Resistive switching characteristic and uniformity of low-power HfO_x-based resistive random access memory with the BN insertion layer

In this letter,the Ta/HfO_x/BN/TiN resistive switching devices are fabricated and they exhibit low power consumption and high uniformity each.The reset current is reduced for the HfO_x/BN bilayer device compared with that for the Ta/HfO_x/TiN structure.Furthermore,the reset current decreases with increasing BN thickness.The HfO_x layer is a dominating switching layer,while the low-permittivity and high-resistivity BN layer acts as a barrier of electrons injection into TiN electrode.The current conduction mechanism of low resistance state in the HfO_x/BN bilayer device is space-chargelimited current(SCLC),while it is Ohmic conduction in the HfO_x device.     

Bipolar resistive switching in Cr-doped TiOx thin films

The electric-pulse-induced resistive switching effect is studied for Ti_0.85Cr_0.15O_x (TCO) films grown on Ir—Si substrates by pulsed laser deposition. Such a TCO device exhibits bipolar switching behaviour with an electric-pulse-induced resistance ratio as large as about 1000% and threshold voltages smaller than 2 V. The resistive switching characteristics may be understood by resistance changes of a Schottky junction composed of a metal and an n-type semiconductor, and its nonvolatility is attributed to the movement of oxygen vacancies near the interface.     

Hafnia-based resistive switching devices for non-volatile memory applications and effects of gamma irradiation on device performance

Non-volatile memory (NVM) devices were fabricated as a Metal– Insulator–Metal (MIM) structures by sandwiching Hafnium dioxide (HfO₂) thin film in between two metal electrodes. The top and bottom metal electrodes were deposited by using the thermal evaporation, and the oxide layer was deposited by using the RF magnetron sputtering technique. The Resistive Random Access Memory (RRAM) device structures such as Ag/HfO₂/Au/Si were fabricated and I-V characteristics for the pristine and gamma-irradiated devices with a dose 24?kGy were measured. Further we have studied the thermal annealing effects, in the range of 100°–400°C in a tubular furnace for the HfO₂/Au/Si samples. The X-ray diffraction (XRD), Rutherford Backscattering Spectrometry (RBS), field emission-scanning electron microscopy (FESEM) analysis measurements were performed to determine the thickness, crystallinity and stoichiometry of these films. The electrical characteristics such as resistive switching, endurance, retention time and switching speed were measured by a semiconductor device analyser. The effects of gamma irradiation on the switching properties of these RRAM devices have been studied.     

Analysis and modeling of resistive switching mechanisms oriented to resistive random-access memory

With the progress of the semiconductor industry,the resistive random-access memory(RAM) has drawn increasing attention.The discovery of the memristor has brought much attention to this study.Research has focused on the resistive switching characteristics of different materials and the analysis of resistive switching mechanisms.We discuss the resistive switching mechanisms of different materials in this paper and analyze the differences of those mechanisms from the view point of circuitry to establish their respective circuit models.Finally,simulations are presented.We give the prospect of using different materials in resistive RAM on account of their resistive switching mechanisms,which are applied to explain their resistive switchings.     

Atomic crystals resistive switching memory

Facing the growing data storage and computing demands, a high accessing speed memory with low power and non volatile character is urgently needed. Resistive access random memory with 4F~2 cell size, switching in sub-nanosecond cycling endurances of over 10~(12) cycles, and information retention exceeding 10 years, is considered as promising nex generation non-volatile memory. However, the energy per bit is still too high to compete against static random acces memory and dynamic random access memory. The sneak leakage path and metal film sheet resistance issues hinder th further scaling down. The variation of resistance between different devices and even various cycles in the same device hold resistive access random memory back from commercialization. The emerging of atomic crystals, possessing fin interface without dangling bonds in low dimension, can provide atomic level solutions for the obsessional issues. Moreove the unique properties of atomic crystals also enable new type resistive switching memories, which provide a brand-new direction for the resistive access random memory.     

Resistive switching behaviour of a tantalum oxide nanolayer fabricated by plasma oxidation

We investigate the resistive switching behaviour of a tantalum oxide nanolayer‐based nonvolatile memory with Pt/TaO_5–x/TaN structure, which was prepared at room temperature through a processing compatible with CMOS technology. The tantalum oxide nanolayer with thickness of about 5 nm was fabricated by plasma oxidation of TaN films. The switching mechanism can be explained by the modulation of the local oxygen‐deficient conduction channel resulting from oxygen ions drift. This Letter represents a cost‐efficient method for developing nanoscale restive switching nonvolatile memories. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Resistive switching behaviour of highly epitaxial CeO2 thin film for memory application

We report on the remarkable potential of highly epitaxial and pure (001)‐oriented CeO₂ thin films grown on conducting Nb‐doped SrTiO₃ (NSTO) substrates by laser molecular beam epitaxy for nonvolatile memory application. Resistive switching (RS) devices with the structure of Au/epi‐CeO₂/NSTO exhibit reversible and steady bipolar RS behaviour with large high/low resistance ratio and a narrow dispersion of the resistance values. Detailed analysis of the conduction mechanisms reveals that the trapping/detrapping processes and oxygen vacancies migration play important roles in the switching behaviour. In the light of XPS measurement results, the CeO₂/NSTO interface with oxygen vacancies or defects is responsible for the RS effect. Furthermore, a model is proposed to explain this resistance switching behaviour. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Analysis of the resistive switching behaviors of vanadium oxide thin film

We demonstrate the polarization of resistive switching for a Cu/VOx/Cu memory cell.The switching behaviors of Cu/VOx/Cu cell are tested by using a semiconductor device analyzer(Agilent B1500A),and the relative micro-analysis of I-V characteristics of VOx/Cu is characterized by using a conductive atomic force microscope(CAFM).The I-V test results indicate that both the forming and the reversible resistive switching between low resistance state(LRS) and high resistance state(HRS) can be observed under either positive or negative sweep.The CAFM images for LRS and HRS directly exhibit evidence for the formation and rupture of filaments based on positive or negative voltage.The Cu/VOx/Cu sandwiched structure exhibits reversible resistive switching behavior and shows potential applications in the next generation of nonvolatile memory.     

新型阻变存储器的物理研究与产业化前景

阻变存储器具有结构简单、速度快、存储密度高、易于三维集成等诸多优点,是下一代存储器的重要候选之一。文章详细介绍了阻变存储器的工作原理、电阻转变的物理机制、电阻转变过程中的物理效应以及阻变存储器的集成和产业化前景。     

阻变式存储器存储机理

阻变式存储器（resistive random access memory, RRAM）是以材料的电阻在外加电场作用下可在高阻态和低阻态之间实现可逆转换为基础的一类前瞻性下一代非挥发存储器.它具有在32nm节点及以下取代现有主流Flash存储器的潜力,成为目前新型存储器的一个重要研究方向.但阻变式存储器的电阴转变机理不明确,制约它的进一步研发与应用.文章对阻变式存储器的体材料中几种基本电荷输运机制进行了归纳,总结了目前对阻变式存储器存储机理的理论模型.     

Electrical properties and carrier transport mechanisms of nonvolatile memory devices based on randomly oriented ZnO nanowire networks

We report reproducible bipolar resistive memory devices based on Au/ZnO nanowire networks (ZnO NWNs)/ITO, which show a high R_on/R_off ratio (～10⁴) and narrow dispersion of set and reset threshold voltages. The dominant conduction mechanisms of low resistance state and high resistance state were verified by Ohmic behavior and space charge limited current, respectively. The switching mechanism is confirmed in terms of the formation and rupture of conductive filaments, with oxygen vacancies localized on the ZnO NWNs surface involved in. The Au/ZnO NWNs/ITO devices presented in our work show potential applications in the next generation nonvolatile memory field. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

基于Cu/SiO_x/Al结构的阻变存储器多值特性及机理的研究

采用氧化硅材料构建了Cu/SiOx/Al的三明治结构阻变存储器件.用半导体参数分析仪对其阻变特性进行测量,结果表明其具有明显的阻变特性,并且通过调节限制电流,得到了四个稳定的阻态,各相邻阻态的电阻比大于10,并且具有良好的数据保持能力.在不同温度条件下对各个阻态进行电学测试及拟合,明确了不同阻态的电子传输机理不尽相同:阻态1和阻态2为欧姆传导机制,阻态3为P-F(Pool-Frenkel)发射机制,阻态4为肖特基发射机制.根据电子传输机制,建立了铜细丝导电模型并对Cu/SiOx/Al阻变存储器件各个阻态的电致阻变机制进行解释.     

Self‐formed Schottky barrier induced selector‐less RRAM for cross‐point memory applications

We propose a selector‐less Pr_0.7Ca_0.3MnO₃ (PCMO) based resistive‐switching RAM (RRAM) for high‐density cross‐point memory array applications. First, we investigate the inhomogeneous barrier with an effective barrier height (Φ_eff), i.e., self‐formed Schottky barrier. In addition, a scalable 4F² selector‐less cross‐point 1 kb RRAM array has been successfully fabricated, demonstrating set, reset, and read operation for high cell efficiency and high‐density memory applications. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Thermal stability and data retention of resistive random access memory with HfO_x/ZnO double layers

As an industry accepted storage scheme, hafnium oxide(HfO_x) based resistive random access memory(RRAM)should further improve its thermal stability and data retention for practical applications. We therefore fabricated RRAMs with HfO_x/ZnO double-layer as the storage medium to study their thermal stability as well as data retention. The HfO_x/ZnO double-layer is capable of reversible bipolar switching under ultralow switching current( 3 μA) with a Schottky emission dominant conduction for the high resistance state and a Poole–Frenkel emission governed conduction for the low resistance state. Compared with a drastically increased switching current at 120℃ for the single HfO_x layer RRAM, the HfO_x/ZnO double-layer exhibits excellent thermal stability and maintains neglectful fluctuations in switching current at high temperatures(up to 180℃), which might be attributed to the increased Schottky barrier height to suppress current at high temperatures. Additionally, the HfO_x/ZnO double-layer exhibits 10-year data retention @85℃ that is helpful for the practical applications in RRAMs.     

Bipolar resistance switching in the fully transparent BaSnO_3-based memory device

The fully transparent indium-tin-oxide/BaSnO3/F-doped SnO2 devices that show a stable bipolar resistance switching effect are successfully fabricated. In addition to the transmittance being above 87% for visible light, an initial forming process is unnecessary for the production of transparent memory. Fittings to the current-voltage curves reveal the interfacial conduction in the devices. The first-principles calculation indicates that the oxygen vacancies in cubic BaSnO3 will form the defective energy level below the bottom of conduction band. The field-induced resistance change can be explained based on the change of the interracial Schottky barrier, due to the migration of oxygen vacancies in the vicinity of the interface. This work presents a candidate material BaSnO3 for the application of resistive random access memory to transparent electronics.     

Analysis of resistive switching behaviors of vanadium oxide thin film

We demonstrated the polarization of resistive switching for Cu/VO_x/Cu memory cell. Switching behaviors of Cu/VO_x/Cu cell were tested by semiconductor device analyzer (Agilent B1500A), and the relative micro-analysis of I-V characteristics of VO_x/Cu was characterized by conductive atomic force microscope (CAFM). The I-V test results indicated that both forming and the reversible resistive switching between low resistance state (LRS) and high resistance state (HRS) can be observed under either positive or negative sweep. The CAFM images for LRS and HRS directly exhibited evidences of the formation and rupture of filaments based on positive or negative voltage. Cu/VO_x/Cu sandwiched structure exhibits a reversible resistive switching behavior and shows potential applications in the next generation nonvolatile memory field.     

Thermochemical resistive switching: materials,mechanisms, and scaling projections

In this article, resistive switching based on the thermochemical mechanism (TCM) is reviewed. This mechanism is observed when thermochemical redox processes dominate over electrochemical processes. As the switching is based on thermal effects, it is inherently unipolar, i.e., the transitions between the resistive states can be induced by the same bias voltage polarity. NiO has emerged as a “model material” for resistive switching based on the TCM effect and the discussion of the resistance states and the switching processes are focused on this material with the appropriate electrodes, mainly Pt. Unipolar switching is unambiguously filamentary. Conductive filaments are formed during the electroforming process needed prior to memory switching. The SET operation is interpreted as a sequence of threshold switching and subsequent Joule heating which triggers local redox reactions in which oxygen deficient NiO and, if the amount of released oxygen exceeds a certain amount, also metallic Ni will form. The RESET transition can be described as a thermally activated solid-state process resulting in a local decrease of the metallic Ni species. In terms of operation and reliability, a trade-off between RESET current reduction and retention was experimentally found. This is due to the decreasing long-term stability of the filaments with decreasing size. In addition, the scaling projection of a TCM-based memory technology with NiO is directly related to RESET currents and the availability of appropriate select devices.     

Ti/HfO2/Pt阻变存储单元中的氧空位聚簇分布

为了研究阻变存储器导电细丝的形成位置和分布规律, 使用X射线光电子能谱研究了Ti/HfO₂/Pt阻变存储器件单元中Hf 4f的空间分布, 得到了阻变层的微结构信息. 通过I-V测试, 得到该器件单元具有典型的阻变特性; 通过针对Hf 4f的不同深度测试, 发现处于低阻态时, 随着深度的增加, Hf⁴⁺化学组分单调地减小; 而处于高阻态和未施加电压前, 该组分呈现波动分布; 通过Hf⁴⁺在高阻态和低阻态下组分含量以及电子能损失谱分析, 得到高阻态下Hf⁴⁺组分的平均含量要高于低阻态; 另外, 高阻态和低阻态下的O 1s谱随深度的演变也验证了Hf⁴⁺的变化规律. 根据实验结果, 提出了局域分布的氧空位聚簇可能是造成这一现象的原因. 空位簇间的链接和断裂决定了导电细丝的形成和消失. 由于导电细丝容易在氧空位缺陷聚簇的地方首先形成, 这一研究为导电细丝的发生位置提供了参考.     

Resistive switching in ceramic multiferroic Bi0.9Ca0.1FeO3

We report resistive switching effects in polycrystalline samples of the multiferroic Bi_0.9Ca_0.1FeO₃ with silver electrodes. Mössbauer spectroscopy shows that upon Ca-doping the Fe remains in a 3+ valence state, suggesting charge compensation through the creation of large amounts of oxygen vacancies. Electrical characterization shows that the oxide/metal resistance can be switched between high and low resistance states by applying voltage pulses. This process was shown to be forming free and a strong relaxation after switching was found. We rationalize our results by considering oxygen vacancies migration to and from the metal–oxide interface, resulting in variations of the Schottky potential barrier height that modulate the interface resistance.