Marx调制器单元设计和叠加测试

 基于单元器件的成功研制,介绍了Marx调制器单元充放电回路、电压和电流的实时监测以及控制系统和连锁保护等功能的设计和实现。对IGBT固态开关的静态、动态均压进行分析和模拟,采用RCD缓冲电路实现IGBT的动态均压;对控制系统改进和优化,设计了专用电源转换模块;分压电路和电流霍尔采样回路分别实现调制器单元电压和电流的检测;连锁保护功能由控制系统和继电器控制完成。所有部件按照电气标准设计在调制器单元支架上。经过测试的4个单元进行了叠加试验,4个单元总输出24 kV,各器件在高压试验中工作正常。     

回旋行波管的全固态Marx高压脉冲调制器设计

为回旋行波管设计了全固态近方波Marx高压脉冲调制器,设计参数:输出电压70kV,输出电流15A,工作频率0~2kHz可调,脉宽200μs可调,功率容量可以达到百kW级。设计利用串联IGBT作为控制开关,利用FPGA通过光纤传输的方式对IGBT进行逻辑控制、电路保护和监测,补偿单元利用FPGA控制IGBT自动补偿的方式对顶部压降进行补偿,使得输出电压平顶度达到±1%。对电路各个部分进行仿真及测试。结果验证此设计方案的可行性,可以提高回旋管电源的稳定性和工作频率,减小调制器体积及维护成本,并为高压测试提供了实验基础。     

绝缘栅双极晶体管串联关键技术

为实现绝缘栅双极晶体管（IGBT）的多级串联,以电阻/电容/二极管（RCD）缓冲电路为动态均压电路,通过数学分析及PSpice仿真验证,建立了RCD缓冲电路参数选择模型;设计了基于数字信号处理器（DSP）控制、光纤隔离传输,以M57962L为IGBT驱动器的驱动电路及故障反馈电路,能驱动32只串联IGBT并对其进行过流和短路保护,32只IGBT的最大导通时间不超过90 ns,短路保护响应时间约为6 s;设计了8路独立输出的50 kV隔离的高压隔离电源,实现IGBT串联电路各部分的供电及电隔离。基于以上IGBT串联方法,实现了32只1200 V IGBT的串联,串联电路可稳定工作在20 kV电压下。     

大功率固态调制器的仿真研究

 设计了大功率固态调制器的新型固态脉冲开关模块。通过分析电力电子仿真软件Saber中绝缘栅双极晶体管(IGBT)物理模型的概念和等效电路,结合实验数据建立了IXDH20N120型IGBT的模型,研究了Saber环境下,不同参数条件和拓扑结构对调制器电路输出特性的影响。仿真结果表明：动态均压网络在有效地保护开关的同时,可以减少IGBT的开关损耗;电路中器件离散性与系统分布参数会造成调制器输出波形质量下降,效率降低。并对调制器在负载打火情况下,因严重不均流而损坏器件故障的机理作了分析,实验证明仿真结果和分析与实际相符。     

基于窄脉冲传输的脉冲展宽IGBT驱动电路

设计了一种采用高压隔离脉冲变压器传输窄脉冲,然后应用脉冲展宽电路实现宽脉冲驱动信号输出的无源IGBT驱动电路。采用正电压turn-on窄脉冲和负电压turn-off窄脉冲组合传输的方式以减小高压隔离脉冲变压器的体积和重量,脉冲展宽电路使IGBT在turn-on脉冲上升沿导通,在turn-off脉冲上升沿关断,且其具备储能功能,无需高压隔离辅助直流电源为其供电。脉冲信号发生电路和过流保护电路耦合设计,使IGBT在正常关断和过流保护关断情况下,其栅极都处于反压偏置状态,以提高IGBT关断的快速性和可靠性。将驱动电路用于级联Marx高压电路中IGBT开关的驱动,turn-on脉冲和turn-off脉冲的脉宽均选择为2 μs,结果表明,Marx电路在输出脉冲电压峰值为20 kV时工作稳定,且脉宽在3.5~50 μs之间连续可调,等离子体负载下的输出电压和电流波形显示,打火情况发生时,过流保护电路工作稳定可靠。该驱动电路可有效实现宽脉冲驱动信号的产生,具有较强的可靠性和实用性。     

450kV高功率速调管调制器系统

研制了一套用于新型速调管测试的450 kV高功率调制器系统。根据系统指标分别设计了脉冲变压器、脉冲形成网络以及充电电路等主要部件。同时,针对高功率脉冲开关的要求,对闸流管相关性能进行了比较研究,并对其触发、保护电路作了优化设计。并利用可编程控制器与触摸屏组合方式实现了调制器和速调管的控制与连锁保护。利用电力电子仿真软件Saber对调制器主电路进行了建模与仿真,脉冲电压波形仿真结果与在水负载上进行的满功率试验结果一致:脉冲宽度2.5μs,脉冲前沿1.1μs,脉冲后沿1.7μs。调制器输出脉冲电压450 kV,脉冲电流600 A,满足速调管测试需要。     

Marx固态调制器单元研制

Marx固态脉冲调制器是根据Marx发生器的原理并以绝缘栅双极晶体管(IGBT)固态开关作为开关元件而设计的脉冲调制器。其低成本、高可靠性、小体积等优点可以很好地满足国际直线对撞机(ILC)对脉冲调制器提出的要求。介绍了Marx调制器单元样机主要部件包括IGBT串联高压开关组件、储能电容器、串联高压充电电源以及控制系统样机的研制。Marx调制器单元完成了12 kV高压试验,各部件达到设计指标,为单元的模块化生产和多单元的叠加试验提供可靠的数据和保障。     

MOSFET调制器的实验研究

 介绍了MOSFET调制器的基本原理,并对其并联分流和感应叠加两种开关结构进行了实验研究。基于可编辑逻辑器件设计了其触发电路,驱动电路采用高速MOSFET对管组成的推挽输出形式,加快了MOSFET的开关速度。利用Pspice软件对开关上有无剩余电流电路(RCD)两种情况进行仿真,结果表明,加装RCD电路可以有效吸收MOSFET在关断瞬间产生的反峰电压。实验中,电流波形用Pearson线圈测量,用3个MOSFET并联作开关,当电容充电电压为450 V,负载为30 Ω时,脉冲电流13 A,前沿20 ns,平顶约80 ns;用3个单元调制器感应叠加,当电容充电电压为450 A,负载为30 Ω时,脉冲电流强度为40 A,前沿25 ns,平顶约70 ns。     

高频高变比脉冲变压器耦合固态刚管调制器

调制器输出脉冲宽度存在两种模式,输出脉冲宽度为10μs时,工作频率0~8kHz可调,输出脉冲宽度为200μs时,工作频率0~400Hz可调。为了实现了调制器的小型化,初级电压设计为700V,初级储能电容可采用高储能密度的电解电容,且可降低绝缘栅双极晶体管(IGBT)串联的风险,次级输出电压为70kV,采用变比为100的脉冲变压器。概述其各个组成部分及其工作原理,重点对IGBT固态开关的驱动、保护电路、损耗和吸收回路进行了分析讨论,并对高变比的变压器进行了理论分析。对调制器进行了实验测试,脉冲前沿2.2μs,脉冲后沿1.65μs,过冲小于7%,脉冲顶降小于1%。     

超导磁体低温液位监测单元的设计与实现

介绍了一种应用于超导磁体的低温液位监测单元的设计与实现.设计了压控电流源电路和电压-频率转换电路用于液氦的液位测量,并设计了电容-频率转换电路用于液氮的液位测量;设计了以STM32微控制器为核心的数字电路,用于压控电流源的控制、频率信号的处理和液位监测数据的数字化显示;同时通过CAN总线把液位的监测数据自动发送至上位机,完成液位监测单元的远程控制.测试结果证明了该设计的可行性.     

Comparison of 1 MeV electron,Co-60 gamma and 1 MeV proton irradiation effects on silicon NPN transistors

The total dose effects of 1?MeV electrons on the dc electrical characteristics of silicon NPN transistors are investigated in the dose range from 100?krad to 100?Mrad. The different electrical characteristics such as Gummel characteristics, excess base current (ΔI_B), dc current gain (h_FE), transconductance (g_m), displacement damage factor (K) and output characteristics were studied in situ as a function of total dose. A considerable increase in base current (I_B) and a decrease in h_FE, g_m and I_CSat was observed after 1?MeV electron irradiation. The collector–base (C–B) junction capacitance of transistors was measured to estimate the change in the effective carrier concentration. After 1?MeV electron irradiation, a considerable degradation in capacitance was observed. The plot of (1/C²) versus voltage shows that the effective carrier concentration and built-in voltage (V_bi) increase marginally upon 1?MeV electron irradiation. The results of 1?MeV electron irradiation were compared with 1?MeV proton and Co-60 gamma irradiation results in the same dose range. The degradation for 1?MeV electron and Co-60 gamma-irradiated transistors was significantly less when compared to 1?MeV proton-irradiated transistor. The 1?MeV proton, 1?MeV electron and Co-60 gamma-irradiated transistors were subjected to isochronal annealing to analyze the recovery of the electrical parameters.     

Neutron irradiation effects on AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors (HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 10¹⁵ cm^-2. The dc characteristics of the devices, such as the drain saturation current and the maximum transconductance, decreased after neutron irradiation. The gate leakage currents increased obviously after neutron irradiation. However, the rf characteristics, such as the cut-off frequency and the maximum frequency, were hardly affected by neutron irradiation. The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism. It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas (2DEG) decreased after neutron irradiation. There was no evidence of the full-width at half-maximum of X-ray diffraction (XRD) rocking curve changing after irradiation, so the dislocation was not influenced by neutron irradiation. It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices.     

Studies on photoinduced effects in pulse-electrodeposited Ag/Hg-1212/CdSe hetero-nanostructures

Metal/superconductor/semiconductor (Ag/Hg-1212/CdSe) hetero-nanostructures have been fabricated using pulse-electrodeposition technique and are characterized by X-ray diffraction (XRD), full-width at half-maximum (FWHM) and scanning electron microscopy (SEM) studies. The junction capacitance of Ag/Hg-1212, Hg-1212/CdSe and Ag/Hg-1212/CdSe heterojunctions is measured in dark and under laser irradiation at room temperature. The nature of the junction formed and built-in-junction potentials were determined. The increase in carrier concentration across the junction due to photo-irradiation has been observed.     

Neutron irradiation effects on A1GaN//GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors(HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 10 15 cm 2.The dc characteristics of the devices,such as the drain saturation current and the maximum transconductance,decreased after neutron irradiation.The gate leakage currents increased obviously after neutron irradiation.However,the rf characteristics,such as the cut-off frequency and the maximum frequency,were hardly affected by neutron irradiation.The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism.It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas(2DEG) decreased after neutron irradiation.There was no evidence of the full-width at half-maximum of X-ray diffraction(XRD) rocking curve changing after irradiation,so the dislocation was not influenced by neutron irradiation.It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices.     

不同顺序中子/γ辐照对双极器件电流增益的影响

利用CFBR-Ⅱ快中子反应堆(中国第二座快中子脉冲堆)和60Co装置开展不同顺序的中子/γ辐照双极晶体管的实验。在集电极-发射极电压恒定条件下,测量了双极晶体管电流增益随集电极电流的变化曲线,研究不同顺序中子/γ辐照对双极晶体管电流增益的影响。分析实验结果发现,集电极-发射极电压一定时,集电极电流极低情况下电流增益退化比较大,随集电极电流增加电流增益逐渐减小;就实验选中的两类晶体管而言,先中子后γ辐照造成双极晶体管电流增益的退化程度大于先γ后中子辐照,而且PNP型晶体管比NPN型晶体管差异更明显。本文进行了双极晶体管电离/位移协同辐照效应相关机理的初步探讨。     

Effect of laser irradiation of C-V characteristics of electrodeposited Ag/Tl-2223/CdSe hetero-nanostructures

One of the innovative technological directions for the high-temperature superconductors has been persued by fabricating the heteroepitaxial multilayer structures such as superconductor-semiconductor heterostructures. In the present investigation, metal/superconductor/semiconductor (Ag/Tl-2223/CdSe) hetero-nanostructures have successfully been fabricated using dc electrodeposition technique and were characterized by X-ray diffraction (XRD), full-width at half-maximum (FWHM) and scanning electron microscopy (SEM) studies. The measurement of junction capacitance as a function of biasing voltage was used for the estimation of junction built-in-potential (V _D) and to study the charge distribution in a heterojunction. The Mott-Schottky plots were measured for each junction in dark and under the photo-irradiation. The effect of laser irradiation on C-V characteristics of hetero-nanostructure has been studied.     

Effects of orientation of substrate on the enhanced low-dose-rate sensitivity (ELDRS) in NPN transistors

The radiation effects and annealing characteristics of two types of domestic NPN bipolar junction transistors, fabricated with different orientations, were investigated under different dose-rate irradiation. The experimental results show that both types of the NPN transistors exhibit remarkable Enhanced Low-Dose-Rate Sensitivity (ELDRS). After irradiation at high or low dose rate, the excess base current of NPN transistors obviously increased, and the current gain would degrade rapidly. Moreover, the decrease of collector current was also observed. The NPN transistor with (111) orientation was more sensitive to ionizing radiation than that with (100) orientation. The underlying mechanisms of various experimental phenomena are discussed in detail in this paper.     

纳米隧道结的量子电容现象

利用STM针尖和二维Au纳米团簇构造的双隧道结，通过对单电子隧穿谱的测量，研究了纳米隧道结的电容随隧道结宽度的变化，发现电容随结宽度的变化偏离了经典电容的行为，为纳米隧道结的量子电容效应提供了实验证据。     

SiGe HBT势垒电容模型

在考虑SiGe HBT的势垒电容时，通常的耗尽层近似不再适用，应考虑可动载流子的影响.在分析研究SiGe HBT载流子输运的基础上，建立了考虑发射结势垒区内载流子分布的发射结势垒电容模型和不同电流密度下包括基区扩展效应的集电结势垒电容模型.将以上势垒电容 模型应用于SiGe HBT频率特性模拟，模拟结果与实验结果符合得很好. 关键词： SiGe HBT 势垒电容 微分电容     

电子辐照能量对Kapton/Al热控涂层光学性能的影响

 研究了电子辐照时，电子能量与累积通量对Kapton/Al热控涂层光学性能的影响。采用原位测量的手段记录了辐照前后的光谱反射系数。试验结果表明，电子辐照后Kapton/Al热控涂层的反射性能,在太阳光谱辐射强度较大的300~1 200nm波长区间产生较大程度退化。在电子辐照作用下，作为离子导电型聚合物的 Kapton薄膜表面没有发现辐照充电效应。辐照后涂层材料存在“退火效应”，或称“漂白效应”。Kapton/Al涂层太阳吸收比的变化量与电子辐照累积通量的变化关系成幂函数形式,其系数与指数的极大值与极小值分别出现在电子能量为50keV附近。在辐照累积通量相同时，该变化量随辐照电子能量的提高而增大。