基于Si掺杂Sb2Te3薄膜的相变存储器研究

采用磁控三靶(Si,Sb及Te)共溅射法制备了Si掺杂Sb2Te3薄膜,作为对比,制备了Ge2Sb2Te5和Sb2Te3薄膜,并且采用微加工工艺制备了单元尺寸为10μm×1Oμm的存储器件原型来研究器件性能.研究表明,Si掺杂提高了Sb2Te3薄膜的晶化温度以及薄膜的晶态和非晶态电阻率,使得其非晶态与晶态电阻率之比达到106,提高了器件的电阻开/关比;同Ge2Sb2Te5薄膜相比,16at%Si掺杂Sb2Te3薄膜具有较低的熔点和更高的晶态电阻率,这有利于降低器件的RESET电流.研究还表明,采用16at%Si掺杂Sb2Te3薄膜作为存储介质的存储器器件原型具有记忆开关特性,可以在脉高3V、脉宽500 ns的电脉冲下实现SET操作,在脉高4 V、脉宽20 ns的电脉冲下实现RESET操作,并能实现反复写/擦,而采用Ge2Sb2Te5薄膜的相同结构的器件不能实现RESET操作.     

基于Ge2Sb1.5Bi0.5Te5可饱和吸收体的锁模光纤激光器

Ge2Sb1.5Bi0.5Te5薄膜具有宽光谱吸收和高稳定性的特点.在金镜上采用磁控溅射制备了40 nm厚的Ge2Sb1.5Bi0.5Te5薄膜,将其在150℃下退火20 min,退火后Ge2Sb1.5Bi0.5Te5由非晶态转变为晶态.测试发现晶态Ge2Sb1.5Bi0.5Te5可饱和吸收体的调制深度提高到了原来的1...     

氮掺杂Ge2Sb2Te5相变存储器的多态存储功能

通过反应溅射的方法,制备了N掺杂的Ge2Sb2Te5(N-GST)薄膜,用作相变存储器的存储介质.研究表明,掺杂的N以GeN的形式存在,不仅束缚了Ge2Sb2Te5 (GST)晶粒的长大也提高了GST的晶化温度和相变温度.利用N-GST薄膜的非晶态、晶态面心立方相和晶态六方相的电阻率差异,能够在同一存储单元中存储三个状态,实现相变存储器的多态存储功能.     

Ge2Sb2Te5薄膜光学性能和短波长静态记录特性的研究

利用直流磁控溅射制备了单层Ge₂Sb₂Te₅薄膜,研究了薄膜在400～800 nm区域的反射、透过光谱,计算了它的吸收系数,发现薄膜在400～800 nm波长范围内具有较强的吸收.随着薄膜厚度的增加,相应的禁带宽度Eg也随之增加.对Ge2Sb2Te5薄膜光存储记录特性的研究发现,在514.5 nm波长激光辐照样品时,薄膜具有良好的写入对比度,擦除前后的反射率对比度在6%~18%范围内.对实验结果进行了分析.     

AgInSbTe薄膜的短波长记录性能分析

采用自制的装置研究了Ag5In5Sb47Te33薄膜的静态记录性能与记录激光的功率和脉冲宽度的关系，并对其记录畴形貌特点进行了直接观察。结果表明只有记录激光的功率和脉冲宽度在一定范围之内才能起到信息记录的作用，所得的记录畴形貌十分清晰，基本为非晶态Ag5In5Sb47Te33；小于该范围的激光能量不能使材料结构发生较大的变化，所得的记录畴形貌模糊，反射率对比度低于2％；大于该范围所得的记录畴由烧蚀区和其周围的非晶态Ag5In5Sb47Te33组成。另外，得到了记录激光功率为12mW、脉冲宽度为90ns的Ag5In5Sb47Te33薄膜的短波长最佳记录条件，其记录畴的反射率对比度为22％，直径为380nm-400nm。     

激光致晶态Ag11In12Te26Sb51相变介质光学常数的研究

研究了结晶度对Ag11In12 Te2 6Sb51相变薄膜光学常数的影响。用初始化仪使相变薄膜晶化 ,改变晶化参量得到不同的结晶度 ,当转速固定时 ,随激光功率的增加 ,折射率基本随之减小 ,消光系数先是增大 ,而后减小 ;当激光功率固定时 ,随转速的增大 ,折射率也随之增大 ,消光系数也是先增大后减小。非晶态与晶态间的变换、薄膜微结构的变化 (包括晶型的转变和原子间键合状态的变化 )以及薄膜内残余应力是影响Ag11In12 Te2 6Sb51相变薄膜复数折射率的主要原因。测量了单层膜的透过率和CD RW相变光盘中Ag11In12 Te2 6Sb51薄膜非晶态和晶态的反射率     

新型AgInSbTe相变薄膜的光学及记录性能

利用直流磁控溅射法制备了一种新型AgInSbTe相变薄膜。示差扫描量热(DSC)实验测定的结晶峰温度为193．92℃。X射线衍射(XRD)表明未经热处理的沉积态薄膜是非晶态,而经过200℃热处理,X射线衍射图出现衍射峰,薄膜从非晶态转变到晶态。同时,研究了晶态和非晶态相变薄膜的吸收率、透射率和反射率随波长的变化。测定了650nm激光作用下的相变薄膜的记录性能,分析了记录功率、记录脉宽对薄膜反射率衬比度的影响,在同一记录脉宽条件下,记录功率越大,反射率衬比度也越大;在同一记录功率条件下,随记录脉宽的增加,反射率衬比度也增大。结果表明,新型AgInSbTe相变薄膜在激光作用下具有较高的反射率衬比度,可获得良好的记录性能。     

激光致晶态Ag11In12Te26Sb51相变介质光学常量的研究

研究了结晶度对Ag11In12Te26Sb51相变薄膜光学常数的影响。用初始化仪使相变薄膜晶化，改变晶化参量得到不同的结晶度，当转速固定时，随激光功率的增加，折射率基本随之减小，消光系数先是增大，而后减小；当激光功率固定时，随转速的增大，折射率也随之增大，消光系数也是先增大后减小。非晶态与晶态间的变换、薄膜微结构的变化（包括晶型的转变和原子间键合状态的变化）以及薄膜内残余应力的影响Ag11In12Te26Sb51相变薄膜复数折射率的主要原因。测量了单层膜的透过率和CD－RW相变光盘中Ag11In12Te26Sb51薄膜非晶态和晶态的反射率。     

掺Sn的Ge2Sb2Te5相变存储薄膜的光学性质

提高存储密度和存取速率一直是光存储发展的方向。这对目前用于可擦重写存储的相变材料提出了越来越多的要求：它们既要对短波长有足够的响应,同时其相变速度也越快越好。因此,相变材料性能的改进十分重要,掺杂是提高相变材料性能的重要手段之一。用直流溅射法制备了掺杂不同量Sn的Ge2Sb2Te5相变薄膜,由热处理前后薄膜的X射线衍射（XRD）发现：薄膜发生了从非晶态到晶态的相变。研究了薄膜在250—900nm区域的反射光谱和透射光谱。结果表明：适当的Sn掺杂能大大增加热处理前后材料在短波长（300—405nm）的反射率衬比度,可见,通过Sn掺杂改良相变材料的短波长光存储性能是一种有效的途径。     

基于Si掺杂Sb2Te3薄膜的相变存储器研究

采用磁控三靶(Si，Sb及Te)共溅射法制备了Si掺杂Sb₂Te₃薄膜，作为对比，制备了Ge₂Sb₂Te₅和Sb₂Te₃薄膜，并且采用微加工工艺制备了单元尺寸为10μm×10μm的存储器件原型来研究器件性能.研究表明，Si掺杂提高了Sb₂Te₃薄膜的晶化温度以及薄膜的晶态和非晶态电阻率，使得其非晶态与晶态电阻率之比达到10⁶，提高了器件的电阻开/关比；同Ge₂Sb₂Te₅薄膜相比，16at% Si掺杂Sb₂Te₃薄膜具有较低的熔点和更高的晶态电阻率，这有利于降低器件的RESET电流.研究还表明，采用16at% Si掺杂Sb₂Te₃薄膜作为存储介质的存储器器件原型具有记忆开关特性，可以在脉高3V、脉宽500ns的电脉冲下实现SET操作，在脉高4V、脉宽20ns的电脉冲下实现RESET操作，并能实现反复写/擦，而采用Ge₂Sb₂Te₅薄膜的相同结构的器件不能实现RESET操作. 关键词： 相变存储器 硫系化合物 2Te₃薄膜')" href="#">Si掺杂Sb₂Te₃薄膜 SET/RESET转变     

Raman spectra and XPS studies of phase changes in Ge2Sb2Te5 films

Ge_2Sb_2Te_5 film was deposited by RF magnetron sputtering on Si (100) substrate. The structure of amorphous and crystalline Ge_2Sb_2Te_5 thin films was investigated using XRD, Raman spectra and XPS. XRD measurements revealed the existence of two different crystalline phases, which has a FCC structure and a hexagonal structure, respectively. The broad peak in the Raman spectra of amorphous Ge_2Sb_2Te_5 film is due to the amorphous －Te－-Te－ stretching. As the annealing temperature increases, the broad peak separates into two peaks, which indicates that the heteropolar bond in GeTe_4 and the Sb－Sb bond are connected with four Te atoms, and other units such as (TeSb) Sb－Sb (Te_2) and (Sb_2) Sb－Sb (Te_2), where some of the four Te atoms in the above formula are replaced by Sb atoms, remain in crystalline Ge_2Sb_2Te_5 thin film. And from the results of Raman spectra and XPS, higher the annealing temperature, more Te atoms bond to Ge atoms and more Sb atoms substitute Te in (Te_2) Sb－Sb (Te_2).     

Phase-selective fluorescence of doped Ge_2Sb_2Te_5 phase-change memory thin films

In this Letter, new concepts of fluorescence phase-change materials and fluorescence phase-change multilevel recording are proposed. High-contrast fluorescence between the amorphous and crystalline states is achieved in nickel- or bismuth-doped Ge_2Sb_2Te_5 phase-change memory thin films. Opposite phase-selective fluorescence effects are observed when different doping ions are used. The fluorescence intensity is sensitive to the crystallization degree of the films. This characteristic can be applied in reconfigurable multi-state memory and other logic devices. It also has likely applications in display and data visualization.     

Laser induced crystallization of as-deposited amorphous Ge2Sb2Te5 films

Crystallization is induced by pulsed laser irradiation of s-deposited amorphous Ge2Sb2Te5 films. Changes of the irradiated areas have been analyzed with the reflectivity contrast. As laser fluences increasing,the reflectivity contrast increases from 0% - 2% to 14% - 16%, which indicates the structure of as deposited films transforms from amorphous to crystalline phases. The process of crystallization driven by the movement and rearrangement of atoms is described. And also the influence of the pulse duration on the threshold of crystallization is discussed, the results show that a lower threshold of crystallization can be produced for as-deposited films irradiated by the laser with short pulse duration. However, by the laser with long pulse duration, crystallization can only be formed with a higher threshold. The crystallization of films by irradiation of laser pulses is studied by Raman spectra.     

GeSb_2Te_4相变光存储薄膜材料的短波长静态记录特性的研究

研究了单层ＧｅＳｂ２Ｔｅ４真空射频溅射薄膜在４００ｎｍ～８３０ｎｍ区域的吸收、反射光谱和光学常数（ｎ，ｋ），发现ＧｅＳｂ２Ｔｅ４薄膜在４００ｎｍ～６００ｎｍ波长范围内具有较强的吸收。在短波长静态测试仪上测试了ＧｅＳｂ２Ｔｅ４薄膜的光存储记录特性，发现在５１４．５ｎｍ波长用较低功率的激光辐照样品时薄膜在写入前后的反射率变化较大，擦除前后的反射率对比度较低，可通过膜层设计来提高     

TeOx薄膜结构及短波长静态记录特性的研究

以真空蒸镀法在K9玻璃基底上制备了TeO_x单层薄膜.使用X射线光电子能谱仪(XPS)、X射线衍射仪(XRD)、原子力显微镜(AFM)对薄膜的结构进行了分析.实验结果表明,薄膜是由晶态Te分散在非晶态TeO₂基体中形成的混合体系,TeO₂基体的存在增强了Te的抗氧化性能;薄膜具有精细粒状结构和粗糙的表面;退火后薄膜的反射率增加和Te向表面的偏析、重聚集及表面粗糙度的降低有关.采用波长为514.4nm的短波长静态记录仪对薄膜静态记录性能的测试结果表明:薄膜具有良好的记录灵敏性,在记录功率1.5mW、脉宽50ns时就可产生较高的反射率衬比(度).研究结果为选择合适掺和物使TeO_x薄膜实际用作高密度光存储介质有重要意义.     

High Reflection Ge_(0.45)Te_(0.55) Recording Films

ＨｉｇｈＲｅｆｌｅｃｔｉｏｎＧｅ０．４５Ｔｅ０．５５ＲｅｃｏｒｄｉｎｇＦｉｌｍｓＬＩＵＨｕｉｙｏｎｇＪＩＡＮＧＦｕｓｏｎｇＭＥＮＬｉｑｉｕＦＡＮＺｈｅｎｇｘｉｕＧＡＮＦｕｘｉ（ＳｈａｎｇｈａｉＩｎｓｔｉｔｕｔｅｏｆＯｐｔｉｃｓ＆ＦｉｎｅＭｅｃｈａｎｉ...     

Formation of high-Sn content polycrystalline GeSn films by pulsed laser annealing on co-sputtered amorphous GeSn on Ge substrate

Polycrystalline Ge_(1-x)Sn_x(poly-Ge_(1-x)Sn_x) alloy thin films with high Sn content( 10%) were fabricated by cosputtering amorphous GeSn(a-GeSn) on Ge(100) wafers and subsequently pulsed laser annealing with laser energy density in the range of 250 mJ/cm~2 to 550 mJ/cm~2. High quality poly-crystal Ge_(0.90) Sn_(0.10) and Ge_(0.82) Sn_(0.18) films with average grain sizes of 94 nm and 54 nm were obtained, respectively. Sn segregation at the grain boundaries makes Sn content in the poly-GeSn alloys slightly less than that in the corresponding primary a-GeSn. The crystalline grain size is reduced with the increase of the laser energy density or higher Sn content in the primary a-GeSn films due to the booming of nucleation numbers. The Raman peak shift of Ge-Ge mode in the poly crystalline GeSn can be attributed to Sn substitution, strain,and disorder. The dependence of Raman peak shift of the Ge-Ge mode caused by strain and disorder in GeSn films on full-width at half-maximum(FWHM) is well quantified by a linear relationship, which provides an effective method to evaluate the quality of poly-Ge_(1-x)Sn_x by Raman spectra.