Chemical mapping of InGaN MQWs

High power LEDs fabricated from InGaN/GaN layers have received much research interest. Hence, in this paper we identify structural and chemical defects resulting from the epitaxial growth of these layers, which directly effect the performance of the device. TEM, annular dark field imaging (ADF), energy filtered TEM (EFTEM) and X-ray mapping were used to study multiple quantum wells structures capped with a p-type GaN layer. TEM and ADF studies of the samples show a number of V-defects which are roughly 100–200 nm apart along the MQW. Each V-defect incorporates a pure edge ( ) dislocation, which runs through the apex of the V-defect up to the free surface. These V-defects contain GaN with no InGaN layers, suggesting that the capping layer has filled in the open V-defects.     

X-ray and cathodoluminescence study on the effect of intentional long time annealing of the InGaN/GaN multiple quantum wells grown by MOCVD

GaN-based InGaN/GaN multiple quantum wells (MQWs) structure having a high-quality epilayer and coherent periodicity was grown by metalorganic chemical vapor deposition. After thermal annealing of InGaN/GaN MQWs, the increase in temperature and annealing time caused the intermixing between the barrier and the wells, which in turn caused a decrease in periodicity on the high-resolution X-ray diffraction patterns. Thereby, we confirmed that the structural performance of InGaN MQWs is successively degrading with increasing thermal annealing temperature. Especially, InGaN MQWs of the sample annealed at 950 °C were profoundly damaged. The cathodoluminescence (CL) measurement indicated that MQWs emission intensity decreases with increasing thermal annealing temperature. Thus, the integrated CL intensity ratio of InGaN MQWs to GaN dramatically decreased while thermal annealing temperatures increased. This result caused the intermixing in MQWs to deteriorate the active layer performance. Furthermore, the peak position of MQWs showed a tendency of the red shift after high thermal annealing. It is suggested that the annealing-induced red shift in MQWs is attributed to the reduction of the inhomogeneity of the In content in the MQWs leading to the reduction of the quantized energies. Consequently, it indicates that the high temperature and the long-time thermal annealing would be inevitably followed by the structural destruction of InGaN MQWs.     

Influence of Si doping on the optical and structural properties of InGaN films

Influence of Si doping on the optical and structural properties of InGaN epilayers with different Si concentrations was investigated in detail by means of high-resolution X-ray diffraction (HRXRD), scanning electron microscope (SEM), Cathodoluminescence (CL) and photoluminescence (PL). It was found that a small amount of Si doping in InGaN could enhance luminescence intensity, improve the crystal quality of InGaN and suppress the formation of V-defects in InGaN. Further investigation by CL showed that V-defects act as nonradiative center, which lower the luminescence efficiency of InGaN. Based on above-mentioned results, one possible mechanism of influence of Si doping on the formation of V-defects in InGaN was also proposed in this paper.     

Interactions between inversion domains and InGaN/GaN multiple quantum wells investigated by transmission electron microscopy

The propagation properties of inversion domains (IDs) in InGaN/GaN multiple quantum well (MQW) structures grown by metalorganic chemical vapor deposition have been investigated by transmission electron microscopy (TEM). The majority of the IDs, originating from the sapphire and/or buffer layer, propagate through the MQWs with normal wurtzite structure retaining their original structural features. Some of IDs could induce V-shaped pits in the MQW structures proposing a new formation mechanism for the so-called V-shaped defects. Detailed measurements show that a few IDs are found to be stopped in abnormal MQW regions, where In droplets appear due to phase separation. We presented direct evidence of pure In-phase droplets by means of high-resolution TEM. The above results provide new information on the structural defects in InGaN/GaN-based materials.     

Suppression of phase separation in InGaN layers grown on lattice-matched ZnO substrates

Sapphire and SiC are typical substrates used for GaN growth. However, they are non-native substrates and result in highly defective materials. The use of ZnO substrates can result in perfect lattice-matched conditions for 22% indium InGaN layers, which have been found to suppress phase separation compared to the same growths on sapphire. InGaN layers were grown on standard (0 0 0 2) GaN template/sapphire and (0 0 0 1) ZnO substrates by metalorganic chemical vapor deposition. These two substrates exhibited two distinct states of strain relaxation, which have direct effects on phase separation. InGaN with 32% indium exhibited phase separation when grown on sapphire. Sapphire samples were compared with corresponding growths on ZnO, which showed no evidence of phase separation with indium content as high as 43%. Additional studies in Si-doping of InGaN films also strongly induced phase separation in the films on sapphire compared with those on ZnO. High-resolution transmission electron microscopy results showed perfectly matched crystals at the GaN buffer/ZnO interface. This implied that InGaN with high indium content may stay completely strained on a thin GaN buffer. This method of lattice matching InGaN on ZnO offers a new approach to grow efficient emitters.     

Role of vapor-phase diffusion in selective-area MOVPE of InGaN/GaN MQWs

Selective-area growth (SAG) of InGaN/GaN multiple quantum wells (MQWs) was performed by metalorganic vapor phase epitaxy (MOVPE). The layers of a blue light-emitting diode (LED), that includes five InGaN quantum wells, were grown on a patterned GaN template on a sapphire substrate. In order to elucidate the contribution of vapor-phase diffusion of group-III precursors to the in-plane modulation of luminescence wavelength, the width of a stripe selective growth area was 60 μm that is sufficiently larger than the typical surface diffusion length, with the mask width varied stepwise between 30 and 240 μm. The distribution of the luminescence wavelength from the MQWs was measured with cathode luminescence (CL) across the stripe growth area. The peak wavelength ranged between 420 and 500 nm. The peak shifted to longer wavelengths and became broader as the measured point approached to the mask edge. Such a shift in the peak wavelength exhibited parabolic profile in the growth area and the wider mask shifted the entire peak positions to longer wavelengths. These trends clearly indicate that the vapor-phase diffusion play a dominant role in the in-plane modulation of the luminescence wavelength in the SA-MOVPE of InGaN MQWs, when the size of a growth area and/or the mask width exceeds approximately 10 μm.     

First III–V-nitride-based violet laser diodes

InGaN multi-quantum-well (MQW) structure laser diodes (LDs) were grown by metalorganic chemical vapor deposition on a sapphire substrate with (11 0) orientation (A face). The mirror facet for a laser cavity was formed by cleaving the substrate along the (1 02) orientation (R-face). The structure of the LDs was an InGaN MQW/GaN/AlGaN separate confinement heterostructure (SCH). As an active layer, the InGaN MQW structure was used. The InGaN MQW LDs showed strong stimulated emission at a wavelength of 415.3 nm under pulsed current injection above 360 mA at room temperature. The laser threshold current density was 6 kA/cm². As a maximum characteristic temperature of the threshold current, T₀ = 313 K was obtained for the InGaN MQW/GaN/AlGaN SCH LDs.     

Influence of various activation temperatures on the optical degradation of Mg doped InGaN/GaN MQW blue LEDs

GaN-based InGaN/GaN multi-quantum-well light emitting diode (MQW LED) structures were grown by metal organic chemical vapor deposition method. The optical properties of the LED structure have been investigated by using the photoluminescence and electroluminescence measurement. Both photoluminescence and electroluminescence results indicate that near pure InN clusters exist within the InGaN layers, which are responsible for the light emission in the LED. With increasing the Mg activation temperature of p-GaN layer, the optical properties of the LED structure tended to significantly degrade. This degradation was found to be deeply related to the variation of InN clusters in the active region. By the current–voltage measurement, a large forward voltage variation was observed. The voltage variation is caused to the conductivity variation of the p-GaN layer due to the different activation temperature. The turn-on voltage obtained from the best LED was 2.56 V and the forward voltage measured at 20 mA was 3.5 V. On the basis of these results, activation of the Mg-doped p-GaN layer must be carried out at the lowest possible value so as to obtain the better performance of LEDs.     

Effects of barrier growth temperature on the properties of InGaN/GaN multi-quantum wells

The effects of the growth temperature and ambient of GaN quantum barriers on the characteristics of InGaN/GaN multi-quantum wells (MQWs) grown by a thermally pre-cracked ion-supplied metalorganic chemical vapor deposition (TPIS-MOCVD) system were investigated. The improvement of optical, structural properties and surface morphology in the MQWs with increasing the growth temperature of quantum barriers was found. Without a GaN capping layer, there were many pits and the thickness of quantum pair reduced by the thermal etching during the temperature-ramping process. Photoluminescence (PL) peaks showed a blue-shift and double peaks, but relative PL intensity abruptly increased due to the suppression of deep level related defects and smooth surface morphology caused by the increased surface mobility of adatom in the high temperature region. By using a GaN capping layer on the InGaN well layer, the thermal decomposition of the InGaN well layer was suppressed and pits on the surface abruptly reduced. A hydrogen carrier gas for the GaN barrier growth also improved the optical and structural properties of MQWs.     

Well width study of InGaN multiple quantum wells for blue–green emitter

InGaN/GaN multiple quantum well structures emitting in the blue/green wavelength region were grown by metal organic vapor phase epitaxy. By reducing the quantum well growth time the influence of the quantum well thicknesses between 3.8 and 1.1 nm on the indium incorporation and the distribution of indium in the quantum wells in growth direction were investigated. X-ray diffraction measurements show that the average indium mole fraction in the quantum wells decreases with reducing quantum well width due to a delay in the indium incorporation at the barrier/well interface. Quantitative analysis reveals a segregation length of about 2 nm as a measure of the graded region in growth direction. Cathodoluminescence imaging reveals that the spatial variation of the wavelength is reduced with decreasing quantum well thickness down to 1.7 nm. Reducing the width of the quantum well further results in an increase of the spatial wavelength variation.     

Selective area epitaxy of InGaN quantum well triangular microrings with a single type of sidewall facets

Triangular microrings have been formed by selective area epitaxy of GaN and InGaN quantum wells (QWs) on patterned (0 0 0 1) AlN/sapphire. SiO₂ patterns consist of triangular ring openings oriented with edges parallel to two different orientations. InGaN QW microrings with each edge parallel to the 〈1 1? 0 0〉 direction have very rough sidewalls while microrings with each edge parallel to the 〈1 1 2¯ 0〉 direction exhibit well formed and smooth sidewalls as a result of the generation of a single type of {1 1? 0 1} facets on the inner and outer sidewalls. These {1 1? 0 1} facets demonstrate similar cathodoluminescence (CL) spectra that appear to be the superposition of two peaks at photon energies ∼2.5 eV (500 nm) and 2.7 eV (460 nm). Moreover, spatially matched striations are observed in the CL intensity images and surface morphologies of the {1 1? 0 1} sidewall facets. The observed striations are found to be related to subtle surface morphologies of the underlying GaN structures.     

Homoepitaxial growth and electrical characterization of GaN-based Schottky and light-emitting diodes

Homoepitaxial growth of GaN epilayers on free-standing hydride vapor phase epitaxy (HVPE) GaN substrates offered a better control over surface morphology, defect density, and doping concentration compared to conventional heteroepitaxial growth. The FWHM of the (0 0 0 2) X-ray diffraction (XRD) rocking curve from homoepitaxial GaN was measured to be as low as 79 arcsec, much smaller than 230 arcsec for GaN grown on sapphire. Schottky diodes grown on GaN substrates exhibited sharper breakdown characteristics and much lower reverse leakage than diodes on sapphire. However, the homoepitaxial devices had poor scalability due to the presence of yield-killing defects originating from the substrate surface. Vertical InGaN/GaN light-emitting diodes (LEDs) on GaN substrates showed reduced series resistance and reverse leakage compared to lateral LEDs on sapphire. Wafer mapping demonstrated that the distribution of leaky homoepitaxial devices correlated well with that of macroscopic defects in the GaN substrates.     

Growth of height-controlled InGaN quantum dots on GaN

InGaN height-controlled quantum dots (HCQDs) were grown by alternately depositing In_0.4Ga_0.6N QD and In_0.1Ga_0.9N spacer layers on a seed In_0.4Ga_0.6N QD layer. Structural and optical studies showed that the height of the InGaN QDs was controlled by the deposition cycle of In_0.4Ga_0.6N/In_0.1Ga_0.9N layers. Photoluminescence studies showed that the In_0.4Ga_0.6N HCQDs provided deep potential wells and the piezoelectric field-induced quantum-confined Stark effect was negligibly small. These phenomena are attributed to variation in quantum confinement energy in the electronically coupled InGaN HCQDs providing deep potential wells.     

Influence of the TEGa flow on the optical and structural properties of InGaN/GaN multiple quantum wells grown by MOCVD

We have investigated the influence of the TEGa flow on the optical and structural properties of InGaN/GaN multiple quantum wells (MQWs) with an indium composition around 20%. The samples with five-pairs InGaN/GaN MQWs were grown on sapphire substrates by metalorganic chemical vapor deposition. Photoluminescence spectra at 8 K showed that the MQWs grown with a low amount of TEGa flow gave a strong single peak and a higher emission energy. High-resolution X-ray diffraction measurements showed a deterioration of the InGaN/GaN interfaces in the sample grown with the large TEGa flow. The luminescence thermal quenching characteristics suggested that more structural defects acting as non-radiative recombination centers formed in the MQWs when the TEGa flow increased. The results indicate that decreasing the TEGa flow help to build up a new growth balance during the growth of InGaN wells, leading to less structural defects, more homogeneous indium distribution and the abrupt MQWs interfaces.     

Improved quality of InGaN/GaN multiple quantum wells by a strain relief layer

Different InGaN/GaN multi quantum wells (MQWs) structures were grown by metalorganic chemical vapor deposition (MOCVD). Samples were investigated by photoluminescence (PL), atom force microscopy (AFM) and double crystal X-ray diffractometry (DCXRD) to character their optical, morphological and crystal properties. By inserting the strain relief layer, the PL intensity was increased more than two times. The surface morphology was improved and the density of V-pits was reduced from 16–18×10⁸ to 6–7×10⁸/cm². Further, the interface abruptness was also improved. We attributed the improvements of the quality of InGaN/GaN MQWs to the relief of strain in the InGaN/GaN MQWs.     

Influence of AlGaN/GaN/InGaN superlattice on the characteristics of LEDs grown by metalorganic chemical vapor deposition

This study examined the influence of strain-compensated triple AlGaN/GaN/InGaN superlattice structures (SLs) in n-GaN on the structural, electrical and optical characteristics of LEDs by analyzing the etch pits density (EPD), stress measurement, high-resolution X-ray diffraction (HRXRD), sheet resistance, photoluminescence (PL) and light–current–voltage (L–I–V). EPD, stress measurement and HRXRD studies showed that the insertion of AlGaN/GaN/InGaN SLs during the growth of n-GaN effectively distributed and compensated for the strong compressive stress, and decreased the dislocation density in n-GaN. The operating voltage at 20 mA for the LEDs grown with SLs decreased to 3.18 V from 3.4 V for the LEDs grown without SLs. In addition, a decrease in the spectral blue shift compared to the LEDs grown without SLs was observed in the LEDs grown with the SLs.     

Magneto-photoluminescence of AlGaN/GaN quantum wells

The magneto-luminescence of GaN/AlGaN quantum wells in fields up to 52 T shows a field dependence that is strongly dependent on the well width. Strong redshifts are seen for the narrowest wells that are attributed to a Zeeman splitting. This is unexpected, since in bulk GaN epilayers the electron and hole g-factors of the lowest valence band cancel each other almost exactly. Therefore, we attribute this splitting to a reordering of the valence band due to the different band offsets caused by the strain and the aluminium component in the AlGaN barriers. The field dependence also gives information on the size of the exciton that has been converted into values for the exciton binding energy, and these values agree reasonably well with a theory that includes the presence of the electric field.     

Emission studies of InGaN layers and LEDs grown by plasma-assisted MBE

We prepared InGaN layers on GaN/sapphire substrates using rf-MBE. Photoluminescence (PL) from these layers, grown at different temperatures T_S, shows that there is a strong tendency of GaN to form a separate phase as T_S is increased from 600°C to 650°C. Concomitant with the phase separation, the PL from the InGaN phase broadens, which indicates that indium composition in this phase becomes increasingly non-uniform. Indium compositions measured by Rutherford backscattering (RBS) are consistent with these results. We also observed an increase in PL intensity for InGaN layers grown at higher temperatures. In this paper, we also report on preparing a top-contact InGaN/GaN light emitting diode. The device was operated at 447 nm and had the emission line width of 37 nm with no observable impurity related features. The turn-on voltage was 3.0 V. The output power was 20 μW at 60 mA drive current.     

Strain variation in p-GaN by different spacer layers in the light emitting diodes and their microstructural and emission behaviors

InGaN/GaN multiple quantum well-based blue light emitting diodes (LEDs) with different spacer layer structures were grown by metalorganic chemical vapor deposition. Fast-Fourier-transformed high-resolution transmission electron microscopy was used to determine the influence of the strain status in the spacer layer on Mg distribution and device performance. A comparison of the (1 1¯ 0 0) planar distance showed that the high-temperature grown InGaN layer in the spacer had a high level of stored strain. This led to the formation of a continuous facet contrast induced by Mg segregation in the p-layer, which was responsible for the deterioration of the electroluminescence performance of the LEDs. These results show that the delicate control of stored strain in nitride films is important for improving the device performance.     

Profiling band structure in GaN devices by electron holography

Electron holography in a field emission gun transmission electron microscope has been used to profile the inner potential V₀ across GaN/x nm In_0.1Ga_0.9N/GaN/(0 0 0 1) sapphire samples (x=10, 40 nm) grown by molecular beam epitaxy and viewed in cross-section. Results are presented which suggest a decrease in V₀ of 3–4 V across the InGaN layer in the [0 0 0 1] direction. It is proposed that the results can be explained by charge accumulation across the InGaN layer and that the opposing contributions due to piezoelectric and polarisation fields are effectively masked by Fermi level pinning.