Silicene on hydrogen‐passivated Si(111) and Ge(111) substrates

By means of first‐principles calculations we predict the stability of silicene as buckled honeycomb lattice on passivated substrates of group‐IV(111)1 × 1 surfaces. The weak van‐der‐Waals interaction between silicene and substrates does not destroy its linear bands forming Dirac cones at the Brillouin zone corners. Only very small fundamental gaps are opened around the Fermi level.

     

Epitaxial SiC formation induced by medium energy ions on Si(1 1 1) at room temperature

In the search for silicon technology compatible substrate for III-nitride epitaxy, we present a proof-of-concept for forming epitaxial SiC layer on Si(1 1 1). A C/Si interface formed by ion sputtering is exposed to 100-1500 eV Ar⁺ ions, inducing a chemical reaction to form SiC, as observed by core-level X-ray photoelectron spectroscopy (XPS). Angle dependent XPS studies shows forward scattering feature that manifest the epitaxial SiC layer formation, while the valence band depicts the metal to insulator phase change.     

SiC formation on Si(100) via C60 precursors

The interaction between C₆₀ molecules and the Si(100) surface and the preparation of silicon-carbide thin films by thermal reaction of C₆₀ molecules with the Si(100) surface have been investigated using X-ray photoelectron spectroscopy, ultraviolet photoelectron spectroscopy, reflection high-energy electron diffraction and atomic force microscopy measurements. The effects of annealing temperature and C₆₀ coverage on the SiC formation will be discussed. It is found that the C₆₀ molecules bond covalently with silicon, and the number of bonds increase upon increasing the annealing temperature. Annealing at T≥830°C entails the formation of stoichiometric silicon carbide clusters that coalesce to form a continuous SiC layer when the C₆₀ coverage is greater than one monolayer. Deep pits acting as silicon diffusion channels are present with dimensions that increase with the amounts of C₆₀.

The interaction of C₆₀ with the SiC surface was also investigated. It is found that a similar covalent interaction is present in the two systems C₆₀/Si and C₆₀/SiC.     

Growth Kinetics of Silicon Carbide Film Prepared by HeatingPolystyrene/Si(111)

在不同的温度下热处理用sol-gel法制的PS/Si(111)叠层凝胶膜制备出了SiC薄膜．用XRD、SEM、XPS、FTIR等分析方法研究了SiC薄膜的结构、组成和表面形貌等．根据FTIR光谱计算了不同温度下得到的SiC薄膜的厚度,并研究了PS/Si(111)热解法生长SiC薄膜的生长动力学．结果表明,随着生长温度的增加,SiC薄膜生长速率变化趋势为：1200～1250 oC生长速率增加缓慢是2D生长机制,1250～1270 oC生长速率快速增加是3D生长机制,1270～1300 oC生长速率为负增长是由于SiC薄膜生长与Si和C原子的挥发共同作用所致．由速率变化求得各段表观生长激活能分别是122.5、522.5、-127.5 J/mol．     

Growth mechanism and morphology of Ge on Pb covered Si(111) surfaces

We study the mechanism and surface morphology in epitaxial growth of Ge on Pb covered Si(111) using a scanning tunneling microscope (STM). We find that Ge adatoms have a very large diffusion length at room temperature. The growth is close to perfect layer-by-layer for the first two bilayers. Surface roughness increases gradually with the film thickness, but no 3D islands are found at room temperature. For growth at 200°C, 3D Ge islands appear after completion of the second bilayer. At room temperature, we believe, the Pb layer enhances surface diffusion and the descending-step motion of Ge adatoms, but the ascending-step motion is hindered and thus 3D island growth is suppressed.     

Adsorption and thermal decomposition of C60 on Co/Si(111)-7 × 7

We present a study on the adsorption and thermal decomposition of C₆₀ on Co covered Si(111)-7 × 7 using scanning tunneling microscopy and X-ray photoelectron spectroscopy. Co-induced magic clusters grown on Si(111)-7 × 7 are identified as a possible adsorption site where 51 ± 3% of C₆₀ molecules adsorb at room temperature. On Co/Si(111)-7 × 7, C₆₀ molecules start to decompose at 450 °C, and are completely dissociated to form SiC by 720 °C. This temperature is significantly lower than 910 °C at which C₆₀ completely dissociates on clean Si(111)-7 × 7. This is a possible low temperature method for growing crystalline SiC films using C₆₀ as a precursor molecule.     

Effect of different Ge predeposition amounts on SiC grown on Si (1 1 1)

The SiC films were grown by solid source molecular beam epitaxy (SSMBE) on Si (1 1 1) with different amounts of Ge predeposited on Si prior to the epitaxial growth of SiC. The samples were investigated with reflection high energy electron diffraction (RHEED), atomic force microscopy (AFM), and X-ray diffraction (XRD). The results indicate that there is an optimized Ge predeposition amount of 0.2 nm. The optimized Ge predeposition suppress the Si outdiffusion and reduce the formation of voids. For the sample without Ge predeposition, the Si outdiffusion can be observed in RHEED and the results of XRD show the worse quality of SiC film. For the sample with excess amount of Ge predeposition, the excess Ge can increase the roughness of the surface which induces the poor quality of the SiC film.     

Ge adsorption on the Si(111) surface

Total energy calculations, performed for one monolayer of Ge adsorbed on Si(111), indicate that 1 × 1 models such as the atop site and hollow site adsorption geometries are unstable with respect to the formation of 2 × 1 Seiwatz chains of Ge adatoms. This result indicates that, for one monolayer coverage, Ge-Ge bonds are likely to form.     

Growth and Chemical Thermodynamics Analysis of SiC Film on Si Substrate by Heating Polystyrene/Silica Bilayer Method

采用改进的PS/OCS/Si(111)叠层热解法,在石英高温管式炉中,常压流通Ar气氛下,于1300 o C制备出了无层错空洞缺陷的晶态SiC薄膜．采用红外、X射线衍射和扫描电镜等分析方法对薄膜样品进行了表征．并研究了这种方法制备SiC薄膜的化学热力学过程．通过对反应平衡常数和吉布斯自由能的计算,初步确定了生成SiC的主反应的发生顺序以及反应体系的平衡状态,并论证了流通的Ar气氛对于反应的持续进行是必须的．该方法制备的薄膜为SiO2/SiC/Si(111)结构,这种结构对于半导体MOS器件的应用是非常有利的．该SiO2层形成反应后期降温阶段,并且可以通过RCA清洗工艺(标准半导体清洗工艺)彻底清除．目前还没有发现用这种方法生长SiC薄膜的报道．     

Soft X-ray emission study of thermally treated Ni(film)/4H–SiC(substrate) interface

Deposition of Ni as contact on 4H–SiC has been investigated. Ni/4H–SiC samples were annealed at temperatures of 600, 800 and 950 °C for 30 min and were non-destructively characterized by soft X-ray emission spectroscopy (SXES) using synchrotron radiation as excitation. Si L_2,3 SXE showed the formation of Ni₂Si for all annealing temperatures. The C K SXE indicated the formation of graphite and graphitic carbons at annealing temperatures of 950 °C and below 800 °C, respectively.     

Morphological properties of AlN and GaN grown by MOVPE on porous Si(111) and Si(111) substrates

Metal Organic Vapour Phase Epitaxy (MOVPE) of AlN and GaN layers at a temperature of 1080 C were performed on porous Si(111) and Si(111) substrates. The thermal stability of porous silicon (PS) is studied versus growth time under AlN and GaN growth conditions. The surface morphology evolution of the annealed PS is revealed by scanning electron microscopy (SEM). Porous Si(111) with low porosity (40%) is more thermally stable than porous Si(100) with relatively high porosity (60%).AlN layers with various thicknesses were grown under the same conditions on the two substrates. Morphological properties of AlN were studied by atomic force microscopy (AFM) and compared taking into account the two different surfaces of the substrates. The two growth kinetics of AlN were found to be different due to the initial surface roughness of the PS substrate. The effect of AlN buffer morphology on the qualities of subsequent GaN layers is discussed. Morphological qualities of GaN layers grown on PS are improved compared to those obtained on porous Si(100) but are still less than those grown on Si substrate.     

Alignment of Ge nanoislands on Si(111) by Ga-induced substrate self-patterning

A novel mechanism is described which enables the selective formation of three-dimensional Ge islands. Submonolayer adsorption of Ga on Si(111) at high temperature leads to a self-organized two-dimensional pattern formation by separation of the 7 x 7 substrate and Ga/Si(111)-(square root[3] x square root[3])-R30 degrees domains. The latter evolve at step edges and domain boundaries of the initial substrate reconstruction. Subsequent Ge deposition results in the growth of 3D islands which are aligned at the boundaries between bare and Ga-covered domains. This result is explained in terms of preferential nucleation conditions due to a modulation of the surface chemical potential.     

Anisotropic photoemission and chemisorption-bond geometry on Ge(111) and Si(111) surfaces

In order to study the effects of photon-polarization selection rules on chemisorptionbond geometry, we have measured photoelectron spectra as a function of angle of incidence, θ_i, in the range 28° ? θ ? 80°. A noble-gas UV resonance lamp and cylindrical mirror analyzer were used to measure both bonding and non-bonding surface Orbitals. A large enhancement (200–400%) of the photocmission is found when photon electric field intensity is near the maximum normal to the surface. This indicates a spatial variation of microscopic fields which is approximately independent of adsorbate bonding since it is determined by the optical properties of the substrate. In addition, we observe some effects on adsorbate photoelectron peaks due to different orbital symmetry. The case of atomic hydrogen chemisorption is discussed as an example of this latter effect.     

Properties of the SiO2/SiC interface investigated by angle resolved studies of the Si 2p and Si 1s levels and the Si KLL Auger transitions

Angle resolved photoemission studies of the Si 2p and Si 1s core levels and the Si KL_2,3L_2,3 Auger transitions from SiO₂/SiC samples are reported. Most samples investigated were grown in situ on initially clean and well ordered √3×√3 reconstructed 4H-SiC(0 0 0 1) surfaces but some samples were grown ex situ using a standard dry oxidation procedure. The results presented cover samples with total oxide thicknesses from about 5 to 118 Å. The angle resolved data show that two oxidation states only, Si⁺¹ and Si⁺⁴, are required to explain and model recorded Si 2p, Si 1s and Si KLL spectra.The intensity variations observed in the core level components versus electron emission angle are found to be well described by a layer attenuation model for all samples when assuming a sub-oxide (Si₂O) at the interface with a thickness ranging from 2.5 to 4 Å. We conclude that the sub-oxide is located at the interface and that the thickness of this layer does not increase much when the total oxide thickness is increased from about 5 to 118 Å.The SiO₂ chemical shift is found to be larger in the Si 1s level than in the Si 2p level and to depend on the thickness of the oxide layer. The SiO₂ shift is found to be fairly constant for oxides less than about 10 Å thick, to increase by 0.5 eV when increasing the oxide thickness to around 25 Å and then to be fairly constant for thicker oxides. An even more pronounced dependence is observed in the Si KLL transitions where a relative energy shift of 0.9 eV is determined.The relative final state relaxation energy ΔR(2p) is determined from the modified Auger parameter. This yields a value of ΔR(2p)=−1.7 eV and implies, for SiO₂/SiC, a “true” chemical shift in the Si 2p level of only ≈0.4 eV for oxide layers of up to 10 Å thick.     

Surfactants: Perfect heteroepitaxy of Ge on Si(111)

The hetero growth of Ge on Si results in formation of 3D clusters with an uncontrolled defect structure. Introduction of a monolayer of a surfactant completely changes the growth mode to a 2D-layer growth (Frankvan der Merwe) with a continuous and smooth Ge film on Si(111). The surfactant is not incorporated but segregates and floates on the growing Ge film. The saturation of the dangling bonds of the semiconductor reduces the surface free energy and drives the strong segregation. The effect on the growth process is the selective change of activation energies which are important for diffusion and the mobility of the Ge. Up to a thickness of 8 MLs (MonoLayers) the misfit-related strain of the pseudomorphic Ge film is relaxed by formation of a micro rough surface. This allows a partial relaxation of the Ge towards its bulk lattice constant which would not be possible for a flat and continuous film. For thicker Ge films the misfit of 4.2% is relieved by a periodic dislocation network, which is confined to the Si-Ge interface. Ge-films thicker than 20 MLs are free of defects and completely relaxed to the Ge bulk lattice constant: a model system for perfect heteroepitaxial growth.     

Growth and characterization of GaN nanorods through ammoniating process by magnetron sputtering on Si(111) substrates

GaN nanorods have been successfully synthesized on Si(111) substrates by magnetron sputtering through ammoniating Ga₂O₃/ZnO films at 950 °C in a quartz tube. The GaN nanorods are characterized by X-ray diffraction, scanning electron microscopy, field-emission transmission electron microscopy, X-ray photoelectron spectroscopy and fluorescence spectrophotometry. The results show that the nanorods have a pure hexagonal GaN wurtzite structure with lengths of about several micrometers and diameters of about 200 nm, and the growth direction of the GaN nanorods is parallel to the (101) plane. The photoluminescence spectrum indicates that the nanorods have a good emission property. Finally, the growth mechanism is also briefly discussed. PACS 61.46.+w; 78.55.Cr; 81.15.Cd; 81.07.-b; 82.30.Hk     

Photoemission studies of the surfactant-aided growth of Ge on Te-terminated Si(100)

The interactions of Ge adatoms with a Si(100) surface terminated by an ordered layer of Te have been studied in detail using XPS, SXPS, STM and LEED. It has been demonstrated that the Te layer has a surfactant action on the growth mode of the Ge in that the two dimensional growth regime is extended to at least 200 Å and the Te is seen to segregate to the growing Ge surface. The surface reconstruction of the Ge layer changes from (1 × 1) in the initial stages to (2 × 2) as growth proceeds and the surface population of Te is reduced. SXPS line shape analysis has indicated that the initial stages of Ge incorporation are characterised by the formation of small islands above those surface Si sites not fully coordinated with Te. Continued growth of such islands is, however, restricted due to their high surface free energy with respect to the surrounding Te-terminated areas. Ge atoms therefore site-exchange with Te atoms in bridge sites, thus becoming incorporated onto the Si lattice and displacing the Te to bridge sites on the growing surface. In this manner islanding is prevented and two-dimensional growth continues beyond the critical thickness. No evidence is seen for any significant incorporation of the Te within the growing Ge layer.     

Electron diffraction on GaAs nanowhiskers grown on Si(100) and Si(111) substrates by molecular-beam epitaxy

The crystal structure of GaAs nanowhiskers grown by molecular-beam epitaxy on Si(111) and Si(100) substrates is investigated using reflection high-energy electron diffraction (RHEED). It is revealed that, in both cases, the electron diffraction images contain a combination (superposition) of systems of reflections characteristic of the hexagonal (wurtzite and/or 4H polytype) and cubic (sphalerite) phases of the GaAs compound. The growth on the Si(111) substrates leads to the formation of nanowhiskers with hexagonal (wurtzite and/or 4H polytype) and cubic (sphalerite) structures with one and two orientations, respectively. In the case of the Si(100) substrates, the grown array contains GaAs nanowhiskers that have a cubic structure with five different orientations and a hexagonal structure with eight orientations in the (110) planes of the substrate. The formation of the two-phase crystal structure in nanowhiskers is explained by the wurtzite—sphalerite phase transitions and/or twinning of crystallites.