Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

High performance polymer films 4. Mechanical behavior

Tensile properties of the polyimide and copolyimide films based on two dianhydrides, pyromellitic dianhydride (PMDA) and 3,3^′,4,4^′-benzophenonetetracarboxylic dianhydride (BTDA) and two diamines, 4,4^′-oxydianiline (ODA), and a proprietary aromatic diamine (PD) have been described. The tensile strength of the films containing higher proportions of BTDA or PMDA and PD is much higher (except the fully rigid film based on PMDA-PD which is brittle in nature) than the films containing higher proportion of ODA moiety. The films containing PD as the diamine moiety exhibit high initial moduli than the films containing exclusively or mainly ODA as the diamine moiety. The films having higher concentration of the -O- linkage originated from diamine ODA are found to exhibit higher elongation values. There is found to be no direct correlation between η_inh of the precursor casting solutions and mechanical properties of structurally different polyimide/copolyimide films. For a particular polyimide or copolyimide film, the tensile strength value is found to be less sensitive than the elongation to the variation of η_inh value of the precursor poly(amic acid) or copoly(amic acid). Tensile strength and elongation of the film, basically rigid in nature, may be improved by post-curing at 360°C/370°C. While Kapton H film retains 78% and 63.5% of its tensile strength and % elongation at break (% E_b) respectively after hot-wet mechanical test, the film based on BTDA 80, PMDA 20 and PD shows an increase of about 27% and 22% in its tensile strength and % E_b respectively.     

Water sorption and activation energy in polyimide thin films

The water sorption behavior and the activation energy were investigated for various chemical structure polyimide thin films; BPDA‐PDA, BPDA‐ODA, PMDA‐ODA, and 6FDA‐ODA. The activation energy for the water diffusion varied in the range of 5.53 to 9.27kcal/mol, and was in the increasing order: BPDA‐PDA < BPDA‐ODA < PMDA‐ODA < 6FDA‐ODA. BPDA‐PDA and BPDA‐ODA polyimide films showed relatively well‐ordered morphological structure, which results in relatively low diffusion coefficient and high activation energy. It was found that the diffusion coefficient and the activation energy are significantly related to the in‐plane orientation, crystallinity, and packing order in the polyimide thin films. The morphological structure was predominant factors for the water diffusion coefficient and activation energy in the polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2714–2720, 2000     

Carbon nanocones/discs – a new type of filler to improve the thermal and mechanical properties of polymer films

The mechanical characteristics and thermal properties of composite films based on the thermally stable aromatic polyimide (PI) (PMDA‐ODA) and carbon nanocones/discs (CNC) were studied. The introduction of CNC to PMDA‐ODA leads to the substantial increase of film stiffness. The Young's modulus values of the composite films are somewhat higher than those of the previously characterized composite films of this PI filled with nanoclay, carbon nanofibers, and asbestos‐like hydrosilicate nanotubes. The introduction of CNC into PMDA‐ODA (concentrations of CNC were up to 15 vol%) does not cause any marked aggregation of nanoparticles. The presence of CNC in the PI matrix does not affect the glass transition temperature of the polymer but hinders chain mobility at temperatures above T_g. This behavior makes it possible to increase the working temperature range of the composite films containing more than 5 vol% of CNCs, up to the temperature of thermal decomposition. The introduction of CNC into PMDA‐ODA leads to dramatic (～12 orders of magnitude) increase of active electrical conductivity of the material. Copyright © 2011 John Wiley & Sons, Ltd.     

Influence of Steric Hindrance Between Hydrogen Atoms of Linkage Groups and Adjacent Phenyls on Properties of Polyimide

A diamine monomer 4,4′-methylenedianiline(MDA) was introduced to modify the polyimide of pyromellitic dianhydride(PMDA) and 4,4′-oxydianiline(ODA) by polycondensation. A series of polyamic acids was synthesized from MDA and ODA of different molar ratios with PMDA of sum mole of moles of MDA and ODA, and polyimide films were obtained by thermal imidization. Polyimide(PI) films were characterized by tensile testing, dynamic mechanical analysis(DMA), thermal gravimetry analysis(TGA), Fourier transform infrared spectroscopy (FTIR), wide X-ray diffraction(WAXD) and molecular simulation. With the increase of MDA content, the tensile strength and thermal decomposition temperature remained generally stable compared with those of PMDA/ODA polyimide. Unexpectedly, the glass transition temperature(T_g) and Young’s modulus increased from 388.7 ℃ and 2.37 GPa to 408.3 ℃ and 5.74 GPa, respectively. The results of WAXD and molecular simulation indicate the steric hindrance among hydrogen atoms of the linkage groups and adjacent phenyls enhanced the properties of the polyimide modified with MDA.     

Preparation of novel,high‐modulus,swollen‐ or jungle‐gym‐type polyimide gels end‐crosslinked with 1,3,5‐tris(4‐aminophenyl)benzene

A novel preparation approach for high‐performance polyimide gels that are swollen or have a jungle‐gym‐type structure is proposed. A new rigid and symmetric trifunctional amine, 1,3,5‐tris(4‐aminophenyl)benzene (TAPB), was synthesized as a crosslinker. Three different kinds of amic acid oligomers derived from pyromellitic dianhydride (PMDA), 4,4′‐oxydiphthalic anhydride (ODPA), p‐phenylenediamine (PDA), and 4,4′‐oxydianiline (ODA) were end‐crosslinked with TAPB at a high temperature to make polyimide networks with different structures. Transparent polyimide gels were obtained from the ODPA–ODA/TAPB series with high compression moduli of about 1 MPa at their equilibrium swollen states in N‐methylpyrrolidone. Microscopic phase separation occurred during the gelation–imidization process when polyimide networks were generated from PMDA–PDA/TAPB and PMDA–ODA/TAPB. After these opaque polyimide networks were dried, a jungle‐gym‐like structure was obtained for the PMDA–PDA/TAPB and PMDA–ODA/TAPB series; that is, there was a high void content inside the networks (up to 70%) and little volume shrinkage. These polyimide networks did not expand but absorbed the solvent and showed moduli as high as those of solids. Therefore, using the highly rigid crosslinker TAPB combined with the flexible monomers ODPA and ODA and the rigid monomers PMDA and PDA, we prepared swollen, high‐performance polyimide gels and jungle‐gym‐type polyimide networks, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2501–2512, 2002     

Preparation and characterization of a polyimide membrane

Two different polyimide semipermeable membranes have been prepared from two base polyimides of PMDA/ODA and BTDA/ODA by incorporation of lithium chloride with the respective poly(amic acids) and subsequently leaching out the maximum possible lithium chloride by water at slightly elevated temperature. The water and various organic vapor permeability of the lithium chloride modified films has been found to be better compared to the respective control films. BTDA/ODA based polyimide films show overall lower permeability.     

Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4′‐oxydiphenylene pyromellitimide) (PMDA‐ODA) and pseudo‐rodlike poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt % cyclohexyl‐2‐pyrrolidone (CHP; bp = 307 °C) and 80 wt % n‐methyl‐2‐pyrrolidone (NMP; bp = 202 °C) was used. The effects of solvent system and imidizing history on the morphological structure, as well as residual stress, were significantly high in the BPDA‐PDA having high chain rigidity, but relatively low in the semiflexible PMDA‐ODA with low chain rigidity. In addition, rapidly cured films prepared from PAA (NMP/CHP) showed higher residual stress and a lower degree of molecular anisotropy than slowly cured film imidized from PAA (NMP). This was induced by high chain mobility in polyimide thin films prepared from PAA (NMP/CHP) during the thermal cure process. Therefore, molecular anisotropy, depending on the solvent system and imidizing history, might be one of the important factors leading to low residual stress in polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2879–2890, 2000     

(Co)polyimides from commonly used monomers, and their nanocomposites

Synthesis of (co)polyimides from aromatic dianhydrides (pyromellitic dianhydride (PMDA), symmetric 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA)) and diamines (4,4′-oxydianiline (ODA), p-phenylenediamine (PDA)) commonly used for the production of commercial polyimides, as well as the preparation of their nanocomposites with SiO₂ nanoparticles were performed with the aim to find ways to control technical performance of polyimides. The (co)polyimide films prepared under mild thermal imidization conditions were analyzed by FTIR, WAXD, DSC and TG, and characterized by transition temperatures and the temperatures of 5% and 10% mass loss, as well as tensile parameters.Films of PMDA/sBPDA–ODA copolyimides at the ambient temperature had a 20% higher ultimate strength and exhibited a higher tensile modulus than the reference polyimide (PMDA–ODA). However, lowering the transition temperature of the polyimide by partial substitution of an sBPDA monomeric unit for PMDA resulted in lowering the modulus at higher temperatures. The best performance was exhibited by semi-crystalline films of sBPDA–ODA/PDA copolyimide, which had a 35% higher ultimate strength and a 64% higher elongation at break at the ambient temperature than the reference polyimide (sBPDA–PDA), and also retained the strength and exhibited a 200% higher elongation at a temperature of 200 °C.Unexpectedly, the elongation at break of PMDA–ODA based (co)polyimide nanocomposites with hydrophobic SiO₂ nanoparticles was greater than that of the baseline (co)polyimides. It was neither the case with PMDA–ODA nanocomposites with hydrophilic SiO₂ nanoparticles, nor with sBPDA–PDA (co)polyimide based nanocomposites with hydrophobic SiO₂ nanoparticles.     

The effect of orientation on thermal expansion behavior in polyimide films

The anisotropy of the thermal expansion of polyimide films was investigated . Out-of-plane or thickness direction coefficients of linear thermal expansion (CTE) were calculated from the difference between the coefficient of volumetric expansion (CVE) and the sum of the in-plane or film direction coefficients of linear thermal expansion for commercial and spin-coated PMDA//ODA and BPDA//PPD films and spin coated BTDA//ODA/MPD films. The CVEs were obtained from a pressure-volume-temperature (PVT) technique based on Bridgeman bellows. The CVE was shown to be essentially constant, independent of molecular orientation and thickness. A decrease in the in-plane CTEs therefore occurs at the expense of an increase in the out-of-plane CTE. In all cases the calculated out-of-plane CTE was higher than the measured in-plane CTE. The ratio of the out-of-plane CTE to the in-plane CTE was 1.2, 3.8, and 49.3 for the spin-coated BTDA//ODA/MPD, PMDA//ODA, and BPDA//PPD films, respectively. © 1994 John Wiley & Sons, Inc.     

Pretilt angle for BTDA,PMDA and CPDA series polyimides with various side chain lengths

Polyamic acid precursors were prepared by mixing dianhydride of 3,3',4,4'-benzophenone-tetracarboxylic dianhydride (BTDA), 1,2,3,4-benzene-tetracarboxylic dianhydride (pyrromellitic dianhydride PMDA), cis-1,2,3,4-cyclopentane-tetracarboxylic dianhydride (CPDA), the diamine (alkyl 3,5-diaminobenzoate) with side chain, and 4,4'-oxydianiline (ODA) without side chain. Copolyimide films with various side chain lengths were prepared by thermal imidization of polyamic acid precursors. The roughness of rubbed polyimide surface increased with increase in the side chain length. The pretilt angle for the BTDA and PMDA series polyimide (PI) increased exponentially with increase in side chain length. Various pretilt angles were obtained on the synthesized polyimides. In the case of CPDA series PI, the pretilt angle was nearly constant at 0 until the alkyl side chain length reached 12 (C12) and then increased markedly at C18. Models of pretilt angle generation were tested.     

Structural characterization of silica modified polyimide membranes

Polyimide and hybrid polyimide‐siloxane were synthesized by polycondensation, imidization, and sol‐gel reaction. The polyimides were prepared from pyromellitic dianhydride (PMDA) and 4,4‐oxydianiline (ODA) in N‐methyl‐2‐pyrollidone (NMP). Trimethoxyvinyl silane (TMVS) was used as a source of silica. Their surface morphologies, structures and thermal performances were determined using scanning electron microscopy (SEM), infrared spectroscopy (IR), thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The results showed that the silica particles were finely and rather homogeneously dispersed in polymers. The glass transition temperature (T_g) of hybrid membrane materials increased with the increasing silica content. TGA analysis showed that polyimides were thermally stable with silica. Modified polyimide‐siloxane films, thermal characteristics were found to be better than the polyimide films without silica. Copyright © 2006 John Wiley & Sons, Ltd.     

Enhancement of properties of polyimide/silica hybrid nanocomposites by benzimidazole formed hydrogen bond

Polyimide/silica hybrid nanocomposites were prepared by sol–gel method without coupling agent. A novel diamine with a benzimidazole group, 2‐(4‐aminophenyl)‐5‐aminobenzimidazole (PABZ), was introduced to copolymerize with 4,4'‐oxydianiline (ODA) and pyromellitic dianhydride (PMDA) to synthesize polyimide (PI) matrix. The compatibility between PI and silica was improved by hydrogen bonds formed between silica phase and the –NH– group on benzimidazole of the new diamine. Highly transparent hybrid films were obtained when silica content reached as high as 30 wt%. SEM results show that silica particles with sizes much smaller than that in PMDA‐ODA/silica system disperse homogeneously in the PI matrix. Differing from most hybrid systems without coupling agent, the tensile strength of PABZ system increases from 152 MPa to 165 MPa with silica content increasing from 0 to 20 wt%, while, it decreases linearly in PMDA‐ODA system. DMA analysis shows that the introduction of PABZ largely increases the glass transition temperature (Tg) for all silica contents, which is suggested to be due to the more rigid structures and stronger interaction between the two phases. Meanwhile, the decomposition temperature and char yields at 800 °C are both higher than that of pure PIs. The structures of the hybrid films were identified by FTIR spectra, which indicate that different silica morphologies are developed, resulted from the hydrogen bonds between benzimidazole and silica phase. Copyright © 2011 John Wiley & Sons, Ltd.     

Novel method for the preparation of poly(urethane–imide)s and their properties

A polymer blend consisting of polyimide (PI) and polyurethane (PU) was prepared by means of a novel approach. PU prepolymer was prepared by the reaction of polyester polyol and 2,4-tolylenediisocyanate (2,4-TDI) and then end-capped with phenol. Poly(amide acid) was prepared from pyromellitic dianhydride (PMDA) and oxydianiline (ODA). A series of oligo(amide acid)s were also prepared by controlling the molar ratio of PMDA and ODA. The PU prepolymer and poly(amide acid) or oligo(amide acid) solution were blended at room temperature in various weight ratios. The cast films were obtained from the blend solution and treated at various temperatures. With the increase of polyurethane component, the films changed from plastic to brittle and then to elastic. The poly(urethane–imide) elastomers showed excellent mechanical properties and moderate thermal stability. The elongation of films with elasticity was more than 300%. The elongation set after the breaking of films was small. From the dynamic mechanical analysis, all the samples showed a glass transition temperature (T_g) at ca. −15°C, corresponding to T_g of the urethane component, suggesting that phase separation occurred between the two polymer components, irrespective of polyimide content. TGA and DSC studies indicated that the thermal degradation of poly(urethane–imide) was in the temperature range 250–270°C. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 3745–3753, 1997     

Preparation and characterization of polyimide/mesoporous silica hybrid nanocomposites based on water-soluble poly(amic acid) ammonium salt

Recently, mesoporous silica was blended with polyimide to develop low dielectric constant (k) materials with improving mechanical and thermal properties of polyimide by utilizing both the nanoporous structure and silica framework. However, even the use of mesoporous silica did not show a significant decrease of k due to the phase segregation in between polyimide and the mesoporous silica materials. In this work, we attempted to prepare polyimide/mesoporous silica hybrid nanocomposites having relatively good phase mixing behavior by utilizing polyimide synthesized from a water soluble poly(amic acid) ammonium salt, which lead to low k up to 2.45. The thermal properties of polyimide were improved by adding mesoporous silicas. For this work, we have fabricated mesoporous silicas through surfactant-templated condensation of tetraethyl orthosilicate (TEOS). Pyromellitic dianhydride (PMDA)-4,4′-oxydianiline (ODA) polyimide was prepared from poly(amic acid) ammonium salt, which had been obtained by incorporating triethylamine (TEA) into PMDA-ODA poly(amic acid) in dimethylacetamide (DMAc), followed by thermal imidization.     

High modulus polyimide/polyimide molecular composite films that utilize acetylene unit as a crosslink site

Polyimide/polyimide molecular composite (MC) films comprised of a rigid polyimide derived from biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA) and a flexible polyimide derived from BPDA and bis (3,3'-diaminodiphenyl) acetylene (intA) and/or oxydianiline (ODA) were prepared by blending the polyamic acid solutions in 7 : 3 weight ratio, and then imidizing the blend films. Acetylene content in the flexible polyimide backbone was controlled by the ratio of intA and ODA. Cold-drawing of the blend polyamic acid films, followed by imidization, gives high modulus polyimide/polyimide MC films. The modulus of the MC films increased almost linearly with the draw ratio, reaching 25.5 GPa for the 40% drawn film. Acetylene groups in the flexible polyimide can be thermally cured to crosslink. The onset of exotherm appeared at 340°C on DSC, reaching maximum at 398°C. After the thermal crosslinking, the MC films maintained the high modulus, though elongation became small. Taking advantage of the crosslinkable acetylene units, two MC films were laminated and processed at 400°C for 20 min under 100 kg/cm² to give a good-quality laminate film. The interface of the two films was strongly bonded through the crosslinking of acetylene groups. Laminate films maintained the high modulus afforded by the cold-drawing. © 1994 John Wiley & Sons, Inc.     

FT-Raman investigation of the thermal curing of PMDA/ODA polyamic acids

The effect of solvent on the curing reactions of PMDA/ODA polyamic acids has been investigated using Fourier transform (FT)-Raman spectroscopy. Films of different thicknesses were cured by: (1) doctor blading 15% solids solutions onto glass slides, (2) removing all but the bound NMP, and (3) removing all the N-methypyrrolidinone (NMP). The rate of cure and final degree of conversion of the PMDA/ODA polyamic acid to polyimide increased substantially in the presence of NMP, and this effect was attributed to the plasticizing effect of the solvent. Below a critical solvent concentration, which was estimated to be approximately 40% of the NMP concentration in the bound-solvent limit, the rate of imidization slowed down considerably. Comparison of FT-Raman data for PMDA/ODA polyamic acid: (1) in solution in NMP, (2) complexed with NMP in the solid state, and (3) in the solid state after all the NMP had been removed with water, indicated that intermolecular interactions were greatest in the latter case and weakest in solution. Spectra of PMDA/ODA in NMP solution provide strong evidence for binding of NMP to the amide carbonyl in solution. © 1993 John Wiley & Sons, Inc.     

Partly Imidized Polyamic Acid and Its UniaxialStretched Polyimide Films

Partly imidized polyamic acid(PAA) has been used to prepare high performance polyimide films. The behaviors of two polyamic acids derived from pyromellitic dianhydride(PMDA)/4,4′-oxydianiline(ODA) and 3,3′,4,4′-biphenyltetracarboxylic diahhydride(BPDA)/paraphenylenediamine(PPD) containing dehydrating agents composed of acetic anhydride and a tertiary amine as the catalyst were investigated. The gel point was dependent on imidization degree in despite of temperature and the molar ratio of catalyst to acetic acid. Imdization content was about 35% for PMDA/ODA and about 22% for BPDA/PPD. The effect of catalyst on imidization possessed an order of triethylamine>3-methylpyridine>pyridine>isoquinoline>2-methylpyridine. The stretching of the films greatly reduced the coefficient of linear thermal expansion(CTE) either in the longitudinal direction or transversal direction. Compared to the film from polyamic acid, the partly imidized film had greater stretching ratio, so that the uniaxial stretched polyimide film from partly imidized PAA had higher tensile strength and tensile modulus, but lower elongation in the stretching direction.     

金属铜与聚苯酰亚胺表面相互作用的理论模拟

利用分子力学模拟研究了单层金属铜在三层聚苯酰亚胺（PMDA-ODA）表面模型上的静态行为。结果单层铜在PMDA-ODA表面上形成了聚集体。分析表明铜原子之间的内聚能大于铜与PMDA-ODA表面之间的着附能。在内聚能中范德华力起重要作用，而在着附能中静电作用的决定因素。通过分析子动力学模拟研究了温度对铜与PMDA-ODA表面相互作用的影响。     

聚酰亚胺LB膜热解制备SiC薄膜的XPS研究

用XPS对沉积在硅基片上的聚酰亚胺LB膜以及由它真空热解制备的SiC薄膜进行了研究 ,并对其形成过程进行了跟踪分析 .XPS结果显示聚酰亚胺LB膜结构均匀 ,质量良好 ;真空热解时 ,约在 6 70℃时LB膜中的C与衬底Si反应形成SiC ;Ar离子溅射深度俄歇谱表明所制备的SiC膜中Si和C浓度成梯度分布 ,说明SiC是由Si和C相互扩散反应形成的