GaN的宽带黄光发射研究

使用非线性最优化技术，用多个高斯函数叠加最优化拟合非掺杂GaN薄膜的宽的黄色发光带. 发现宽带黄色发光带可分解为三个高斯型谱的叠加. 表明宽的黄色发光带是由三个独立辐 射跃迁发射叠加而成. 使用一种新的吸收归一化光致发光激发谱直接测量出此三个独立发射 的初始态能级，发现三个独立发射具有相同的初始态和不同的末态，并对初、末态能级的起 源作出了合理的指派. 关键词： GaN薄膜 吸收归一化光致发光激发谱 宽带黄光发射     

GaN薄膜的蓝光和红光发射机理研究

由于生长工艺的不完善，非掺杂GaN薄膜中通常存在未知的杂质和缺陷，产生与这些未知杂质和缺陷能级相关的发光。报道了非掺杂GaN薄膜的692nm红色发光．并研究了非掺杂GaN薄膜的蓝、红色发光的发射机理；利用作者提出的吸收归一化光致发光激发光谱，直接测量出了非掺杂GaN薄膜的蓝、红色发光的初始态能级，确定蓝色发光为施主-价带跃迁复合，而红色发光为施主-受主跃迁复合；给出了黄、蓝、红光的发射模型。所取得的结果对于确定未知杂质和缺陷的种类具有重要的参考价值。     

HVPE外延GaN膜中黄带的光致发光激发谱研究

测量了氢化物气相外延方法生长的非特意掺杂和掺碳GaN外延膜的光致发光谱，并在光致发光谱峰位2．25eV(550nm)附近分别测量了光致发光激发谱，对两者进行了比较．从光致发光谱中发现掺碳使黄带明显增强，从光致发光激发谱中看到了掺碳引起的约3．38～2．67eV(367～465nn)范围内的特征激发带．利用CC曲线模型说明了特征激发带和黄带之间的关系，分析了黄带的可能起因．     

分子束外延高Mg掺杂GaN的发光特性

采用分子束外延技术在蓝宝石衬底上制备Ｍｇ掺杂的立方相ｐ－ＧａＮ,并对其不同温度下的光致发光光谱进行了研究．实验观察到高Ｍｇ掺杂ＧａＮ中施主受主对发光的反常温度行为．理论分析表明,高Ｍｇ掺杂ＧａＮ中施主受主对的发光受到陷阱与受主间竞争俘获非平衡空穴过程和空穴隧穿输运过程的影响．     

用MOVPE方法外延生长Si掺杂的立方相GaN

用MOVPE方法采取一种两步生长过程生长了未掺杂和Si掺杂的GaN.在生长了一个20nm厚的缓冲层后,外延生长了1μm厚的立方GaN外延层.利用二次离子质谱测定了掺杂的程度.并用X射线衍射和光致发光测量来表征了未掺杂和Si掺杂GaN的结构和光学质量.     

金刚石薄膜的蓝光发射

利用氮化铝陶瓷作为衬底，在不同甲烷与氢气的配比流量下，利用热丝ＣＶＤ方法制备了一个系列的金刚石薄膜，通过测量样品在４３０ｎｍ处的光致荧光（ＰＬ）谱及其Ｒａｍａｎ光谱，给出了金刚石薄膜的结构与生长信息，薄膜ＰＬ强度随甲烷浓度增加到３％时达到最大，继续增加了甲烷浓度ＰＬ强度下降。     

量子阱生长气压对InGaN/GaN黄光LED光电性能的影响

采用MOCVD技术在图形化硅衬底上生长了InGaN/GaN多量子阱黄光LED外延材料,研究了不同的量子阱生长气压对黄光LED光电性能的影响。使用高分辨率X射线衍射仪（HRXRD）和荧光显微镜（FL）对晶体质量进行了表征,使用电致发光系统积分球测试对光电性能进行了表征。结果表明：随着气压升高,In的并入量略有降低且均匀性更好,量子阱中的点缺陷数目降低,但是阱垒间界面质量有所下降。在实验选取的4个气压4,6.65,10,13.3 kPa下,外量子效率最大值随着量子阱生长气压的上升而显著升高,分别为16.60%、23.07%、26.40%、27.66%,但是13.3 kPa下生长的样品在大电流下EQE随电流droop效应有所加剧,在20 A·cm^-2的工作电流下,样品A、B、C、D的EQE分别为16.60%、19.77%、20.03%、19.45%,10 kPa下生长的量子阱的整体光电性能最好。     

MOVPE 生长GaN薄膜的 光致黄带发光与激发光源的相关性

用四种不同光源作为激发光源,研究了蓝宝石衬底金属有机物汽相外延方法生长的氮化镓薄膜的光致发光特性。结果发现用连续光作为激发光源时,光致发光谱中除出现365 nm的带边发射峰外,同时观察到中心波长位于约550 nm 的较宽黄带发光;而用脉冲光作为激发光源时其发光光谱主要是365 nm附近的带边发光峰,未观察到黄带发光。氮化镓薄膜的光致发光特性依赖于所用的激发光源性质。     

硅衬底阳极氧化铝膜的荧光发射研究

报道了用电子束蒸发技术在硅守底上沉积，并于１５ｗｔ％Ｈ２ＳＯ４，温度２５℃和４０Ｖ直流电压条件下阳极氧化铝薄的制备（膜厚约４００ｎｍ）。研究了该阳极氧化铝膜的红外吸收光谱（ＦＴＩＲ）、光致荧光光谱（ＰＬ）和荧光激发光谱（ＰＬＥ）。发现其荧光光谱在２８０￣５００ｎｍ范围内由三个主发射带组成，其峰值分别位于３１２ｎｍ，３６７ｎｍ和４４９ｎｍ。所有这三个ＰＬ带，经分析都与阳极氧化铝膜中的氧化铝膜中的氧空     

Investigation of yellow luminescence intensity of N-polar unintentionally doped GaN

This paper reports that the yellow luminescence intensity of N-polar GaN Epi-layers is much lower than that of Ga-polar ones due to the inverse polarity,and reduces drastically in the N-polar unintentionally-doped GaN after etching in KOH solution.The ratio of yellow luminescence intensity to band-edge emission intensity decreases sharply with the etching time.The full width at half maximum of x-ray diffraction of(10-12) plane falls sharply after etching,and the surface morphology characterized by scanning electron microscope shows a rough surface that changes with the etching time.The mechanism for the generation of the yellow luminescence are explained in details.     

Exciton localization behaviour in different well width undoped GaN/Al0.07Ga0.93N nanostructures

We report results from optical spectroscopy such as photoluminescence (PL) and time resolved photo-luminescence (TRPL) techniques from different well width MOCVD grown GaN/Al_0.07Ga_0.93N MQW samples. There is evidence of localization at low temperature in all samples. The decay time of all samples becomes non-exponential when the detection energy is increased with respect to the peak of the emission. Localization of carriers (excitons) is demonstrated by the “S-shape” dependences of the PL peak energies on the temperature. The time-resolved PL spectra of the 3-nm well multi quantum wells reveal that the spectral peak position shifts toward lower energies as the decay time increases and becomes red-shifted at longer decay times. There is a gradient in the PL decay time across the emission peak profile, so that the PL process at low temperatures is a free electron-localized hole transition.     

Luminescence of a GaN grain with a nonpolar and semipolar plane in relation to microstructural characterization

We report on the growth of the high-quality GaN grain on a r-plane sapphire substrate by using a self-organized SiN interlayer as a selective growth mask.Transmission electron microscopy,scanning electron microscopy,and Raman spectroscopy are used to reveal the effect of SiN on the overgrown a-plane GaN growth.The SiN layer effectively terminates the propagation of the threading dislocation and basal plane stacking faults during a-plane GaN regrowth through the interlayer,resulting in the window region shrinking from a rectangle to a "black hole".Furthermore,strong yellow luminescence(YL) in the nonpolar plane and very weak YL in the semipolar plane on the GaN grain is revealed by cathodoluminescence,suggesting that C-involved defects are responsible for the YL.     

Effects of ion implantation on yellow luminescence in unintentional doped n-type GaN

The effects of Si, O, C and N ion implantation with different implantation doses on yellow luminescence (YL) of GaN have been investigated. The as-grown GaN samples used in the work were of unintentional doped n-type, and the photoluminescence (PL) spectra of samples had strong YL. The experimental results showed that YL of ion implanted samples exhibited marked reductions compared to samples with no implantation, while the near band edge (NBE) emissions were reduced to a lesser extent. The deep-level centers associated with YL may be produced in GaN films by O and C ion implantation, and identities of these deep-level centers were analyzed. It was also found that the dose dependence of YL was analogous with the one of the intensity ratios of YL to the near band edge (NBE) emission (I _YL /I _NBE ) for ion implanted samples. The possible reason for this comparability has been proposed.      

Point defect determination by photoluminescence and capacitance-voltage characterization in a GaN terahertz Gunn diode

Photoluminescence （PL） measurement is used to study the point defect distribution in a GaN terahertz Gunn diode, which is able to the degrade high-field transport characteristic during further device operation. PL, secondary ion mass spectroscopy （SIMS）, transmission electron microscope （TEM）, and capacitance-voltage （C-V） measurements are used to discuss the origin of point defects responsible for the yellow luminescence in structures. The point defect densities of about 1011 cm-2 in structures are extracted by analysis of C-V characterization. After thermal annealing treatment, diminishments of point defect densities in structures are efficiently demonstrated by PL and C-V results.     

Intrinsic relationship between photoluminescence and electrical characteristics in modulation Fe-doped AlGaN/GaN HEMTs

The photoluminescence(PL) and electrical properties of Al GaN/GaN high electron mobility transistors(HEMTs) with different Fe doping concentrations in the GaN buffer layers were studied. It was found that, at low Fe doping concentrations,the introduction of Fe atoms can result in a downward shift of the Fermi level in the GaN buffer layer, since the Fe atoms substitute Ga and introduce an Fe_(Ga)~(3+/2+) acceptor level. This results in a decrease in the yellow luminescence(YL) emission intensity accompanied by the appearance of an infrared(IR) emission, and a decrease in the off-state buffer leakage current(BLC). However, a further increase in the Fe doping concentration will conversely result in the upward shift of the Fermi level due to the incorporation of O donors under the large flow rate of the Fe source. This results in an increased YL emission intensity accompanied by a decrease in the IR emission intensity, and an increase in the BLC. The intrinsic relationship between the PL and BLC characteristics is expected to provide a simple and effective method to understand the variation of the electrical characteristic in the modulation Fe-doped HEMTs by optical measurements.     

GaN激子跃迁的时间分辨光谱学研究

用时间分辨光谱学方法研究低压有机金属化学汽相沉积生长的ＧａＮ中自由，束缚激子（ＢＸ）的跃迁，讨论了这些跃迁的光致发光谱，复合寿命及其与温度的关系，给出了中性施主束缚激子和自由激子（ＦＸ）的辐射复合寿命分别为０．１２ｎｓ和０．４ｎｓ。