绝缘氧化层上自离子注入Si薄膜W线发光性能的调控

对SOI基片上的Si薄膜进行了一系列Si⁺自注入和热退火的改性实验,并利用低温光致发光(PL)光谱对这些Si薄膜样品的发光性能进行了测试. 在这些SOI样品的PL光谱中观察到了丰富的光学结构,包括D₁,D₂,D₃,X以及异常尖锐的W线. 通过对比在同等光谱测试条件下的W线归一化强度,获得了针对SOI基片发射W线较为理想的自注入和热退火参数. 同时,还对D系列发光峰以及W线的缺陷起源和光学性质进行了很好的讨论. 关键词： SOI结构 自离子注入 W线 近红外发光器件     

Photoluminescence and structural defects in silicon layers implanted by iron ions

The photoluminescence spectra of silicon samples implanted by ⁵⁶Fe⁺ ions [energy, 170 keV; dose, 1×10¹⁶, (2–4)×10¹⁷ cm^?2] and annealed at temperatures of 800, 900, and 1000°C are measured. The structure of the samples at each stage of treatment is investigated using transmission electron microscopy (TEM). It is found that the phase formation and morphology of crystalline iron disilicide precipitates depend on the dose of iron ions and the annealing temperature. A comparison of the dependences of the intensity and spectral distribution of the photoluminescence on the measurement temperature, annealing temperature, and morphology of the FeSi₂ phase revealed the dislocation nature of photoluminescence.     

Photoluminescence studies of Si nanocrystals

Summary We report room temperature time-resolved photoluminescence (PL) and temperature dependence of continuous wave (cw) PL studies of high fluence (from 3·10¹⁶ to 3·10¹⁷ cm⁻²) Si⁺-implanted thermal SiO₂ layers after annealing at high temperature (T=1000°C). Such measurements were related to TEM analysis of samples. Nancocrystals were observed at TEM only a samples implanted at higher fluence. In these samples a near infrared PL signal peaked at approximately 1.5 eV with decay time of about 100 μs is present. Besides, in all samples a light emission is present in the green region of the spectrum. The intensity of the emission shows large variations with ion fluence, and is characterized by 0.4, 2 and 7 ns decay times. Paper presented at the III INSEL (Incontro Nazionale sul Silicio Emettitore di Luce) Torino, 12–13 October 1995.     

XRD and RBS study of annealing effects in titanium implanted a-silicon films

We have used ion implantation of 30 keV⁴⁸Ti⁺ ions into a-Si films at nominal doses of 10²⁰-10²¹ ions/m² to fabricate coherent silicide layers. Characterization of these layers and study of their annealing behaviour were carried out using XRD and RBS techniques. We find that the layers are a mixture of Ti₅Si₄, TiSi, TiSi₂ and Si. On annealing at relatively lower temperatures (up to ～ 300° C), predominant silicide phases present in the layer are Ti-rich, such as Ti₅Si₄ and TiSi. At higher temperatures, the Ti-rich layer has a tendency to consume unreacted Si from the film and to form a predominantly Si-rich silicide layer. A structure of silicon different from the diamond cubic structure is noticed in these implanted layers.     

Effect of nitrogen implantation with overlay coatings on microhardness in 4145 steel

The effect of nitrogen implantation on microhardness in 4145 steel was investigated. Practically no increase in microhardness for 10, 20 and 40 gm loads was observed in samples implanted with a dose of 6.5×10¹⁷N⁺ ions cm^?2 at 94 keV. The effect of ion-beam induced intermixing of aluminium and titanium film (400Å), due to nitrogen implantation was also studied. A noticeable increase of 15% in microhardness was observed. Annealing at temperature ∽300°C proved effective, while a decreasing trend in hardness could be observed for annealing temperatures >300°C. Furthermore, preliminary test indicated that these samples were more suitable for wear-protection.     

Doping and radiation damage profiles of P+ ions implanted in silicon along the [110] axis

Several doses of 200 KeV phosphorus ions have been implanted under channeling conditions along the [110] direction in silicon.

Range distribution has been determined for the three implant doses 10¹³, 10¹⁴, 10¹⁵ P⁺/cm² both with the electrical measurements and the neutron activation techniques.

The radiation damage distribution has been determined both with 290 KeV proton back-scattering analysis and with transmission electron microscopy (TEM) observations.

Good agreement has been found between electrical and neutron activation profiles in the samples where 100% of the implanted dose had been electrically activated by means of annealing.

Carrier concentration profiles, from samples implanted with 10¹⁵ P⁺/cm², determined after two different annealing temperatures (500°C and 700°C) have bcen compared with the radiation damage distribution and a correlation between damage and phosphorus electrical activation process seems to be possible.

Maximum damage peak, as determined by back-scattering analysis, shifts from ～0.4 μ depth in the lower dose(5 × 10¹⁴ P⁺/cm²), to ～0.22 pm depth in the higher implanted dose (4 × 10¹⁵ P⁺/cm²). Damage distribution of phosphorus ions random implanted in the same experimental conditions shows 3 peak at ～0.2 μn depth.

In accordance with the back-scattering analysis, T.E.M. observations on 10¹⁵P⁺/cm² implanted samples show the presence of amorphous regions at depth between 0.25 and 0.5 μm from the surface. In the most damaged layer ～0.3μm in depth, a surface density of ～10¹²/cm² amorphous regions 25-50 A diameter was observed.     

Specific features of steady-state implantation of crystalline silicon with a molecular oxygen-nitrogen beam: Si <Emphasis Type="Italic">L</Emphasis><Subscript>2, 3</Subscript> x-ray emission spectra

The local electronic structure of 〈111〉 n-silicon single-crystal samples is studied using Si L _{2, 3} x-ray emission spectroscopy. The Si _x O _y N _z system is formed by implanting the samples with an ¹⁶O ₂ ⁺ and ¹⁴N ₂ ⁺ ion molecular beam (the oxygen/nitrogen ratio in the molecular beam is 1:1, the implantation energy is 30 keV, the irradiation fluences vary from 2.0 × 10¹⁷ to 1.5 × 10¹⁸ cm^?2, the samples after the implantation are subjected to rapid thermal annealing in nitrogen at 800°C for 5 min). A comparison of the recorded Si L spectra with the spectra of the reference samples reveals clear correlations between the specific features of the electronic structure of the silicon oxynitride formed upon implantation and the ion fluence. It is shown that the implantation at fluences of 2 × 10¹⁷ and 1 × 10¹⁸ cm^?2 results in the predominant formation of Si₃N₄, whereas the implantation at a fluence of 1.5 × 10¹⁸ cm^?2 leads primarily to the formation of SiO₂ layers in single-crystal silicon. The most probable factors and mechanisms accounting for such implantation of ¹⁶O ₂ ⁺ and ¹⁴N ₂ ⁺ into the samples under study are discussed. The experimental data obtained are compared with ab initio full-potential linearized augmented plane wave calculations of the band structure.     

Structure of self-implanted silicon annealed under enhanced hydrostatic pressure

Implantation of any ions at a sufficiently high dose and energy (E) into single-crystalline Si leads to the creation of amorphous Si (aSi), with damages peaking near the projected range (R _p) of implanted species. Enhanced hydrostatic pressure (HP) at a high temperature (HT) influences the recrystallization of aSi. The structure of self-implanted Czochralski silicon (Si⁺ dose, D=2×10¹⁶ cm^?2, E=150 keV, R _p=0.22 μm) processed for 5 h at 1400 or 1520 K under HPs up to 1.45 GPa was investigated by X-ray, secondary ion mass spectrometry and photoluminescence methods. The implantation of Si produces vacancies (V) and self-interstitials (Si_i). Vacancies and Si_is form complex defects at HT–HP, also with contaminants (e.g. oxygen, always present in Czochralski silicon). The mobility and recombination of V and Si_i as well as the kinetics of recrystallization are affected by HP, thus processing at HT–HP affects the recovery of aSi.     

Surface damage and topography of erbium metal films implanted with helium to high fluences

Topographical and expansion effects which occur as a result of implanting erbium thin films with helium up to fluences of 1.5 × 10¹⁸ He⁺/cm² are described. There exists an inverse relationship between critical dose and annealing temperature with respect to the formation of surface bubbles. Post implantation annealing at or below 400°C is found to strongly reduce implantation induced expansion for doses less than 3.5 × 10¹⁷ He⁺/cm², but is observed to result in increased expansion above this dose. At temperatures above 400°C, expansion is increased for all doses investigated. Details of bubble development in the implanted layer are discussed and the manner in which surface bubbles develop from enlarged subsurface bubbles is illustrated.     

Secondary ion emission from silicon and silicon oxide

The emission of Si⁺, Si²⁺, Si³⁺, Si₂⁺, SiO⁺ and B⁺ from boron doped silicon has been studied at oxygen partial pressures between 2 × 10^?10 and 2 × 10^?5 Torr. Sputtering was done with 2 to 15 keV argon ions at current densities between 3 and $\text{40}\text{μ}\text{A}\text{cm}{}^2$. The relative importance of the different ionization processes could be deduced from a detailed study of the yield variation at varying bombardment conditions. Comparison with secondary ion emission from silicon dioxide allows a rough determination of the composition of oxygen saturated silicon surfaces.     

Influence of ion-irradiation parameters on defect formation in silicon films

It is shown that unlike bulk silicon, for which amorphization is observed at an irradiation dose of 5 × 10¹⁶ ion/cm², thin silicon films on sapphire are amorphized at lower critical doses (10¹⁵ ion/cm²). An undamaged surface layer remains when the silicon films are irradiated with Si⁺ ion beams. Its thickness depends on the current density of the incident beam. Rutherford backscattering studies show that annealing at 950°C improves the crystallinity of the irradiated silicon film. Annealing of the films at 1100°C leads to mixing of the silicon-sapphire interface.     

Investigation of irradiated and annealed high-temperature superconducting films with the Umka nanotechnological complex

Superconducting YBa₂Cu₃O_{7 ? x} films were fabricated by dc magnetron sputtering. They were irradiated with 1.2-MeV He⁺ ions to doses of 4 × 10¹⁵, 8 × 10¹⁵, 16 × 10¹⁵, and 32 × 10¹⁵ cm^?2. The irradiated films were subjected to stepwise (30 min per step) vacuum annealing at 500, 600, 700, 800, and 900°C. After vacuum annealing, the samples irradiated to doses of 4 × 10¹⁵, 8 × 10¹⁵, and 16 × 10¹⁵ cm^?2 exhibited partial recovery of their critical temperature, whereas the sample with a dose of 32 × 10¹⁵ cm^?2 exhibited no signs of partial recovery of T _C. Investigation of the irradiated annealed samples with the Umka nanotechnological complex has revealed damaged surface regions extended to a relatively large (several tenths of a micrometer) depth.     

High concentration effects of ion implanted boron in silicon

The diffusion behaviour of implanted boron in silicon was investigated using the¹⁰B(n,α)⁷ Li nuclear reaction. An anomalous behavior with a strong reduction of the diffusivity above an effective solubility limit at 1.5×10¹⁹, 6×10¹⁹, and 1.1×10²⁰ cm⁻³ was found for annealing temperatures of 800, 900, and 1,000°C, respectively.     

Photoluminescence evolution in self-ion-implanted and annealed silicon

Si⁺ ion-implanted silicon wafers are annealed at different temperatures from room temperature to 950~℃ and then characterized by using the photoluminescence (PL) technique at different recorded temperatures (RETs). Plentiful optical features are observed and identified clearly in these PL curves. The PL spectra of these samples annealed in different temperature ranges are correspondingly dominated by different emission peaks. Several characteristic features, such as an R line, S bands, a W line, the phonon-assistant W^\rm TA and Si^\rm TO peaks, can be detected in the PL spectra of samples annealed at different temperatures. For the samples annealed at 800~\du, emission peaks from the dislocations bounded at the deep energy levels of the forbidden band, such as D_1 and D₂ bands, can be observed at a temperature as high as 280~K. These data strongly indicate that a severe transformation of defect structures could be manipulated by the annealing and recorded temperatures. The deactivation energies of the main optical features are extracted from the PL data at different temperatures.     

Positron annihilation studies of defects in 3CSiC hot-implanted with nitrogen and aluminum ions

2 ⁺ and Al⁺ at temperatures from room temperature (RT) to 1200 °C at doses of 10¹³ and 10¹⁵/cm². It is found from Doppler broadening spectra of annihilation gamma-rays obtained by varying the incident positron energy that hot-implantation gives rise to clustering of vacancies, whereas it suppresses amorphization and diminishes the thickness of damaged layers. The average size of such clusters increases with increasing implantation dose and temperature. Vacancy clustering by hot-implantation can be interpreted by the combination of vacancies during implantation. Vacancy type defects in the low-dose (10¹³/cm²) implanted samples are found to be removed by annealing at 1400 °C, whereas large vacancy clusters still remain after 1400 °C annealing in the high-dose (1 0¹⁵/cm²) implanted samples. It is also derived from the depth profile of positron diffusion length that positron scattering centers are produced after annealing at 1400 °C in all implanted samples. Received: 7 March 1997/Accepted: 6 May 1997     

Electrical properties of Cd,Zn and S ion-implanted layers in GaAs

The electrical properties of cadmium, zinc, and sulfur ion-implanted layers in gallium arsenide have been measured by the van der Pauw-Hall technique. Ion implantation was performed with the substrates held at room temperature. The dependence of sheet resistivity, surface carrier concentration, and mobility on ion dose and on post-implantation anneal temperature was determined. In the case of 60 keV Cd⁺ ions implanted into n-type substrates, a measurable p-type layer resulted when samples were annealed for 10 minutes at a temperature in the range 600—900°C. After annealing at 300—900°C for 10 minutes, 100 per cent electrical activity of the Cd ions resulted for ion doses ≤ 10¹⁴/cm².

The properties of p-type layers produced by implantation of 85 keV Zn⁺ ions were similar to those of the 60 keV cadmium-implanted layers, in that no measurable p-type behavior was observed in samples annealed below a relatively high temperature. However, in samples implanted with 20 keV Zn⁺ ions a p-type layer was observed after annealing for 10 minutes at temperatures as low as 300°C.

Implantation of sulfur ions into p-type GaAs substrates at room temperature resulted in the formation of a high resistivity n-type layer, evcn before any annealing was performed. Annealing at temperatures up to 200°C or above 600°C lowered the resistivity of the layer, while annealing in the range 300—500°C eliminated the n-type layer.     

Luminescence and structure of nanosized inclusions formed in SiO2 layers under double implantation of silicon and carbon ions

Luminescent and structural characteristics of SiO₂ layers exposed to double implantation by Si⁺ and C⁺ ions in order to synthesize nanosized silicon carbide inclusions have been investigated by the photoluminescence, electron spin resonance, transmission electron microscopy, and electron spectroscopy methods. It is shown that the irradiation of SiO₂ layers containing preliminary synthesized silicon nanocrystals by carbon ions is accompanied by quenching the nanocrystal-related photoluminescence at 700–750 nm and by the enhancement of light emission from oxygen-deficient centers in oxide in the range of 350–700 nm. Subsequent annealing at 1000 or 1100°C results in the healing of defects and, correspondingly, in the weakening of the related photoluminescence peaks and also recovers in part the photoluminescence of silicon nanocrystals if the carbon dose is less than the silicon dose and results in the intensive white luminescence if the carbon and silicon doses are equal. This luminescence is characterized by three bands at ～400, ～500, and ～625 nm, which are related to the SiC, C, and Si phase inclusions, respectively. The presence of these phases has been confirmed by electron spectroscopy, the carbon precipitates have the sp ³ bond hybridization. The nanosized amorphous inclusions in the Si⁺ + C⁺ implanted and annealed SiO₂ layer have been revealed by high-resolution transmission electron microscopy.     

Accumulation and annealing of implantation damage in a-Si:H

Hydrogenated amorphous silicon (a-Si:H) films have been irradiated with H⁺, B⁺, P⁺, and Ar⁺ ion beams. The accumulation and the annealing of irradiation-induced defects has been investigated through a series of electronic transport and PDS measurements. We find that for all projectiles damage accumulation is dominated by atomic displacement collisions with the damage saturating for energy transfers in excess of about 10 eV/target atom. Annealing at elevated temperatures causes the conductivity of doped and irradiated a-Si:H films to increase according to stretched exponential decay curves. All annealing parameters derivable from such fits scale with the energy originally dissipated into atomic displacement collisions. For energy transfers up to 10 eV/target atom the activation energy for annealing increases up to a saturation value and, at the same time, an increasing fraction of the irradiation-induced defects becomes stable against annealing at moderate temperatures (T _a<250° C). We discuss these results with respect to damage accumulation data in crystalline silicon (c-Si) and with regard to the annealing of metastable defects in a-Si:H.     

The influence of the annealing conditions on the photoluminescence of ion-implanted SiO2:Si nanosystem at additional phosphorus implantation

The influence of P ion doping on the photoluminescence (PL) of the system of nanocrystals in SiO₂ matrix (SiO₂:Si) both without annealing and after annealing at various temperatures (provided before and after additional P implantation) is investigated. The Si and P implantation was carried out with ion energies of 150 keV and doses Φ_Si=10¹⁷ cm⁻² and Φ_P=(0.1–300)×10¹⁴ cm⁻² (current density j3 μAcm⁻²). The system after Si implantation was formed at 1000°C and 1100°C (2 h). For the case of SiO₂:Si system as-implanted by P, the intensity of PL was drastically quenched, but partially retained. As for the step-by-step annealing (at progressively increased temperatures) carried out after P implantation, the sign and degree of doping effect change with annealing temperature. The possible mechanisms of these features are discussed.     

The studies of high-temperature and short-time annealing,phase transition process,and magnetic property for LaFe11.7Si1.3 compound

The high-temperature phase transition is analyzed according to the DSC of as-cast LaFe_11.7 Si_1.3 compound and the X-ray patterns of LaFe_11.7Si_1.3 compounds prepared by high-temperature and short-time annealing. Large amount of 1:13 phase begins to appear in LaFe_11.7Si_1.3 compound annealed near the melting point of LaFeSi phase (about 1422?K). When the annealing temperature is close to the temperature of peritectic reaction (about 1497?K), the speed of 1:13 phase formation is the fastest. The phase relation and microstructure of the LaFe_11.7Si_1.3 compounds annealed at 1523?K (5?h), 1373?K (2?h)?+?1523?K (5?h), and 1523?K (7?h) +1373?K (2?h) show that longer time annealing near peritectic reaction is helpful to decrease the impurity phases. For studying the influence of different high-temperature and short-time annealing on magnetic property, the Curie temperature, thermal, and magnetic hystereses, and the magnetocaloric effect of LaFe_11.7Si_1.3 compound annealed at three different temperatures are also investigated. Three compounds all keep the first order of magnetic transition behavior. The maximal magnetic entropy change ΔS_M (T, H) of the samples is 12.9, 16.04, and 23.8?J?kg^?1?K^?1 under a magnetic field of 0–2?T, respectively.