生长温度、过冷度对InAsPSb外延层表面形貌影响的研究

本文采用恒温液相外延生长方法,研究了InAsPSb四元材料外延层表面形貌与生长温度、过冷度之间的关系.实验结果表明,生长温度、过冷度对外延晶体质量及表面形貌的影响较为明显,同时对其它因素的影响也做了分析.     

在MOCVD外延生长中V/Ⅲ比对Al_xGa_(1-x)As外延层中A1组分分布的影响

本实验首次观察到用MOCVD方法在GaAs基片上外延生长Al_xGa_(1-x)As/GaAs薄膜结构时,生长中所用的Ⅴ/Ⅲ比对外延层中Al组份x的分布的影响.当Ⅴ/Ⅲ比较低时,外延层中的Al组份出现很明显的层状阶梯形三层分布:靠近基片的一层中x值较低,而在外延层的表面层中x值较高.随着生长中所用的Ⅴ/Ⅲ比增加时,Al组份的分布趋于均匀.利用GaAs的高温热分解和Ga、As离子在晶体中的热扩散及其对外延生长的影响,对这一现象作了初步解释.     

在MOCVD外延生长中Ⅴ/Ⅲ比对AlxGa1-xAs外延层中A1组分分布的影响

本实验首次观察到用MOCVD方法在GaAs基片上外延生长AlxGa1-xAs/GaAs薄膜结构时,生长中所用的Ⅴ/Ⅲ比对外延层中Al组份x的分布的影响.当Ⅴ/Ⅲ比较低时,外延层中的Al组份出现很明显的层状阶梯形三层分布:靠近基片的一层中x值较低,而在外延层的表面层中x值较高.随着生长中所用的Ⅴ/Ⅲ比增加时,Al组份的分布趋于均匀.利用GaAs的高温热分解和Ga、As离子在晶体中的热扩散及其对外延生长的影响,对这一现象作了初步解释.     

两步生长法生长的Inx Ga1-x As/GaAs材料及性质

利用LP-MOCVD技术,采用两步生长法在GaAs(100)单晶衬底上外延生长InxGa1-xAs材料。通过扫描电子显微镜( SEM)与原子力显微镜( AFM)观察了缓冲层厚度对外延层表面形貌、表面粗糙度的影响;利用X射线衍射( XRD)分析了缓冲层厚度对外延层结晶质量的影响;利用拉曼光谱分析了缓冲层厚度对外延层材料合金有序度的影响;通过透射电子显微镜( TEM)观察了外延层材料位错的分布状态,计算了外延层的位错密度。实验结果表明,两步生长法生长的Inx Ga1-x As/GaAs异质结材料的缓冲层厚度存在一个最优值。     

SiO2对多层GaN外延片热应力分布影响的仿真分析

为了研究SiO2对多层结构GaN外延片的热应力的影响,以直径d为40 mm的GaN外延片为研究对象,利用有限元分析法分别对蓝宝石/AlN/GaN和蓝宝石/SiO2/AlN/GaN这两种光阴极组件外延片表面热应力进行理论计算和仿真。在其他结构参数相同的情况下,分别分析了两种光阴极组件外延片径向和厚度方向的应力分布,分析了外延片热应力分布及影响因素。分析结果显示:在1 200 ℃的生长温度下,径向区域内的热应力分布比较均匀,厚度方向的热应力均在衬底和外延层的界面上发生突变。最后分析了外延片生长温度、蓝宝石衬底和GaN、AlN过渡层厚度对表面热应力的影响。     

Si基GaN外延层光致发光光谱与二次离子质谱的研究

报道了在Si基上用简便的真空反应法制备出GaN外延层．光致发光光谱测试结果表明不同的生长温度和退火工艺会对GaN外延层的发光特性产生影响,在1050℃下生长的GaN外延层的发光强度高于其他温度下生长的发光强度,退火可以使GaN外延层的发光强度增强．二次离子质谱(SIMS)测试结果表明外延层中Ga和N分布均匀,在表面处Ga发生了偏聚,同时外延层中还存在Si,O等杂质,这使得外延层中背景电子浓度高达1.7×10¹⁸/cm³. SIMS测试结果还表明,在外延生长前采用 关键词：     

截止波长12μm的p型-InAs_(0.04)Sb_(0.96)材料的熔体外延生长

为了获得P型的长波长InAsSb材料并研究掺杂剂Ge对材料特性的影响,用熔体外延法生长了掺Ge的波长为12μm的P型-InAsSb外延层．用傅里叶红外光谱仪、VanderPauw法和电子探针微分析研究了材料的透射光谱、电学性质以及组分的分布．结果表明,两性杂质Ge在熔体外延生长的InAs0.01Sb0.96材料中起受主杂质作用．当外延层的组分相同时,材料的截止波长不随掺Ge浓度的变化而变化,但是随着外延层中掺Ge量的增加,外延层的透射率下降．掺杂原子Ge在外延层的表面及生长方向的分布都是相当均匀的．77K下测得,载流子浓度为9．18×10^16cm^-3的掺Ge的P型-InAS0.01Sb0.96样品,其空穴迁移率达到1120cm^2·Vs^-1.     

截止波长12 μm的p型-InAs0.04Sb0.96材料的熔体外延生长

为了获得p-型的长波长InAsSb材料并研究掺杂剂Ge对材料特性的影响,用熔体外延法生长了掺Ge的波长为12 μm的p型-InAsSb 外延层.用傅里叶红外光谱仪、Van der Pauw 法和电子探针微分析研究了材料的透射光谱、电学性质以及组分的分布.结果表明,两性杂质Ge在熔体外延生长的InAs0.04Sb0.96材料中起受主杂质作用.当外延层的组分相同时,材料的截止波长不随掺Ge浓度的变化而变化,但是随着外延层中掺Ge量的增加,外延层的透射率下降.掺杂原子Ge在外延层的表面及生长方向的分布都是相当均匀的.77 K下测得,载流子浓度为9.18×1016 cm-3的掺Ge的p型-InAs0.04Sb0.96样品,其空穴迁移率达到1 120 cm2·Vs-1.     

截止波长12 μm的p型-InAs0.04Sb0.96材料的熔体外延生长

为了获得p-型的长波长InAsSb材料并研究掺杂剂Ge对材料特性的影响,用熔体外延法生长了掺Ge的波长为12 μm的p型-InAsSb 外延层.用傅里叶红外光谱仪、Van der Pauw 法和电子探针微分析研究了材料的透射光谱、电学性质以及组分的分布.结果表明,两性杂质Ge在熔体外延生长的InAs0.04Sb0.96材料中起受主杂质作用.当外延层的组分相同时,材料的截止波长不随掺Ge浓度的变化而变化,但是随着外延层中掺Ge量的增加,外延层的透射率下降.掺杂原子Ge在外延层的表面及生长方向的分布都是相当均匀的.77 K下测得,载流子浓度为9.18×1016 cm－3的掺Ge的p型-InAs0.04Sb0.96样品,其空穴迁移率达到1 120 cm2·Vs－1.     

在GaN生长初期形貌发展的观察

报道了对GaN在生长初期形貌发展的观察和形貌的高度分布演化.形貌观察发现GaN外延层由分离的岛转化为连续的膜,形貌的发展显示GaN经历了横向生长的阶段.利用原子力显微镜有数字化记录的特点,从形貌的观察中也得到了外延层高度分布,发现高度分布可用单峰或多峰高斯分布拟合.通过与形貌特征的对比,发现宽而且不对称的分布对应着岛状的外延层形貌,可以用多峰高斯分布拟和;窄而且对称的分布则对应着比较连续的膜,可以用单峰高斯分布拟和.     

分子束外延生长Sb薄膜及其量子尺寸效应

在GaAs(001)衬底上，用分子束外延生长Sb(111)薄膜，用反射式高能电子衍射仪原位监控生长过程，用透射电子显微镜观察薄膜结构，并用van der Pauw方法测量了电阻率随生长温度的变化，观察到Sb薄膜半金属/半导体转变及其量子尺寸效应． 关键词：     

2～4μm波长的InAsPSb异质结激光管材料的液相外延

采用液相外延方法,生长出外延层与衬底之间的失配度△α/α≤1.6×10-3界面平直、组分恒定的InAsPSb/InAs外延晶体.单异质结外延层,得到了3.09μm波长的激光输出,双异质结外延片也得到了较好的伏-安特性曲线.     

HgCdTe buried multi-junction photodiodes fabricated by the liquid phase epitaxy

This article reports the parameters and characteristics of the new type of HgCdTe buried photodiodes operated at near-room temperature (T=200–300 K) in long wavelength infrared spectral range. The liquid phase epitaxy (LPE) Hg_1−xCd_xTe (x=0.16–0.20) layers were grown on holes etched in (1 0 0) CdZnTe substrate. Prior to layer deposition, the CdZnTe substrate has been etched to form the bars on 30 μm centers and 20-μm depth. Next, 20-μm thick HgCdTe epitaxial layer has been grown from Te-rich solution. The type of conductivity was controlled by deliberately doping with indium (n-type) and Sb (p-type). The Nomarski microscopy showed that the surface of specially prepared layers was flat and the composition of layers, measured by Fourier transform infrared microscopy, was homogenous. Samples were cleaved and examined in cross section by scanning electron microscopy. Finally, serial connected multi-junction photodiodes have been fabricated. It is shown that LPE can be used to realise advanced bandgap engineered multi-junction structures. This conclusion is supported by device quality characteristics: spectral response and detectivity.     

超薄溶液LPE技术生长GaInAsP/InP超晶格的理论与实验

本文由有限厚度溶液及自由表面浓度和恒定表面浓度二种模型出发对LPE生长动力学过程进行了理论分析,并导出了实现薄层生长的参数控制条件,根据这一条件用LPE技术实际生长了GaInAsP/InP超晶格,570℃下用突冷法及被压缩到200μm～500μm的薄层溶液在0.2s的驻留时间内分别重复长出了5nm(Ga0.40In0.60As0.89P0.11)和10nm(InP)的超晶格,证明了用重复推拉舟的LPE系统在一定的参数条件下可以生长MQW结构.     

光吸收法检测GaxIn1-xAsyP1-y/InP双异质结液相外延片的室温禁带宽度

用双光束分光光度计测定了GaxIn1-xAsyP1-y/InP双异质结外延片中四元层的禁带宽度,并和制得的发光管发射波长及计算值进行比较。部分样品用电子探针阴极荧光法对照。说明光吸收法简便、迅速、可靠。可对液相外延质量提供一定的评价。     

p型Ga0.47In0.53AS接触层的生长

用过冷法在632-630℃生长了掺Zn的p型Ga0.47In0.53As接触层.研究了液相中Ga组分和Zn组分对GaxIn1-xAs/InP异质结晶格失配的影响,用一次外延技术生长了GaxIn1-xAs作接触层的GaInAsP/InP双异质结.     

REBCO厚膜的液相外延生长研究

本文从基片和种膜、LPE的初始阶段研究和超导性能的控制这三个方面回顾总结了液相外延生长REBCO(RE=稀土元素)厚膜的研究进展.我课题组发现的高温超导体氧化物YBCO的过热现象直接证实了采用低包晶熔点的YBCO种膜可以生长包晶温度较高的REB-CO,丰富了种膜的选择范围,此现象尤为值得关注.在LPE生长的初始阶段存在种膜的部分溶解、夹杂的形成和与稀土元素种类有关的择优生长等现象,用包括曲率效应和界面能影响的粗化机制可以解释以上现象.因而生长高结晶性的LPE厚膜时选用高品质的种膜甚为重要.为优化生长工艺,须考虑种膜的品质、熔剂中的Ba/Cu比和气氛对Mg的污染和结晶取向,RE离子对Ba的替代等方面问题,以达到获得高质量的REBCO LPE厚膜的目的.     

CHANGES IN MELTING BEHAVIOR AND MORPHOLOGY ON ANNEALING OF LINEAR AND BRANCHED POLYETHYLENE

Changes in morphology and melting behavior of various types of commercial polyethylenes as a result of annealing were studied using differential scanning calorimetry, transmission electron microscopy, and density measurements. The range of polyethylenes whose densities varied between 0.96 and 0.90 g/cm³ included linear polyethylene (LPE), high-density polyethylene, a 1-octene copolymer traditional linear low density polyethylene, low density polyethylene, and a 1-octene copolymer prepared by Dow's INSITE constrained geometry catalysts technology. Two sets of samples were initially prepared by fast cooling and slow cooling from the melt. Despite an initial lower crystalline content and crystal thickness for the fast cooled (FC) branched polyethylene samples, a higher melting temperature than for the slow cooled (SC) samples was found using a 10°C/min heating rate. In concordance with a recent work, melting–recrystallization processes are held responsible for the anomalous behavior. The annealing treatment consisted of heating the two sets of samples at 1°C/min from room temperature to a temperature located at the start of the endotherm. The thermal treatment stabilizes the crystals through an increase in their thickness, which prevents melting–recrystallization processes from taking place on subsequent heating. A lower melting temperature after annealing was observed for the FC branched polyethylene samples. No such behavior was found for the SC samples and even for the FC LPE sample.     

ABSENCE OF ISOTHERMAL LAMELLAR THICKENING IN A LINEAR POLYETHYLENE BLEND

Melting and lamellar morphology of a polyethylene blend were studied. Two linear polyethylene (LPE) samples were used. A commercial LPE and a low molecular weight LPE fraction (M _n ≈ 2015) were solution blended. The pure LPE and a blend (30% commercial LPE content) were held in the melt at 126° C for up to 48 h, above the equilibrium melting point of the fraction, but below the crystallization temperature of the commercial LPE. The melting behavior of both materials as a function of storage time was studied using differential scanning calorimetry (DSC), in addition to transmission electron microscopy (TEM) of chlorosulfonated samples. Results showed that, although the LPE lamellae grew at the same temperature, those in the pure LPE were thicker than in the blend. Correspondingly, isothermally grown lamellae in pure LPE melt at higher temperatures.