Enlarged ferromagnetic hysteresis in InMnP:Be epilayers formed by thermal diffusion using MBE-grown Mn/InP:Be bilayers

The p-type InMnP:Be epilayers, which were prepared by thermal diffusion of Mn through in-situ deposition of Mn layer using molecular beam epitaxy (MBE) onto MBE-grown InP:Be epilayers and subsequent in-situ annealing at 300–350 °C, were investigated. InMnP:Be epilayers prepared by the above sequence clearly showed the Mn-related emission band at 1.1–1.2 eV, which indicates the effective incorporation of Mn²⁺ ions into the host layer InP:Be. The samples demonstrated very large ferromagnetic hysteresis loops with enhanced coercivity, and the ferromagnetic-to-paramagnetic transition of the samples was observed to occur at ∼85 K. These results suggest that InP-based ferromagnetic semiconductor layers having enhanced ferromagnetism can be effectively formed by the above-mentioned sequential in-situ processes.     

Influence of Be on N composition in Be-doped InGaAsN grown by RF plasma-assisted molecular beam epitaxy

Undoped and Be-doped InGaAsN layers were grown on GaAs substrates under the same growth conditions by radio frequency plasma-assisted molecular beam epitaxy. Increased tensile strain (Δa/a=3×10⁻³) was observed for Be-doped InGaAsN layers, compared to undoped InGaAsN layers. The strain is shown to originate from the increase in N composition related to Be incorporation, rather than solely from Be atoms substituting Ga atom sites (Be_Ga). A possible reason is the high Be–N bond strength, which inhibits the loss of N from the growth surface during epitaxial growth, thereby increasing the N composition in the Be-doped InGaAsN layer.     

Surface and interfacial structure of epitaxial SrTiO3 thin films on (0 0 1) Si grown by molecular beam epitaxy

Effects of relaxation of interfacial misfit strain and non-stoichiometry on surface morphology and surface and interfacial structures of epitaxial SrTiO₃ (STO) thin films on (0 0 1) Si during initial growth by molecular beam epitaxy (MBE) were investigated. In situ reflection high-energy electron diffraction (RHEED) in combination with X-ray diffraction (XRD), atomic force microscopy (AFM), X-ray photoelectron spectrometry (XPS) and transmission electron microscopy (TEM) techniques were employed. Relaxation of the interfacial misfit strain between STO and Si as measured by in situ RHEED indicates initial growth is not pseudomorphic, and the interfacial misfit strain is relaxed during and immediately after the first monolayer (ML) deposition. The interfacial strain up to 15 ML results from thermal mismatch strain rather than lattice mismatch strain. Stoichiometry of STO affects not only surface morphology but interfacial structure. We have identified a nanoscale Sr₄Ti₃O₁₀ second phase at the STO/Si interface in a Sr-rich film.     

The transition from As-doped GaN, showing blue emission, to GaNAs alloys in films grown by molecular beam epitaxy

We have studied the transition from As-doped GaN showing strong blue emission (2.6 eV) at room temperature to the formation of GaN_1−xAs_x alloys for films grown by plasma-assisted molecular beam epitaxy. We have demonstrated that with increasing N-to-Ga ratio there is first an increase in the intensity of blue emission at about 2.6 eV and then a transition to the growth of GaN_1−xAs_x alloy films. We present a model based on thermodynamic considerations, which can explain how this might occur.     

AlGaN photodetectors grown on Si(1 1 1) by molecular beam epitaxy

The fabrication and characterisation of Al_xGa_1−xN (0x0.35) photodetectors grown on Si(1 1 1) by molecular beam epitaxy are described. For low Al contents (<10%), photoconductors show high responsivities (10A/W), a non-linear dependence on optical power and persistent photoconductivity (PPC). For higher Al contents the PPC decreases and the photocurrent becomes linear with optical power. Schottky photodiodes present zero-bias responsivities from 12 to 5 mA/W (x=0−0.35), a UV/visible contrast higher than 10³, and a time response of 20 ns, in the same order of magnitude as for devices on sapphire substrate. GaN-based p–n ultraviolet photodiodes on Si(1 1 1) are reported for the first time.     

Improvement of GaInNAsSb films fabricated by atomic hydrogen-assisted molecular beam epitaxy

The effect of incorporation of antimony in GaInNAs films grown by atomic hydrogen-assisted molecular beam epitaxy (MBE) has been investigated. We show that the rate of incorporation of N and In forming GaInNAs do not depend on the Sb beam flux. However, the incorporation of Sb is strongly dependent on the Sb/As₂ flux ratio. Introducing a small amount of Sb (<∼1%) significantly improves the photoluminescence (PL) emission efficiency of GaInNAs, but Sb concentration of >1% rapidly degrades the PL intensity, though a large redshift can still be achieved. Therefore, there is an optimum amount of Sb for the growth of low-strained GaInNAs films to improve the overall optical quality.     

Incorporation behaviors of group V elements in GaAsSbN grown by gas-source molecular-beam epitaxy

We report the incorporation behaviors of As, Sb, and N atoms in GaAsSbN grown by gas-source molecular-beam epitaxy. We found that N atom is more reactive and competitive than Sb atom at the growth temperature ranging from 420 to 450 °C. The increment in Sb beam flux hardly changes the N composition. However, the increment in N flux retards the incorporation of Sb. In addition, the increment in As₂ flux makes the Sb and N compositions decrease at the same rate. Based on these results, we have successfully grown GaAsSbN epilayers lattice-matched to GaAs substrates. The energy gap at room temperature is as low as 0.803 eV. Negative deviation from Vegard's law in lattice constant is observed in these layers.     

The incorporation behavior of arsenic and antimony in GaAsSb/GaAs grown by solid source molecular beam epitaxy

GaAsSb ternary epitaxial layers were grown on GaAs (0 0 1) substrate in various Sb₄/As₂ flux ratios by solid source molecular beam epitaxy. The alloy compositions of GaAs_1−ySb_y were inferred using high-resolution X-ray symmetric (0 0 4) and asymmetric (2 2 4) glance exit diffraction. The non-equilibrium thermodynamic model is used to explain the different incorporation behavior between the Sb₄ and As₂ under the assumption that one incident Sb₄ molecule produces one active Sb₂ molecule. It is inferred that the activation energy of Sb₄ dissociation is about 0.46 eV. The calculated results for the incorporation efficiency of group V are in good agreement with the experimental data.     

MgO films grown on yttria-stabilized zirconia by molecular beam epitaxy

MgO films were grown on (0 0 1) yttria-stabilized zirconia (YSZ) substrates by molecular beam epitaxy (MBE). The crystalline structures of these films were investigated using X-ray diffraction and transmission electron microscopy. Growth temperature was varied from 350 to 550 °C, with crystalline quality being improved at higher temperatures. The MgO films had a domain structure: (1 1 1)[1 1 2¯]_MgO(0 0 1)[1 0 0]_YSZ with four twin variants related by a 90° in-plane rotation about the [1 1 1]_MgO axis. The observed epitaxial orientation was compared to previous reports of films grown by pulsed laser deposition and sputtering and explained as resulting in the lowest interface energy.     

Growth of EuTe islands on SnTe by molecular beam epitaxy

Semiconductor magnetic quantum dots are very promising structures, with novel properties that find multiple applications in spintronic devices. EuTe is a wide gap semiconductor with NaCl structure, and strong magnetic moments S=7/2 at the half filled 4f⁷ electronic levels. On the other hand, SnTe is a narrow gap semiconductor with the same crystal structure and 4% lattice mismatch with EuTe. In this work, we investigate the molecular beam epitaxial growth of EuTe on SnTe after the critical thickness for island formation is surpassed, as a previous step to the growth of organized magnetic quantum dots. The topology and strain state of EuTe islands were studied as a function of growth temperature and EuTe nominal layer thickness. Reflection high energy electron diffraction (RHEED) was used in-situ to monitor surface morphology and strain state. RHEED results were complemented and enriched with atomic force microscopy and grazing incidence X-ray diffraction measurements made at the XRD2 beamline of the Brazilian Synchrotron. EuTe islands of increasing height and diameter are obtained when the EuTe nominal thickness increases, with higher aspect ratio for the islands grown at lower temperatures. As the islands grow, a relaxation toward the EuTe bulk lattice parameter was observed. The relaxation process was partially reverted by the growth of the SnTe cap layer, vital to protect the EuTe islands from oxidation. A simple model is outlined to describe the distortions caused by the EuTe islands on the SnTe buffer and cap layers. The SnTe cap layers formed interesting plateau structures with easily controlled wall height, that could find applications as a template for future nanostructures growth.     

A structural study of phase transitions within GaN layers grown by low-temperature molecular beam epitaxy

The epitaxial growth of GaN layers on sapphire substrates by molecular beam epitaxy at low temperatures (500°C) has been investigated. Samples exhibited a transition from hexagonal to mixed hexagonal/cubic phase under conditions of increasing Ga flux as determined using a TEM-RHEED technique with complementary SEM and PL observations. Embedded cubic grains adopted two domain variants with additional evidence for twinning.     

Anomalous temperature-dependent photoluminescence characteristic of as-grown GaInNAs/GaAs quantum well grown by solid source molecular beam epitaxy

The photoluminescence (PL) mechanisms of as-grown GaInNAs/GaAs quantum well were investigated by temperature-dependent PL measurements. An anomalous two-segmented trend in the PL peak energy vs. temperature curve was observed, which has higher and lower temperature-dependent characteristics at low temperature (5–80 K) and high temperature (above 80 K), respectively. The low and high-temperature segments were fitted with two separate Varshni fitting curves, namely Fit_low and Fit_high, respectively, as the low-temperature PL mechanism is dominated by localized PL transitions while the high-temperature PL mechanism is dominated by the e1–hh1 PL transition. Further investigation of the PL efficiency vs. 1/kT relationship suggests that the main localized state is located at 34 meV below the e1 state. It is also found that the temperature (80 K) at which the PL full-width at half-maximum changes from linear trend to almost constant trend correlates well with the temperature at which the PL peak energy vs. temperature curve changes from Fit_low to Fit_high.     

Reduction of threading dislocations in migration enhanced epitaxy grown GaN with N-polarity by use of AlN multiple interlayer

High quality GaN layer was obtained by insertion of high temperature grown AlN multiple intermediate layers with migration enhanced epitaxy method by the RF-plasma assisted molecular beam epitaxy on (0 0 01) sapphire substrates. The propagating behaviors of dislocations were studied, using a transmission electron microscope. The results show that the edge dislocations were filtered at the AlN/GaN interfaces. The bending propagation of threading dislocations in GaN above AlN interlayers was confirmed. Thereby, further reduction of dislocations was achieved. Dislocation density being reduced, the drastic increase of electron mobility to 668 cm²/V s was obtained at the carrier density of 9.5×10¹⁶ cm⁻³ in Si doped GaN layer.     

Effect of arsenic species on the kinetics of GaAs nanowires growth by molecular beam epitaxy

GaAs nanowires (NWs) are grown on GaAs (1 1 1) B substrates in a molecular beam epitaxy system, by Au-assisted vapor–liquid–solid growth. We compare the characteristics of NWs elaborated with As₂ or As₄ molecules. In a wide range of growth temperatures, As₄ leads to growth rates twice faster than As₂. The shape of the NWs also depends on the arsenic species: with As₄, regular rods can be obtained, while pencil-like shape results from growth with As₂. From the analysis of the incoming fluxes, which contributes to the NWs formation, we conclude that the diffusion length of Ga adatoms along the NW sidewalls is smaller under As₂ flux as compared to that under As₄ flux. It follows that As₂ flux is favourable to the formation of radial heterostructures, whereas As₄ flux is preferable to maintain pure axial growth.     

Growth of epitaxial ZnO films on Si (1 1 1) substrates with Cr compound buffer layer by plasma-assisted molecular beam epitaxy

Single crystalline ZnO film was grown on (1 1 1) Si substrate through employing an oxidized CrN buffer layer by plasma-assisted molecular beam epitaxy. Single crystalline characteristics were confirmed from in-situ reflection high energy electron diffraction, X-ray pole figure measurement, and transmission electron diffraction pattern, consistently. Epitaxial relationship between ZnO film and Si substrate is determined to be (0 0 0 1)_ZnO‖(1 1 1)_Si and [1 1 2¯ 0]_ZnO‖[0 1 1]_Si. Full-width at half-maximums (FWHMs) of (0 0 0 2) and (1 0 1¯ 1) X-ray rocking curves (XRCs) were 1.379° and 3.634°, respectively, which were significantly smaller than the FWHMs (4.532° and 32.8°, respectively) of the ZnO film grown directly on Si (1 1 1) substrate without any buffer. Total dislocation density in the top region of film was estimated to be ∼5×10⁹ cm⁻². Most of dislocations have a screw type component, which is different from the general cases of ZnO films with the major threading dislocations with an edge component.     

Optimisation of low-temperature silicon epitaxy on seeded glass substrates by ion-assisted deposition

Using single crystalline Si wafer substrates, ion-assisted deposition (IAD) has recently been shown [J. Crystal Growth 268 (2004) 41] to be capable of high-quality high-rate epitaxial Si growth in a non-ultra-high vacuum (non-UHV) environment at low temperatures of about 600 °C. In the present work the non-UHV IAD method is applied to planar borosilicate glass substrates featuring a polycrystalline silicon seed layer and carefully optimised. Using thin-film solar cells as test vehicle, the best trade-off between various contamination-related processes (seed layer surface as well as bulk contamination) is determined. In the optimised IAD process, the temperature of the glass substrate remains below 600 °C. The as-grown Si material is found to respond well to post-growth treatments (rapid thermal annealing, hydrogenation), enabling respectable open-circuit voltages of up to 420 mV under 1-Sun illumination. This proves that the non-UHV IAD method is capable of achieving device-grade polycrystalline silicon material on seeded borosilicate glass substrates.     

Investigation of void formation beneath thin AlN layers by decomposition of sapphire substrates for self-separation of thick AlN layers grown by HVPE

Void formation at the interface between thick AlN layers and (0 0 0 1) sapphire substrates was investigated to form a predefined separation point of the thick AlN layers for the preparation of freestanding AlN substrates by hydride vapor phase epitaxy (HVPE). By heating 50–200 nm thick intermediate AlN layers above 1400 °C in a gas flow containing H₂ and NH₃, voids were formed beneath the AlN layers by the decomposition reaction of sapphire with hydrogen diffusing to the interface. The volume of the sapphire decomposed at the interface increased as the temperature and time of the heat treatment was increased and as the thickness of the AlN layer decreased. Thick AlN layers subsequently grown at 1450 °C after the formation of voids beneath the intermediate AlN layer with a thickness of 100 nm or above self-separated from the sapphire substrates during post-growth cooling with the aid of voids. The 79 μm thick freestanding AlN substrate obtained using a 200 nm thick intermediate AlN layer had a flat surface with no pits, high optical transparency at wavelengths above 208.1 nm, and a dislocation density of 1.5×10⁸ cm⁻².