共查询到19条相似文献,搜索用时 62 毫秒
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Sn-Sb-Cu(Bi)系无铅钎料的研究 总被引:1,自引:0,他引:1
本文研究了Sn-Sb-Cu(Bi)系无铅钎料的润湿性、显微组织以及熔化特性,对Sb、Cu、Bi等元素在Sn基钎料中的作用进行了阐述,发现了几种有应用潜力的合金,有望取代现有广泛使用的SnAg(Cu)系钎料. 相似文献
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添加微量稀土元素的SnAgCu无铅钎料的研究 总被引:7,自引:0,他引:7
介绍目前国际上较为公认的SnAgCu系无铅钎料的特点,并汇总了国际上相关专利的情况.同时,结合本实验室的专利技术,介绍了添加微量稀土对SnAgCu系无铅钎料性能的影响,并着重研究了稀土对显微组织,特别是金属间化合物的影响规律.研究结果表明:从综合性能角度考虑,添加稀土的作用明显,特别是显著改善了钎料的抗蠕变性能,稀土添加量的最佳范围在w(0.05~0.25)%之间.适量的稀土添加,可有效抑制金属间化合物的生长,细化组织. 相似文献
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研制开发熔点在260 ℃以上的高温无铅钎料来代替传统的高铅钎料运用于电子封装一直是钎焊领域的一大难题。熔点约为272 ℃的Bi-2.6 Ag-5 Sb钎料合金因润湿性和焊接可靠性不良在运用上受到限制。文中通过在Bi-2.6 Ag-5 Sb钎料合金中添加微量元素Cu来改善B-i2.6 Ag-5 Sb合金的润湿性及焊接可靠性。研究结果表明,Cu含量对BiAgSbCu系钎料合金熔点影响较小,当Cu含量为2 %时,润湿性及焊接可靠性最佳。 相似文献
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Sn-Ag基无铅钎料Nd:YAG激光重熔界面研究 总被引:2,自引:0,他引:2
通过Nd∶YAG激光重熔和热风二次重熔试验,得到了Sn3.5Ag和Sn3.0Ag0.5Cu无铅钎料球在Cu焊盘的钎料凸台.利用扫描电子显微镜分别分析了激光重熔和热风二次重熔后两种无铅钎料与铜焊盘界面反应及组织形貌,并对激光一次重熔无铅钎料凸台进行了剪切试验,观察了凸台的剪切断口.结果表明,在合适的激光功率和加热时间条件下能够获得成形良好的无铅钎料凸台,Sn3.5Ag和Sn3.0Ag0.5Cu两种无铅钎料与Cu焊盘所产生的界面化合物主要为Cu3Sn和Cu6Sn5,凸台界面反应组织形貌以及剪切承载力与激光功率和加热时间密切相关,而且激光重熔形成的界面化合物影响热风二次重熔界面的组织形貌. 相似文献
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《电子元件与材料》2017,(3):59-62
向Zn20Sn高温无铅钎料中添加微量铈镧混合稀土(RE),研究了RE的添加量对该钎料合金显微组织及性能的影响。结果表明,添加微量RE的合金显微组织中出现含RE的金属间化合物(IMC)。随着RE的添加,形状各异的IMC的数量显著增加。RE质量分数为0.5%~1.0%的合金的固相线温度不变,而液相线温度略有降低。当RE质量分数为0.5%时,钎料在Cu基板上的铺展面积最大,比Zn20Sn钎料提高了57.6%。但随着RE的继续添加,钎料的润湿性降低。当RE质量分数超过0.1%时,钎料的显微硬度和电阻率随着RE含量的增加而增大。综合考虑,合适的RE添加量为质量分数0.5%。 相似文献
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Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions 总被引:3,自引:0,他引:3
F. Tai F. Guo Z. D. Xia Y. P. Lei Y. F. Yan J. P. Liu Y. W. Shi 《Journal of Electronic Materials》2005,34(11):1357-1362
In this research, nanosized Ag reinforcement particles were incorporated by mechanical means into a promising lead-free solder,
Sn-0.7Cu, in an effort to improve the comprehensive property of the Sn-0.7Cu solder. Wettability, mechanical performance,
and creep-rupture life tests were conducted to study the difference between Sn-0.7Cu solder and its composite solder with
different Ag reinforcement volume fractions. Experimental results indicated that the composite solders and their joints showed
better wettability and mechanical properties, as well as longer creep-rupture lives, than Sn-0.7Cu solder. The composite solder
with 1vol.%Ag reinforcement addition exhibited the best comprehensive property as compared to the composite solders with other
reinforcement volume fractions. Systematic creep-rupture life tests were conducted on the 1vol.%Ag-reinforced Sn-0.7Cu-based
composite solder joints. Significant enhancement of the creep-rupture lives were found in the composite solder joints under
different stress and temperature combinations as compared to the Sn-0.7Cu solder joint. Ductile rupture surfaces were exhibited
in most of the broken solder joints. 相似文献
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Solder joints used in electronic applications undergo reflow operations. Such operations can affect the solderability, interface
intermetallic layer formation and the resultant solder joint microstructure. These in turn can affect the overall mechanical
behavior of such joints. In this study the effects of reflow on solderability and mechanical properties were studied. Nanoindentation
testing (NIT) was used to obtain mechanical properties from the non-reflow (as-melted) and multiple reflowed solder materials.
These studies were carried out with eutectic Sn-3.5Ag solders, with or without mechanically added Cu or Ag reinforcements,
using Cu substrates. Microstructural analysis was carried out on solder joints made with the same solders using copper substrate. 相似文献
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稀土改性的Sn-58Bi低温无铅钎料 总被引:1,自引:0,他引:1
研究了微量稀土对Sn-58Bi低温钎料的改性作用.试验添加质量分数为0.1 ?组混合稀土的无铅材料,并对比Sn-58Bi和Sn-58Bi0.5Ag合金.观察了钎料显微组织的变化并做了定量分析,采用DSC测试了钎料的熔化温度,同时测量了钎料的润湿性能、接头强度与硬度.结果表明,微量稀土添加细化了Sn-58Bi钎料合金的显微组织,对钎料的熔化温度几乎没有影响,能显著改善Sn-58Bi钎料的润湿性能和接头剪切强度,而且改善的程度优于添加微量Ag对Sn-58Bi钎料的作用. 相似文献
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Microstructure and mechanical properties were investigated for ten systems of lead-free solders compared with the eutectic
Sn-Pb solder. Mechanical properties including elastic, plastic, and creep deformations were predicted by indentation testing.
This method was established based on the elastic-plastic-creep finite-element method (FEM). The predicted mechanical properties
were obtained for the temperatures ranging between −20°C and 160°C. 相似文献
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This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn,
Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture
resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than
Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with
the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective
mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved
through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved. 相似文献
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概要地评述了无铅焊料中低银含量的锡-银-铜(SnAgCu)体系的发展方向。由于高银含量的锡-银-铜(SnAgCu)体系存在着成本高和耐跌落(摔)性差的问题,它将被低银含量的锡-银-铜(SnAgCu)体系所取代。在低银含量的锡-银-铜(SnAgCu)体系中加入某些微量添加剂可以达到锡-铅焊料的性能水平。 相似文献