晶界对纳米多晶铝中冲击波阵面结构影响的分子动力学研究

用分子动力学方法研究了纳米多晶铝在冲击加载下的冲击波阵面结构及塑性变形机理.模拟研究结果表明:在弹性先驱波之后,是晶界间滑移和变形主导了前期的塑性变形机理;然后是不全位错在界面上成核和向晶粒内传播,然后在晶粒内形成堆垛层错、孪晶和全位错的过程主导了后期的塑性变形机理.冲击波阵面扫过之后留下的结构特征是堆垛层错和孪晶留在晶粒内,大部分全位错则湮灭于对面晶界.这个由两阶段塑性变形过程导致的时序性塑性波阵面结构是过去未见报道过的. 关键词： 晶界 塑性变形 冲击波阵面 分子动力学     

温度和应变速率耦合作用下纳米晶Ni压缩行为研究

本文利用低温力学测试系统研究了电化学沉积纳米晶Ni在不同温度和宽应变速率条件下的压缩行为. 借助应变速率敏感指数、激活体积、扫描电子显微镜及高分辨透射电子显微镜方法, 对纳米晶Ni的压缩塑性变形机理进行了表征. 研究表明, 在较低温度条件下, 纳米晶Ni的塑性变形主要是由晶界位错协调变形主导, 晶界本征位错引出后无阻碍的在晶粒内无位错区运动, 直至在相对晶界发生类似切割林位错行为. 并且, 在协调塑性变形时引出位错的残留位错能够增加应变相容性和减小应力集中; 在室温条件下, 纳米晶Ni的塑性变形机理主要是晶界-位错协调变形与晶粒滑移/旋转共同主导. 利用晶界位错协调变形机理和残留位错运动与温度及缺陷的相关性揭示了纳米晶Ni在不同温度、不同应变速率条件下力学压缩性能差异的内在原因.     

纳米Ni在77 K温度下压缩行为的研究

利用低温力学测试系统研究了电化学沉积纳米Ni在77 K温度下的压缩行为. 室温下纳米Ni 的屈服强度为 2.0 GPa, 77 K温度下的屈服强度为3.0 GPa, 压缩变形量则由室温的10%左右下降到5%. 借助应变速率敏感指数、激活体积、扫描电子显微和高分辨透射电子显微分析, 对纳米Ni的塑性变形机制进行了表征. 研究表明, 在77 K温度下的塑性变形主要是由晶界-位错协调变形主导, 晶界本征位错弓出后无阻碍地在晶粒内无位错区运动, 直至在相对晶界发生类似切割林位错行为. 同时分析了弓出位错的残留位错部分在协调塑性变形时起到的增加应变相容性和减小应力集中的作用. 利用晶界-位错协调机制和残留位错运动与温度及缺陷的相关性揭示了纳米Ni室温和77 K温度压缩性能差异的内在原因. 关键词： 塑性变形 强度 位错     

纳米多晶铜中冲击波阵面的分子动力学研究

冲击波阵面反映材料在冲击压缩下的弹塑性变形行为以及屈服强度、应变率条件等宏观量, 还与冲击压缩后的强度变化联系. 本文使用分子动力学方法, 模拟研究了冲击压缩下纳米多晶铜中的动态塑性变形过程, 考察了冲击波阵面和弹塑性机理对晶界存在的依赖, 并与纳米多晶铝的冲击压缩进行了比较. 研究发现: 相比晶界对纳米多晶铝的贡献而言, 纳米多晶铜中晶界对冲击波阵面宽度的影响较小; 并且其塑性变形机理主要以不全位错的发射和传播为主, 很少观察到全位错和形变孪晶的出现. 模拟还发现纳米多晶铜的冲击波阵面宽度随着冲击应力的增加而减小, 并得到了冲击波阵面宽度与冲击应力之间的定量反比关系, 该定量关系与他人纳米多晶铜模拟结果相近, 而与粗晶铜的冲击压缩实验结果相差较大.     

多晶银纳米线拉伸变形的分子动力学模拟研究

纳米尺度金属Ag以其独特的导电和导热性,广泛应用于微电子、光电子学、催化等领域,特别是在纳米微电极和纳米器件方面的应用.本文采用分子动力学方法模拟了不同晶粒尺寸下多晶银纳米线的拉伸变形行为,详细分析了晶粒尺寸对多晶银纳米线弹性模量、屈服强度、塑性变形机理的影响.发现当晶粒尺寸小于13.49 nm时,多晶Ag纳米线呈现软化现象,出现反Hall-Petch关系,此时的塑性变形机理主要以晶界滑移、晶粒转动为主,变形后期形成五重孪晶;当晶粒尺寸大于13.49 nm时,塑性变形以位错滑移为主,变形后期产生大量的孪晶组织.     

纳米多晶铁的冲击相变研究

利用分子动力学方法研究了不同晶粒度的纳米多晶铁在冲击压缩下的结构相变过程,模拟结果表明:纳米多晶铁的冲击结构相变(由体心立方(bcc)结构 α 相到六角密排(hcp)结构 ε 相)发生的临界冲击应力在15 GPa左右.纳米多晶铁在经过弹性压缩变形后,晶界导致的塑性变形开始发生,然后大多数相变从晶界成核并最终发展为大规模相变.不同变形过程在应力和粒子速度剖面上能得到清晰的体现,并通过微观原子结构分析分辨.冲击压缩后的微观结构以晶界原子和以fcc结构原子充当孪晶界的hcp原子为主.晶粒度明显影响晶界变形及相变 关键词： 冲击相变 纳米多晶铁 冲击波 分子动力学     

纳米单晶与多晶铜薄膜力学行为的数值模拟研究

通过对不同温度下单晶薄膜的拉伸性能的分子动力学模拟，从微观角度揭示了温度效应对材料性能的影响. 结果表明温度效应对材料的变形机理影响很大.0K温度下由于缺乏热激活软化的影响, 粒子运动所受到的阻碍较大, 薄膜的强度较高, 塑性变形主要来自于粒子的短程滑移.温度升高，粒子的热运动加剧，屈服强度降低, 塑性变形将主要来自于大范围的位错长程扩展.多晶薄膜的模拟结果表明, 虽然其晶粒形状较为特殊, 但是它仍然遵循反Hall-Petch关系.在模拟过程中，侧向应力最大值比拉伸方向应力的最大值滞后出现.位错只会从晶界产生并向晶粒内部传播，晶粒间界滑移是多晶薄膜塑性变形的主要来源. 关键词： 纳米薄膜 变形机理 温度效应 分子动力学     

晶粒尺寸对纳米多晶铁变形机制影响的模拟研究

利用分子动力学模拟方法研究了拉伸荷载作用下晶粒尺寸对纳米多晶铁变形机制的影响.研究结果表明杨氏模量随着晶粒尺寸的减小而减小.当晶粒尺寸小于15.50 nm时,纳米多晶铁的峰值应力和晶粒尺寸之间遵循反常的Hall-Petch关系,此时晶粒旋转和晶界迁移是其塑性变形的主要变形机制;随着晶粒尺寸的增大,变形孪晶和位错滑移在其塑性变形过程中逐渐占据主导地位.裂纹的形成是导致大晶粒尺寸模型力学性能降低的主要因素.纳米多晶铁在塑性变形中会出现孪晶界的迁移和退孪晶现象.此外还研究了温度对纳米多晶铁变形机制的影响.     

剪切作用下Cu(100)扭转晶界塑性行为研究

本文采用分子动力学方法研究了在剪切载荷作用下,Cu(100)扭转晶界对Cu柱屈服强度的影响.模拟结果发现,在加载过程中,低角度扭转晶界形成的位错网发生位错形核与扩展,位错之间的塞积作用提高了Cu柱的屈服强度;对于高角度扭转晶界,晶界发生滑动降低了Cu柱的屈服强度.同时发现,随着扭转角度的增加,Cu柱的屈服强度先增大,当扭转角度大于临界角度时,Cu柱的屈服应力逐渐减小.这表明剪切载荷作用下,两种不同的机理主导Cu柱的屈服,对于小于临界角度的扭转晶界,Cu柱的屈服由晶界位错形核和扩展机理主导,对于大于临界角度 关键词： 扭转晶界 分子动力学 位错形核 晶界滑移     

晶体相场法研究晶粒缩小过程中的位错湮灭与晶界迁移

通过晶体相场法模拟了与基体三种不同取向圆形晶粒在缩小过程中晶界上的位错湮灭机制与晶界迁移机制.研究结果表明:当圆形晶粒和基体的取向差17°时,圆形晶粒和基体形成位错核心重叠的大角晶界,用位错模型难以解释该演化过程,但结果表明圆形晶粒半径的平方与演化时间成线性关系,该关系与弯曲晶界迁移理论相互印证;当取向差为4°时,圆形晶粒和基体形成由分离位错构成的小角晶界,在该晶粒缩小的过程中,位错以径向攀移为主且会发生晶粒转动以调整位错间距,随着位错间距的减小相互靠近的位错发生反应;当取向差为10°时,晶界既有位错核心重叠较小的部分也有由分离位错构成的部分,在晶粒缩小时晶界演化表现为位错径向攀移和切向运动,两种运动的耦合运动使得能相互反应的位错相互靠近并发生反应.     

具有室温超塑延展性的纳米晶体铜

卢柯等人用电沉积法合成的高纯度、高致密度的纳米晶体铜的体材可以在室温经过冷轧延伸到５０倍以上而不出现应变硬化效应、力学性能测试与微结构研究表明,这种超塑延展性来源于晶界主导的塑性形变机制,而不是晶格位错机制。同时这种室温超塑延展性的纳米晶体铜材料具有广阔的工业应用前景。     

Nanocrystalline gold with small size: inverse Hall–Petch between mixed regime and super-soft regime

ABSTRACT

Molecular dynamics simulations were used to study the atomic mechanisms of deformation of nanocrystalline gold with 2.65–18?nm in grain size to explore the inverse Hall–Petch effect. Based on the mechanical responses, particularly the flow stress and the elastic-to-plastic transition, one can delineate three regimes: mixed (10–18?nm, dislocation activities and grain boundary sliding), inverse Hall-Petch (5–10?nm, grain boundary sliding), and super-soft (below 5?nm). As the grain size decreases, more grain boundaries present in the nanocrystalline solids, which block dislocation activities and facilitate grain boundary sliding. The transition from dislocation activities to grain boundary sliding leads to strengthening-then-softening due to grain size reduction, shown by the flow stress. It was further found that, samples with large grain exhibit pronounced yield, with the stress overshoot decrease as the grain size decreases. Samples with grain sizes smaller than 5?nm exhibit elastic-perfect plastic deformation without any stress overshoot, leading to the super-soft regime. Our simulations show that, during deformation, smaller grains rotate more and grow in size, while larger grains rotate less and shrink in size.     

Study of the effects of grain size on the mechanical properties of nanocrystalline copper using molecular dynamics simulation with initial realistic samples

Abstract

Molecular dynamics simulations have been performed to study the mechanical properties of a columnar nanocrystalline copper with a mean grain size between 9.0 and 24 nm. A melting–cooling method has been used to generate the initial samples: this method produces realistic samples that contain defects inside the grains such as dislocations and vacancies. The results of uniaxial tensile tests applied to these samples reveal the presence of a critical mean grain size between 16 and 20 nm, for which there is an inversion of the conventional Hall–Petch relation. The principal mechanisms of deformation present in the samples correspond to a combination of dislocations and grain boundary sliding. In addition, this analysis shows the presence of sliding planes generated by the motion of perfect edge dislocations that are absorbed by grain boundaries. It is the initial defects present inside the grains that lead to this mechanism of deformation. An analysis of the atomic configurations further shows that nucleation and propagation of cracks are localised on the grain boundaries especially on the triple grains junctions.     

Physical mesomechanics of grain boundary sliding in a deformable polycrystal

The temperature-rate dependences of strain resistance and the mechanisms of grain boundary sliding in Pb polycrystals and Pb-based alloys under active tension were investigated. The activation energy of plastic deformation and grain boundary sliding was determined. The structural mechanisms of grain boundary sliding were studied in a wide temperature range. The conclusion was made that self-consistency of grain boundary sliding and intragranular plastic flow has its origin in rotational deformation modes, with the grain boundary sliding being a primary process. Theoretical analysis of rotational deformation modes involved in grain boundary sliding was performed. It is shown that the dependence of deforming stress on the polycrystal grain size is impossible to describe by one universal Hall-Petch equation.     

Grain Boundary Diffusion and Mechanisms of Creep of Nanostructured Metals

Comparative investigations of diffusion in coarse-grained (d = 20 μm), nanocrystalline (d = 0.04 μm) and nanostructured nickel (d = 0.3 μm) have been carried out in a temperature interval of 0.2–0.3 melting temperature. The reasons for difference of parameters of copper grain-boundary diffusion in the above materials are discussed. The effect exerted by grain boundary state and grain boundary diffusion fluxes of impurity on creep mechanisms of nanostructured nickel and copper in the temperature interval of 373–473 K have been studied. Significant change in the apparent creep activation energy under copper grain boundary diffusion fluxes is described as a consequence of different contribution of grain boundary sliding to overall deformation.     

纳米多晶铜的超塑性变形机理的分子动力学探讨

在聚能装药爆炸压缩形成射流的过程中, 伴随着金属药型罩的晶粒细化, 从原始晶粒30-80 μm细化到亚微米甚至纳米量级, 从微观层面研究其细化机理和动态超塑性变形机理具有很重要的科学意义. 采用分子动力学方法模拟了不同晶粒尺寸下纳米多晶铜的单轴拉伸变形行为, 得到了不同晶粒尺寸下的应力-应变曲线, 同时计算了各应力-应变曲线所对应的平均流变应力. 研究发现平均流变应力最大值出现在晶粒尺寸为14.85 nm时. 通过原子构型显示, 给出了典型的位错运动过程和晶界运动过程, 并分析了在不同晶粒尺寸下纳米多晶铜的塑性变形机理. 研究表明: 当晶粒尺寸大于14.85 nm时, 纳米多晶铜的变形机理以位错运动为主; 当晶粒尺寸小于14.85 nm时, 变形机理以晶界运动为主, 变形机理的改变是纳米多晶铜出现软化现象即反常Hall-Petch关系的根本原因. 通过计算结果分析, 建立了晶粒合并和晶界转动相结合的理想变形机理模型, 为研究射流大变形现象提供微观变形机理参考.     

Computer simulation of displacement cascades in nanocrystalline ni

Large-scale molecular dynamics of cascade production of the primary damage state are performed in fcc nanocrystalline Ni of average grain diameters of 5 and 12 nm. Primary knock-on atom kinetic energies of 5-30 keV are simulated. During the thermal spike phase, significant atomic motion towards the surrounding grain boundary structure is observed, characterized by many replacement-collision sequences. Upon resolidification, the excess volume condenses to form vacancy dominated defects with a complex partial dislocation network forming at higher energies.