0.38 THz混频器关键器件设计和仿真优化

太赫兹混频器是太赫兹波收发系统中的关键器件,是将信号频率从一个量值变换为另一个量值的电路器件,其中肖特基二极管是太赫兹混频器中的核心器件,除了肖特基二极管以外,低频滤波器、本振端口等也属于太赫兹混频器中的关键器件。对0.38 THz混频器中的关键组件包括波导管、肖特基二极管、滤波器等在HFSS中进行了建模、仿真,最后通过对仿真结果的分析,实现了可以满足0.38 THz太赫兹混频器的各个关键模块的模型,通过这些模型实现了混频器整体的优化。     

AN UNCOOLED VERY LOW NOISE SCHOTTKY DIODE RECEIVER FRONT-END FOR MIDDLE ATMOSPHERIC OZONE AND CARBON MONOXIDE MEASUREMENTS

The paper describes an uncooled front-end of the Schottky diode receiver system, which may be applied for observations of middle atmospheric ozone and carbon monoxide thermal emission lines at frequencies 110.8 GHz and 115.3 GHz, respectively. The mixer of the front-end has utilized high-quality Schottky diodes that allowed us to reduce the mixer conversion loss. The combination of the mixer and an ultra-low-noise IF amplifier in the one integrated unit has resulted in double-sideband (DSB) receiver noise temperature of 260 K at a local oscillator (LO) frequency of 113.05 GHz in the instantaneous IF band from 1.7 to 2.7 GHz. This is the lowest noise temperature ever reported for an uncooled ozone receiver system with Schottky diode mixers.     

基于CSMRC结构和容性肖特基二极管的220GHz三倍频器

设计了基于容性肖特基二极管的220 GHz非平衡三倍频器。首先对容性肖特基二极管进行测试和关键参数提取,建立了肖特基二极管的等效电路模型,以此为基础进行三倍频电路设计;在倍频电路设计中通过引入紧凑悬置微带谐振单元(CSMRC)滤波结构来减小信号传输损耗;由于三倍频电路设计中难以实现全波阻抗匹配,因此采用了整体电路结构谐波平衡调匹配方法设计倍频电路,最后对制备出的倍频器进行测试和分析;实验测试结果表明：倍频器在213.1~221.6 GHz范围内输出功率大于10 mW,倍频效率大于5%,最高输出功率为18.7 mW@218.6 GHz,最高倍频效率为8.24%@217.9 GHz。     

Design of vertical diamond Schottky barrier diode with junction terminal extension structure by using the n-Ga2O3/p-diamond heterojunction

A novel junction terminal extension structure is proposed for vertical diamond Schottky barrier diodes (SBDs) by using an n-Ga₂O₃/p-diamond heterojunction. The depletion region of the heterojunction suppresses part of the forward current conduction path, which slightly increases the on-resistance. On the other hand, the reverse breakdown voltage is enhanced obviously because of attenuated electric field crowding. By optimizing the doping concentration, length, and depth of n-Ga₂O₃, the trade-off between on-resistance and breakdown voltage with a high Baliga figure of merit (FOM) value is realized through Silvaco technology computer-aided design simulation. In addition, the effect of the work functions of the Schottky electrodes is evaluated. The results are beneficial to realizing a high-performance vertical diamond SBD.     

Energy deposition and penetration depth of heavy ions in the electronic stopping region

Previous calculations of spatial moments over the distribution of ion ranges and bombardment damage have been extended into the range of ion energies where electronic stopping is important. Numerical solutions are given of well-known integral equations, under the assumption of Thomas-Fermi scattering and velocity-proportional electronic stopping, for equaI masses of ion and target and five values of the electronic stopping constant, over a range of four decades of ion energy. The results are compared with experimental damage distributions, with good success. Implications on sputtering are mentioned briefly.     

n-GaN肖特基势垒二极管的高温电子辐照效应

本文研究了n-GaN肖特基势垒二极管的高温电子辐照效应。实验结果显示,高温下进行电子辐照,界面处辐照诱生缺陷会同时产生和被退火恢复;器件的击穿电压和反向漏电流受辐照影响减弱,其电学阈值增加;由辐照效应导致的可见光响应的影响仍然存在。     

Modeling of 4H--SiC multi-floating-junction Schottky barrier diode

This paper develops a new and easy to implement analytical model for the specific on-resistance and electric field distribution along the critical path for 4H-SiC multi-floating junction Schottky barrier diode. Considering the charge compensation effects by the multilayer of buried opposite doped regions, it improves the breakdown voltage a lot in comparison with conventional one with the same on-resistance. The forward resistance of the floating junction Schottky barrier diode consists of several components and the electric field can be understood with superposition concept, both are consistent with MEDICI simulation results. Moreover, device parameters are optimized and the analyses show that in comparison with one layer floating junction, multilayer of floating junction layer is an effective way to increase the device performance when specific resistance and the breakdown voltage are traded off. The results show that the specific resistance increases 3.2 mΩ·cm 2 and breakdown voltage increases 422 V with an additional floating junction for the given structure.     

Characteristics and parameter extraction for NiGe/n-type Ge Schottky diode with variable annealing temperatures

Current transport mechanism in Ni-germanide/n-type Ge Schottky diodes is investigated using current--voltage characterisation technique with annealing temperatures from 300~\duto 500~\du. Based on the current transport model, a simple method to extract parameters of the NiGe/Ge diode is presented by using the $I$--$V$ characteristics. Parameters of NiGe/n-type Ge Schottky diodes fabricated for testing in this paper are as follows: the ideality factor $n$, the series resistance $R_{\rm s}$, the zero-field barrier height $\phi _{\rm b0}$, the interface state density $D_{\rm it}$, and the interfacial layer capacitance $C_{\rm i}$. It is found that the ideality factor $n$ of the diode increases with the increase of annealing temperature. As the temperature increases, the interface defects from the sputtering damage and the penetration of metallic states into the Ge energy gap are passivated, thus improving the junction quality. However, the undesirable crystallisations of Ni-germanide are observed together with NiGe at a temperature higher than 400~\du. Depositing a very thin ($\sim $1~nm) heavily Ge-doped $n^{+}$ Ge intermediate layer can improve the NiGe film morphology significantly.     

Design optimization of high breakdown voltage vertical GaN junction barrier Schottky diode with high-K/low-K compound dielectric structure

A vertical junction barrier Schottky diode with a high-$K$/low-$K$ compound dielectric structure is proposed and optimized to achieve a high breakdown voltage (BV). There is a discontinuity of the electric field at the interface of high-$K$ and low-$K$ layers due to the different dielectric constants of high-$K$ and low-$K$ dielectric layers. A new electric field peak is introduced in the n-type drift region of junction barrier Schottky diode (JBS), so the distribution of electric field in JBS becomes more uniform. At the same time, the effect of electric-power line concentration at the p-n junction interface is suppressed due to the effects of the high-$K$ dielectric layer and an enhancement of breakdown voltage can be achieved. Numerical simulations demonstrate that GaN JBS with a specific on-resistance ($R_{\rm on, sp}$) of 2.07 m$\Omega\cdot$cm$^{2}$ and a BV of 4171 V which is 167% higher than the breakdown voltage of the common structure, resulting in a high figure-of-merit (FOM) of 8.6 GW/cm$^{2}$, and a low turn-on voltage of 0.6 V.     

套刻偏差对4H-SiC 浮动结结势垒肖特基二极管的影响研究

4H-SiC浮动结结势垒肖特基二极管与常规结势垒肖特基二极管相比在 相同的导通电阻条件下具有更高的击穿电压. 由p⁺埋层形成的浮动结与主结p⁺区 之间的套刻对准是实现该结构的一项关键技术. 二维模拟软件ISE的模拟结果表明, 套刻偏差的存在会明显影响器件的击穿特性, 随着偏差的增大击穿电压减小. 尽管主结和埋层的交错结构与对准结构具有相似的击穿特性, 但是当正向电压大于2 V后, 交错结构的串联电阻更大.     

Sulphide passivation of GaN based Schottky diodes

Wet chemical passivation of n-GaN surface was carried out by dipping GaN samples in ammonium sulphide diluted in aqueous and alcoholic solvent base solutions. Photoluminescence (PL) investigations indicated that sulphide solution effectively led to the reduction of GaN surface states. Increased band edge PL peak showed that S²⁻ ions are more active in alcohol based solvents. X-ray photoelectron spectroscopy revealed reduction in surface oxides by introduction of sulphide species. Ni/n-GaN Schottky barrier diodes were fabricated on passivated surfaces. Remarkable improvement in the Schottky barrier height (0.98 eV for passivated diodes as compared to 0.75 eV for untreated diodes) has been observed.     

Analysis and simulation of a 4H-SiC semi-superjunction Schottky barrier diode for softer reverse-recovery

In this paper,a 4H-SiC semi-superjunction (SJ) Schottky barrier diode is analysed and simulated.The semi-SJ structure has an optimized design and a specific on-resistance lower than that of conventional SJ structures,which can be achieved without increasing the process difficulty.The simulation results show that the specific on-resistance and the softness factor depend on the aspect and thickness ratios,and that by using the semi-SJ structure,specific on-resistance can be reduced without decreasing the softness factor.It is observed that a trade-off exists between the specific on-resistance and the softness of the diode.     

Analysis and simulation of a 4H-SiC semi-superjunction Schottky barrier diode for softer reverse-recovery

In this paper, a 4H-SiC semi-superjunction (SJ) Schottky barrier diode is analysed and simulated. The semi-SJ structure has an optimized design and a specific on-resistance lower than that of conventional SJ structures, which can be achieved without increasing the process difficulty. The simulation results show that the specific on-resistance and the softness factor depend on the aspect and thickness ratios, and that by using the semi-SJ structure, specific on-resistance can be reduced without decreasing the softness factor. It is observed that a trade-off exists between the specific on-resistance and the softness of the diode.     

Optimum coupling of a Gaussian beam to a corner reflector with a four-wavelength antenna

The coupling of a Gaussian radiation beam to a corner reflector with a four-wavelength long wire antenna was studied theoretically and experimentally. The antenna configuration in conjunction with a Schottky barrier diode is recently used widely as a fast submillimeter wave detector. The optimum angle focusing the radiation to the antenna has been obtained and is 11° (half-width at the 8.7dB points).     

Study and optimal simulation of 4H-SiC floating junction Schottky barrier diodes’ structures and electric properties

This paper stuides the structures of 4H-SiC floating junction Schottky barrier diodes. Some structure parameters of devices are optimized with commercial simulator based on forward and reverse electrical characteristics. Compared with conventional power Schottky barrier diodes, the devices are featured by highly doped drift region and embedded floating junction layers, which can ensure high breakdown voltage while keeping lower specific on-state resistance, and solve the contradiction between forward voltage drop and breakdown voltage. The simulation results show that with optimized structure parameter, the breakdown voltage can reach 4.36 kV and the specific on-resistance is 5.8 mΩ·cm2 when the Baliga figure of merit value of 13.1 GW/cm2 is achieved.     

Temperature-dependent characteristics of 4Hben SiC junction barrier Schottky diodes

The current-voltage characteristics of 4H-SiC junction barrier Schottky (JBS) diodes terminated by an offset field plate have been measured in the temperature range of 25-300 ℃. An experimental barrier height value of about 0.5 eV is obtained for the Ti/4H-SiC JBS diodes at room temperature. A decrease in the experimental barrier height and an increase in the ideality factor with decreasing temperature are shown. Reverse recovery testing also shows the temperature dependence of the peak recovery current density and the reverse recovery time. Finally, a discussion of reducing the reverse recovery time is presented.     

GaN基肖特基势垒二极管结构优化研究进展

作为宽禁带半导体器件,GaN基肖特基势垒二极管(SBD)有耐高压、耐高温、导通电阻小等优良特性,这使得它在电力电子等领域有广泛应用。本文首先综述了SBD发展要解决的问题;然后,介绍了GaN SBD结构、工作原理及结构优化研究进展;接下来,总结了AlGaN/GaN SBD结构、工作原理及结构优化研究进展,并着重从AlGaN/GaN SBD的外延片结构、肖特基电极结构以及边缘终端结构等角度,阐述了这些结构的优化对AlGaN/GaN SBD性能的影响;最后,对器件进一步的发展方向进行了展望。     

Leakage current and sub-bandgap photo-response of oxygen-plasma treated GaN Schottky barrier diodes

The effect of oxygen plasma treatment on the performance of GaN Schottky barrier diodes is studied. The GaN surface is intentionally exposed to oxygen plasma generated in an inductively coupled plasma etching system before Schottky metal deposition. The reverse leakage current of the treated diodes is suppressed in low bias range with enhanced diode ideality factor and series resistance. However, in high bias range the treated diodes exhibit higher reverse leakage current and corresponding lower breakdown voltage. The X-ray photoelectron spectroscopy analysis reveals the growth of a thin GaO_x layer on GaN surface during oxygen plasma treatment. Under sub-bandgap light illumination, the plasma-treated diodes show larger photovoltaic response compared with that of untreated diodes, suggesting that additional defect states at GaN surface are induced by the oxygen plasma treatment.     

Study of 4H-SiC junction barrier Schottky diode using field guard ring termination

This paper reports that the 4H-SiC Schottky barrier diode, PiN diode and junction barrier Schottky diode terminated by field guard rings are designed, fabricated and characterised. The measurements for forward and reverse characteristics have been done, and by comparison with each other, it shows that junction barrier Schottky diode has a lower reverse current density than that of the Schottky barrier diode and a higher forward drop than that of the PiN diode. High-temperature annealing is presented in this paper as well to figure out an optimised processing. The barrier height of 0.79 eV is formed with Ti in this work, the forward drop for the Schottky diode is 2.1 V, with an ideality factor of 3.2, and junction barrier Schottky diode with blocking voltage higher than 400 V was achieved by using field guard ring termination.