Curing kinetics of epoxy resins with hyperbranched polyesters as toughening agents

The effects of hyperbranched polyesters on the cure kinetics of diglycidyl ether of bisphenol A (DGEBA) in the presence of m‐phenylene diamine were investigated with nonisothermal differential scanning calorimetry. The results showed that the addition of hyperbranched polyesters enhanced the cure reaction of DGEBA with m‐phenylene diamine, and this resulted in a reduction of the peak temperature of the curing curve and the activation energy because of the low viscosity and large number of terminal hydroxyl groups. However, when linear poly(ethylene glycol) was added, the activation energy of the blends also slightly decreased, whereas the peak temperature of the curing curve increased. The curing kinetics of the blends were calculated by the isoconversional method of Málek. The two‐parameter autocatalytic model (i.e., the ?esták–Berggren equation) was found to be the most adequate for describing the cure kinetics of the studied systems. The obtained nonisothermal differential scanning calorimetry curves showed results in agreement with those theoretically calculated. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2649–2656, 2004     

Curing behavior and kinetics of epoxy resins cured with liquid crystalline curing agent

This article describes the synthesis of a liquid crystalline curing agent 4,4′-bis-(4-amine-butyloxy)-biphenyl (BABB), and its application as a curing agent for the epoxy resin (DGEBA) in comparison with normal curing agent, 4,4′-diaminobiphenyl (DABP). BABB was investigated with polarized optical microscopy, differential scanning calorimetry, and small-angle X-ray scatting, and the results showed that BABB displayed smectic liquid crystalline phase. The curing behaviors of DGEBA cured with BABB and DABP were studied by using differential scanning calorimetry (DSC), polarized optical microscopy (POM), and dynamic mechanical analysis (DMA). The results indicated that BABB showed a higher chemical reactivity than DABP. The kinetics was studied under isothermal conditions using an isoconversional method, and the isothermal DSC data can be fitted reasonably by an autocatalytic curing model. The nematic droplet texture was observed for the resulting polymer network of DGEBA/BABB system, while the DGEBA/DABP system showed an isotropic state. The storage modulus of DGEBA/BABB system was enhanced in comparison with DGEBA/DABP system because of the formation of LC phase, whereas the glass transition temperatures decreased because of the introduction of flexible spacer group.     

Curing kinetics of bio-based epoxy resin-toughened DGEBA epoxy resin blend

In the present study, TEIA bioresin was blended with the diglycidyl ether bisphenol A (DGEBA) epoxy resin in different ratios (i.e. 10, 20, 30, 40 mass%), cured with methylhexahydrophthalic anhydride curing agent in the presence of 2-methylimidazole catalyst. The optimized composition of DGEBA and TEIA bioresin blends system was employed as an adhesive strength. The adhesive strength of the TEIA-modified DGEBA epoxy resin blend system was increased from 4.14 to 6.31 MPa on an aluminium substrate compared to the DGEBA epoxy resin. The curing kinetics of non-isothermal, DGEBA epoxy resin and its bio-based blend systems were investigated employing differential scanning calorimetry. An increase in the peak temperature and reduction in a heat of curing as well as activation energy in DGEBA epoxy resin were observed with the addition of TEIA bioresin content. The activation energy (E_a) of the DGEBA resin and their bio-based blend system were obtained from Kissinger and Flynn–Wall–Ozawa methods.

     

Curing of liquid crystalline epoxy resins with a biguanide

This work extends the authors' investigations on liquid crystalline epoxy resins prepared from diglycidyl ether of 4,4′-dihydroxybiphenyl (DGE-DHBP) and aliphatic dicarboxylic compounds (ADC) or difunctional aromatic compounds. Syntheses and properties of these liquid crystalline epoxy resins are described elsewhere. In this paper a study on the curing reaction of the above mentioned liquid crystalline epoxy resins is presented. Ortho-tolylbiguanide was applied as the curing agent. The curing reactions were investigated by differential scanning calorimetry, microscopic observations and IR spectroscopy. Depending upon the temperature program of curing, it was possible to obtain polymeric networks with liquid crystalline order. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2739–2745, 1997     

Curing kinetics of lignin-novolac phenolic resins using non-isothermal methods

The curing kinetics of lignin-novolac and methylolated lignin-novolac resins were studied using non-isothermal methods employing differential scanning calorimetry (DSC) at different heating rates. The Belichmeier, Ozawa and Kissinger methods were applied, which give the kinetic parameters of the curing process studied. In addition, the model-fitting Coats-Redfern method was used to analyze the experimental data. The kinetic study evaluated the effect of the lignin (softwood ammonium lignosulfonate), methylolated or not, on the resin curing process. Results for lignin-novolac and modified lignin-novolac resins were compared with a commercial novolac resin as a reference. When lignosulfonate is modified by methylolation and is incorporated in the novolac resin, there is an important reduction in activation energy. The lignin-novolac showed slightly higher values of activation energy than methylolated-lignin resins, but lower values than commercial resins. This behavior has been attributed to the extra methyol groups introduced by lignosulfonate.     

Curing studies of epoxy resins with phosphorus‐containing amines

The curing system of diglycidyl ether of bisphenol A (DGEBA) with two phosphorus‐containing amine compounds—bis(3‐aminophenyl)methyl phosphine oxide and bis(4‐aminophenyl)‐bis(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl)methane—was studied with differential scanning calorimetry under isothermal and nonisothermal conditions and compared with the DGEBA/diamino diphenyl methane system. The isoconversional method was used to evaluate the dependence of the effective activation energy on the extent of conversion. Modulated differential scanning calorimetry and dynamic mechanical thermal analysis were used to study the phenomena of vitrification and gelation. The thermal and flame‐retardant properties were evaluated, and the limiting oxygen index values of the phosphorylated resins, above 30, confirmed that phosphorus‐containing epoxy resins are effective flame retardants. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1676–1685, 2006     

Curing behavior and toughening performance of epoxy resins containing hyperbranched polyester

The effects of the hyperbranched polyester with hydroxyl end groups (HBPE‐OH) on the curing behavior and toughening performance of a commercial epoxy resin (diglycidyl ether of bisphenol A, DGEBA) were presented. The addition of HBPE‐OH into DGEBA strongly increased its curing rate and conversion of epoxide group due to the catalytic effect of hydroxyl groups in HBPE‐OH and the low viscosity of the blend at curing temperature. The improvements on impact strength and critical stress intensity factor (or fracture toughness, K_1c) were observed with adding HBPE‐OH. The impact strength was 8.04 kJ m^?1 when HBPE‐OH reached 15 wt% and the K_1c value was approximately two times the value of pure epoxy resin when HBPE‐OH content was 20 wt%. The morphology of the blends was also investigated, which indicated that HBPE‐OH particles, as a second phase in the epoxy matrix, combined with each other as the concentration of HBPE‐OH increased. Copyright © 2004 John Wiley & Sons, Ltd.     

Curing reaction characteristics and phase behaviors of biphenol type epoxy resins with phenol novolac resins

Diglycidyl ether of 4,4′-dihydroxybiphenol (BPDGE) is a liquid crystalline epoxy. The biphenyl epoxy (diglycidyl ether of 3,3′,5,5′-tetramethyl-4,4′-biphenyl, TMBPDGE) has found great applications in plastic encapsulated semiconductor packaging. Phenol novolac (PN) was used as curing agent. The reaction kinetics of BPDGE/PN and TMBPDGE/PN systems in the presence of triphenylphosphine (TPP) were characterized by an isoconversional method under dynamic conditions using differential scanning calorimetry (DSC) measurements. The results showed that the curing of epoxy resins involves different reaction stages and the values of activation energy are dependent on the degree of conversion. The effects of curing temperature on their phase structure have been investigated with polarized optical microscopy and Wide-angle X-ray diffraction. With proper curing process, BPDGE showed a nematic phase when cured with PN.     

Curing kinetics of amine and sodium hydroxide catalyzed phenol-formaldehyde resins

The effect of both formaldehyde content and catalyst type used in the synthesis of several resole type phenolic resins has been studied by using differential scanning calorimetry. In this study Kissinger-Akahira-Sunose (KAS), Ozawa-Flynn-Wall (OFW) and Friedman model-free kinetics are applied in order to correlate the dynamic cure behaviour with the mentioned synthesis variables. Strong upward dependency of activation energy on conversion has been detected in all cases up to a maximum value. Lower the formaldehyde content fewer changes in activation energy have been detected, revealing a more homogeneous polymerization. As formaldehyde content increases, stronger variations of energy values have been observed and the maximum value is shifted to lower conversions. By comparing triethylamine and sodium hydroxide catalysts similar behaviour has been observed, with higher energy values and shifting of the maximum in the latter. Friedman approach has been resulted in more convenient and accurate for the energy values determination and KAS method seems useful for the dynamic cure prediction of that type of thermoset.     

Curing epoxy resins with anhydrides. Model reactions and reaction mechanism

The mechanism of acid curing of epoxy resins catalyzed with tertiary amines was investigated by using model systems composed of phenylglycidyl ether and benzoic acid or acetic acid anhydrides in the presence of benzyldimethylamine. The reaction was studied by NMR spectrometry, liquid chromatography, and ozone absorption. The main findings are that (1) the tert-amine is bound chemically and irreversibly during the reaction under the formation of a quaternary ammonium salt and (2) 1-phenyloxypropanediol-2,3-dibenzoate or diacetate is the main reaction product. The suggested reaction mechanism involves initiation in which the tertiary amine reacts with the epoxy group, giving rise to a zwitterion that contains a quaternary nitrogen atom and an alkoxide anion; the latter immediately reacts with the anhydride and quaternary salt is formed. In a later stage the carboxy anion of the quaternary salt reacts first with the epoxy group, then with the anhydride. By this reaction diester is formed and the carboxy anion is regenerated.     

The kinetics of model reactions of curing epoxy resins with amines

The isothermal course of the reaction of phenylglycidyl ether and N,N-methylglycidylaniline with dibutyl amine at various temperatures was investigated DSC. The data were treated on the basis of a reaction scheme with two processes in parallel, one of them auto-catalyzed. A good fit with the experiment was reached only when the order of both processes with respect to amine had been reduced to half its original value. An assumption that the kinetics of the amine-epoxy resin rection are considerably affected by the formation of various complexes through hydrogen bonds may be an explanation. A simple mathematical model has been suggested to estimate this influence. Because of the relatively high heats of interaction for the formation of complexes, the dependence of the measured heat on the degree of conversion is not linear. The magnitude of the error caused by neglecting this fact in investigation of the kinetics by DSC has been estimated.     

Cure kinetics of liquid crystalline epoxy resins based on biphenyl mesogen

The cure kinetics of a biphenyl-based liquid crystalline (LC) epoxy resin (LCER) was studied using differential scanning calorimetry (DSC) and polarized optical microscopy. The effects of LC phase formation on the cure kinetics were investigated. Both a model-free isoconversional method and a model-fitting method were used to analyze the DSC data. Results from the isoconversional analysis were applied to develop tentative multi-step kinetic models describing the curing reaction. Kinetic analysis showed that compared to the resins cured in amorphous phase, LCERs exhibited higher values of reaction enthalpy and a complex dependence of activation energy on the degree of cure. The formation of the LC phase resulted in a decrease in activation energy, leading to higher degree of reaction.     

Curing kinetics of arylamine-based polyfunctional benzoxazine resins by dynamic differential scanning calorimetry

In this study, the curing kinetics of polyfunctional benzoxazine resins based on arylamine, i.e. aniline and 3,5-xylidine, designated as BA-a and BA-35x, respectively, were investigated. Non-isothermal differential scanning calorimetry (DSC) at different heating rates is used to determine the kinetic parameters and the kinetic models of the curing processes of the arylamine-based polyfunctional benzoxazine resins were proposed. Kissinger, Ozawa, Friedman, and Flynn-Wall-Ozawa methods were utilized to determine the kinetic parameters of the curing reaction. BA-a resin shows only one dominant autocatalytic curing process with the average activation energy of 81-85 kJ mol⁻¹, whereas BA-35x exhibits two dominant curing processes signified by the clear split of the curing exotherms. The average activation energies of low-temperature curing (reaction (1)) and high-temperature curing (reaction (2)) were found to be 81-87 and 111-113 kJ mol⁻¹, respectively. The reaction (1) is found to be autocatalytic in nature, while the reaction (2) exhibits nth-order curing kinetics. In addition, the predicted curves from our kinetic models fit well with the non-isothermal DSC thermogram.     

Studies on the curing kinetics of epoxy resins using silicon containing amide-amines

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of novel silicon containing amide-amines were investigated by the dynamic differential scanning calorimetry. Silicon containing amide-amines were prepared by reacting 2.5 moles of 4,4'-diaminodiphenyl ether (E)/4,4'-diaminodiphenyl methane (M)/3,3'-diaminodiphenyl sulfone (mS)/bis(m-aminophenyl) methyl phosphine oxide (B) with one mole of bis(4-chlorobenzoyl) dimethyl silane. The multiple heating rate method (5, 10, 15 and 20°C min^-1) was used to study the curing kinetics of epoxy resins in the presence of stoichiometric amounts of amide-amines having molecular masses in the range of 660 to 760 g mol^-1. The peak exotherm temperature depends on the heating rate as well as on the structure of amide-amines. Activation energy of curing reaction as determined in accordance to the Ozawa's method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was the highest in case of resins cured with amide-amines having both phosphorus and silicon atoms. This revised version was published online in July 2006 with corrections to the Cover Date.     

Curing of epoxy resins by complex based on monoamide of phosphonic acid and ammonium chloride

Reaction of epoxy-diane resin with complex based on monoamide of phosphonic acid and ammonium chloride (MODAF) is studied. It is established that the MODAF equivalent in the reaction with epoxy resin is equal to 1/5 of its molecular weight. Epoxy resin is cured via the reactions of both monoamide and ammonium chloride. The dependence of the epoxide and hydroxyl groups has a stepped character over time, which is probably due to the existence of certain threshold concentrations of the curing coefficients. The investigated reaction is a new example of macroscopic coherence manifestation.     

Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.     

Luminescence spectroscopy as a tool for testing of cure kinetics of epoxy resins

In this paper, steady-state luminescence spectroscopy is used for the analysis of curing of epoxy resin. The advantage of this method is its rapidity, simplicity and sensitivity. Moreover, this method is contactless, and thus non-invasive. The aim is to analyze epoxy resin, mathematically describe its curing kinetics and determine its storage temperature. Using the photoluminescence method, a rapid procedure for obtaining the necessary technological data is achieved. This method is suitable for continuous measurement in production because there is no contact with the material, and the measurement itself can be performed very quickly. The elaborated mathematical model can serve as a basis for creating algorithms for automated data processing in case of fully robotic workplaces.