低起始温度的线性升温热处理对直拉硅中氧沉淀的影响

研究了直拉硅片从不同的温度线性升温(Ramping)到750℃,然后在750℃退火64 h过程中的氧沉淀行为. 结果表明,Ramping对硅片中氧沉淀的形成有明显的促进作用,且起始温度越低促进作用越强. 这是因为在Ramping处理中,低温(450—650℃)热处理阶段氧的扩散速率显著增强,促进了氧沉淀核心的形成,且较低的Ramping升温速率有利于氧沉淀核心的稳定和继续长大. 进一步的实验结果还表明,低起始温度的Ramping处理可应用于硅片的内吸杂工艺,能促进氧沉淀的生成提高硅片的内吸杂能力,减少热预 关键词： 直拉硅 氧沉淀 退火     

低温退火对重掺砷直拉硅片的氧沉淀形核的作用

通过对比研究重掺砷直拉硅片和轻掺n型直拉硅片经过低温(450—800℃)和高温(1000℃)两步退火的氧沉淀行为,阐明了低温退火对重掺掺砷直拉硅片的氧沉淀形核的作用.研究指出：重掺砷硅片在450℃和650℃退火时的氧沉淀形核比在800℃退火时更显著,这与轻掺硅片的情况截然相反;此外,与轻掺硅片相比,重掺砷硅片在450℃和650℃退火时氧沉淀的形核得到增强,而在800℃退火时氧沉淀的形核受到抑制.分析认为,重掺砷硅片在450℃和650℃退火时会形成砷-空位-氧(As-V-O)复合体,它们促进了 关键词： 重掺砷直拉硅片 氧沉淀形核 低温退火     

直拉硅中氮在高温退火过程中对氧沉淀的影响

研究了掺氮直拉硅单晶（NCZ）中氮在高温退火过程中对氧沉淀的影响.通过不同温度高温退 火后，测量氧沉淀的生成量和观察硅片体内微缺陷（BMD）密度与高温形核时间的变化关系 ，同时用透射电子显微镜(TEM)观察氧沉淀及相关缺陷的微观结构.实验结果表明高温退火后 氮对硅中氧沉淀形核有明显的促进作用，在相同退火条件下NCZ硅中BMD密度要远远高于相应 的普通直拉硅.这是由于氮在高温下与氧反应形成氮氧复合体（N-V-O）促进了氧沉淀的形核 ，而且TEM的结果表明氧沉淀的形态都是平板状，周围存在应力场. 关键词： 直拉硅 掺氮 氧沉淀     

低起始温度的线性升温热处理对直拉硅中氧沉淀的影响

研究了直拉硅片从不同的温度线性升温(Ramping)到750℃，然后在750℃退火64 h过程中的氧沉淀行为. 结果表明，Ramping对硅片中氧沉淀的形成有明显的促进作用，且起始温度越低促进作用越强. 这是因为在Ramping处理中，低温(450—650℃)热处理阶段氧的扩散速率显著增强，促进了氧沉淀核心的形成，且较低的Ramping升温速率有利于氧沉淀核心的稳定和继续长大. 进一步的实验结果还表明，低起始温度的Ramping处理可应用于硅片的内吸杂工艺，能促进氧沉淀的生成提高硅片的内吸杂能力，减少热预     

中子辐照氢气氛生长硅的红外吸收

用傅里叶变换红外吸收光谱技术测量了中子辐照氢气氛生长区熔硅在1800—2300cm^-1和400—1200cm^-1频段的吸收光谱。给出了较强谱带的退火曲线。与质子注入硅的红外光谱及中子辐照氢气氛生长硅的深能级瞬态谱结果相比较,讨论了相应于一些谱带的硅氢中心的可能结构。 关键词：     

多孔硅量子点的受激辐射：陷阱态的作用

 经激光辐照和高温退火后能够在硅基上生成氧化多孔硅结构。用514 nm的激光泵浦,观测到该多孔硅的受激辐射。当激励强度超过阈值时,在650～750 nm区域有很强的受激发光峰。这些受激发光峰的半高宽小于0.5 nm。激光辐照和高温退火后,在样品上能形成某些特殊的氧化结构。在傅里叶红外光谱分析中,显示有硅氧双键或硅氧桥键在硅表面形成。计算结果表明：当硅氧双键或硅氧桥键形成时,电子的陷阱态出现在纳晶硅的带隙中。价带顶和陷阱态之间的粒子数反转是解释这种受激辐射的关键。     

快中子辐照直拉硅中受主和施主的研究

通过傅里叶红外光谱、正电子湮没寿命谱和Hall技术研究了高剂量快中子辐照直拉硅的辐照 缺陷、电阻率、载流子迁移率、载流子浓度随退火温度的变化.经快中子辐照，直拉硅样品 的导电类型由n型转变为p型.在450和600℃热处理出现两种受主中心，分别由V2_{2O22，V22O，VO22，V-O-V及V44型缺 陷引起，这些缺陷态的出现使得样品中空穴浓度迅速增加；大于650℃热处理这些受主态 缺陷迅速消失， 关键词： 快中子辐照 空位型缺陷 受主 施主}     

掺杂剂对重掺n型直拉硅片的氧化诱生层错生长的影响

对比研究了电阻率几乎相同的重掺锑和重掺磷直拉硅片的氧化诱生层错(OSF)的生长, 以揭示掺杂剂对重掺n型直拉硅片的OSF生长的影响. 研究表明: 在相同的热氧化条件下, 重掺锑直拉硅片的OSF的长度大于重掺磷硅片的. 基于密度泛函理论的第一性原理计算结果表明: 与磷原子相比, 锑原子是更有效的空位俘获中心, 从而抑制空位与自间隙硅原子的复合. 因此, 在经历相同的热氧化时, 氧化产生的自间隙硅原子与空位复合后所剩余的数量在重掺锑硅片中的更多, 从而导致OSF更长.     

中子辐照高掺硅砷化镓的光致发光研究

研究了高掺硅的n型GaAs在中子辐照前后和150℃-500℃等时热退火以后的光致发光光谱。观察到在中子辐照后积分发光强度降低为辐照前的1/36。在退火温度超过250℃时,积分发光强度显著增长,当退火温度达400℃以上时,在带边峰的低能侧出现能量为1.35eV、1.30eV和1.26eV的发光峰。假设250℃退火阶段对应于较大的空位团分解为较小的空位团,400℃退火阶段对应于较小的空位团分解出VGa,可以较好地解释实验现象。     

钨酸铅晶体的本征色心和辐照诱导色心

根据钨酸铅晶体(PbWO4,简称PWO)的缺陷化学和晶体结构特点,用光吸收谱、广延X射线吸收精细结构(EXAFS)和精密X射线衍射(XRD)方法对高温退火后PWO晶体进行微结构研究,获得了其退火前后缺陷变化的情况,据此提出生成态(asgrown)晶体中350nm本征色心吸收带起源于V-F空穴心,并指出PWO中紫外区色心吸收带的强度取决于晶体中铅空位和氧空位浓度之差:[VPb]-[VO];然后,结合晶体在紫外光(UV)辐照过程中色心的转化规律和偏振吸收谱的实验结果,提高420nm辐照诱导色心吸收带起源于V0F双空穴心.并对所提出的PWO晶体色心模型的合理性进行了讨论. 关键词： 钨酸铅 本征色心 辐照诱导色心 色心模型     

低温退火磷吸杂工艺对低少子寿命铸造多晶硅电性能的影响

本文针对低少子寿命铸造多晶硅片进行试验, 通过一种将多温度梯度磷扩散吸杂工艺与低温退火工艺结合的新型低温退火吸杂工艺, 去除低少子寿命多晶硅片中影响其电性能的Fe杂质及部分晶体缺陷, 提高低少子寿命多晶硅所生产的太阳电池各项电性能. 通过低温退火磷扩散吸杂工艺与其他磷扩散吸杂工艺的比较, 证明了低温退火吸杂工艺具有更好的磷吸杂和修复晶体缺陷的作用. IV-measurement发现经过低温退火工艺处理后的低少子寿命多晶硅, 制备的太阳电池光电转换效率比其他实验组高0.2%, 表明该工艺能有效地提高低少子寿命多晶硅太阳电池各项电性能参数及电池质量. 本研究结果表明新型低温退火磷吸杂工艺可将低少子寿命硅片应用于大规模太阳电池生产中, 提高铸造多晶硅材料在太阳能领域的利用率, 节约铸造多晶硅的生产成本. 关键词： 低温退火 磷吸杂 低少子寿命多晶硅 太阳电池     

Rapid-thermal-anneal-based internal gettering for?germanium-doped Czochralski silicon

The internal gettering (IG) effects involved with a rapid thermal anneal (RTA) in germanium-doped Czochralski silicon (GCz-Si) wafer have been investigated. It was found that germanium doping could enhance the oxygen precipitation in bulk while shrinking the denuded zone width near the surface through pre-RTA at high temperature plus low–high temperature conventional furnace anneals. Rapid cooling rate after RTA was clarified to be beneficial for oxygen precipitation for GCz-Si wafer. It was suggested that the germanium doping could increase the vacancy concentration in Cz-Si during RTA by forming the germanium–vacancy complexes. In contrast to that in Cz-Si wafer, the smaller-sized higher-density oxygen precipitates were presented in the nucleation anneals, then followed RTA pretreatment while more oxygen precipitates survived during ramping processes after nucleation anneals in the GCz-Si wafer. Enhanced heterogeneous nucleation and reduced critical radius of precipitates associated with the germanium–vacancy complexes have been proposed for the oxygen precipitation enhancement.     

Accelerated oxygen precipitation in fast neutron irradiated Czochralski silicon

Annealing effect of the oxygen precipitation and the induced defects have been investigated on the fast neutron irradiated Czochralski silicon （CZ-Si） by infrared absorption spectrum and the optical microscopy. It is found that the fast neutron irradiation greatly accelerates the oxygen precipitation that leads to a sharp decrease of the interstitial oxygen with the annealing time. At room temperature （RT）, the 1107cm^-1 infrared absorption band of interstitial oxygen becomes weak and broadens to low energy side. At low temperature, the infrared absorption peaks appear at 1078cm^-1, 1096cm^-1, and 1182cm^-1, related to different shapes of the oxygen precipitates. The bulk microdefects, including stacking faults, dislocations and dislocation loops, were observed by the optical microscopy. New or large stacking faults grow up when the silicon self-interstitial atoms are created and aggregate with oxygen precipitation.     

直拉单晶硅中洁净区形成后铜沉淀行为的研究

本文研究了直拉单晶硅中形成洁净区后过渡族金属杂质铜的沉淀行为. 样品经过高低高三步常规热处理形成洁净区后, 在不同温度下引入杂质铜, 然后对样品分别进行普通热处理和快速热处理, 通过腐蚀和光学显微镜研究发现, 在700 ℃引入铜杂质后经过普通热处理和快速热处理都不会破坏洁净区, 在900 ℃和1100 ℃引入铜杂质后经过普通热处理不会破坏洁净区, 而经过快速热处理会破坏洁净区. 研究表明, 快速热处理可以使硅片体内产生大量的空位, 空位的外扩散是破坏洁净区的主要原因. 关键词： 直拉单晶硅 铜沉淀 洁净区     

SIMS investigation of gettering centres produced by phosphorus MeV ion implantation

The ion implantation is a well-known standard procedure in electronic device technology for precise and controlled introduction of dopants into silicon. Damages caused by implantation act as effective gettering zones, collecting unwanted metal impurities. In this work, the consequences of high-energy ion implantation into silicon and of subsequently annealing were analysed by means of secondary ion mass spectrometry (SIMS). The differences in impurities gettering behaviour were studied in dependence of the implantation dose and annealing time at T = 900 °C.     

Effect of preliminary annealing of silicon substrates on the spectral sensitivity of photodetectors in bipolar integrated circuits

We examine the results of an effect of preliminary annealing on the spectral sensitivity of photodetectors in bipolar integrated circuits, formed in silicon grown by the Czochralski method. We demonstrate the possibility of substantially improving the sensitivity of photodetectors in the infrared region of the spectrum with twostep annealing. The observed effect is explained by participation of oxidation in the gettering process, where oxidation precedes formation of a buried n+ layer in the substrate.     

Raman scattering from amorphous zones in neutron irradiated silicon

A Raman scattering study of neutron irradiated silicon is presented for the first time. We have observed features in the Raman spectrum arising from amorphous zones produced in the bulk of the sample due to neutron induced defects. We relate these first order Raman modes to the crystalline vibrational density of states averaged over the Brillouin zone.     

Oxygen and hydrogen accumulation at buried implantation-damage layers in hydrogen- and helium-implanted Czochralski silicon

Oxygen and hydrogen accumulations at buried implantation-damage layers were studied after post-implant-ation annealing of hydrogen- and helium-implanted Czochralski (Cz) silicon. Hydrogen implantation was carried out at energies E=180 keV and doses D=2.7×10¹⁶ cm^-2, and helium implantation at E=300 keV and D=10¹⁶ cm^-2. For comparison hydrogen implantation was also done into float-zone (Fz) silicon wafers. Post-implantation annealing at 1000 °C was done either in H₂ or N₂ atmosphere. Hydrogen and oxygen concentration profiles were measured by secondary ion mass spectroscopy (SIMS). It is shown that the ambient during annealing plays a significant role for the gettering of oxygen at buried implantation-damage layers in Cz Si. For both hydrogen and helium implantations, the buried defect layers act as rather effective getter centers for oxygen and hydrogen at appropriate conditions. The more efficient gettering of oxygen during post-implantation annealing in a hydrogen ambient can be attributed to a hydrogen-enhanced diffusion of oxygen towards the buried implantation-damage layers, where a fast oxygen accumulation occurs. Oxygen concentrations well above 10¹⁹ cm^-3 can be obtained. From the comparison of measurements on hydrogen-implanted Cz Si and Fz Si one can conclude that at the buried defect layers hydrogen is most probably trapped by voids and/or may be stable as immobile molecular hydrogen species. Therefore hydrogen accumulated at the defect layers, and is preserved even after high-temperature annealing at 1000 °C. Received: 3 July 2000 / Accepted: 11 July 2000 / Published online: 22 November 2000     

Gettering of metallic impurities in photovoltaic silicon

 This work addresses the issue of structural defect-metallic impurity interactions in photovoltaic silicon and their effect on minority carrier diffusion length values. Aluminium and phosphorus segregation gettering studies were performed on photovoltaic silicon in order to gain insight into these interactions and quantify the effect of gettering on solar cell performance. Integrated circuit grade silicon was also studied for comparative purposes. Additionally, a novel rapid thermal annealing technique, designed to dissolve metallic impurity precipitates, and Deep Level Transient Spectroscopy were utilized to determine the as-grown impurity concentration in both grades of materials. Significant differences in gettering responses between the two grades of silicon are observed. Gettering treatments greatly improve I.C. grade silicon with a specific gettering temperature providing the optimal response. Photovoltaic grade silicon does not respond as well to the gettering treatments and, in some cases, the material degrades at higher gettering temperatures. The degradation is primarily observed in dislocated regions of multicrystalline photovoltaic silicon. Additionally, these dislocated regions were found to possess the highest as-grown metallic impurity concentration of all the materials studied. The dislocation-free photovoltaic silicon has a higher diffusion length relative to dislocated silicon but could not be improved by the gettering methods employed in this study. A model is presented to describe these phenomena where the high concentration of metallic impurities at dislocations produce relatively low minority carrier diffusion lengths as well as the degrading response with higher gettering temperatures while microdefects create an upper limit to the photovoltaic grade material’s diffusion length. Received: 21 June 1996/Accepted: 2 September 1996