Thermal properties and moisture absorption of nanofillers‐filled epoxy composite thin film for electronic application

This current study aimed to enhance the thermal conductivity of thin film composites without compromising other polymer qualities. The effect of adding high thermal conductivity nanoparticles on the thermal properties and moisture absorption of thin film epoxy composites was investigated. Three types of fillers in nanosize with high thermal conductivity properties, boron nitride (BN), synthetic diamond (SD), and silicon nitride (Si₃N₄) were studied. SN was later used as an abbreviation for Si₃N₄. The contents of fillers varied between 0 and 2 vol.%. An epoxy nanocomposite solution filled with high thermal conductivity fillers was spun at 1500–2000 rpm to produce thin film 40–60 µm thick. The effects of the fillers on thermal properties and moisture absorption were studied. The addition of 2 vol.% SD produced the largest improvement with 78% increment in thermal conductivity compared with the unfilled epoxy. SD‐filled epoxy thin film also showed good thermal stability with the lowest coefficients of thermal expansion, 19 and 124 ppm, before and after T_g, respectively, which are much lower compared with SN‐filled and BN‐filled epoxy thin film composites. However the SD‐filled epoxy film has its drawback as it absorbs more moisture compared with BN‐filled and SN‐filled epoxy film. Copyright © 2012 John Wiley & Sons, Ltd.     

Epoxy composites with ceramic core–shell fillers for thermal management in electrical devices

In this work, a novel core–shell material has been manufactured in order to enhance the thermal conductivity of epoxy‐based composites. The polymer derived ceramics technique has been used to produce fillers whose core is composed of a standard material – silica, and whose outer layer consists of a boron nitride or silicon nitride shell. The synthesized filler was characterized by infrared spectroscopy, X‐ray diffraction, and scanning electron microscopy coupled with an energy dispersive spectroscopy analysis. The successful formation of core–shell structure was proven. Composite samples based on an epoxy resin filled with 31 vol% of synthetized core–shell filler have been investigated in order to determine the effective thermal conductivity of the modified system. The resulting core–shell composite samples exhibited improvements in thermal conductivity of almost 30% in relation to standard systems, making them a promising material for heat management applications. Additionally, the temperature dependence of the thermal conductivity was investigated over a broad temperature range indicating that the thermal behavior of the composite with incorporated core–shell filler is stable. This stability is a crucial factor when considering the potential of using this technology in applications such as electronics and power systems. Copyright © 2017 John Wiley & Sons, Ltd.     

Measurement of thermal diffusivity of filler-polymide composites by flash radiometry

Thermal diffusivity D of filler-polyimide composites was investigated using flash radiometry. The fillers used were: diamond, alumina, boron nitride, aluminium nitride, silicon carbide, and silicon carbide whiskers, Composite films were prepared by casting a polyamic acid solution with dispersed filler on a glass plate and then annealing. The effects of filler type, size, content, and shape on D were studied. D increased with increasing average filler particle diameter and filler content. For the composite filled with fine Al₂O₃ whose average particle diameter is about 0.2 μm, aggregates of filler were observed with dimensions up to a few microns. The formation of thermal paths through this aggregate enhances thermal diffusion. For the composites filled with high thermal conductivity filler such as BN and AIN, there was a strong increase in D above a filler content of 20 vol %. D was ten times larger than that of unfilled polyimide when the BN content was 54 vol %. D of the SiC-whisker composite increased strongly up to a filler content of 18 vol %. Above this content D significantly decreased, probably because of interconnected voids formed by mold shrinkage.     

Effect of Different Hybrid Method on Properties of Carbon Nanotubes/Dolomite Hybrid Filled Phenolic Composites

Hybridization of multi wall carbon nanotubes (MWCNTs) with other filler in polymer matrix composites (PMC) is one of the techniques for combining different properties of fillers for making more unique composites. In this work, the hybrid filler (CNTs–dolomite) are prepared via chemical vapour deposition (CVD hybrid) and the milling method (physically hybrid). The effect of different hybrid method on properties of multi wall carbon nanotubes/dolomite hybrid filled phenolic composites were studied. Phenolic/CVD hybrid composites and phenolic/physically hybrid composites with different filler loadings were prepared using hot mounting press. The prepared samples were characterized for their thermal conductivity and hardness. The thermal conductivity was measured using the Transient Plane Source (TPS) method, using a Hot-DiskTM Thermal Constant Analyzer and the hardness was measured using Rockwell micro-hardness. The results showed that at 5% filler loading, the phenolic/CVD hybrid composites were capable of increasing the thermal conductivity and micro-hardness up to 7.22% and 101.6% respectively compared to pure phenolic.     

Thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites

A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC–Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN–Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K .     

Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Epoxy composites containing particulate fillers‐fused silica, glass powder, and mineral silica were investigated to be used as substrate materials in electronic packaging application. The content of fillers were varied between 0 and 40 vol%. The effects of the fillers on the thermal properties—thermal stability, thermal expansion and dynamic mechanical properties of the epoxy composites were studied, and it was found that fused silica, glass powder, and mineral silica increase the thermal stability and dynamic thermal mechanical properties and reduce the coefficient of thermal expansion (CTE). The lowest CTE value was observed at a fused silica content of 40 vol% for the epoxy composites, which was traced to the effect of its nature of low intrinsic CTE value of the fillers. The mechanical properties of the epoxy composites were determined in both flexural and single‐edge notch (SEN‐T) fracture toughness properties. Highest flexural strength, stiffness, and toughness values were observed at fillers content of 40 vol% for all the filled epoxy composites. Scanning electron microscopy (SEM) micrograph showed poor filler–matrix interaction in glass powder filled epoxy composites at 40 vol%. Copyright © 2007 John Wiley & Sons, Ltd.     

Thermal stability of styrene butadiene rubber (SBR) composites filled with kaolinite/silica hybrid filler

Styrene butadiene rubber (SBR) composites filled with fillers, such as modified kaolinite (MK), precipitated silica (PS), and the hybrid fillers containing MK and PS, were prepared by melt blending. The kaolinite sheets were finely dispersed in the SBR matrix around 20–80 nm in thickness and reached the nano-scale. The SBR composites with fillers exhibited excellent thermal stability compared to the pure SBR. The thermal stability of SBR composites was improved with the increasing of MK mass fraction. When MK hybridized with PS, kaolinite sheets were covered by the fine silica particles and the interface between filler particles and rubber matrix became more indistinct. SBR composite filled by hybrid fillers containing 40 phr MK and 10 phr PS became more difficult in decomposition and was better than that of 50 phr PS/SBR and 50 phr MK/SBR in thermal stability. Therefore, the hybridization of the fine silica particles with the kaolinite particles can effectively improve the thermal stability of SBR composites.     

Moisture–absorption,dielectric relaxation,and thermal conductivity studies of polymer composites

In the search for new packaging materials for the electrical/electronics industry, three types of polymer composites have been studied. Silicone/boron nitride powders, polyurethane/alumina powders, and polyurethane/carbon fibers have all been synthesized to study the moisture–absorption kinetics, thermal conductivities, and the dielectric loss spectra under various levels of humidity. The water uptake data indicate that water molecules are absorbed not only by the polymer matrix, but also by the interfaces introduced by the fillers. For all materials, the dielectric relaxation spectroscopy shows the presence of a peak in the 175–200 K range, which is largely due to absorbed water. The silicone/boron nitride samples absorbed the least amount of moisture. Incorporating this result with the thermal conductivity data of the three types of polymer composites, it is concluded that silicone polymers embedded with boron nitride can best serve as the coating for the electronic devices that require heat dissipation and moisture resistance, in addition to electrical insulation. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 2259–2265, 1998     

Study on insulating thermal conductive BN/HDPE composites

Thermal conductivity of boron nitride (BN) reinforced high density polyethylene (HDPE) composites was investigated under a special dispersion state of BN particles in HDPE, i.e., BN particles surrounding HDPE matrix particles. The results indicated that the special dispersion of BN in matrix gives the composites high thermal conductivity at low filler content; moreover, the smaller BN particles can more easily form conductive chains of filler compared to the larger filler particles. Examining the dependence of electrical insulation and mechanical properties of the composites on BN content demonstrated that the reinforced composites containing 30% by volume of filler has good electrical insulation and mechanical properties.     

Thermally conductive cyanate ester nanocomposites filled with graphene nanosheets and multiwalled carbon nanotubes

In this work, dodecylamine‐modified graphene nanosheets (DA‐GNSs) and γ‐aminopropyl‐triethoxysilane‐treated multiwalled carbon nanotubes (f‐MWCNTs) are employed to prepare cyanate ester (CE) thermally conductive composites. By adding 5 wt% DA‐GNSs or f‐MWCNTs to the CE resin, the thermal conductivities of the composites became 3.2 and 2.5 times that of the CE resin, respectively. To further improve the thermal conductivity, a mixture of the two fillers was utilized. A remarkable synergetic effect between the DA‐GNSs and f‐MWCNTs on improving the thermal conductivity of CE resin composites was demonstrated. The composite containing 3 wt% hybrid filler exhibited a 185% increase in thermal conductivity compared with pure CE resin, whereas composites with individual DA‐GNSs and f‐MWCNTs exhibited increases of 158 and 108%, respectively. Moreover, the composite with hybrid filler retained high electrical resistivity. Scanning electron microscopy images of the composite morphologies showed that the modified graphene nanosheets (GNSs) and multiwalled carbon nanotubes (MWCNTs) were uniformly dispersed in the CE matrix, and a number of junction points among MWCNTs and between MWCNTs and GNSs formed in the composites with hybrid fillers. Generally, we can conclude that these composites filled with hybrid fillers may be promising materials of further improving the thermal conductivity of CE composites. Copyright © 2014 John Wiley & Sons, Ltd.     

Design of thermal hybrid composites based on liquid crystal polymer and hexagonal boron nitride fiber network in polylactide matrix

Development of high thermally conductive and electrically insulative composites is of interest for electronic packaging industry. Advancements in smaller and more compact electronic devices required improvements in packing materials, including their weight, thermal conductivity, and electrical resistivity. In addition, with the increasing environmental awareness, the usage of green (bio‐based) alternatives was equally important. In the present study a hybrid based on fibers of highly concentrated hexagonal boron nitride (hBN) in liquid crystal polymer (LCP) matrix were fabricated. These hybrids were formed by arranging hBN platelets into LCP fiber form to reach high filler concentration and then randomly mix it in polylactide (PLA) matrix. With appropriate filler interaction within the hybrid, thermal conductivity similar to that of pure fiber could be achieved. Filler interaction may be tailored by optimizing the fibers aspect ratio. This study demonstrated the effect of random fillers in fibers shape in increasing the overall thermal conductivity of PLA polymeric hybrid using hBN and LCP fibers. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016 , 54, 457–464     

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity,rheology, and lap shear strength

Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.     

Effect of nano/micro‐mixed ceramic fillers on the dielectric and thermal properties of epoxy polymer composites

Nano/micro ceramic‐filled epoxy composite materials have been processed with various percentage additions of SiO₂, Al₂O₃ ceramic fillers as reinforcements selected from the nano and micro origin sources. Different types of filler combinations, viz. only nano, only micro, nano/micro, and micro/micro particles, were designed to investigate their influence on the thermal expansion, thermal conductivity, and dielectric properties of epoxy polymers. Thermal expansion studies were conducted using thermomechanical analysis that revealed a two‐step expansion pattern consecutively before and after vitreous transition temperatures. The presence of micro fillers have shown vitreous transition temperature in the range 70–80°C compared with that of nano structured composites in which the same was observed as ~90°C. Similarly, the bulk thermal conductivity is found to increase with increasing percentage of micron‐size Al₂O₃. It was established that the addition of micro fillers lead to epoxy composite materials that exhibited lower thermal expansion and higher thermal conductivity compared with nano fillers. Moreover, nano fillers have a significantly decisive role in having low bulk dielectric permittivity. In this study, epoxy composites with a thermal expansion coefficient of 2.5 × 10^?5/K, thermal conductivity of 1.18 W/m · K and dielectric permittivity in the range 4–5 at 1 kHz have been obtained. The study confirms that although the micro fillers seem to exhibit good thermal conductivity and low expansion coefficient, the nano‐size ceramic fillers are candidate as cofillers for low dielectric permittivity. However, a suitable proportion of nano/micro‐mixed fillers is necessary for achieving epoxy composites with promising thermal conductivity, controlled coefficient of thermal expansion and dielectric permittivity. Copyright © 2013 John Wiley & Sons, Ltd.     

Effect of conductive particles on the mechanical,electrical, and thermal properties of maleated polyethylene

Inclusion of conductive particles is a convenient way for the enhancement of electrical and thermal conductivities of polymers. However, improvement of the mechanical properties of such composites has remained a challenge. In this work, maleated polyethylene is proposed as a novel matrix for the production of conductive metal–thermoplastic composites with enhanced mechanical properties. The effects of two conductive particles (iron and aluminum) on the morphological, mechanical, electrical, and thermal properties of maleated polyethylene were investigated. Morphological observations revealed that the matrix had excellent adhesion with both metal particles. Increase in particle concentration was shown to improve the tensile strength and modulus of the matrix significantly with iron being slightly more effective. Through‐plane electrical conductivity of maleated polyethylene was also substantially improved after adding iron particles, while percolation was observed at particle contents of around 20–30% vol. In the case of aluminum, no percolation was observed for particle contents of up to 50% vol., which was linked to the orientation of the particles in the in‐plane direction due to the squeezing flow. Inclusion of particles led to substantial increase (over 700%) in the thermal conductivities of both composites. The addition of high concentrations of metal particles to matrix led to the creation of two groups of materials: (i) composites with high electrical and thermal conductivities and (ii) composites with low electrical and high thermal conductivities. Such characteristics of the composites are expected to provide a unique opportunity for applications where a thermally conductive/electrically insulating material is desired. Copyright © 2015 John Wiley & Sons, Ltd.     

Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine

A thermal conductivity of 32.5 W/mK is achieved for a boron nitride-filled polybenzoxazine at its maximum filler loading of 78.5% by volume (88% by weight). The extraordinarily high conductivity value results from outstanding properties of the polybenzoxazine matrix and the boron nitride filler. The bisphenol-A–methylamine-based polybenzoxazine possesses very low A-stage viscosity which aids in filler wetting and mixing. The filler particles with an average size of ca. 225 μm are large aggregates of boron nitride flake-like crystals. It has bimodal particle size distribution which assists in increasing the particle packing density. This filler–matrix system provides a highly thermally conductive composite due to the capability of forming conductive networks with low thermal resistance along the conductive paths. The SEM picture of the composite fracture surface reveals good interfacial adhesion between the boron nitride filler and polybenzoxazine matrix. Water absorption of the filled systems at 24 h is <0.1% and decreases with increasing filler content.     

The influence of fillers on thermophysical properties of adhesives

The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity.     

An overview of boron nitride based polymer nanocomposites

Recently, boron nitride (BN) based materials have received significant attention in both academic and industrial sectors due to its interesting properties like large energy band gap, good resistance to oxidation, excellent thermal conductivity, thermal stability, chemical inertness, significant mechanical property and widespread applications. This review article deals with the preparation and properties of boron nitride and its nanocomposites with various polymers. Diverse polymers have been explored for the preparation of boron nitride filled polymer nanocomposites by adopting different mixing methods. Properties of the resulting polymer nanocomposites mainly depend up on filler size and dispersion, mixing conditions and type of interaction between polymer matrix and the filler. Herein, the structure, preparation and properties of various boron nitride based polymer nanocomposites are reviewed in detail along with a brief overview of different classes of BN nanomaterials.     

导热增强聚乙二醇相变复合材料的制备及其性能

本文以聚乙二醇(PEG)为相变材料,通过添加不同的无机填料,采用熔融共混浇筑方式制备了导热增强型相变复合材料。 通过扫描电子显微镜(SEM)、热常数分析仪、差示扫描量热仪(DSC)、红外热成像和热重分析仪研究了所制备复合材料的微观结构、导热性能与相变过程。 研究结果表明,相比于碳酸钙和氧化铝,在相同添加含量下,氮化硼(BN)可有效提高PEG的导热系数,当BN质量分数为40%时,导热系数可达到3.40 W/(m·K);当填料添加量相同时,片状BN和不规则纳米碳酸钙(CaCO₃)比球形氧化铝(Al₂O₃)对PEG具有更加优良的定型效果,在相变过程中,能够更加有效阻隔PEG的流动,保持复合材料的形状稳定性。     

Silane surface modification of boron nitride for high thermal conductivity with polyphenylene sulfide via melt mixing method

Polyphenylene sulfide (PPS) is a promising engineering polymer, which is used for various industrial applications. In this study, we developed a highly thermally conductive PPS composite containing boron nitride (BN) as a thermally conductive ceramic filler. (3‐Aminopropyl) triethoxysilane was doped onto the surface of hydroxyl‐functionalized BN using a simple sol–gel process. The modified BN particles were embedded in a PPS matrix via a melt mixing process using a twin extruder to form BN‐Si composites. The maximum thermal conductivity 3.09 W/m·K was exhibited by the surface‐modified BN‐Si containing 60 wt%. This value was 116% higher than the thermal conductivities of the pristine BN and PPS matrix, respectively. The surface‐treated composites also showed an improved storage modulus because of an improvement in the interfacial adhesion and interaction between the BN filler and the PPS matrix. Copyright © 2017 John Wiley & Sons, Ltd.     

Thermal characterization of the effect of fillers and ionic liquids on the vulcanization and properties of acrylonitrile–butadiene elastomer

Different thermal analysis techniques were used to study the effect of fillers and ionic liquids (ILs) on the vulcanization process, thermal and dynamic mechanical properties of acrylonitrile–butadiene elastomer (NBR). The products of the studies were composites of NBR filled with hydrotalcite, nanosized silica or carbon black. ILs such as 1-butyl-1-methylpyrrolidinium (BMpyrrolBF₄), 1-butyl-4-methylpyridinium (BMpyrBF₄) or 1-butyl-1-methylpiperidinium (BMpipBF₄) tetrafluoroborates were applied to improve the dispersion degree of the curatives and filler particles in the elastomer and to increase the efficiency of vulcanization. The differential scanning calorimetry results indicated that ILs reduced the vulcanization temperature of NBR compounds and increased the homogeneity of cross-link distribution in the elastomer network. NBRs filled with carbon black or silica exhibited similar thermal stabilities, whereas hydrotalcite reduced the temperature of thermal decomposition. The lowest mechanical loss factors were determined for vulcanizates filled with nanosized silica.