Characteristics of surface nano-structural modifications in nitrogen ion implanted W as a function of temperature

The surface modifications of tungsten massive samples (0.5 mm foils) made by nitrogen ion (30 keV; 1 × 10¹⁸ N⁺ cm⁻²) implantation are studied by XRD, AFM, and SIMS. XRD patterns clearly showed WN₂ (0 1 8) (rhombohedral) very close to W (2 0 0) line. Crystallite sizes obtained from WN₂ (0 1 8) line, showed an increase with substrate temperature. AFM images showed the formation of grains on W samples, which grew in size with temperature. These morphological changes are similar to those observed for thin films by increasing substrate temperature (i.e. structure zone model (SZM)). Surface roughness variation with temperature, showed a decrease with increasing temperature. The density of implanted nitrogen ions, and the depth of nitrogen ion implantation in W are studied by SIMS. The results show a minimum for N⁺ density at a certain temperature consistent with XRD results (i.e. I_W (2 0 0)/I_W (2 1 1)). This minimum in XRD results is again similar to that obtained for different thin films by Savaloni et al. [Physica B, 349 (2004) 44; Vacuum, 77 (2005) 245] and Shi and Player [Vacuum, 49 (1998) 257].     

Surface nano-structural modifications and characteristics in nitrogen ion implanted W as a function of temperature and N energy

The surface modifications of tungsten massive samples (0.5 mm foils) made by nitrogen ion implantation are studied by SEM, XRD, AFM, and SIMS. Nitrogen ions in the energy range of 16-30 keV with a fluence of 1 × 10¹⁸ N⁺ cm⁻² were implanted in tungsten samples for 1600 s at different temperatures. XRD patterns clearly showed WN₂ (0 1 8) (rhombohedral) very close to W (2 0 0) line. Crystallite sizes (coherently diffracting domains) obtained from WN₂ (0 1 8) line, showed an increase with substrate temperature. AFM images showed the formation of grains on W samples, which grew in size with temperature. Similar morphological changes to that has been observed for thin films by increasing substrate temperature (i.e., structure zone model (SZM)), is obtained. The surface roughness variation with temperature generally showed a decrease with increasing temperature. The density of implanted nitrogen ions and the depth of nitrogen ion implantation in W studied by SIMS showed a minimum for N⁺ density as well as a minimum for penetration depth of N⁺ ions in W at certain temperatures, which are both consistent with XRD results (i.e., I_{W (2 0 0)}/I_{W (2 1 1)}) for W (bcc). Hence, showing a correlation between XRD and SIMS results.     

A refined Ehrlich-Schwoebel effect on the modification of Si surface nanostructures by post ion milling

A modeling work has been conducted on a phenomenon called post ion milling (PIM), a post-treatment of Ar⁺ ion sputtering to modify nanostructures on solid surface. It was found by experiments that for PIM with a sufficiently low ion flux, both the average dot size and the surface roughness of Si nanodot arrays on Si(1 0 0) decline steadily against milling time. However, the usually adopted Kuramoto-Sivashinsky (KS) model involving the Bradley-Harper (BH) theory failed to explain the experimental results, nor the KS model that combines both the BH and Ehrlich-Schwoebel (ES) effects. We reexamined the ES term in the KS equation, and derived new terms reflecting the ES contribution. With such a modification, the KS model involving both the BH and the refined ES effects finally gave a qualitative explanation to the PIM result.     

Synergetic effect between ion energy and sample temperature in the formation of distinct dot pattern on Si(1 1 0) by ion-sputter erosion

We observed a synergetic effect between ion energy and sample temperature in the formation of distinct dot pattern on Si(1 1 0) by Ar⁺ ion sputtering. The ion flux was 20 μA/cm², a value smaller than those used in preceding reports by one or two orders of magnitude. In experiments, the ion energy was from 1 to 5 keV, and the temperature from room temperature to 800 °C. A phase diagram indicating the ranges of ion energy and temperature within which distinct dot patterns can be achieved has been obtained. Data analyses and simulation results reveal that the synergetic effect is consistent with the effect of the Ehrlich-Schwoebel step-edge barrier, rather than the Bradley-Harper model.     

An electrostatic force microscope study of Si nanostructures on Si(1 0 0) as a function of post-annealing temperature and time

The evolution of Si nanostructures induced by Ar⁺ ion sputtering on Si(1 0 0) was studied with electrostatic force microscopy (EFM) as a function of post-annealing temperature (T = room temperature-800 °C) and time (t = 0-160 min). The post-annealing of the nanostructure was conducted in vacuum. It was found that with T increasing, the EFM contrast degraded steadily and became nearly undetectable at T = 800 °C; with t increasing at T = 800 °C, the EFM contrast fell down steadily as well. However, the surface morphology and roughness were much less affected after annealing. The results suggest that the as-formed Si nanostructures may not be epitaxially grown on Si(1 0 0) substrate as claimed before. A plane capacitance model supported this conclusion.     

Using time-of-flight secondary ion mass spectrometry and multivariate statistical analysis to detect and image octabenzyl-polyhedral oligomeric silsesquioxane in polycarbonate

Silsesquioxane, with an empirical formula of RSiO_3/2, has the potential to combine the mechanical properties of plastics with the oxidative stability of ceramics in one material [D.W. Scott, J. Am. Chem. Soc. 68 (1946) 356; K.J. Shea, D.A. Loy, Acc. Chem. Res. 34 (2001) 707; K.-M. Kim, D.-K. Keum, Y. Chujo, Macromolecules 36 (2003) 867; M.J. Abad, L. Barral, D.P. Fasce, R.J.J. William, Macromolecules 36 (2003) 3128]. The high sensitivity, surface specificity, and ability to detect and image high mass additives make time-of-flight secondary ion mass spectrometry (ToF-SIMS) a powerful surface analytical instrument for the characterization of polymer composite surfaces in an analytical laboratory [J.C. Vickerman, D. Briggs (Eds.), ToF-SIMS Surface Analysis by Mass Spectrometry, Surface Spectra/IMPublications, UK, 2001; X. Vanden Eynde, P. Bertand, Surf. Interface Anal. 27 (1999) 157; P.M. Thompson, Anal. Chem. 63 (1991) 2447; S.J. Simko, S.R. Bryan, D.P. Griffis, R.W. Murray, R.W. Linton, Anal. Chem. 57 (1985) 1198; S. Affrossman, S.A. O’Neill, M. Stamm, Macromolecules 31 (1998) 6280]. In this paper, we compare ToF-SIMS spectra of control samples with spectra generated from polymer nano-composites based on octabenzyl-polyhedral oligomeric silsesquioxane (BnPOSS) as well as spectra (and images) generated from multivariate statistical analysis (MVSA) of the entire spectral image. We will demonstrate that ToF-SIMS is able to detect and image low concentrations of BnPOSS in polycarbonate. We emphasize the use of MVSA tools for converting the massive amount of data contained in a ToF-SIMS spectral image into a smaller number of useful chemical components (spectra and images) that fully describe the ToF-SIMS measurement.     

Effect of gas residence time on the morphology of silicon surface etched in SF6 plasmas

This paper describes the effect of the SF₆ gas residence time on the morphology of silicon (1 0 0) samples etched in a reactive ion etching system. Profilometry and atomic force microscopy techniques were used to characterize the etching process focusing attention on the evolution of the surface morphology. Under the condition of variable pressure and gas flow rate, the decrease of the residence time leads to an increase of the silicon etch rate concomitantly with an increase of the surface roughness. Contrary fact is observed when the gas flow is fixed and the pressure is varied. Here, the increasing of residence time leads to a constant increase of silicon etch rate with small variations in final surface roughness. To better understanding this resident time effect, mass spectrometry analyses were realized during the discharge for both gas flow conditions.     

2D and 3D SIMS investigations on sintered steels

Powder metallurgy (PM) is a well-established method for manufacturing ferrous precision parts. Sintering is one of the important production steps and can be strongly enhanced (activated) by formation of a liquid phase during the sintering process. The liquid phase can be reached by the addition of alloying elements (e.g., copper) or sintering activators (e.g., phosphorus) and is formed by melting of eutectic phase mixtures or by incipient melting. The main investigations presented in this work are done by secondary ion mass spectrometry (SIMS): 2D and 3D elemental distribution. Additionally, impact energy and hardness measurements were performed in order to study the influence of phosphorus on mechanical properties. The concentration of P in different samples was varied between 0 and 1 weight percent (wt.%), the carbon content was consistently 0.5 wt.%. Nominal specimens were sintered at 1120 and 1250 °C in protective atmosphere of flowing nitrogen to determine the influence of sintering temperature.     

SIMS investigation of gettering centres produced by phosphorus MeV ion implantation

The ion implantation is a well-known standard procedure in electronic device technology for precise and controlled introduction of dopants into silicon. Damages caused by implantation act as effective gettering zones, collecting unwanted metal impurities. In this work, the consequences of high-energy ion implantation into silicon and of subsequently annealing were analysed by means of secondary ion mass spectrometry (SIMS). The differences in impurities gettering behaviour were studied in dependence of the implantation dose and annealing time at T = 900 °C.     

Nano- and micro-scale patterning of Si (1 0 0) under keV ion irradiation

Evolution of Si (1 0 0) surface under 100 keV Ar⁺ ion irradiation at oblique incidence has been studied. The dynamics of surface erosion by ion beam is investigated using detailed analysis of atomic force microscopy (AFM) measurements. During an early stage of sputtering, formation of almost uniformly distributed nano-dots occurs on Si surface. However, the late stage morphology is characterized by self-organization of surface into a regular ripple pattern. Existing theories of ripple formation have been invoked to provide an insight into surface rippling.     

Thickness influence on surface morphology and ozone sensing properties of nanostructured ZnO transparent thin films grown by PLD

Transparent zinc oxide (ZnO) thin films with a thickness from 10 to 200 nm were prepared by the PLD technique onto silicon and Corning glass substrates at 350 °C, using an Excimer Laser XeCl (308 nm). Surface investigations carried out by atomic force microscopy (AFM) and X-ray diffraction (XRD) revealed a strong influence of thickness on film surface topography. Film roughness (RMS), grain shape and dimensions correlate with film thickness. For the 200 nm thick film, the RMS shows a maximum (13.9 nm) due to the presence of hexagonal shaped nanorods on the surface. XRD measurements proved that the films grown by PLD are c-axis textured. It was demonstrated that the gas sensing characteristics of ZnO films are strongly influenced and may be enhanced significantly by the control of film deposition parameters and surface characteristics, i.e. thickness and RMS, grain shape and dimension.     

AFM investigation on surface evolution of amorphous carbon during ion-beam-assisted deposition

Hydrogen-free amorphous carbons (a-C) have been prepared on mirror-polished Si(1 1 1) wafers through thermally evaporated C₆₀ with simultaneous bombardments of Ne⁺ ions. The time evolution of film surfaces has been characterized by atomic force microscopy (AFM) at two temperatures of 400 and 700 °C, respectively. Based on the topography images and the root-mean-square (rms) roughness analysis, it is found that the a-C surfaces present roughening growth at the initial stage. With increasing growth time, the cooperative nucleation of the islands and pits appears on the surfaces, suggesting three-dimensional growth, and then they continue to evolve to irregular mounds at 400 °C, and elongated mounds at 700 °C. At the steady growth stage, these surfaces further develop to the structures of bamboo joints and ripples corresponding to these two temperatures, respectively. It is believed that besides ion sputtering effect, the chemical bonding configurations in the amorphous carbon films should be taken into considerations for elucidating the surface evolutions.     

Evolution of surface morphology of NiO thin films under swift heavy ion irradiation

NiO nanoparticle thin films grown on Si substrates were irradiated by 107 MeV Ag⁸⁺ ions. The films were characterized by glancing angle X-ray diffraction and atomic force microscopy. Ag ion irradiation was found to influence the shape and size of the nanoparticles. The pristine NiO film consisted of uniform size (∼100 nm along major axis and ∼55 nm along minor axis) elliptical particles, which changed to also of uniform size (∼63 nm) circular shape particles on irradiation at a fluence of 3 × 10¹³ ions cm⁻². Comparison of XRD line width analysis and AFM data revealed that the particles in the pristine films are single crystalline, which turn to polycrystalline on irradiation with 107 MeV Ag ions.     

Thickness dependence on thermal stability of sputtered Ag nanolayer on Ti/Si(1 0 0)

Thermal stability of Ag layer on Ti coated Si substrate for different thicknesses of the Ag layer have been studied. To do this, after sputter-deposition of a 10 nm Ti buffer layer on the Si(1 0 0) substrate, an Ag layer with different thicknesses (150-5 nm) was sputtered on the buffer layer. Post annealing process of the samples was performed in an N₂ ambient at a flow rate of 200 ml/min in a temperature range from 500 to 700 °C for 30 min. The electrical property of the heat-treated multilayer with the different thicknesses of Ag layer was examined by four-point-probe sheet resistance measurement at the room temperature. Phase formation and crystallographic orientation of the silver layers were studied by θ-2θ X-ray diffraction analysis. The surface topography and morphology of the heat-treated films were determined by atomic force microscopy, and also, scanning electron microscopy. Four-point- probe electrical measurement showed no considerable variation of sheet resistance by reducing the thickness of the annealed Ag films down to 25 nm. Surface roughness of the Ag films with (1 1 1) preferred crystallographic orientation was much smaller than the film thickness, which is a necessary condition for nanometric contact layers. Therefore, we have shown that the Ag layers with suitable nano-thicknesses sputtered on 10 nm Ti buffer layer were thermally stable up to 700 °C.     

Sputter depth profiling by secondary ion mass spectrometry coupled with sample current measurements

Ion-induced secondary electron emission determined via sample current measurements (SCM) was employed as a useful adjunct to conventional secondary ion mass spectrometry (SIMS). This paper reports on the results of 3-6 keV O₂⁺ SIMS-SCM sputter depth profiling through CrN/AlN multilayer coatings on nickel alloy, titanium dioxide films deposited on stainless steel, and corrosion layers formed onto surface of magnesium alloy after long-term interaction with an ionic liquid. For Au/AlNO/Ta films on silicon, in addition to SIMS-SCM profiles, the signal of mass-energy separated backscattered Ne⁺ ions was monitored as a function of the depth sputtered as well. The results presented here indicate that secondary electron yields are less affected by “matrix effect” than secondary ion yields, and at the same time, more sensitive to work function variations and surface charging effects. SCM depth profiling, with suppression of “the crater effect” by electronic gating of the registration system is capable of monitoring interfaces in the multilayer structure, particularly, metal-dielectric boundaries. In contrast to SIMS, SCM data are not influenced by the angle and energy windows of an analyser. However, the sample current measurements provide lower dynamic range of the signal registration than SIMS, and SCM is applicable only to the structures with different secondary electron emission properties and/or different conductivity of the layers. To increase the efficiency, SCM should be accompanied by SIMS measurements or predetermined by proper calibration using other elemental-sensitive techniques.     

Natural variability in the surface roughness of combinatorial libraries of materials

Using a conventional method for the fabrication of solid-state combinatorial libraries, we have produced the binary libraries Fe_1−xCr_x and Mo_1−xSn_x (0 < x < 1) and found that their surface roughness is highly dependent on chemical composition. Roughness enhancements of up to 20-fold have been observed on the nanometer scale and were manifested in the boundaries between structurally dissimilar phases. It is anticipated that this is a common occurrence in thin-film libraries of metals and an obstacle in separating the influence of roughness and composition on the performance of library materials in biomaterial studies.     

Range evaluation in SIMS depth profiles of Er-implantations in silicon

In the last decade ion implantation of common dopants in silicon has been almost full characterised. However, data of inner transition elements are based on few measurements or even extrapolations. Our investigations focus on erbium, an upcoming dopant in photonic applications. Some of us have previously found errors of 20% in the projected range of Er in Si and SiO₂ when comparing the range profiles measured with SIMS and simulations using SRIM, T2D, and our own binary collision simulator IMSIL. Because of the far-reaching consequences, we have performed additional, more precise experiments to confirm our previous results.Equal doses of Er has been implanted into SIMOX wafers with energies of 100, 200, 300, 400, 500, and 600 keV. Profiles have been measured with secondary ion mass spectrometry (SIMS). Relative sensitivity factors (RSF) were gathered from low-energy implantations, remaining within the Si top layer. We used the Si/SiO₂ interface at exactly 217.7 nm to calibrate the depth scale of all profiles. In addition dynamical Monte-Carlo simulations of the sputter process were taken to correct the depth scale and the interface position.     

Effect of sputtering power on surface topography of dc magnetron sputtered Ti thin films observed by AFM

Titanium films were deposited on glass substrates at room temperature by direct current (dc) magnetron sputtering at fixed Ar pressure of 1.7 Pa and sputtering time of 4 min with different sputtering power ranging from 100 to 300 W. Atomic force microscopy (AFM) was used to study topographic characteristics of the films, including crystalline feature, grain size, clustering and roughening. The amorphous-like microstructure feature has been observed at 100-150 W and the transition of crystal microstructure from amorphous-like to crystalline state occurs at 200 W. The increase in grain size of Ti films with the sputtering power (from 200 to 300 W) has been confirmed by AFM characterization. In addition, higher sputtering power (300 W) leads to the transformation of crystal texture from globular-like to hexagonal type. The study has shown that higher sputtering power results in the non-linear increase in deposition rate of Ti films. Good correlativity between the surface roughness parameters including root mean square (RMS) roughness, surface mean height (Ra) and maximum peak to valley height (P-V) for evaluating the lateral feature of the films has been manifested. Surface roughness has an increasing trend at 100-250 W, and then drops up to 300 W.     

Surface morphology of highly mismatched InSb films grown on GaAs substrates by molecular beam epitaxy

InSb films on GaAs(001) substrates with and without GaAs buffer layer have been grown by molecular beam epitaxy. Rather than surface undulations, aligned ripples and pyramidal hillocks along the orthogonal 〈110〉 directions were observed on the surface of InSb films. Both the preferential growth and the termination of ripples were proved to be related to strain‐driven mass transport. A model was proposed to elucidate the formation of the hillocks, which are more efficient to relax strain than ripples. Due to the strain relaxation through hillocks with small bases predominantly, the surfaces of the InSb films grown without a GaAs buffer layer are smoother than those of films grown with a GaAs buffer layer. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

High-temperature oxidation of CrN/AlN multilayer coatings

Experiments are reported on sputter depth profiling of CrN/AlN multilayer abrasive coatings by secondary ion mass spectrometry (SIMS) coupled with sample current measurements (SCM). The coatings were deposited by a closed-field unbalanced magnetron sputtering. It is shown that after oxidation tests, performed in air at 900 °C for 2 h and at 1100 °C for 4 h, the layered structure begins to degrade but is not destroyed completely. Oxidation at 1100 °C for 20 h causes total destruction of the coatings that can be attributed to a fast diffusion of oxygen, nickel, manganese and other elements along defect paths (grain boundaries, dislocations, etc.) in the coating. There are practically no nitrides in the near-surface layer after such a treatment and all the metallic components are in the oxidized form as follows from the data obtained by X-ray photoelectron spectroscopy (XPS). According to XPS and mass-resolved ion scattering spectrometry (MARISS), the surface content of Al in the heat-treated coatings has decreased in comparison with the as-received sample and that of Cr increased. Both XPS and MARISS data exhibit real increase in superficial concentration of the substrate materials (Mn and Ni) that is controversial if using SIMS alone. SCM turned out to be an informative depth profiling method complementary to more expensive and complicated SIMS, being particularly useful for structures with different secondary electron emission properties of the layers. SCM with predetermined SIMS calibration allows a routine characterization of coatings and other multilayer structures, particularly, in situations where the expenses of analysis can be justified.