等离子体射频功率对微晶硅薄膜微结构及其特性影响

采用射频等离子增强化学气相沉积(RF-PECVD)技术在低温、高沉积压力的条件下制备微晶硅薄膜材料.在优化其它沉积参数的条件下,研究等离子功率密度对微晶硅薄膜材料微结构的影响.通过X射线衍射谱,拉曼光谱,红外吸收谱以及SEM来表征了微晶硅薄膜材料的微结构.结果显示:随着射频功率的增加,微晶硅薄膜的晶化率提高,晶粒尺度减小,薄膜呈小晶粒生长,薄膜中氢含量减少,微结构因子增加,薄膜生长表现出不均匀性.     

氨气流量对富硅SiNx薄膜结构及其光学特性的影响

采用等离子体增强化学气相沉积技术,以NH3、SiH4和N2为反应气体制备富硅-氮化硅薄膜.在优化了其它沉积参数条件下,研究氨气流量对富硅-氮化硅薄膜的结构和光学性质的影响.利用傅立叶变换红外光谱、紫外可见光谱和X射线衍射谱分析了薄膜的键合情况、带隙结构.结果表明,随着NH3流量的增大,薄膜中的Si-N键和N-H键增强,Si-H键减小并向高波数方向移动,薄膜逐渐由非晶SiNx相向小晶粒Si3 N4相转变.同时随着NH3流量的增大,薄膜的光学带隙逐渐展宽,微观结构的有序度降低.XRD图谱分析表明薄膜内的平均晶粒尺寸也随着氨气流量的增加而在逐渐增大.结合以上结果分析,适当增加NH3流量有助于薄膜由非晶SiNx向包含小晶粒的Si3 N4转变.     

PECVD沉积参数对非晶硅向微晶硅薄膜转化的影响

采用等离子体增强化学气相沉积(PECVD)系统,以硅烷和氢气为反应气源,通过改变射频功率、硅烷浓度来制备氢化硅基薄膜材料.研究了沉积参数的变化对硅基薄膜材料微结构的影响.通过红外吸收谱、紫外可见光谱以及X射线衍射谱对样品材料进行表征.实验结果表明,随着射频功率的增加,薄膜中氢含量也相应地增大,而光学带隙表现出先增大后减小的规律.当硅烷浓度逐渐降低时,薄膜材料的光学带隙相应地降低,并从非晶硅薄膜逐渐向微晶硅薄膜材料转变,且薄膜材料在(111)方向的晶粒尺度达到了10.92 nm.实现了在高沉积压强、大射频功率、低硅烷浓度条件下可以有效优化改善硅基薄膜质量.     

辉光功率对n型a-Si:H薄膜结构及性能的影响

采用射频等离子增强化学气相沉积(RF-PECVD)方法,以氢稀释的硅烷(SiH4)为反应气体,磷烷(PH3)为掺杂气体,制备了n型氢化非品硅(a-Si:H)薄膜.研究了辉光放电功率对薄膜微结构和光电性能的影响,采用XRD和拉曼散射光谱对薄膜的微结构进行了表征,薄膜的折射率通过NKD-7000 W光学薄膜系统拟合,薄膜暗电导率利用高阻仪测试.结果表明:在辉光功率30～150 W范国内,所沉积的磷掺杂的硅薄膜为非晶态;非晶态薄膜结构中程有序度随辉光功率的增大先增人后减小,在功牢为100 W时非晶硅薄膜中程有序程度最高;薄膜的折射率随着辉光功率的增大先增加后减小,在功率为70 W达到最大值3.7;薄膜暗电导率在100 W最大,其最人值为9.32×10-3S/ cm.     

射频功率对Si薄膜微观结构及电学性能的影响

采用等离子体增强化学气相沉积(PECVD)法制备了不同射频功率的Si薄膜,并对其进行真空退火处理.研究了射频功率和退火处理对薄膜微观结构和电学性能的影响,并总结了不同电场环境对薄膜原子排列有序度的影响规律.结果表明:随射频功率的增加,Si薄膜的非晶结构无实质改变,但其少子寿命明显增强;经800℃真空退火处理后,Si薄膜的微观结构均由非晶态转变为晶态,晶化程度达60;以上,且少子寿命达到20 μs以上.     

氧化硅中纳米晶硅薄膜的低温沉积及其键合特性研究

以Ar和H2为溅射气体,采用Si和SiO2双靶活性溅射技术实现了镶嵌纳米晶硅(nc-Si)的富硅氧化硅(SiOx)薄膜的300℃低温生长,并分析了氢气掺入对薄膜微观结构及键合特性的影响.结果表明,氢气流量比的增加导致纳米硅粒子尺寸增加,而生长速率逐渐减小.薄膜中Si-O键合结构以Si(O4)键为主,随H2流量比的增加,Si-O4-nSin(n=0,1)键密度减小,Si-O4-nSin(n=2,3)和SiH2键密度持续增加,而所对应Si-H键密度呈现先减小后增加趋势,该结果可解释为等离子体内氢原子对反应前驱物中氧的去除效应增强和氢原子与表面氧的解吸附反应几率的增加.     

等离子体增强CVD法沉积的微晶硅薄膜的微结构研究

本文系统研究了PECVD法沉积μc-Si薄膜中衬低温度、氢气稀释率和射频功率等参数对μc-Si薄膜结构特性的影响.表明:随着衬低温度的增加、氢气稀释率的增大、射频功率的提高,薄膜的晶化率增大.沉积薄膜的晶化率最大可达80;,表面粗糙度大约为30nm.通过对反应过程中的能量变化进行了分析,得到反应为放热反应,且非晶结构对沉积参数比较敏感.     

氢流量对富硅-氮化硅薄膜键结构及光学性质的影响

采用等离子体增强化学气相沉积法,以SiH4、NH3和H2为反应气体,通过改变氢流量来制备富硅-氮化硅薄膜.利用傅里叶变换红外吸收光谱、紫外-可见光透射光谱、X射线衍射谱和光致发光谱对薄膜的结构与性质进行表征.实验发现,适当地增加H2流量,可以提高反应过程中H离子与Si、N悬挂键的键合几率,从而起到钝化薄膜悬键的作用.当H2流量从10 sccm变化到20 sccm时,H主要起到钝化薄膜悬挂键作用,因而缺陷态减少,缺陷态发光减弱,薄膜的光学带隙缓慢展宽.继续增加H2流量,薄膜中的氮原子持续增加,伴随着缺陷态再次增多,辐射加强,并导致光学带隙迅速展宽.当H2流量达到30 sccm时,薄膜中的氮化硅晶粒增大,数目增多,缺陷态发光消失,出现了氮化硅中由非晶硅量子点团簇引起的发光现象,说明薄膜中出现了非晶硅量子点团簇.因此,适量的增加氢流量能够对薄膜起到钝化的作用,并实现从富硅-氮化硅向Si3N4相转变的过程中形成氮化硅基质包埋的非晶硅量子点团簇结构.     

衬底温度对nc-Si∶H薄膜微结构和氢键合特征的影响

采用射频等离子体增强型化学气相沉积(RF-PECVD)技术,以H2和SiH4作为反应气体源,在不同的衬底温度下沉积了nc-Si∶H薄膜.采用Raman散射、X射线衍射、红外吸收等技术分析了薄膜的微结构和氢键合特征.结果表明,随衬底温度的升高,nc-Si∶H薄膜的沉积速率不断增大,晶化率和晶粒尺寸增加,纳米硅颗粒呈现出Si(111)晶面的择优生长趋势.键合特性显示,薄膜中的氢含量随衬底温度升高而逐渐减小,薄膜均匀性先增大后减小.     

PECVD低温制备微晶硅薄膜的研究

实验采用等离子体增强化学气相沉积(PECVD)法在玻璃衬底上制备了微晶硅薄膜.研究了氢稀释比、衬底温度、射频功率等因素对薄膜晶化的影响,得出在一定范围内随着衬底温度的升高、射频功率和氢稀释比的增大,薄膜的晶化率得到提高;但进一步提高沉积温度、射频功率反而会使薄膜晶化效果变差,并对晶化硅薄膜低温生长的机理进行了初步的探讨.     

Fabrication of Er doped oxyfluoride-silicate glass film by pulsed laser deposition for planar amplifier

Pulsed laser deposition (PLD) technique has been employed to fabricate glassy films based on the Er³⁺ doped oxyfluoride lead-silicate glasses. Glassy films have been produced at temperatures between 300 and 400 °C with O₂ pressures ranging from 25 to 175 mTorr. The film microstructure appears to be determined mainly by substrate temperature. The film refractive index increases with higher temperatures and lower O₂ pressures. The photoluminescence intensity of Er³⁺ ions and lifetime are very much dependent on the film microstructure and defects. Fewer fabrication defects and less porous films produce stronger fluorescence intensity and longer lifetime of Er³⁺ ions. At an optimized temperature and O₂ pressure, the Er photoluminescence properties of the film can be reproduced and are very close to those of target glass. Consequently the work reported here suggested a good candidate for further investigation as a thin film material for EDWA.     

In‐situ measurements of mass transport rate in vapour growth of hexamethylenetetramine crystal layers

This paper refers to the implementation of a remote optical imaging system suitable for in‐situ mass transport rate measurements in the growth of crystalline layers when grown in closed cylindrical ampoules by a physical vapour transport (PVT) technique. By means of this system, the measurements are carried out by taking photographs, at regular time intervals, of the source material volume as it reduces itself because of mass transfer. After storing the photographs, in real time, in a PC, a suitable software allows to estimate the mass transport rate during the growth process. The authors report here on the detailed setting up of such system when aimed at measuring the growth rate, as it varies with time, of hexamethylenetetramine (HMT, urotropine) crystal layers. A presentation and discussion of the results of these measurements have previously been reported. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Influence of hydrogen on SiO2 thick film deposited by PECVD and FHD for silica optical waveguide

Silicon dioxide (SiO₂) thick films have been deposited by plasma enhanced chemical vapor deposition (PECVD) and flame hydrolysis deposition (FHD). PECVD SiO₂ films were obtained at low temperatures (<350 °C) by the decomposition of the appropriate mixture of (SiH₄+N₂O) gases under suitable rf power and N₂O/SiH₄ ratio. For low N₂O/SiH₄ ratio, a refractive index(n) value close to 1.50 is obtained. The deposition rate increased with the increase of rf power. FHD SiO₂ films were produced by the flame hydrolysis reaction of halide materials such as SiCl₄, POCl₃ and BCl₃ in an oxy‐hydrogen torch. The porous SiO₂ layer, under the POCl₃/BCl₃ ratio deposition condition, has to be consolidated by annealing at around 1300 °C.     

化学气相沉积法制备二维过渡金属硫族化合物研究进展

二维过渡金属硫族化合物(TMDs)是继石墨烯之后的新型二维材料,由于其自身的独特物理化学性质在半导体、光电材料、能源储存和催化制氢等方面备受瞩目。化学气相沉积(CVD)是目前适合实现大规模制备二维材料的工艺之一,制备过程中参数的高度可控性使其具有很大优势。本文综述了近期通过CVD制备TMDs的研究进展,探讨了在CVD制备工艺中各种参数对产物生长和最终形貌的影响,包括前驱体、温度、衬底、辅助剂、压力和载气流量等。列举了一些改进的CVD制备工艺,并对其特点进行了总结。最后讨论了目前CVD制备TMDs所面临的挑战并对其发展前景进行展望。     

衬底温度对氢化非晶硅薄膜特性的影响

采用等离子增强化学气相沉积(PECVD)系统,以乙硅烷和氢气为气源,石英玻璃和单晶硅片为衬底制备了氢化非晶硅(a-Si∶ H)薄膜.采用扫描电子显微镜、X-射线衍射仪、台阶仪、紫外可见分光光度计、傅里叶变换红外光谱仪和电子能谱仪等分别表征了a-Si∶H薄膜的表面形貌、结晶特性、沉积速率,光学带隙,键合结构和Si化合态等特性.结果表明:随着衬底温度的增加,a-Si∶H薄膜表面的颗粒尺寸减小,均匀性增加,沉积速率则逐渐降低;衬底温度从80℃增加到130℃时,光学带隙显著增加,而在130℃至230℃范围内,光学带隙基本不随衬底温度变化;以SiH键对应的伸缩振动的相对峰强度逐渐增加,而以SiH2或(SiH2)n键对应的伸缩振动的相对强度逐渐减小;a-Si∶H薄膜中Si0+态的相对含量增加.因此,衬底温度大于130℃有利于制备优质a-Si∶H薄膜,230℃是沉积a-Si∶H薄膜的最佳衬底温度.     

气相输运沉积制备化合物薄膜材料的研究进展

相比用于制备晶体材料的化学气相输运(Chemical Vapor Transport,CVT)方法,近空间气相输运沉积(Close-spaced Vapor Transport Deposition,CSVT)及气相输运沉积(Vapor Transport Deposition,VTD)方法不为人们所熟知.近几年来,气相输运沉积逐渐应用于锑基薄膜(Sb2 Se3、Sb2 S3及Sb2(Se,S)3)、锡基薄膜(SnS、SnS2)及铋基薄膜(Bi2 Se3、Bi2 Te3)等材料的制备,有可能成为一种重要的材料制备方法.本文综述了气相输运沉积用于化合物薄膜制备的研究进展,对其特点进行分析,并对其发展趋势进行了展望.     

The pentacene films on the glass/ITO surface: structure and optical properties

Abstract

The structure, morphology and optical transmittance spectra of pentacene films on the (glass/ITO) surface were studied. The films were grown by two methods - the thermal vacuum deposition (TVD) and pulsed laser deposition (PLD). The electron diffraction pattern from thermally deposited pentacene films confirms their polycrystalline structure while the diffraction pattern of PLD-coated layers has a diffusion character. The results obtained showed that layers deposited by the TVD method has an optical spectrum that is characteristic for the pentacene film in contrary to the layers deposited by the PLD method. It is found a sensitivity of the optical transmittance of pentacene films to the ammonia action, which may be used for development the optical gas sensor.     

Light structured deposition (2): Material optical functionality

Aspherical refractive optical elements have been fabricated by an original light-assisted approach for deposition of semiconducting alloys. The fabrication of axicons by this method is reported for the case of an As–S binary glass alloy. The influence of both light intensity and exposure time on the deposit thickness profile is also presented.     

KTiOAsO4 Thin Films Prepared by Pulsed Laser Deposition

A pulsed Nd:YAG Laser was used to evaporate solid targets of KTiOAsO₄ (KTA) at power densities of 0.6 to 2.0x10⁹ W/cm². KTA thin films were deposited on glass, Si (100). After proper annealing treatment, single phase, (orthorh-ombic) polycrystalline KTA thin films were obtained. Some propitious of these thin films were also examined.     

纳米金刚石场发射阴极制备及性能研究

为了提高阴极场发射的均匀性与稳定性,探索了一种电泳沉积纳米金刚石场发射的阴极工艺.在这个工艺中,研制了特定比例的纳米金刚石电泳液,在抛光的金属钛衬底上通过电泳沉积了纳米金刚石场发射阴极.用扫描电子显微镜和拉曼光谱观察了涂层的形貌和结构,并测试了制备的涂层阴极的场发射特性.实验结果表明,在钛片上沉积的金刚石涂层薄而均匀.采用电泳方法制备场发射阴极具有简单易行,成本低廉以及可大面积制作等优势,可在平板显示器中得到广泛应用.