Al2O3介质层厚度对AlGaN/GaN金属氧化物半导体-高电子迁移率晶体管性能的影响

在蓝宝石衬底上采用原子层淀积法制作了三种不同Al₂O₃介质层厚度的绝缘栅高电子迁移率晶体管.通过对三种器件的栅电容、栅泄漏电流、输出和转移特性的测试表明：随着Al₂O₃介质层厚度的增加,器件的栅控能力逐渐减弱,但是其栅泄漏电流明显降低,击穿电压相应提高.通过分析认为薄的绝缘层能够提供大的栅电容,因此其阈值电压较小,但是绝缘性能较差,并不能很好地抑制栅电流的泄漏;其次随着介质厚度的增加,可以对栅极施加更高的正偏压,因此获 关键词： 2O₃')" href="#">Al₂O₃ 金属氧化物半导体-高电子迁移率晶体管 介质层厚度 钝化     

具有高开启/关断电流比的Al2O3/AlGaN/GaN金属氧化物半导体高电子迁移率晶体管

采用原子层淀积(ALD)方法,制备了Al₂O₃为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT)。在栅压为-20 V时,MOS-HEMT的栅漏电比Schottky-gate HEMT的栅漏电低4个数量级以上。在栅压为+2 V时,Schottky-gate HEMT的栅漏电为191μA;在栅压为+20 V时,MOS-HEMT的栅漏电仅为23.6 nA,比同样尺寸的Schottky-gate HEMT的栅漏电低将近7个数量级。AlGaN/GaN MOS-HEMT的栅压摆幅达到了±20 V。在栅压V_gs=0 V时, MOS-HEMT的饱和电流密度达到了646 mA/mm,相比Schottky-gate HEMT的饱和电流密度(277 mA/mm)提高了133%。栅漏间距为10μm的AlGaN/GaN MOS-HEMT器件在栅压为+3 V时的最大饱和输出电流达到680 mA/mm,特征导通电阻为1.47 mΩ·cm²。Schottky-gate HEMT的开启与关断电流比仅为10⁵,MOS-HEMT的开启与关断电流比超过了10⁹,超出了Schottky-gate HEMT器件4个数量级,原因是栅漏电的降低提高了MOS-HEMT的开启与关断电流比。在V_gs=-14 V时,栅漏间距为10μm的AlGaN/GaN MOS-HEMT的关断击穿电压为640 V,关断泄露电流为27μA/mm。     

磷化铟复合沟道高电子迁移率晶体管击穿特性研究

用密度梯度量子模型定量研究了磷化铟(InP)复合沟道高电子迁移率晶体管(HEMT)的击穿特性，考虑了复合沟道内碰撞电离以及沟道量子效应，重点研究了器件击穿电压随In_0.7Ga_0.3As沟道厚度的变化关系，提出了提高击穿电压的方法，采用商用器件模拟软件Sentaurus模拟了器件的开态击穿电压，对比了实验和模拟的结果. 研究表明：适当减小In_0.7Ga_0.3As沟道层的厚度可以在保持器件饱和电流基本不变的前提下大幅度提高开态击穿电压，这对于提高InP基HEMT的功率性能具有重要意义. 关键词： 磷化铟 高电子迁移率晶体管 密度梯度模型 击穿     

不同散射机理对 Al2O3/InxGa1-xAs nMOSFET 反型沟道电子迁移率的影响

通过考虑体散射、界面电荷的库仑散射以及 Al₂O₃/In_xGa_1-xAs 界面粗糙散射等主要散射机理, 建立了以 Al₂O₃为栅介质In_xGa_1-xAs n 沟金属-氧化物-半导体场效应晶体管 (nMOSFETs) 反型沟道电子迁移率模型, 模拟结果与实验数据有好的符合. 利用该模型分析表明, 在低至中等有效电场下, 电子迁移率主要受界面电荷库仑散射的影响; 而在强场下, 电子迁移率则取决于界面粗糙度散射. 降低界面态密度, 减小 Al₂O₃/In_xGa_1-xAs 界面粗糙度, 适当提高In含量并控制沟道掺杂在合适值是提高 InGaAs nMOSFETs 反型沟道电子迁移率的主要途径. 关键词： InGaAs MOSFET 反型沟道电子迁移率 散射机理     

δ掺杂的赝形高电子迁移率晶体管AlGaAs/InGaAs/GaAs结构的光谱研究

报道δ掺杂赝形高电子迁移率晶体管结构Al(?)Ga(?)As/In(?)Ga(?),As/GaAs的综合光谱研究结果。采用光致发光光谱,平面光电流谱和光致发光激发光谱方法,并与理论计算相对比,确认了光致发光谱上n=1电子子带n=2电子子带到n=1重空穴子带间的强发光峰,对弱峰C的研究表明它是n=1电子子带到n=1轻空穴子带复合跃迁的发光峰。由于费密能级高于第二电子子带,没有发现文献中曾报道过的属于费密边的发光峰;平面光电流谱和光致发光激发光谱观察到n=1重空穴子带到n=1,2,3电子子带的三个激子跃迁峰。 关键词：     

不同量子阱宽度的InP基In0.53GaAs/In0.52AlAs高电子迁移率晶体管材料二维电子气的性能研究

用Shubnikov-de Haas(SdH)振荡效应，研究了在1.4 K下不同量子阱宽度(10—35 nm)的InP基高电子迁移率晶体管材料的二维电子气特性.通过对纵向电阻SdH振荡的快速傅里叶变换分析，得到不同阱宽时量子阱中二维电子气各子带电子浓度和量子迁移率.研究发现，在Si掺杂浓度一定时，阱宽的改变对于量子阱中总的载流子浓度改变不大，但是随着阱宽的增加，阱中的电子从占据一个子带到占据两个子带，且第二子带上的载流子迁移率远大于第一子带迁移率.当量子阱宽度为20 nm时，处在第二子能级上的电子数与处在 关键词： 量子阱宽 二维电子气 Shubnikov-de Haas振荡 高电子迁移率晶体管     

AlGaN/GaN高电子迁移率晶体管温度传感器特性

本文制作了基于无栅AlGaN/GaN高电子迁移率晶体管结构的温度传感器,并对其温度相关的电学特性进行了表征.实验测试了器件从50℃到400℃的变温电流-电压特性,研究了器件灵敏度随着器件沟道长宽比的变化,并研究了在300—500℃高温的空气和氮气中经过1 h恒温加热后器件的电学特性变化.理论与实验研究结果表明,随着器件沟道长宽比的增大,器件的灵敏度会随之上升;在固定电流0.01 A下,器件电压随温度变化的平均灵敏度为44.5 mV/℃.同时,稳定性实验显示器件具有较好的高温保持稳定性.     

双δ掺杂In0.65Ga0.35As/In0.52Al0.48As赝型高迁移率晶体管材料子带电子特性研究

研究了基于InP基的In_0.65Ga_0.35As/In_0.52Al_0.48As赝型高迁移率晶体管材料中纵向磁电阻的Shubnikov-de Haas(SdH)振荡效应和霍耳效应，通过对纵向磁电阻SdH振荡的快速傅里叶变换分析，获得了各子带电子的浓度，并因此求得了各子带能级相对于费米能级的位置.联立求解Schrdinger方程和Poisson方程，自洽计算了样品的导带形状、载流子浓度分布以及各子带能级和费米能级位置.理论计算和实验结果很好符合.实验和理论计算均表明，势垒层的掺杂电子几乎全部转移到了量子阱中，转移率在95%以上. 关键词： SdH振荡 二维电子气 FFT分析 自洽计算     

掺Fe高阻GaN缓冲层特性及其对AlGaN/GaN高电子迁移率晶体管器件的影响研究

利用金属有机物化学气相沉积技术在蓝宝石衬底上制备了掺Fe高阻Ga N以及Al Ga N/Ga N高电子迁移率晶体管(HEMT)结构.对Cp_2Fe流量不同的高阻Ga N特性进行了研究.研究结果表明,Fe杂质在Ga N材料中引入的Fe~(3+/2+)深受主能级能够补偿背景载流子浓度从而实现高阻,Fe杂质在Ga N材料中引入更多起受主作用的刃位错,也在一定程度上补偿了背景载流子浓度.在一定范围内,Ga N材料方块电阻随Cp_2Fe流量增加而增加,Cp_2Fe流量为100 sccm(1 sccm 1mL min)时,方块电阻增加不再明显;另外增加Cp_2Fe流量也会导致材料质量下降,表面更加粗糙.因此,优选Cp_2Fe流量为75 sccm,相应方块电阻高达×10?/,外延了不同掺Fe层厚度的Al Ga N/Ga N HEMT结构,并制备成器件.HEMT器件均具有良好的夹断以及栅控特性,并且增加掺Fe层厚度使得HEMT器件的击穿电压提高了39.3%,同时对器件的转移特性影响较小.     

增强型AlGaN/GaN高电子迁移率晶体管高温退火研究

深入研究了两种增强型AlGaN/GaN高电子迁移率晶体管(HEMT)高温退火前后的直流特性变化.槽栅增强型AlGaN/GaN HEMT在500 ℃ N₂中退火5 min后,阈值电压由0.12 V正向移动到0.57 V,器件Schottky反向栅漏电流减小一个数量级.F注入增强型AlGaN/GaN HEMT在 400 ℃ N₂中退火2 min后,器件阈值电压由0.23 V负向移动到-0.69 V,栅泄漏电流明显增大.槽栅增强型器件退火过程中Schottky有效势垒     

Effect of the Si-doped In0.49Ga0.51P barrier layer on the device performance of In0.4Ga0.6As MOSFETs grown on semi-insulating GaAs substrates

In0.4Ga0.6As channel metal-oxide-semiconductor field-effect transistors (MOSFETs) with and without an Si-doped In0.49Ga0.51P barrier layer grown on semi-insulating GaAs substrates have been investigated for the first time. Compared with the In0.4Ga0.6As MOSFETs without an In0.49Ga0.51P barrier layer, In0.4Ga0.6As MOSFETs with an In0.49Ga0.51P barrier layer show higher drive current, higher transconductance, lower gate leakage current, lower subthreshold swing, and higher effective channel mobility. These In0.4Ga0.6As MOSFETs (gate length 2 μm) with an In0.49Ga0.51P barrier layer exhibit a high drive current of 117 mA/mm, a high transconductance of 71.9 mS/mm, and a maximum effective channel mobility of 1266 cm2/(V·s).     

生长温度对In0.53Ga0.47As/InP的LPMOCVD生长影响

利用LPMOCVD技术在InP衬底生长了InxGa1-xAs材料，获得表面平整．光亮的In0.53Ga0.47As外延层。研究了生长温度对InxGa1-xAs外延层组分、表面形貌、结晶质量、电学性质的影响。随着生长温度的升高，为了保证铟在固相中组分不变，必须增加三甲基铟在气相中的比例。在生长温度较高时，外延层表面粗糙。生长温度在630℃与650℃之间，X射线双晶衍射曲线半高宽最窄，高于或低于这个温度区间，半高宽变宽。迁移率随着生长温度的升高而增加,在630℃为最大值，然后随着生长湿度的升高反而降低。生长温度降低使载流子浓度增大，在生长温度大于630℃时载流子浓度变化较小。     

Study of single event effect for the InP-based HEMT with In0.53Ga0.47As/In0.3Ga0.7As/In0.7Ga0.3As composite channel

In this study, the single event effects in In_0.53Ga_0.47As/In_0.3Ga_0.7As/In_0.7Ga_0.3As composite channel InP-based HEMT are investigated using TCAD simulation for the first time. Due to the higher conduction band difference between bottom In_0.7Ga_0.3As channel and InAlAs buffer, the electrons in the buffer layer induced by ions strike cannot enter the channel, led to reduce the peak concentration in the composite channel and significantly weakened the drain current for composite channel device. Meanwhile, higher barrier height under the gate for composite channel InP-based HEMT is formed after particle strike, and further attenuate the drain current. Therefore, the single event effects can be effectively reduced by designing channel structure. In addition, drain voltage and incident position also show significant impact drain current. With the increase in the drain voltage, the drain current increase and the most sensitive incident position is the gate electrode for the device.     

Improvement of photoluminescence and electroluminescence characteristics of MBE-grown In0.53Ga0.47As/In0.53(Ga0.6Al0.4)0.47As quantum well laser structure with InGaAlAs digital alloys by thermal annealing

We investigated the effect of rapid thermal annealing (RTA) on the photoluminescence (PL) and electroluminescence of the In_0.53Ga_0.47As/In_0.53(Ga_0.6Al_0.4)_0.47As multiple quantum well (MQW) laser structure with InGaAlAs barrier layers provided by the digital-alloy technique. The SiO₂- (Si₃N₄-) capped samples followed by the RTA exhibited a significant improvement of PL intensity without any appreciable shifts in PL peak energy for settings of up to 750 °C (800 °C) for 45 s. This improvement is attributed to the annealing of nonradiative defects in InAlAs layers of digital-alloy InGaAlAs and partially those near the heterointerfaces of the digital-alloy layers. The InGaAs/InGaAlAs MQW laser diodes fabricated on the samples annealed at 850 °C show a hugely improved lasing performance. Received: 2 September 2002 / Accepted: 3 September 2002 / Published online: 17 December 2002 RID="*" ID="*"Corresponding author. Fax: +82-62/970-2204, E-mail: ytlee@kjist.ac.kr     

Al2O3绝缘层的AlGaN/GaN MOSHEMT器件研究

在研制AlGaN/GaN HEMT器件的基础上,采用ALD法制备了Al₂O₃ AlGaN/GaN MOSHEMT器件.通过X射线光电子能谱测试表明在AlGaN/GaN异质结材料上成功淀积了Al₂O₃薄膜.根据对HEMT和MOSHEMT器件肖特基电容、器件输出以及转移特性的测试进行分析发现：所制备的Al₂O₃薄膜与AlGaN外延层间界面态密度较小,因而MOSHEMT器件呈现出较 关键词： 2O₃')" href="#">Al₂O₃ ALD GaN MOSHEMT     

Physical analysis of normally-off ALD Al2O3/GaN MOSFET with different substrates using self-terminating thermal oxidation-assisted wet etching technique

Based on the self-terminating thermal oxidation-assisted wet etching technique, two kinds of enhancement mode Al$_{2}$O$_{3}$/GaN MOSFETs (metal-oxide-semiconductor field-effect transistors) separately with sapphire substrate and Si substrate are prepared. It is found that the performance of sapphire substrate device is better than that of silicon substrate. Comparing these two devices, the maximum drain current of sapphire substrate device (401 mA/mm) is 1.76 times that of silicon substrate device (228 mA/mm), and the field-effect mobility ($\mu_{\rm FEmax}$) of sapphire substrate device (176 cm$^{2}$/V$\cdot$s) is 1.83 times that of silicon substrate device (96 cm$^{2}$/V$\cdot$s). The conductive resistance of silicon substrate device is 21.2 $\Omega {\cdot }$mm, while that of sapphire substrate device is only 15.2 $\Omega {\cdot }$mm, which is 61% that of silicon substrate device. The significant difference in performance between sapphire substrate and Si substrate is related to the differences in interface and border trap near Al$_{2}$O$_{3}$/GaN interface. Experimental studies show that (i) interface/border trap density in the sapphire substrate device is one order of magnitude lower than in the Si substrate device, (ii) Both the border traps in Al$_{2}$O$_{3}$ dielectric near Al$_{2}$O$_{3}$/GaN and the interface traps in Al$_{2}$O$_{3}$/GaN interface have a significantly effect on device channel mobility, and (iii) the properties of gallium nitride materials on different substrates are different due to wet etching. The research results in this work provide a reference for further optimizing the performances of silicon substrate devices.     

ZYA系统的拉曼光谱

测试了６０Ｗｔ％ＺｒＯ２（２．２５ｍｏｌ％Ｙ２Ｏ３）－４０Ｗｔ％ａ－Ａｌ２Ｏ３（ＺＹＡ）粉末样品受机械压力前后的拉曼光谱，并由此说明了四方相ＺｒＯ２陶瓷基质的相变增韧机制。     

Synchrotron radiation photoemission study of interface formation between MgO and the atomically clean In0.53Ga0.47As surface

The evolution of interface formation between MgO and the atomically clean In_0.53Ga_0.47As is studied by synchrotron radiation based photoemission. The deposition of MgO in a step wise fashion on the decapped In_0.53Ga_0.47As surface at room temperature results in the growth of an ultrathin interfacial oxide layer. Subsequent thermal annealing at 400 °C led to the reduction of the As and In oxides and the appearance of a Ga oxide component. The deposition of metallic Mg resulted in the further removal of the interfacial oxide and the out diffusion of In into the overlayer indicating severe disruption of the interface. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Tunability of optical gain (SWIR region) in type-II In0.70Ga0.30As/GaAs0.40Sb0.60 nano-heterostructure under high pressure

The interest in applying an external pressure on a nano-heterostructure is to attempt to extract more information about the electronic structure through distortion of the electronic structure. This paper reports the tunability of the optical gain under the high pressure effect in M-shaped type-II In_0.70Ga_0.30As/GaAs_0.40Sb_0.60 symmetric lasing nano-heterostructure designed for SWIR generation. In order to simulate the optical gain, the heterostructure has been modeled with the help of six band k.p method. The 6×6 diagonalized k.p Hamiltonian has been solved to evaluate the valence sub-bands (i.e. light and heavy hole energies); and then optical matrix elements and optical gain within TE (Transverse Electric) mode has been calculated. For the injected carrier density of 5×10¹²/cm², the optimized optical gain within TE mode is as high as ~9000/cm at the wavelength of ~1.95 µm, thus providing a very important alternative material system for the generation of SWIR wavelength region. The application of very high pressure (2, 5 and 8 GPa) on the structure along [110] direction shows that the gain as well as lasing wavelength both approach to higher values. Thus, the structure can be tuned externally by the application of high pressure within the SWIR region.     

关于MgB2/Al2O3超导薄膜电阻转变和各向异性的研究

利用电子束蒸发方法将MgB2超导薄膜沉积到Al2O3(001)衬底上.采用标准的四引线法研究了磁场平行和垂直超导薄膜ab平面下的电阻转变.一个激活能模型 U(T,H)= U0(1-T/(Tc+δ))n (1-H/Hc2(0))m被建立用来分析超导薄膜磁通线的激活能和电阻转变,结果表明该模型能够在整个转变温度范围描述超导体磁通线的激活能和电阻转变.另外,利用多项式Hc2(t)=Hc2(0)+At+Bt2分析了MgB2/Al2O3超导薄膜的上临界磁场,获得了该超导薄膜的各向异性参数γ=Hc2ab(0)/Hc2c(0)= 2.26.