Measurement of thermal diffusivity of filler-polymide composites by flash radiometry

Thermal diffusivity D of filler-polyimide composites was investigated using flash radiometry. The fillers used were: diamond, alumina, boron nitride, aluminium nitride, silicon carbide, and silicon carbide whiskers, Composite films were prepared by casting a polyamic acid solution with dispersed filler on a glass plate and then annealing. The effects of filler type, size, content, and shape on D were studied. D increased with increasing average filler particle diameter and filler content. For the composite filled with fine Al₂O₃ whose average particle diameter is about 0.2 μm, aggregates of filler were observed with dimensions up to a few microns. The formation of thermal paths through this aggregate enhances thermal diffusion. For the composites filled with high thermal conductivity filler such as BN and AIN, there was a strong increase in D above a filler content of 20 vol %. D was ten times larger than that of unfilled polyimide when the BN content was 54 vol %. D of the SiC-whisker composite increased strongly up to a filler content of 18 vol %. Above this content D significantly decreased, probably because of interconnected voids formed by mold shrinkage.     

Enhanced thermal conductivity of epoxy–matrix composites with hybrid fillers

The results of thermal conductivity study of epoxy–matrix composites filled with different type of powders are reported. Boron nitride and aluminum nitride micro‐powders with different size distribution and surface modification were used. A representative set of samples has been prepared with different contents of the fillers. The microstructure was investigated by SEM observations. Thermal conductivity measurements have been performed at room temperature and for selected samples it was also measured as a function of temperature from 300 K down to liquid helium temperatures. The most spectacular enhancement of the thermal conductivity was obtained for composites filled with hybrid fillers of boron nitride–silica and aluminum nitride–silica. In the case of sample with 31 vol.% of boron nitride–silica hybrid filler it amounts to 114% and for the sample with 45 vol.% of hybrid filler by 65% as compared with the reference composite with silica filler. However, in the case of small aluminum nitride grains application, large interfacial areas were introduced, promoting creation of thermal resistance barriers and causing phonon scattering more effective. As a result, no thermal conductivity improvement was obtained. Different characters of temperature dependencies are observed for hybrid filler composites which allowed identifying the component filler of the dominant contribution to the thermal conductivity in each case. The data show a good agreement with predictions of Agari‐Uno model, indicating the importance of conductive paths forming effect already at low filler contents. Copyright © 2014 John Wiley & Sons, Ltd.     

Synergetic effect of thermal conductivity and flame retardancy of cyanate ester composites containing DOPO and BN with great dielectric properties

DOPO and boron nitride (BN) fillers with different particle sizes and several loadings were employed to improve the properties of cyanate ester (CE) resin. The effects of BN content and particle size on the thermal conductivity of the BN‐DOPO/CE ternary composites were discussed. The influence of enhancing the thermal conductivity of the ternary composites on their flame retardancy was studied. The consequences showed that increasing the thermal conductivity of BN‐DOPO/CE composites had an active impact on their flame retardancy. Approving flame retardancy of the ternary composites was certified by the high limiting oxygen index (LOI), UL‐94 rating of V‐0, and low heat release rate (HRR) and total heat release (THR). For instance, in contrast with pure CE matrix, peak of HRR (pk‐HRR), average of HRR (av‐HRR), THR, and average of effective heat of combustion (av‐EHC) of CEP/BN_{0.5 μm}/10 composite were decreased by 51.7%, 33.8%, 18.7%, and 18.9%, respectively. Thermal gravimetry analysis (TGA) showed that the addition of BN fillers improves the thermal stability of the composites. Moreover, the ternary composites possess good dielectric properties. Their dielectric constants (ε) are less than 3, and dielectric loss tangent (tgδ) values are lower than neat CE resin.     

Effect of nano/micro‐mixed ceramic fillers on the dielectric and thermal properties of epoxy polymer composites

Nano/micro ceramic‐filled epoxy composite materials have been processed with various percentage additions of SiO₂, Al₂O₃ ceramic fillers as reinforcements selected from the nano and micro origin sources. Different types of filler combinations, viz. only nano, only micro, nano/micro, and micro/micro particles, were designed to investigate their influence on the thermal expansion, thermal conductivity, and dielectric properties of epoxy polymers. Thermal expansion studies were conducted using thermomechanical analysis that revealed a two‐step expansion pattern consecutively before and after vitreous transition temperatures. The presence of micro fillers have shown vitreous transition temperature in the range 70–80°C compared with that of nano structured composites in which the same was observed as ~90°C. Similarly, the bulk thermal conductivity is found to increase with increasing percentage of micron‐size Al₂O₃. It was established that the addition of micro fillers lead to epoxy composite materials that exhibited lower thermal expansion and higher thermal conductivity compared with nano fillers. Moreover, nano fillers have a significantly decisive role in having low bulk dielectric permittivity. In this study, epoxy composites with a thermal expansion coefficient of 2.5 × 10^?5/K, thermal conductivity of 1.18 W/m · K and dielectric permittivity in the range 4–5 at 1 kHz have been obtained. The study confirms that although the micro fillers seem to exhibit good thermal conductivity and low expansion coefficient, the nano‐size ceramic fillers are candidate as cofillers for low dielectric permittivity. However, a suitable proportion of nano/micro‐mixed fillers is necessary for achieving epoxy composites with promising thermal conductivity, controlled coefficient of thermal expansion and dielectric permittivity. Copyright © 2013 John Wiley & Sons, Ltd.     

Thermally conductive and electrically insulative nanocomposites based on hyperbranched epoxy and nano‐Al2O3 particles modified epoxy resin

Novel epoxy nanocomposites based on a diglycidyl ether of bisphenol A (DGEBA) epoxy, an epoxy functionalized hyperbranched polymer (HTTE) and nano‐Al₂O₃ were synthesized with the aim of determining the effect of the nano‐Al₂O₃ particles and HTTE on the structure and properties of epoxy nanocomposites. The mechanical properties, thermal conductivity, bulk resistivity, and thermal stability of the nano‐Al₂O₃/HTTE/DGEBA ternary composites were evaluated and compared with the corresponding matrix. The improvement in impact properties of these nanocomposites was explained in terms of fracture surface analysis by SEM. The results indicate that the incorporation of nanoparticles and hyperbranched epoxy effectively improved the toughness of epoxy composites without sacrificing thermal conductivity and bulk resistivity compared to the neat epoxy and Al₂O₃/DGEBA, obtaining a well dispersion of nanoparticles in epoxy matrix and solving the drawbacks for single fillers filled epoxy nanocomposite. Copyright © 2010 John Wiley & Sons, Ltd.     

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity,rheology, and lap shear strength

Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.     

Polymer/boron nitride nanosheet composite with high thermal conductivity and sufficient dielectric strength

An efficient method was reported to fabricate boron nitride (BN) nanosheets using a sonication–centrifugation technique in DMF solvent. Then non‐covalent functionalization and covalent functionalization of BN nanosheets were performed by octadecylamine (ODA) and hyperbranched aromatic polyamide (HBP), respectively. Then, three different types of epoxy composites were fabricated by incorporation of BN nanosheets, BN‐ODA, and BN‐HBP. Among all three epoxy composites, the thermal conductivity and dielectric strength of epoxy composites using BN‐HBP nanosheets display the highest value, efficiently enhancing to 9.81 W/m K at 50 vol% and 34.8 kV/mm at 2.7 vol% (increase by 4057% and 9.4% compared with the neat epoxy), respectively. The significantly improved thermal conductivity and dielectric strength are attributed to the large surface area, which increases the contact area between nanosheets and nanosheets, as well as enhancement of the interfacial interaction between nanosheets and epoxy matrix. Copyright © 2015 John Wiley & Sons, Ltd.     

Thermal conductivity epoxy resin composites filled with boron nitride

Boron nitride (BN) micro particles modified by silane coupling agent, γ‐aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052 W/mK, five times higher than that of native EP (0.202 W/mK). The mechanical properties of the composites are optimal with 10 wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright © 2011 John Wiley & Sons, Ltd.     

Effect of nano‐modified SiO2/Al2O3 mixed‐matrix micro‐composite fillers on thermal,mechanical, and tribological properties of epoxy polymers

Thermo‐mechanically durable industrial polymer nanocomposites have great demand as structural components. In this work, highly competent filler design is processed via nano‐modified of micronic SiO₂/Al₂O₃ particulate ceramics and studied its influence on the rheology, glass transition temperature, composite microstructure, thermal conductivity, mechanical strength, micro hardness, and tribology properties. Composites were fabricated with different proportions of nano‐modified micro‐composite fillers in epoxy matrix at as much possible filler loadings. Results revealed that nano‐modified SiO₂/Al₂O₃ micro‐composite fillers enhanced inter‐particle network and offer benefits like homogeneous microstructures and increased thermal conductivity. Epoxy composites attained thermal conductivity of 0.8 W/mK at 46% filler loading. Mechanical strength and bulk hardness were reached to higher values on the incorporation of nano‐modified fillers. Tribology study revealed an increased specific wear rate and decreased friction coefficient in such fillers. The study is significant in a way that the design of nano‐modified mixed‐matrix micro‐composite fillers are effective where a high loading is much easier, which is critical for achieving desired thermal and mechanical properties for any engineering applications. Copyright © 2016 John Wiley & Sons, Ltd.     

Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Epoxy composites containing particulate fillers‐fused silica, glass powder, and mineral silica were investigated to be used as substrate materials in electronic packaging application. The content of fillers were varied between 0 and 40 vol%. The effects of the fillers on the thermal properties—thermal stability, thermal expansion and dynamic mechanical properties of the epoxy composites were studied, and it was found that fused silica, glass powder, and mineral silica increase the thermal stability and dynamic thermal mechanical properties and reduce the coefficient of thermal expansion (CTE). The lowest CTE value was observed at a fused silica content of 40 vol% for the epoxy composites, which was traced to the effect of its nature of low intrinsic CTE value of the fillers. The mechanical properties of the epoxy composites were determined in both flexural and single‐edge notch (SEN‐T) fracture toughness properties. Highest flexural strength, stiffness, and toughness values were observed at fillers content of 40 vol% for all the filled epoxy composites. Scanning electron microscopy (SEM) micrograph showed poor filler–matrix interaction in glass powder filled epoxy composites at 40 vol%. Copyright © 2007 John Wiley & Sons, Ltd.     

Preparation of nanoalumina/EPDM composites with good performance in thermal conductivity and mechanical properties

In this paper, nanoalumina (Al₂O₃) highly filled ethylene propylene diene monomer (EPDM) composites are prepared, and the mechanical (static and dynamic) properties and thermal conductivity are investigated systemically through various characterization methods. Furthermore, influences of in situ modification (mixing operation assisted by silane at high temperature for a certain time) with the silane‐coupling agent bis‐(3‐triethoxy silylpropyl)‐tetrasulfide (Si69) and stearic acid (SA) pretreatment on the nano‐Al₂O₃ filled composites are as well investigated. The results indicate that nano‐Al₂O₃ particles can not only perform well in reinforcing EPDM, but also improve the thermal conductivity significantly. Assisted by in situ modification with Si69, the mechanical properties (especially dynamic mechanical properties) of the nano‐Al₂O₃ filled composites are improved obviously, without influencing the thermal conductivity. By comparing to the traditional reinforcing fillers, such as carbon black (grade N330) and silica, in situ modified nano‐Al₂O₃ filled composites exhibit excellent performance in mechanical (static and dynamic) properties as well as better thermal conductivity, especially lower compression heat build‐up and better fatigue resistance. In general, our work indicates that nano‐Al₂O₃, as the novel thermal conductive reinforcing filler, is suitable to prepare rubber products serving in dynamic conditions, with the longer expected service life. Copyright © 2010 John Wiley & Sons, Ltd.     

Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives

In the present study, the synergistic effect of hybrid boron nitride (BN) with graphene on the thermal conductivity of epoxy adhesives has been reported. Graphene was prepared by chemical reduction of graphite oxide (GO) in a mixture of concentrated H₂SO₄/H₃PO₄ acid. The particle size distribution of GO was found to be ~10 μm and a low contact angle of 54° with water indicated a hydrophilic surface. The structure of prepared graphene was characterized by Fourier transform infrared (FTIR), X‐ray diffraction (XRD), Raman spectroscopy and atomic force microscopy (AFM). The thermal conductivity of adhesives was measured using guarded hot plate technique. Test results indicated an improvement in the thermal conductivity up to 1.65 W/mK, which was about ninefold increase over pristine epoxy. Mechanical properties of different epoxy formulations were also measured employing lap shear test. The surface characterization of different epoxy adhesive systems was characterized through XRD, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies. Fourier transform infrared also served to determine the nature of interactions between filler particles and epoxy resin. Non‐isothermal differential scanning calorimetric (DSC) technique was used to investigate the effects of graphene and BN particles on the cure kinetics and cross‐linking reaction of epoxy cured with amine curing agent. The Kissinger equation, the model‐free isoconversional Flynn–Wall–Ozawa method and the Ozawa model were used to analyze the kinetic parameter. Copyright © 2017 John Wiley & Sons, Ltd.     

Highly thermal conductive benzoxazine‐epoxy interpenetrating polymer networks containing liquid crystalline structures

A diamine‐based benzoxazine monomer (Bz) and a liquid crystalline epoxy monomer (LCE) are synthesized, respectively. Subsequently, a benzoxazine‐epoxy interpenetrating polymer network (PBEI) containing liquid crystalline structures is obtained by sequential curing of the LCE and the Bz in the presence of imidazole. The results show that the preferential curing of LCE plays a key role in the formation mechanism of liquid crystalline phase. Due to the introduction of liquid crystalline structures, the thermal conductivity of PBEI increases with increasing content of LCE. When the content of LCE is 80 wt %, the thermal conductivity reaches 0.32 W m^?1 K^?1. Additionally, the heat‐resistance of PBEI is superior to liquid crystalline epoxy resin. Among them, PBEI55 containing equal weight of Bz and LCE has better comprehensive performance. Its thermal conductivity, glass transition temperature, and the 5 % weight loss temperature are 0.28 W m^?1 K^?1, 160 °C, and 339 °C, respectively. By introducing boron nitride (BN) fillers into PBEI55, a composite of PBEI/BN with the highest thermal conductivity of 3.00 W m^?1 K^?1 is obtained. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55 , 1813–1821     

Efficient thermal properties enhancement to hyperbranched aromatic polyamide grafted aluminum nitride in epoxy composites

Aluminum nitride (AlN) nanoparticles were firstly treated with a silane coupling agent, γ‐aminopropyl‐triethoxysilane (γ‐APS), to introduce amine groups (AlN‐APS), then grafting of the hyperbranched aromatic polyamide started from the modified surface (AlN‐HBP). The surface modified AlN nanoparticles were characterized by Fourier transform infrared, nuclear magnetic resonance, and thermogravimetric analyzer. Then the nanoparticles with these three different interface structures were selected as reinforcing fillers for epoxy composites. The study reports the influence of interfacial structure of nanoparticles on the morphology and thermal properties of epoxy composites. It was found that the AlN‐HBP nanoparticles result in a strong interface and thus the incorporation of the AlN‐HBP nanoparticles not only improved the dispersion of the nanoparticles in the epoxy matrix but also enhanced the thermal conductivity, thermal stability, glass transition temperatures, and dynamical thermomechanical properties. Copyright © 2013 John Wiley & Sons, Ltd.     

Achieving a high thermal conductivity for segregated BN/PLA composites via hydrogen bonding regulation through cellulose network

Normally, the effective dispersion of thermal conductive fillers is a prerequisite for ensuring thermally conductive networks formed in polymer composites. In this work, a facile method was provided by using cellulose to alter the distribution state of boron nitride (BN) for the preparation of high thermally conductive polylactic acid (PLA). After powder mixing and hot‐pressing process, the Cellulose@BN was located at the boundaries of PLA granules to form consecutive thermally conductive networks with more compact structure. Morphology observation and FTIR spectra confirmed that BN edges absorbed on the cellulose surface under the intermolecular hydrogen bond interaction between PLA and BN. At the BN content of 25 wt%, contrasted with traditional BN/PLA segregated polymer composites (SPCs), thermal conductivity coefficient of Cellulose@BN/PLA SPCs improved by 53.5% from 0.71 to 1.09 Wm^?1 K^?1. This enhancement could be attributed to the reason that the cellulose regulated stripe aggregation allowed the BN connect with each other more compact, thus a thermal conduction networks with reduced phonon scattering were formed.     

Epoxy composites with ceramic core–shell fillers for thermal management in electrical devices

In this work, a novel core–shell material has been manufactured in order to enhance the thermal conductivity of epoxy‐based composites. The polymer derived ceramics technique has been used to produce fillers whose core is composed of a standard material – silica, and whose outer layer consists of a boron nitride or silicon nitride shell. The synthesized filler was characterized by infrared spectroscopy, X‐ray diffraction, and scanning electron microscopy coupled with an energy dispersive spectroscopy analysis. The successful formation of core–shell structure was proven. Composite samples based on an epoxy resin filled with 31 vol% of synthetized core–shell filler have been investigated in order to determine the effective thermal conductivity of the modified system. The resulting core–shell composite samples exhibited improvements in thermal conductivity of almost 30% in relation to standard systems, making them a promising material for heat management applications. Additionally, the temperature dependence of the thermal conductivity was investigated over a broad temperature range indicating that the thermal behavior of the composite with incorporated core–shell filler is stable. This stability is a crucial factor when considering the potential of using this technology in applications such as electronics and power systems. Copyright © 2017 John Wiley & Sons, Ltd.     

Influence of organo-clay on electrical and mechanical properties of PP/MWCNT/OC nanocomposites

The electrical, thermal and mechanical properties of nanocomposites, based on polypropylene (PP) filled by multi-walled carbon nanotubes (MWCNTs) and organo-clay (OC), were studied with the purpose of finding out the effect of OC on the microstructure of MWCNTs dispersion and PP/MWCNT/OC composites. It was found that addition of organo-clay nanoparticles improved nanotube dispersion and enhanced electrical properties of PP/MWCNT nanocomposites. Addition of organo-clay (MWCNT/OC ratio was 1/1) reduced the percolation threshold of PP/MWCNT nanocomposites from ?_c = 0.95 vol.% to ?_c = 0.68 vol.% of carbon nanotubes, while the level of conductivity became 2–4 orders of magnitude higher. The DSC and DMA analyses have shown that the influence of organo-clay on the thermal and mechanical properties of material was not significant in composites with both fillers as compared to PP/OC. Such an effect can be caused by stronger interaction of OC with carbon nanotubes than with polymer matrix.     

The surface modification of boron nitride particles

Journal of Thermal Analysis and Calorimetry - The use of coupling agents to enhance the thermal conductivity of composites of epoxy and boron nitride (BN) has been investigated. Two types of BN...     

Thermal stability and conductivity of hot-pressed Si3N4–graphene composites

This study concerns new Si₃N₄–graphene composites manufactured using the hot-pressing method. Because of future applications of silicon nitride for cutting tools or specific parts of various devices having contact with high temperatures there is a need to find a ceramic composite material with good mechanical and especially thermal properties. Excellent thermal properties in the major directions are characteristic of graphene. In this study, the graphene phase is added to the silicon nitride phase in a quantity of up to 10 mass%, and the materials are sintered under uniaxial pressure. The mixture of AlN and Y₂O₃ is added as sintering activator to the composite matrix. The studies focus on thermal stability of produced composites in argon and air conditions up to the temperature of 1,000 °C. The research also concerns the influence of applied uniaxial pressure during the sintering process on the orientation of graphene nanoparticles in the Si₃N₄ matrix. The study also presents research on anisotropy of thermal diffusivity and following thermal conductivity of ceramic matrix composites versus the increasing graphene quantity. Most of the presented results have not been published in the literature yet.     

Significant enhancement of electrical and thermal conductivities of polyethylene carbon nanotube composites by the addition of a low amount of silver nanoparticles

Electrically and thermally conductive high‐density polyethylene composites filled with hybrid fillers, multiwall carbon nanotubes (MWCNTs) and silver nanoparticles (Ag‐NPs), have been prepared in the melt state. The investigation of their electrical and thermal conductivities while comparing with high‐density polyethylene/MWCNT binary composites shows that the addition of only 3 vol% of Ag‐NPs does not reduce the electrical percolation threshold (P_c) that remains as low as 0.40 vol% of MWCNTs but leads to an increase in the maximum dc electrical conductivity of PE/MWCNT composites by two orders of magnitudes. Moreover, the association of both Ag‐NPs and carbon nanotube particles improved our composite's thermal conductivity. Copyright © 2014 John Wiley & Sons, Ltd.