Lead diffusion in α-Zr

Pb diffusion in α-Zr matrix between 823 and 1123 K was measured using heavy ion Rutherford backscattering spectrometry (HIRBS) technique. A deviation from the Arrhenius law was observed, with two different regions. At low temperatures the activation energy Q is close to the expected value for a substitutional diffuser but the pre-exponential factor D₀ is higher than expected. Close to the phase transition temperature the opposite occurs, with a low Q value. This behavior is similar to the one observed for Hf and self-diffusion in α-Zr. Received: 29 September 1998 / Accepted: 29 January 1999 / Published online: 28 April 1999     

Volume and grain boundary diffusion of implanted 113Sn in aluminium

Volume and grain boundary diffusion of ¹¹³Sn in aluminium was investigated with the radiotracer method. The implantation technique was used for tracer deposition to avoid problems of tracer hold-up caused by the oxide layer always present on aluminium. The diffusion penetration was chosen large enough to permit serial sectioning of samples with the aid of a microtome.The temperature dependence of the volume diffusivity was determined as D(T)=4.54×10^–5×exp[–(114.5±1.2)kJmol^–1/RT] m ² s ^–1. This confirms previous measurements from our group which already showed that Sn is the fastest foreign metal diffusor so far investigated in aluminium.Grain boundary diffusion of ¹¹³Sn in Al polycrystals was measured in the type-B kinetic regime. The grain boundary diffusion product P=sD _gb (s=segregation factor, =grain boundary width, D _gb=grain boundary diffusivity) was found to be strongly affected by the impurity content of aluminium. For Al polycrystals of 99.9992% nominal purity we obtained P _5N(T)=1.08×10^–8exp [–(96.9±7.5) kJ mol^–1/RT] m³ s^–1 and for less pure Al polycrystals of 99.99% nominal purity P _4N(T)=3.0×10^–10 exp [–(90.1±4.2) kJ mol^–1/RT] m³ s^–1 was determined. The grain boundary diffusion product in the purer material is more than one order of magnitude higher than in the less pure material. Very likely this is an effect of co-segregation of non-diffusant impurities into the grain boundaries.     

Characterization of amorphous silicon films by contactless transient photoconductivity measurements

Contactless transient photoconductivity measurements of intrinsic a-Si: H films in the microwave frequency range are presented. The measurements are evaluated quantitatively and the electron drift mobility is determined. It is shown that the influence of the surface on the observed decay behaviour can be neglected. A relation between the long time decay behaviour and the position of the Fermi level is observed.     

Hydrogen implantation and diffusion in silicon and silicon dioxide

Depth profiles of hydrogen implanted into crystalline silicon in random direction at different fluences have been measured by the¹⁵N technique and by SIMS. Whereas hydrogen implanted at a fluence of 10¹⁵ ions/cm² shows some limited mobility, no such mobility is observed for higher implantation fluences. In these cases, ballistic computer codes describe the depth distributions well, within the ranges of both experimental and theoretical accuracy. Annealing up to 510 K does not change the hydrogen distributions.Furthermore, high-fluence hydrogen implantation into silicon dioxide has been examined. There is some indication for radiation-enhanced diffusion during the implantation process. Upon subsequent thermal annealing, the hydrogen is found to diffuse, probably via a trapping/detrapping mechanism associated with an OH/H₂ transformation of the hydrogen bonding.     

Study of hydrogenated amorphous silicon nitride films prepared by RF magnetron sputtering

Hydrogenated amorphous silicon nitride films have been deposited by the rf magnetron sputtering method with non-stoichiometric and stoichiometric compositions using a poly-Si target and a mixture of Ar, H₂ and N₂ as the sputtering gas. Data on optical and infrared absorption, electrical conductivity, breakdown voltage, capacitance measurements and thermal evolution of hydrogen have been presented as a function of nitrogen concentration in the films, especially in the stoichiometric region of composition. Attempts have been made to identify the roles of hydrogen and nitrogen in determining the electrical and optical properties and thermal stability exhibited by the films. Properties relevant for device application of the material have been shown to be comparable to those obtained by glow discharge or electron cyclotron resonance plasma chemical vapour deposition methods of deposition. RF magnetron sputtering has therefore been suggested as a viable alternative to the more widely adopted CVD methods for device applications of silicon nitride, where the use of hazardous process gases can be avoided.     

Au diffusion in α-Ti

The solubility and diffusion of Au in -Ti have been studied in a 823–1023 K temperature range using the Rutherford backscattering technique. For this purpose we have implanted Au into -Ti samples. Our results show that the solubility of Au varies between 0.2 and 0.35 at.%. In addition, we found that the diffusion coefficients follow a normal Arrhenius behavior with Q=260 kJ/mol and D _o=1.9×10^–5 m²/s¹. These values are typical for a substitutional diffusion mechanism.     

Microwave detected transient photoconductivity measurements during plasma deposition of intrinsic hydrogenated amorphous silicon

Contactless in-situ measurements of the microwave detected transient photoconductivity during growth of intrinsic a-Si:H films by plasma enhanced chemical vapour deposition are presented. It is shown, that these measurements can be performed without perturbation of the deposition process. The growth of a-Si:H films at 250° C and 120° C substrate temperature is studied and the information obtained from these measurements is discussed. In-situ characterization during growth of a multilayer structure with films deposited subsequently at 120° C, 250° C and again at 120° C is shown.     

Field-enhanced neutralization of electrically active boron in hydrogen implanted Schottky diodes

We have observed that hydrogen implantation in p-type boron-doped silicon material induces a neutralization of boron in a 10 m deep region after the Schottky diodes have been heated at a 90° C temperature under reverse-biasing. The profile of neutralized acceptors can be reversibly shaped by successively applying different reverse biases.     

The characteristics of platinum diffusion in n-type GaN

The electrical and optical characteristics of platinum (Pt) diffusion in n-type gallium nitride (GaN) film are investigated. The diffusion extent was characterized by the SIMS technique. The temperature-dependent diffusion coefficients of Pt in n-GaN are 4.158 × 10⁻¹⁴, 1.572 × 10⁻¹³ and 3.216 × 10⁻¹³ cm²/s at a temperature of 650, 750 and 850 °C, respectively. The Pt diffusion constant and activation energy in GaN are 6.627 × 10⁻⁹ cm²/s and 0.914 eV, respectively. These results indicate that the major diffusion mechanism of Pt in GaN is possibly an interstitial diffusion. In addition, it is also observed that the Pt atom may be a donor because the carrier concentration in Pt-diffused GaN is higher than that in un-diffused GaN. The optical property is studied by temperature-dependent photoluminescence (PL) measurement. The thermal quenching of the PL spectra for Pt-diffused GaN samples is also examined.     

Hydrogenated amorphous silicon p-doping with diborane,trimethylboron and trimethylgallium

The uses of diborane, trimethylboron and trimethylgallium gases have been systematically compared in order to obtain p-type hydrogenated amorphous silicon grown in silane rf glow discharges. The doping properties and the contamination effects due to the thermal CVD have been investigated by an in situ Kelvin probe. This study, which has been completed by electrical (dark conductivity, activation energy and fill factor of standard p-i-n devices), and optical (a combination of transmission and photothermal deflection spectroscopy) measurements, indicates that trimethylboron doped layers have semiconducting properties similar to those of diborane doped layers. When trimethylboron is used, the contamination is shown to be reduced by at least a factor 50. In contrast, trimethylgallium, despite its acceptable doping efficiency, produces a contamination intermediate between the diborane and the trimethylboron ones. The effects of C incorporation in the doped layers have also been studied, in particular by optical absorption measurements in the band-edge region.     

Optical and electronic properties of hydrogenated amorphous silicon films deposited by square-wave modulated RF discharges of silane-he mixtures

The optoelectronic properties of a-Si: H films deposited under very different plasma conditions have been studied as functions of the square-wave modulation frequency of a 13.56 MHz rf discharge. Results for two extreme deposition conditions are presented. At both high and low deposition rates, the modulation of the rf discharge results in a negligible effect or a deterioration of the film properties, particularly the photoconductivity which we have found to be the most sensitive parameter. At high deposition rates, modulation of the discharge at 10 Hz results in the incorporation of particles into the film which produce enhanced absorption in the film. Therefore, for our reactor configuration, the modulation of the discharge does not produce an improvement but rather a degradation of the film properties.     

Determination of the copper diffusion coefficient in silicon from transient ion-drift

We use the transient ion drift in a depletion region of a Schottky barrier to determine ion diffusivities at moderate temperatures. The pulsed reverse bias leads to temperature dependent capacitance transients similar to deep level carrier emission transients. A simple theoretical model together with classical transient signal analysis provide the means to extract the ion diffusion constant. When applied to copper in silicon, diffusion data are obtained in a not yet investigated temperature range (280–400 K) which agree well with both low and high temperature diffusion data.     

Application of the modified electrostatic model to the impurity diffusion in nickel

The modified electrostatic model (Neumann and Tölle 1995) is applied to the impurity diffusion in nickel.Z ₀ = 0.4 is used for the effective charge of the nickel ion.The comparison of calculated and experimental diffusion parameters reveals that the sign of J Q, the difference between impurity diffusion and self-diffusion energy, and the sign of the difference between impurity diffusion and self-diffusion coefficient is correctly predicted in all cases. On the other hand the comparison exhibits some systematic deviations for 5p impurities, which cannot be explained in terms of the current impurity diffusion models.     

Carbon precipitation and diffusion in SiGeC alloys under silicon self-interstitial injection

In this work we investigate the diffusion and precipitation of supersaturated substitutional carbon in 200-nm-thick SiGeC layers buried under a silicon cap layer of 40 nm. The samples were annealed in either inert (N₂) or oxidizing (O₂) ambient at 850 °C for times ranging from 2 to 10 h. The silicon self-interstitial (I) flux coming from the surface under oxidation enhances the C diffusion with respect to the N₂-annealed samples. In the early stages of the oxidation process, the loss of C from the SiGeC layer by diffusion across the layer/cap interface dominates. This phenomenon saturates after an initial period (2–4 h), which depends on the C concentration. This saturation is due to the formation and growth of C-containing precipitates that are promoted by the I injection and act as a sink for mobile C atoms. The influence of carbon concentration on the competition between precipitation and diffusion is discussed. Received: 19 October 2001 / Accepted: 19 December 2001 / Published online: 20 March 2002 / Published online: 20 March 2002     

High-temperature diffusion of phosphorus and boron in silicon via vacancies or via self-interstitials?

The paper re-examines the effect of oxidation on the diffusion of phosphorus and boron in silicon as well as recent results on redistribution phenomena of these dopants under irradiation and on the emitter-push effect. It is shown that at high temperatures phosphorus and boron diffuse via a defect mechanism involving silicon self-interstitials. These results support the view-point that self-interstitials are the dominating point defects in silicon under thermal equilibrium conditions. Possible generation mechanisms for the self-interstitial supersaturation causing the emitter-push effect are suggested.     

Tomographic study of the three-dimensional distribution of a high-fluence implant in a polymer

6 Li⁺ ions were implanted into PMMA at high flux up to fluences of 1×10¹⁵ cm^-2 under angles of 0° to 70° towards the surface normal. The Li depth distributions were determined by means of neutron depth profiling, and compared with theoretical simulations. The three-dimensional Li distribution was reconstructed from the one-dimensional depth profiles by means of a tomographic technique. It turned out that the measured Li depth distributions can be described by a superposition of Gaussian and exponential functions. This points at considerable Li mobility during or after the ion implantation, with trapping in unsaturable traps in the ion-irradiated region which roughly follow the electronic energy transfer distribution. The Li redistribution is more pronounced along the track direction than transversely to it. The normalized Li distributions in various implantation directions were fed into our tomographic program to reconstruct the three-dimensional distribution of the deposited lithium. As expected, the lithium preferentially distributes along the ion tracks. This work is another hint that mobility of implanted ions in solids does not proceed isotropically, but is strongly influenced by the radiation-damage distributions. Received: 11 May 1998 / Accepted: 9 September 1998 / Published online: 24 February 1999     

Rapid thermal annealing of high dose arsenic-implanted silicon

A model for rapid thermal annealing of high dose arsenic-implanted silicon layers is proposed. The kinetics of arsenic clustering was taken into account. Assuming that all arsenic is initially electrically active, the clustering rate is found to be enhanced during the early stage of annealing in comparison with results reported for conventional furnace tempering [1]. An influence of a low temperature preannealing on the diffusion behaviour of arsenic has not been observed.     

New stable microwave plasma passivated a-Si MIS cells with high open circuit voltage

A new microwave plasma surface passivation technique has been applied to a-SiH type solar cells at various low pressure O₂ and H₂O atmospheres. Open circuit voltageV _OC close to 900 mV and in excess of 900 mV are obtained with Ir, and with Pt, respectively, as continuous barrier metals. The corresponding unpassivated cells (Schottky type solar cells) show considerably lower values ofV _OC=650 mV. In contrast to published results involving Ni, Pd, Zr, and other metals as Schottky barriers, we have observed over a period of several months a remarkably good stability of the passivated devices.     

Analysis of temperature and enhanced diffusion effects in sputtering of CrSi2

Previously reported experimental results on sputtering and enhanced diffusion processes in CrSi₂ during 100 keVXe⁺ bombardment at different temperatures have been quantitatively analyzed.The framework for the analysis is a simple theoretical model in which the Si atoms are considered mobile in a matrix of Cr atoms whose density is assumed constant and diffusivity is considered zero everywhere. Erosion velocity of the matrix (due to the sputtering of Cr atoms), sputtering and enhanced diffusion processes of Si atoms are taken into account in the mathematical model.In our analysis we show that the time evolution of the total number of sputtered atoms in binary solids cannot yield an unambigous conclusion as to the existence of preferential sputtering.Further, it is found that in the case of CrSi₂ the preferential sputtering of Si atoms depends on the suicide temperature.     

Oxygen diffusion in C60 films

We have performed detailed resistivity measurements as a function of temperature in the range from 12 to 300 K on oxygen loaded C₆₀ films. We observe that two ordering phase transitions (i.e.,T ₀=260 K andT _g =90 K) are present in (T), which, in addition, strongly depends on the oxygen content. We find a decrease of both ordering temperatures with increasing oxygen concentrations. The mechanisms of oxygen diffusion are greatly enhanced in the ordered phase on heating. Finally, the transition to a glassy state atT _g is detected as a point of reversibility of the resistivity curve as a function of temperature.