Influence of initial surface reconstruction on the interface structure of HfO2/GaAs

We show that the bonding structures and electrical properties of the HfO₂/GaAs interface can be controlled by a choice of the reconstruction on the initial GaAs surface. Electron-beam evaporation of HfO₂ onto the c(4 × 4) surface yielded As-O bonds at the interface, while Ga-O bonds were dominant at the interfaces formed on the (2 × 4) and (4 × 6) surfaces. Influences of the initial surface reconstruction on the interface structure persisted even after annealing at 673 K. Electrical characterization of Ir/HfO₂/GaAs capacitors indicated that the interfacial As-O bonds cause weak Fermi level pinning. It was also suggested that the interfaces dominated by the Ga-O bonds have trapping states in the upper half of the GaAs bandgap.     

Interface models and processing technologies for surface passivation and interface control in III-V semiconductor nanoelectronics

Interface models and processing technologies are reviewed for successful establishment of surface passivation, interface control and MIS gate stack formation in III-V nanoelectronics. First, basic considerations on successful surface passivation and interface control are given, including review of interface models for the band alignment at interfaces, and effects of interface states in nanoscale devices. Then, a brief review is given on currently available surface passivation technologies for III-V materials, including the Si interface control layer (ICL)-based passivation scheme by the authors’ group. The Si-ICL technique has been successfully applied to surface passivation of nanowires and to formation of a HfO₂ high-k dielectric/GaAs interfaces with low values of the interface state density.     

Interface engineering with an MOCVD grown ZnO interface passivation layer for ZrO2-GaAs metal-oxide-semiconductor devices

This work deals with the fabrication of a GaAs metal-oxide-semiconductor device with an unpinned interface environment. An ultrathin (∼2 nm) interface passivation layer (IPL) of ZnO on GaAs was grown by metal organic chemical vapor deposition to control the interface trap densities and to prevent the Fermi level pinning before high-k deposition. X-ray photoelectron spectroscopy and high resolution transmission electron microscopy results show that an ultra thin layer of ZnO IPL can effectively suppress the oxides formation and minimize the Fermi level pinning at the interface between the GaAs and ZrO₂. By incorporating ZnO IPL, GaAs MOS devices with improved capacitance-voltage and reduced gate leakage current were achieved. The charge trapping behavior of the ZrO₂/ZnO gate stack under constant voltage stressing exhibits an improved interface quality and high dielectric reliability.     

Interfaces analysis of the HfO2/SiO2/Si structure

The physical and chemical properties of the HfO₂/SiO₂/Si stack have been analyzed using cross-section HR TEM, XPS, IR-spectroscopy and ellipsometry. HfO₂ films were deposited by the MO CVD method using as precursors the tetrakis 2,2,6,6 tetramethyl-3,5 heptanedionate hafnium—Hf(dpm)₄ and dicyclopentadienil-hafnium-bis-diethylamide—Сp₂Hf(N(C₂H₅)₂)₂.The amorphous interface layer (IL) between HfO₂ and silicon native oxide has been observed by the HRTEM method. The interface layer comprises hafnium silicate with a smooth varying of chemical composition through the IL thickness. The interface layer formation occurs both during HfO₂ synthesis, and at the annealing of the HfO₂/SiO₂/Si stack. It was concluded from the XPS, and the IR-spectroscopy that the hafnium silicate formation occurs via a solid-state reaction at the HfO₂/SiO₂ interface, and its chemical structure depends on the thickness of the SiO₂ underlayer.     

Effect of modification of S-terminated Ge(1 0 0) surface on ALD HfO2 gate stack

When S-termination on a Ge(1 0 0) surface was desorbed at an elevated temperature and an atomic layer deposition (ALD) HfO₂ film was deposited, interfacial thickness was less than 1 nm. As a result, the equivalent oxide thickness (EOT) of the stack on the initially S-terminated surface was thinner than that deposited on the O₃-oxidized surface, while HfO₂ film thickness was almost identical on both surfaces. Nevertheless, the HfO₂ stack on the initially S-terminated surface exhibited improved leakage current characteristics due to an increase in barrier height. Its thinner but robust interface will contribute to the scaling down of gate oxide integrity.     

Nature of chemical states of sulfur embedded in atomic‐layer‐deposited HfO2 film on Ge substrate for interface passivation

Sulfur was embedded in atomic‐layer‐deposited (ALD) HfO₂ films grown on Ge substrate by annealing under H₂S gas before and after HfO₂ ALD. The chemical states of sulfur in the film were examined by S K‐edge X‐ray absorption spectroscopy. It was revealed that the valences of S‐ions were mostly –2 at Ge/HfO₂ interface (GeS_x or HfO_2–yS_y to passivate the interface), while they were mostly +6 in HfO₂ layers (sulfates; HfO_2–z(SO₄)_z). The leakage current density in post‐deposi‐tion‐treated film was lower than that in pre‐deposition‐treated one. This suggests that the passivation of defects in oxide layer by sulfate ions is more effective to lower the leakage current rather than the interface defect passivation by S^2– ions. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Effect of O-vacancy defects on the Schottky barrier heights in Ni/SiO2 and Ni/HfO2 interfaces

We perform first-principles density functional calculations to study the electronic structure of Ni/HfO₂ and Ni/SiO₂ interfaces and the effect of O-vacancy (V_O) defects on the Schottky barrier height and the effective work function. We generate two interface models in which Ni is placed on O-terminated HfO₂ (1 0 0) and α-quartz (1 0 0) surfaces. As the concentration of V_O defects at the interface increases, the p-type Schottky barrier height tends to increase in the Ni/HfO₂ interface, due to the reduction of interface dipoles, whereas it is less affected in the Ni/SiO₂ interface.     

单层膜体吸收与界面吸收研究

采用热透镜测量方法进行了SiO₂和HfO₂单层膜的体吸收与界面吸收分离研究.首先推导了光从薄膜侧及基底侧入射时单层膜内的驻波场分布,给出了单一厚度薄膜分离体吸收和界面吸收的计算方程式以及求解薄膜消光系数的方法.利用电子束蒸发工艺制备了半波长光学厚度(λ=1064 nm)的SiO₂和HfO₂单层膜,通过热透镜的测量数据实际分离了两种薄膜的体吸收和界面总吸收.计算结果表明,对于吸收小至10^{-6关键词： 驻波场理论 光热技术 薄膜吸收 消光系数}     

Optical characterization of InGaAsN/GaAsN/GaAs quantum wells with InGaP cladding layers

Optical properties of InGaAsN/GaAs and InGaAsN/GaAsN/GaAs quantum well structures with InGaP cladding layers were studied by photoreflectance at various temperatures. The excitonic interband transitions of the InGaAsN/GaAsN/GaAs QW systems were observed in the spectral range above hν=E_g(InGaAsN). The confinement potential of the system with strain compensating GaAsN barriers became one step broader, thus more quantum states and larger optical transition rate were observed. A matrix transfer algorithm was used to calculate the subband energies numerically. Band gap energies, effective masses were adopted from the band anti-crossing model with band-offset values adjusted to obtain the subband energies to best fit the observed optical transition features. A spectral feature below and near the GaAs band gap energy from GaAs barriers is enhanced by the GaAs/InGaP interface space charge accumulation induced internal field.     

Surface reactions in atomic layer deposition of HfO2, ZrO2 and Al2O3 on hydroxylated and sulfur-passivated GaAs(1 0 0) surfaces: A comparative study by density functional theory

The surface reactions in atomic layer deposition (ALD) of HfO₂, ZrO₂ and Al₂O₃ on hydroxylated and sulfur-passivated GaAs surfaces are compared by using density functional theory. The HfCl₄ and ZrCl₄ half-reactions show large similarities in energetics and geometrical structure. However, both of them show large discrepancies with the Al(CH₃)₃ (TMA) half-reaction. Calculations find that it is more energetically favorable for the Al₂O₃ deposition than the HfO₂ and ZrO₂ deposition at the initial ALD stage. In addition, calculations find that although the GaAs passivation with sulfur helps to improve the interfacial properties, it is both kinetically and thermodynamically less favorable.     

Band bending and band alignment at HfO2/HfSixOy/Si interfaces

Band bending and band alignment at HfO₂/SiO₂/Si and HfO₂/Hf/SiO₂/Si interfaces were investigated using X-ray photoelectron spectroscopy. After Hf-metal pre-deposition, a 0.55 eV band bending in Si and a 1.80 eV binding energy decrease for Hf 4f and O 1s of HfO₂ were observed. This was attributed to the introduction of negative space charges at interface by Hf pre-deposition. Band bending decrease and synchronous binding energy increases of O 1s and Hf 4f for HfO₂ were observed during initial Ar⁺ sputtering of the Hf pre-deposited sample. This was interpreted through the neutralization of negative space charges by sputtering-induced oxygen vacancies.     

HfO2/AlGaN/GaN structures with HfO2 deposited at ultra low pressure using an e‐beam

We show that HfO₂/AlGaN/GaN structures with HfO₂ layer deposited using an e‐beam in ultra high vacuum are suitable for field effect transistors. The dielectric constant of the HfO₂ was found ε_HfO > 23–24, which is close to the highest re‐ ported values for this material. The leakage current did not exceed 10^–4 A/cm² at the threshold voltage. The comparison of the losses in the samples with and without HfO₂ indicates low concentration of the interface traps. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Passivation of defect states in Si-based and GaAs structures

Formation of defect states on semiconductor surfaces, at its interfaces with thin films and in semiconductor volumes is usually predetermined by such parameters as semiconductor growth process, surface treatment procedures, passivation, thin film growth kinetics, etc. This paper presents relation between processes leading to formation of defect states and their passivation in Si and GaAs related semiconductors and structures. Special focus is on oxidation kinetics of yttrium stabilized zirconium/SiO₂/Si and Sm/GaAs structures. Plasma anodic oxidation of yttrium stabilized zirconium based structures reduced size of polycrystalline silicon blocks localised at thin film/Si interface. Samarium deposited before oxidation on GaAs surface led to elimination of EL2 and/or ELO defects in MOS structures. Consequently, results of successful passivation of deep traps of interface region by CN⁻ atomic group using HCN solutions on oxynitride/Si and double oxide layer/Si structures are presented and discussed. By our knowledge, we are presenting for the first time the utilization of X-ray reflectivity method for determination of both density of SiO₂ based multilayer structure and corresponding roughnesses (interfaces and surfaces), respectively.     

Characterization of HfOxNy gate dielectrics using a hafnium oxide as target

Hafnium oxynitride (HfO_xN_y) gate dielectric has been deposited on Si (1 0 0) by means of radio frequency (rf) reactive sputtering using directly a HfO₂ target in N₂/Ar ambient. The thermal stability and microstructural characteristics for the HfO_xN_y films have been investigated. XPS results confirmed that nitrogen was successfully incorporated into the HfO₂ films. XRD analyses showed that the HfO_xN_y films remain amorphous after 800 °C annealing in N₂ ambient. Meanwhile the HfO_xN_y films can also effectively suppress oxygen diffusion during high temperature annealing and prevent interface layer from forming between HfO_xN_y films and Si substrates. AFM measurements demonstrated that surface roughness of the HfO_xN_y films increase slightly as compared to those pure HfO₂ films after post deposition annealing. By virtue of building reasonable model structure, the optical properties of the HfO_xN_y films have been discussed in detail.     

High-k Al2O3 MOS structures with Si interface control layer formed on air-exposed GaAs and InGaAs wafers

This paper attempts to realize unpinned high-k insulator-semiconductor interfaces on air-exposed GaAs and In_0.53Ga_0.47As by using the Si interface control layer (Si ICL). Al₂O₃ was deposited by ex situ atomic layer deposition (ALD) as the high-k insulator. By applying an optimal chemical treatment using HF acid combined with subsequent thermal cleaning below 500 °C in UHV, interface bonding configurations similar to those by in situ UHV process were achieved both for GaAs and InGaAs after MBE growth of the Si ICL with no trace of residual native oxide components. As compared with the MIS structures without Si ICL, insertion of Si ICL improved the electrical interface quality, a great deal both for GaAs and InGaAs, reducing frequency dispersion of capacitance, hysteresis effects and interface state density (D_it). A minimum value of D_it of 2 × 10¹¹ eV⁻¹ cm⁻² was achieved both for GaAs and InGaAs. However, the range of bias-induced surface potential excursion within the band gap was different, making formation of electron layer by surface inversion possible in InGaAs, but not possible in GaAs. The difference was explained by the disorder induced gap state (DIGS) model.     

Metal carbide-induced negative flatband voltage shift in TaCx and HfCx/HfO2 gate stacks

We systematically investigated the role of the top interface for TaC_x and HfC_x/HfO₂ gate stacks on the effective work function (Φ_m,eff) shift by inserting a SiN layer at the gate/HfO₂ top interface or HfO₂/SiO₂ bottom interface. We found that Φ_m,eff of the TaN gate electrode on HfO₂ was larger than that on SiO₂ because of the HfO₂/SiO₂-bottom-interface dipole. On the other hand, we found that Φ_m,eff values of the TaC_x and HfC_x gate electrodes on HfO₂ agree with Φ_m,eff on SiO₂. This is because the potential offset of the opposite direction with respect to the bottom interface dipole appears at the metal carbide/HfO₂ interface. It is thus concluded that the top interface in the metal carbide/HfO₂ gate stacks causes the negative Φ_m,eff shift.     

First-principles study of electronic structure, chemical bonding, and optical properties of cubic SrHfO3

Electronic structure and optical properties of SrHfO₃ are calculated using the full potential linearized augmented plane wave plus local orbitals method. The calculated equilibrium lattice is in reasonable agreement with the experimental data. From the density of states (DOS) as well as charge density studies, we find that the bonding between Sr and HfO₃ is mainly ionic and that HfO₃ entities bond covalently. The complex dielectric functions are calculated, which are in good agreement with the available experimental results. The effect of the spin-orbit coupling on the optical properties is also investigated and found to be quite small.     

First-principles study of the （001） surface of cubic PbHfO3 and BaHfO3

Using first-principles techniques,we investigate the(001) surfaces of cubic PbHfO3(PHO) and BaHfO3(BHO) terminated with both AO(A=Pb and Ba) and HfO2.Surface structure,partial density of states,band structure,and surface energy are obtained.The BaO surface is found to be similar to its counterpart in BHO.For the HfO2-terminated surface of cubic PHO,the largest relaxation appears on the second-layer atoms but not on the first-layer ones.The analysis of the structure relaxation parameters reveals that the rumpling of the(001) surface for PHO is stronger than that for BHO.The surface thermodynamic stability is explored,and it is found that both the PbO-and the BaO-terminated surfaces are more stable than the HfO2-terminated surfaces for PHO and BHO,respectively.The surface energy calculations show that the(001) surface of PHO is more easily constructed than that of BHO.     

On the use of a O2:SF6 plasma treatment on GaAs processed surfaces for molecular beam epitaxial regrowth

Preparation of processed GaAs surface cleaning in view of molecular beam epitaxy regrowth by means of a O₂SF₆ microwave plasma has been investigated. Photoemission, Auger electron spectroscopy, atomic force microscopy and secondary ion mass spectrometry have been used for characterization. The O₂SF₆ plasma treatment was found to be very efficient for decontaminating the GaAs surface and leads to the formation of an oxide layer that can be taken off by a thermal or low-temperature H-plasma-assisted deoxidation. The levels of oxygen and carbon contaminants at the regrowth interface were measured to be in the range of a standard homoepitaxial layer-epiready substrate interface. Fluorine was observed to be eliminated upon deoxidation while sulphur is present, particularly in the case of low temperature grown layers. This plasma treatment was found to be efficient for preparation of processed GaAs surfaces for molecular beam epitaxial regrowth.     

Determination of complex dielectric functions at HfO2/Si interface by using STEM-VEELS

The complex dielectric functions and refractive index of atomic layer deposited HfO₂ were determined by the line scan method of the valence electron energy loss spectrum (VEELS) in a scanning transmission electron microscope (STEM). The complex dielectric functions and dielectric constant of monoclinic HfO₂ were calculated by the density functional theory (DFT) method. The resulting two dielectric functions were relatively well matched. On the other hand, the refractive index of HfO₂ was measured as 2.18 by VEELS analysis and 2.1 by DFT calculation. The electronic structure of HfO₂ was revealed by the comparison of the inter-band transition strength, obtained by STEM-VEELS, with the density of states (DOS) calculated by DFT calculation.