODA. The activation energy for the water diffusion varied in the range of 5.53 to 9.27kcal/mol, and was in the increasing order: BPDA‐PDA < BPDA‐ODA < PMDA‐ODA < 6FDA‐ODA. BPDA‐PDA and BPDA‐ODA polyimide films showed relatively well‐ordered morphological structure, which results in relatively low diffusion coefficient and high activation energy. It was found that the diffusion coefficient and the activation energy are significantly related to the in‐plane orientation, crystallinity, and packing order in the polyimide thin films. The morphological structure was predominant factors for the water diffusion coefficient and activation energy in the polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2714–2720, 2000     

A study on dielectric characteristics of fluorinated polyimide thin film

In this work, the effects of fluorination of polyimide thin films on surface and dielectric characteristics were studied using X-ray photoelectron spectroscopy (XPS) and dielectric spectrometry, respectively. The thermal and mechanical properties of the film were characterized by thermogravimetric analysis (TGA) and tensile strengths, respectively. The fluorine content of the polyimide thin film was increased with increasing treatment concentration, resulting in decreasing dielectric constant of the film. It was found that the replacement of fluorine led to the decrease of the local electronic polarizability of polyimide, or to the increase of the free volume, which can be attributed to the relatively large size of fluorine. Nevertheless, the fluorination did not significantly affect thermal or mechanical properties of the polyimide film under mild conditions in this system.     

Thermal stress analysis for polyimide thin film: The effect of solvent evaporation

We propose a stress model to account for the thermal stress caused by a mismatch of isobaric expansivity, solvent evaporation, and imidization. The evaporation strain term is given as functions of a viscosity, and solvent weight fraction. The proposed model is in very good agreement with experimental data and gives useful information about the analysis of the thermal stress caused in polymeric films.     

聚酰亚胺中溶剂成份的剖析

报道了用红外光谱法和GC/MS法对聚酰亚胺中所含溶剂成份的分析与鉴定。在红外光谱分析中，采用液膜法测定红外光谱图提供官能团的有关信息确定溶剂可能结构。由EI源质谱仪获得聚酰亚胺中所含溶剂成份的MS图和数据。并提出它的碎片裂解途径和特征离子，进行了辅助分析，确定了所含溶剂结构。     

Nanoindentation studies of polyimide thin films with various internal linkages in the diamine component

Polyimide thin films were synthesized from 3,3′,4,4′‐biphenyltetracarboxylic acid dianhydride (BPDA) and four different diamines (p‐phenylene diamine, 4,4′‐oxydiphenylene diamine, 4,4′‐biphenylene diamine, and 4,4′‐sulfonyldiphenylene diamine). The nanoindentation behavior of the resulting polyimides, namely, poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA), poly(4,4′‐biphenylene biphenyltetracarboximide) (BPDA‐BZ), poly(4,4′‐oxydiphenylene biphenyltetracarboximide) (BPDA‐ODA), and poly(4,4′‐sulfonyldiphenylene biphenyltetracarboximide) (BPDA‐DDS), were investigated. Also, the morphological properties were characterized with a prism coupler and wide‐angle X‐ray diffraction and were correlated to the nanoindentation studies. The nanoindentation behavior and hardness varied quite significantly, depending on the changes in the chemical and morphological structures. The hardness of the polyimide thin films increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐BZ < BPDA‐PDA. For all the polyimide thin films, except that of BPDA‐BZ, the hardness decreased with an increase in the load. The birefringence, a measure of the molecular in‐plane orientation, increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐PDA < BPDA‐BZ. The X‐ray diffraction studies revealed that the crystallinity of the polyimide thin films varied with the changes in the chemical structure. The studies showed that the indentation response with an applied load and the hardness by nanoindentation for the BPDA‐based polyimides were closely related to the morphological structure. The nanoindentation and birefringence results revealed that the mechanical properties of the polyimide thin films were dependent on the crystallinity, which arose because of the chain order along the chain axis and the molecular packing order. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 861–870, 2004     

A study of dimethylferrocene diffusion and electrode kinetics using microelectrode voltammetry in poly(ethylene glycol) solvent

The heterogeneous electron transfer rate constant (k _s) of dimethylferrocene (DMFc) was estimated using cyclic voltammetric peak potential separations taken typically in a mixed diffusion geometry regime in a polyelectrolyte, and the diffusion coefficient (D) of DMFc was obtained using a steady-state voltammogram. The heterogeneous electron transfer rate constant and diffusion coefficient are both smaller by about 100-fold in the polymeric solvent than in the monomeric solvent. The results are in agreement with the difference of longitudinal dielectric relaxation time (τ_L) in the two kinds of solvents, poly(ethylene glycol) (PEG) and CH₃CN, indicating that k _s varies inversely with τ_L; k _s is proportional to D of DMFc. Both D and k _s of DMFc in PEG containing different supporting electrolytes and at different temperatures have been estimated. These results show that D and k _s of DMFc increase with increasing temperature in the polyelectrolyte, whereas they vary only slightly with changing the supporting electrolyte. Received: 5 February 1998 / Accepted: 23 July 1998     

Pulsed laser ablation and deposition of thin films

Pulsed laser ablation is a simple, but versatile, experimental method that finds use as a means of patterning a very diverse range of materials, and in wide areas of thin film deposition and multi-layer research. Superficially, at least, the technique is conceptually simple also, but this apparent simplicity hides a wealth of fascinating, and still incompletely understood, chemical physics. This overview traces our current physico-chemical understanding of the evolution of material from target ablation through to the deposited film, addressing the initial laser-target interactions by which solid material enters the gas phase, the processing and propagation of material in the plume of ejected material, and the eventual accommodation of gas phase species onto the substrate that is to be coated. It is intended that this Review be of interest both to materials scientists interested in thin film growth, and to chemical physicists whose primary interest is with more fundamental aspects of the processes of pulsed laser ablation and deposition.     

Structure and properties of thin films of binary rodlike/flexible polyimide mixtures

Binary mixtures of a rodlike poly(p-phenylene pyromellitimide) (PMDA-PDA) and a flexible 6F-BDAF polyimide synthesized from hexafluoroisopropylidene diphthalic anhydride and 2,2-bis(4-aminophenoxy-p-phenylene) hexafluoropropane were prepared by solution-blending of the meta-PMDA-PDA poly(amic ethyl ester) and 6F-BDAF poly(amic acid) precursors, followed by solvent evaporation and thermal imidization. Mixtures containing different molecular weights of 6F-BDAF poly(amic acid) were studied. The size scale of the phase separation, as measured by light scattering, is ca. 1 μm or smaller in most cases. The domain size is primarily set by the demixing of the precursor polymers during solvent evaporation, with no significant coarsening observed during the thermal imidization. The observed variation of the domain size with molecular and process parameters such as composition, molecular weight, and film thickness is discussed in terms of the miscibility of the precursor polymers, rate of solvent evaporation, and solidification. Dynamic mechanical thermal analysis and dielectric relaxation measurements indicate that the glass transition temperature of 6F-BDAF is unaffected in all of the mixtures studied, indicating complete demixing of rodlike and flexible polyimides in agreement with theory. X-ray photoelectron spectroscopy results show a strong surface segregation of 6F-BDAF in mixtures containing as low as 10% by weight of the 6F-BDAF component in the bulk. The mixtures with PMDA-PDA as the major matrix component therefore exhibit excellent mechanical toughness, dimensional stability up to 500°C, low coefficients of thermal expansion (< ca. 10 ppm/°C), and low dielectric constants (<3.0). On the other hand, the surface properties of the mixtures are dominated by the flexible 6F-BDAF, resulting in excellent polymer/polymer self-adhesion (lamination) properties between fully imidized films.     

Influence of curing temperature on the optical properties of fluorinated polyimide thin films

The influence of curing temperature (CT) on the optical properties of 6FDA/ODA poly(amic acid)-polyimide (PAA-PI) films was characterized by measuring ATR-FT-IR spectra, refractive index (RI) and birefringence of the films. The results showed that the infrared absorption intensity of characteristic peaks (IAICP) corresponding to the imide ring and the RI of PAA-PI films reached their maxima when the films had been cured at 270 °C, while the magnitude of birefringence (|Δn|) of the films reached its minimum as CT rose up to 330 °C. However, the RI decreased as CT was between 270 °C and 330 °C. Both the RI and |Δn| of the film increased obviously when CT increased after 330 °C. We think this is due to the interchain crosslink reaction (ICCR) above 330 °C and can be an evident proof of ICCR. And the evidences supporting ICCR was also discussed via IR differential spectra.     

Single molecule spectroscopy studies of diffusion in mesoporous silica thin films

Single molecule spectroscopy is applied in studies of diffusion and surface adsorption in sol-gel-derived mesoporous silica thin films. Mesoporous films are obtained by spin casting surfactant-templated sols onto glass substrates. Small-angle X-ray diffraction results are consistent with hexagonally ordered mesophases in as-synthesized (i.e., surfactant-containing) films. Upon calcination, a 30% contraction and disordering of these structures occurs. Nile Red is used as a fluorescent probe of both the as-synthesized and calcined films. It is loaded into the samples at subnanomolar levels either prior to spin casting or after calcination. Fluorescence imaging and single-point fluorescence time transients show the dye molecules to be relatively mobile in the as-synthesized samples. In contrast, the molecules appear entrapped at fixed locations in dry calcined films. In calcined films rehydrated under high humidity conditions, the Nile Red molecules again become mobile. Time transients obtained from the as-synthesized and rehydrated samples provide clear evidence for frequent reversible adsorption of the dye to the silica surfaces. Autocorrelations of the time transients provide quantitative data on the mean diffusion coefficients (D = 2.4 x 10(-10) and 2.6 x 10(-10) cm2/s) and mean desorption times (1/k = 25 and 40 s) for the as-synthesized and rehydrated films, respectively. The results prove both water and surfactant play important roles in governing matrix interactions and mass transport.     

Controllable porous fluorinated polyimide thin films for ultralow dielectric constant interlayer dielectric applications

In this paper, silica microspheres were used as template to prepare porous fluorinated polyimide (FPI) thin films from polyamic acid (PAA, precursor of FPI) and silica colloid solution. The strong hydrogen-bonding interaction between silica microspheres and PAA chains have improved the dispersion of silica microspheres in N,N-Dimethylformamide (DMF) solution, resulting in the high weight content of silica template in PAA/silica colloid solution, and thus giving rise to the formation of porous FPI films with maximum porosity of 35%. The interior microstructures of the resultant porous FPI thin films were investigated. It is found that the porous FPI thin films have interconnected “ink-bottle-type” porous structure, and the pore size, porosity could be precisely controlled by the diameter and weight content of silica microspheres, respectively. Although both the tensile strength and young modules declined with the increasing porosity, the high level void of the porous FPI films endowed the FPI ultralow dielectric constant of 1.84 when the porosity increased to 35%. Furthermore, the mechanical and dielectric properties of the porous FPI films were closely related to the microstructures and porosity, indicating the desired properties could be controlled to meet the application in the microelectronics.