大角度Cu晶界在升温、急冷条件下晶界结构的分子动力学研究

应用分子动力学方法模拟了大角度重位点阵数Σ=5（310）/［001］对称倾斜Cu 晶界在被升温、降温到300,800和1100 K时的晶界结构. 结果表明，随着温度的升高晶界区域的结构发生变化.在远低于块体熔点温度时，晶界就已经发生了预熔化，在晶界区域存在着晶体-熔体共存的现象. 通过对高温晶界的急冷处理，改变了晶界处的原子结构. 关键词： 分子动力学 晶界 熔化 凝固     

镍基单晶超合金Ni/Ni3Al晶界的分子动力学模拟

在镍基单晶超合金中，由于单晶Ni的晶格常数比单晶Ni₃Al的稍小，在Ni/Ni3Al晶界面 上必然要出现错配.采用分子动力学模拟了镍基单晶超合金的Ni/Ni₃Al晶界的结 构，考虑 了两个不同的初始模型，并进行了分子动力学弛豫.弛豫的结果均表明：由于晶格的差异形 成的错配能不是通过长程晶格错配的方式来释放，而是通过在局部区域形成位错的方式释放 的.由于Ni₃Al相周围Ni相环境的不同，形成的位错也有所不同. 关键词： 镍基单晶超合金 晶界 分子动力学模拟     

氦泡在bcc钨中晶界处成核长大的分子动力学模拟

钨(W)是潜在的聚变堆面向等离子体材料.聚变反应中产生的氦(He)不溶于金属W,并在其中易聚集形成He泡,使W基体发生脆化,从而导致W基体的性能发生退化.在前人工作的基础上,本文采用分子动力学研究了He泡在单晶bcc-W中以及bcc-W中∑3[211](110)和∑9[110](411)晶界处He泡形核长大初期的演化过程.结果发现,晶界处He泡的长大机制和单晶W中有所不同.单晶W中He泡通过挤出位错环促进长大.而He泡在∑3[211](110)晶界处的长大机制为:首先挤出并发射少量自间隙W原子,而后挤出1/2⟨111⟩位错线,随后,该位错线会沿晶界面上[111]方向迁移出去;在∑9[110](411)晶界处,He泡在我们的模拟时间尺度范围内没有观察到W自间隙子的发射和位错的挤出.     

Effect of grain boundary structures on the behavior of He defects in Ni: An atomistic study

We investigated the effect of grain boundary structures on the trapping strength of He_N(N is the number of helium atoms) defects in the grain boundaries of nickel. The results suggest that the binding energy of an interstitial helium atom to the grain boundary plane is the strongest among all sites around the plane. The He_N defect is much more stable in nickel bulk than in the grain boundary plane. Besides, the binding energy of an interstitial helium atom to a vacancy is stronger than that to a grain boundary plane. The binding strength between the grain boundary and the He _N defect increases with the defect size. Moreover, the binding strength of the He_N defect to the Σ3(12)[110] grain boundary becomes much weaker than that to other grain boundaries as the defect size increases.     

Diffusion behavior of helium in titanium and the effect of grain boundaries revealed by molecular dynamics simulation

The microstructures of titanium(Ti), an attractive tritium(T) storage material, will affect the evolution process of the retained helium(He). Understanding the diffusion behavior of He at the atomic scale is crucial for the mechanism of material degradation. The novel diffusion behavior of He has been reported by molecular dynamics(MD) simulation for the bulk hcp-Ti system and the system with grain boundary(GB). It is observed that the diffusion of He in the bulk hcp-Ti is significantly anisotropic(the diffusion coefficient of the [0001] direction is higher than that of the basal plane),as represented by the different migration energies. Different from convention, the GB accelerates the diffusion of He in one direction but not in the other. It is observed that a twin boundary(TB) can serve as an effective trapped region for He.The TB accelerates diffusion of He in the direction perpendicular to the twinning direction(TD), while it decelerates the diffusion in the TD. This finding is attributable to the change of diffusion path caused by the distortion of the local favorable site for He and the change of its number in the TB region.     

晶界对纳米多晶铝中冲击波阵面结构影响的分子动力学研究

用分子动力学方法研究了纳米多晶铝在冲击加载下的冲击波阵面结构及塑性变形机理.模拟研究结果表明:在弹性先驱波之后,是晶界间滑移和变形主导了前期的塑性变形机理;然后是不全位错在界面上成核和向晶粒内传播,然后在晶粒内形成堆垛层错、孪晶和全位错的过程主导了后期的塑性变形机理.冲击波阵面扫过之后留下的结构特征是堆垛层错和孪晶留在晶粒内,大部分全位错则湮灭于对面晶界.这个由两阶段塑性变形过程导致的时序性塑性波阵面结构是过去未见报道过的. 关键词： 晶界 塑性变形 冲击波阵面 分子动力学     

Molecular kinetic theory of boundary slip on textured surfaces by molecular dynamics simulations

A theoretical model extended from the Frenkel-Eyring molecular kinetic theory (MKT) was applied to describe the boundary slip on textured surfaces. The concept of the equivalent depth of potential well was adopted to characterize the solid-liquid interactions on the textured surfaces. The slip behaviors on both chemically and topographically textured surfaces were investigated using molecular dynamics (MD) simulations. The extended MKT slip model is validated by our MD simulations under various situations, by constructing different complex surfaces and varying the surface wettability as well as the shear stress exerted on the liquid. This slip model can provide more comprehensive understanding of the liquid flow on atomic scale by considering the influence of the solid-liquid interactions and the applied shear stress on the nano-flow. Moreover, the slip velocity shear-rate dependence can be predicted using this slip model, since the nonlinear increase of the slip velocity under high shear stress can be approximated by a hyperbolic sine function.     

Theory and simulation of coupled grain boundary migration and grain rotation in low angle grain boundaries

Abstract

Microstructure evolution due to coupled grain boundary migration and grain rotation in low angle grain boundaries is studied through a combination of molecular dynamics and phase field modeling. We have performed two dimensional molecular dynamics simulations on a bicrystal with a circular grain embedded in a larger grain. Both size and orientation of the embedded grain are observed to evolve with time. The shrinking embedded grain is observed to have two regimes: constant dislocation density on the grain boundary followed by constant rate of increase in dislocation density. Based on these observations from the molecular dynamics simulations, a theoretical formulation of the kinetics of coupled grain rotation is developed. The grain rotation rate is derived for the two regimes of constant dislocation density and constant rate of change of dislocation density on the grain boundary during evolution. The theoretical calculation of the grain rotation rate shows strong dependence on the grain size and compares very well with the molecular dynamics simulations. A multi-order parameter based phase field model with coupled grain rotation is developed using the theoretical formulation to model polycrystalline microstructure evolution.     

Effect of solute atoms on grain boundary sliding in magnesium alloys

The effect of solid-solution alloying on grain boundary sliding (GBS) was investigated using pure magnesium and six kinds of Mg–X (X?=?Ag, Al, Li, Pb, Y and Zn) dilute binary solid solutions with an average grain size of 10?µm. A sharp increase in damping capacity caused by GBS was observed above a certain temperature. The temperature at which a sharp increase in damping capacity occurred depended on the alloying element. The addition of Y and Ag markedly increased the onset temperature (more than 100?K) for a sharp increase in damping capacity, whereas the addition of Zn, Al and Li slightly increased the onset temperature (less than 50?K) as compared with that for pure magnesium. Tensile tests at a temperature of 423?K revealed that the higher the onset temperature, the lower the strain rate sensitivity of the flow stress. It is suggested that the former elements (Y and Ag) are more effective in suppressing GBS in magnesium alloys than the latter ones (Zn, Al and Li). The suppression of GBS was associated with low grain boundary energy, and the extent to which the energy is reduced depended on the alloying element. It was suggested that the change in the lattice parameter (the so-called c/a ratio) affects the grain boundary energy, and thus, the occurrence of GBS.     

Influence of grain boundary state on electrical resistivity of ultrafine grained aluminium

An ultrafine grained (UFG) structure has been obtained in commercial purity Al by high-pressure torsion (HPT). Changes in microhardness and electrical resistivity of the UFG material after annealing at various temperatures within a range of 363–673 K have been investigated in correlation with the microstructure evolution. It has been shown that annealing at 363 K leads to substantial decrease in the electrical resistivity while keeping high microhardness level and approximately the same average grain size. The contributions from the various microstructural units (vacancies, dislocations, grain boundaries (GBs)) to the electrical resistivity were analysed. It was shown for the first time that a non-equilibrium state associated with strain-distorted grain boundary (GB) structure strongly affects electrical resistivity of UFG Al. The resistivity of non-equilibrium GBs in UFG structure formed by HPT was evaluated to be at least 50% higher than the resistivity of the thermally equilibrium GBs in a coarse-grained structure.     

能量粒子轰击金刚石的计算机模拟

利用Tersoff势和分子动力学方法研究了初始动能为500 eV的硼粒子注入金刚石的微观行为.结果表明：硼注入后产生温度为5000 K的热峰，其寿命为0.18 ps；同时产生半径为0.45 nm局部非晶化区域，三重配位原子数占该区域原子数的7%.薄膜表层原子向内弛豫，近表层原子向外弛豫，表面层与近表层原子的间距减少了15%，表面层表现为压应力.硼原子以B<110>分裂间隙的形式存在于金刚石结构中. 关键词： 分子动力学模拟 金刚石 硼 注入     

微合金化元素晶界偏聚与钢的超细化理论研究

通过计算机编程建立钢奥氏体相中Σ5〈001〉/(210)大角晶界模型，用实空间的递推方法计 算碳、氮及微合金元素在完整晶体及晶界区引起的环境敏感镶嵌能，进而讨论碳、氮及微合 金元素在晶界区的偏聚及交互作用.计算结果表明，轻杂质C，N易偏聚于晶界区，且形成气 团；微合金元素在完整的奥氏体中趋于均匀分布，Ti，V，Nb易占位于晶界三角棱柱的顶部( 压缩区)，且其加入量足够大时，它们能够在晶界区形成气团；微合金元素能够偏聚于C，N 掺杂的大角晶界区，当温度下降使得C，N及微合金元素的浓度超过其最大固溶度时，在钢的 奥氏体晶界区将有C，N化合物脱溶，这些化合物既可成为奥氏体再结晶的异质晶核，又可以 阻碍奥氏体晶粒长大，故可起到细化晶粒作用.在微合金元素中Nb的细化效果最好. 关键词： 电子结构 晶界偏聚 超细化     

Dependence of grain boundary character distribution on the initial grain size of 304 austenitic stainless steel

Abstract

In order to study the dependence of the grain boundary character distributions (GBCD) on the grain size, annealing treatment was carried out on 304 austenitic stainless steel with different initial grain sizes. The evolution of the GBCD was analysed by electron backscatter diffraction. The experimental results showed that abnormal grain growth (AGG) occurred when grain size was small. With a smaller initial grain size, the number density of abnormally large grains and the fraction of low-Σ CSL boundaries increased but the size of abnormally large grains decreased and the random boundaries presented a continuous network. With a larger initial grain size, the fraction of low-Σ CSL boundaries also increased as well as the size of abnormally large grains but the number density of abnormally large grains decreased and the connectivity of random boundary network was disrupted by low-Σ CSL boundaries, especially Σ3ⁿ (n = 1, 2, 3) boundaries. However, with a very large initial grain size, normal grain growth (NGG) occurred, which had no effect on the fraction of low-Σ CSL boundaries and the connectivity of random boundary network.     

Molecular dynamics simulation of stress and grain evolution

A three-dimensional molecular dynamics simulation is carried out to study the evolution of grains and stresses during the deposition of atoms on the (100) plane of a fcc regular crystal, using the cubic system with x–y periodic boundary conditions. At the bottom an atomic surface and at the top a reflecting wall are assumed. Atoms in the system interact via the Lennard–Jones potential. During simulation the films grow according to the Volmer–Weber mode and exhibit specific shape of the stress curves. When the film becomes continuous, the stress during the growth possesses a maximum value, but later new grain boundaries are formed. Individual atoms in the grain boundaries generate compressive stress in the films.     

Role of helium in the sliding and mechanical properties of a vanadium grain boundary:A first-principles study

The effects of helium （He） on the sliding and mechanical properties of a vanadium （V） E5（310）/[001] grain boundary （GB） have been investigated using a first-principles method. It has been found that He was energetically favorable sitting at the GB region with a segregation energy of -0.27 eV, which was attributed to the special atomic configurations and charge density distributions of the GB. The maximal sliding energy barrier of the He-doped GB was calculated to be 1.73 J/m^2, 35% larger than that of the clean GB. This suggested that the presence of He would hinder the V GB mobility. Based on the thermodynamic criterion, the total energy calculations indicated that the embrittlement of V GB would be enhanced by He segregation.     

Non-planar grain boundary structures in fcc metals and their role in nano-scale deformation mechanisms

This work presents the results of a comparative molecular dynamics study showing that relaxed random grain boundary structures can be significantly non-planar at the nano-scale in fcc metals characterized by low stacking fault values. We studied the relaxed structures of random [1?1?0] tilt boundaries in a polycrystal using interatomic potentials describing Cu and Pd. Grain boundaries presenting non-planar features were observed predominantly for the Cu potential but not for the Pd potential, and we relate these differences to the stacking fault values. We also show that these non-planar structures can have a strong influence on dislocation emission from the grain boundaries as well as on grain boundary strain accommodation processes, such as grain boundary sliding. We studied the loading response in polycrystals of 40 nm grain size to a level of 9% strain and found that the non-planar grain boundaries favour dislocation emission as a deformation mechanism and hinder grain boundary sliding. This has strong implications for the mechanical behaviour of nano-crystalline materials, which is determined by the competition between dislocation activity and grain boundary accommodation of the strain. Thus, the two interatomic potentials for Cu and Pd considered in this work resulted in the same overall stress–strain curve, but significantly different fractions of the strain accommodated by the intergranular versus intragranular deformation mechanisms. Strain localization patterns are also influenced by the non-planarity of the grain boundary structures.     

界面旋转角对双晶镁力学性质影响的分子动力学模拟

采用分子动力学模拟方法,研究了在拉伸载荷下晶界对双晶镁变形机制的影响,对不同旋转角度的模型以及对称与非对称结构的模型进行了研究.模拟结果表明:应变加载方向与晶向所成角度对双晶镁塑形变形阶段的流动应力能够产生明显的影响;对称结构的双晶镁模型的塑性性质明显优于非对称结构模型.研究结果还发现,由于晶界区域不同的位错成核及发射等运动,大角度双晶模型的塑性响应明显优于对应小角度模型的塑性响应.     

Twin boundary and grain boundary effects on cyclic responses of tensile pre-deformed highly oriented nanotwinned Cu: Molecular dynamics simulation

Molecular dynamics method is performed for analyzing the relationship of the twin boundary and grain boundary on the cyclic response of nanotwinned Cu. Results show that the strength difference among the grain boundary, the twin boundary and the variation of dislocation density are nearly 2-2.5 times. We predict twin boundary is only a factor that affects the stable response, however, the dislocation form and the time to reach stability is caused by the grain boundary. Furthermore, the phenomenon of cyclic hardening is found in all the nanotwinned Cu samples.