化学镀镍过程中丙酸作用的机理研究

利用循环伏安法和红外漫反射光谱法研究化学镀镍过程中丙酸的作用机理. 不同丙酸浓度下的循环伏安曲线表明,丙酸能同时促进Ni^2＋的还原和H₂PO^-₂的氧化.根据丙酸分别与NaH₂PO₂和NiSO₄共存时镍基体上吸附物的红外漫反射光谱变化,推断丙酸是通过与NaH₂PO₂和Ni^2＋形成表面络合物来促进化学沉积的. 丙酸能与NaH₂PO₂形成分子间氢键,促使P-H键断裂并生成·PHO^-₂中间物,从而提高H₂PO^-₂的氧化速度; 同时,丙酸以其-OCO-官能团与Ni^2＋生成桥式配合物,有利于加速Ni^2＋的沉积. H₂PO^-₂氧化速度的提高有助于磷的沉积,从而增大了化学镀层中的磷含量.     

硼酸铝晶须合成机理的研究

利用DTA、XRD和SEM研究了AlK(SO4 ) 2 H3BO3 K2 SO4 体系高温合成硼酸铝 (9Al2 O3·2B2 O3)晶须的机理 ,研究结果表明 ,在该体系中 ,9Al2 O3·2B2 O3 晶须的合成温度是 72 0～ 10 0 0℃ ,这一合成温度大大低于氧化铝 硼酸体系中 9Al2 O3·2B2 O3 晶须的合成温度 (110 0℃ )。合成机理的研究同时发现 ,该体系中 ,由 2Al2 O3·B2 O3 中间产物向9Al2 O3·2B2 O3 晶须转化的反应速率较快 ,这也明显有别于氧化铝 硼酸体系中 9Al2 O3·2B2 O3 晶须的合成机理     

镀液中金属杂质离子对电镀镍层性能的影响

向镍电镀原液中引入2 g/L的Co~(2+),Cr3+,Mn~(2+),Fe~(2+),Cd~(2+),Zn~(2+)等离子,通过电镀得到不同的镀层.X射线衍射(XRD)、X射线光电子能谱(XPS)及扫描电子显微镜(SEM)的结果表明,不同金属离子对镍沉积影响不同,金属杂质离子的存在会使镀层中晶粒尺寸变小,影响镍镀层的均匀性和致密度.通过阴极极化曲线、计时电位和交流阻抗等方法探讨了含有不同金属杂质的镀液在电镀过程中电化学行为的规律性.通过镀液的浓度梯度、耐腐蚀、耐热循环及耐高温等实验获得了不同条件下金属杂质在镀液中所允许的浓度范围.     

无电镀镍复合镀层耐蚀性质研究

研究无电镀镍镀层加入钻石微粒或PTFE微粒的均匀分散相 ,所得之复合镀层在 3.5%NaCl水溶液中的电化学分析 ,浸渍试验与临雾试验 ,皆显示复合镀层之耐蚀性低于不含微粒之无电镀镍镀层 .由SEM ,AES ,XRD ,EPMA分析镀层微观组成 ,复合镀层之磷含量分布呈差异性变化 ,磷量较多区域为微阴极 ,磷量较少区域为微阳极 ,复合镀层存在众多微电池组合 ,容易引起电化学伽凡尼腐蚀 ,造成复合镀层耐蚀性降低 ,当镀层微粒含量增加时 ,微粒的惰性保护效果超过微电池效应 ,复合镀层的耐蚀性质才能提高     

加速剂对化学镀镍层组成与结构的影响

加速剂对化学镀镍层组成与结构的影响方景礼，武勇，韩克平，张敏（南京大学应用化学研究所配位化学国家重点实验室南京２１００９３）关键词化学镀镍，Ｎｉ０Ｐ合金，加速剂，硫脲化学镀镍磷合金具有耐蚀性、可焊性、厚度均匀和硬度高等优点，已得到广泛应用。为提高生产...     

添加剂Ce^4＋对化学镀镍的影响

本文探讨了添加剂Ｃｅ＾４＋对化学镀镍过程的影响，结果表明，Ｃｅ＾４＋可降低Ｎｉ－Ｐ合金镀层在３％ＮａＣｌ溶液中的腐蚀电流，提高其耐蚀性，并发现热处理可使其抗 腐蚀性能进一步提高。但各合金镀层在０．１ｍｏｌ／ＨＣｌ中的耐腐蚀性由于Ｃｅ＾４＋的加入普遍下降。     

氯酸盐电还原机理的研究

本文利用Mo盘-Pt盘旋转电极研究了ClO_3的电还原过程, 并根据实验事实提出了一较完整的反应机理。我们首次检测到了ClO_3还原的中间产物ClO_2和Cl(或Cl_2)。其最终产物为Cl~-离子。     

热缓冲剂对稀土贮氢合金吸氢动力学的影响

以铜粉作为热缓冲剂添加到稀土贮氢合金粉中,应用动力学机理函数计算机拟合的方法,研究了ML(NiCoMnAlCu)5和Mm(NiCoMnAlCu)5(ML为富镧混合稀土金属,Mm为富铈混合稀土金属)在α+β相区恒温吸氢动力学.研究结果表明,当铜粉与贮氢合金粉达到一定比例时,能够消除热传导对吸氢动力学的影响.富铈稀土合金和富镧稀土合金吸氢均受氢在β相的内扩散控制,合金中随La/Ce比例的减小,吸氢速度加快.     

酸性化学镀镍中次亚磷酸钠阳极氧化行为的研究

采用线性电位扫描和交流阻抗法研究了酸性化学镀镍过程中还原剂次亚磷酸钠的阳极氧化行为。结果表明,次亚磷酸钠的氧化是一个复杂的电化学过程,其阳极氧化行为受本身浓度、溶液温度、阳极扫描速度以及Ｎｉ＾２＋的影响,在其氧化反应之前可能存在异相界面转化步骤,该步骤成为整个氧化过程的控制步骤。     

化学镀镍诱发过程的研究 II.用电子能谱研究诱发过程

In the previous paper, it was reported that a sudden decrease down to -0.6V and lower in stationary potential was observed from the stationary potential-time curve and the reaction of electroless nickeling could be induced by metallic iron catalyst when it was in contact with substrate metallic copper. In this paper, AES and XPS surface analysis and depth profile technique was employed to investigate the surface and depth distribution of Ni, Cu, Fe and P in the nickel coating deposited on the substrate metal. The experimental results showed that there was a thin adsorption layer consisting of C, S and Cl. The pure electroless nickel deposition, its Ni/P ratio being about two, existed under the adsorption layer. A layer with rapidly changed Ni/P ratio occurred close to the surface of substrate metal, under this layer the substrate metal was alloyed with Ni and P, thus becoming Cu-Ni-P alloy. The ratio of components in this alloy was found to be Cu:Ni:P=56:36:5. This fact explained why the electroless nickel deposition can preferably adhered to the substrate metal. In inducing process, Fe was not detected by AES from the substrate metal and nickel deposition. Thus it showed that the inducing reaction takes place without the deposition of inducing metal.     

添加剂丙烯基硫脲对镍电沉积的影响研究

采用循环伏安、线性扫描和恒电位阶跃电化学方法结合扫描电镜研究了不同浓度的丙烯基硫脲(ATU)对NH₃-NH₄Cl-H₂O体系镍在玻碳电极上的电沉积过程的影响. 循环伏安测试、线性扫描以及恒电位暂态曲线一致表明ATU的加入对镍电沉积具有阻化作用,并且随着ATU浓度的增加其阻化作用增强;恒电位暂态曲线结果表明,镍的电结晶是按瞬时形核三维生长机理进行的,随外加电位负移,晶体向外生长速率增大;ATU的加入没有改变镍的形核方式,但形核数密度增大,并且减小晶体向外生长的速率;扫描电镜结果表明,ATU的加入可以细化晶粒,得到整平、致密的镍沉积层.     

Effect of current density on the microstructure and morphology of the electrodeposited nickel coatings

The aim of this research work was to study the effect of deposition current density on microstructure and surface morphology of electrodeposited nickel coatings. For this purpose, nickel deposits have been synthesized by direct current from Watts bath without additive, to limit the incorporation of pollutants resulting from surface adsorption or electro-activity of these compounds. Nickel deposits have been investigated by scanning electron microscopy and X-ray diffraction. Cyclic voltammetry was also used to gain information on the general behavior of the deposition. The optimum conditions of deposition were established and the influence of current density on the grain size, surface morphology, and crystal orientation was determined.     

Synthesis of nanostructured films from template electrodeposition technique

In this report, the use of a simple and versatile technique of templated electrodeposition through colloidal templates to produce nanostructured films of Pt and Au with regular submicron spherical holes arranged in a hexagonal close-packed structure is described. The templates were produced by self assembly of a monodispersed suspension of polystyrene spheres on gold substrates using capillary forces. The self assembly process was modified through the chemical modification of the gold substrate with cysteamine thiol. Films of Pt and Au were prepared by electrochemical deposition through the template. The electrochemical deposition charge and the current time curve were used to control the film height with a precision of approximately 10 nm. The colour of the nanostructured films changed as the film thickness was changed. On the other hand, high surface area of the nanostructured Pt film on top of the gold substrate was calculated using electrochemical cyclic voltammogram. About 55 roughness factor was obtained. SAXS measurements showed strong scattering at low angles indicating the presence of a well-ordered mesostructure.     

Influence of bath composition and deposition parameters on nanostructure and thermal stability of gold

Nanocrystalline gold is electrodeposited from a stable nontoxic bath, in which Au⁺ is stabilized by complex formation with 3-mercapto-1-propanesulfonic acid sodium salt. Nanoscaling is achieved by pulse techniques. The crystallite size is strongly dependent on physical and chemical process parameters, such as pulse duration, current density, bath temperature, type, and amount of additives; especially, we observe a decrease of the crystallite size down to 16 nm by the proper choice of current density and temperature, and down to 7 nm by the use of additives. The thermal stability of nanocrystalline gold is investigated by in situ high-temperature X-ray diffraction; nanogold exhibits a thermal stability up to 673 K. An activation energy of 37 kJ mol⁻¹ is determined for the grain-growth kinetics.Paper presented at the “Jahrestagung der Fachgruppe Angewandte Electrochemie der Gesellschaft Deutscher Chemiker, Düsseldorf, 11.–14.06.2005”     

Nafion effect on the lead dioxide electrodeposition kinetics

Electrodeposition of lead dioxide in the presence of Nafion in solution is described by a four-stage kinetic scheme. The limiting stage at low polarizations is that of the second-electron transfer, and at high polarizations, the stage of delivery of lead compounds to the electrode surface. Nafion adsorption at the oxide profoundly affects the process kinetics.     

A quartz crystal microbalance study on a metallic nickel electrode

Electrochemical processes taking place on a Ni electrode have been investigated with the electrochemical quartz crystal microbalance. At potentials negative of ca. –500 mV vs. SCE, a closed frequency loop is observed without irreversible changes in the mass of the electrode. The phase transition - -Ni(OH)₂, taking place at potentials positive to –500 mV vs. SCE, is accompanied by an irreversible increase in the mass of the electrode. When Ni(OH)₂ is further oxidized, the frequency increase is followed by a decrease, indicating the transport of various species in both directions, i.e. from and into the electrode. During the Ni(OH)₂ oxidation reaction the transport of species responsible for the mass increase is slower than the charge transfer process.Contribution to the 3rd Baltic Conference on Electrochemistry, GDASK-SOBIESZEWO, 23–26 April 2003. Dedicated to the memory of Harry B. Mark, Jr. (February 28, 1934–March 3rd, 2003)     

Observation of a combined dilution and salting effect in buffers under conditions of high dilution and high ionic strength

The pH value of buffer solutions is crucially dependent on the relative concentrations of all species in solution. The addition of water or neutral salt can have a significant effect on the pH of a buffer solution. This study examines the magnitude of the "dilution effect" and the "salt effect" for several commonly used inorganic and biological buffers. Novel data are obtained for the change in pH observed upon dilution or addition of neutral salt to these buffers which add to, complement and extend existing literature values. The validity of considering the dilution and salt effects as a combined ionic strength effect is also considered as well as the ability of the pH measuring device to perform valid measurements in these extreme conditions.     

Alkalization of the near-cathode layer in electrodeposition of nickel from a chloride electrode

Dependences of the pH at which hydrate formation begins and the pH of the near-cathode layer on the electrolysis modes (temperature, cathode current density, pH in the electrolyte bulk) and the dependence of the pH of the nearcathode layer on the distance from the cathode surface in a low-concentration chloride nickelplating electrolyte were studied.     

Influence of [BMIM]HSO4 on electrodeposition and corrosion behavior of Zn coatings from acidic sulfate bath

The effect of 1‐butyl‐3‐methylimidazolium hydrogen sulfate‐[BMIM]HSO₄ on the nucleation and growth of zinc from acidic sulfate bath was investigated at a glassy carbon (GC) electrode using cyclic voltammetry, chronoamperometric and scanning electron microscopy techniques. Dimensionless chronoamperometric current‐time transients for the electrodeposition of zinc on GC from the bath free of [BMIM]HSO₄ were in good accord with the theoretical transients for the limiting case of instantaneous three‐dimensional nucleation with diffusion‐controlled growth of the nuclei. The addition of [BMIM]HSO₄ was found to have a blocking effect on the electrodeposition of zinc and led to decrease of the nucleation and growth rate of nuclei. In addition, the instantaneous nucleation mechanism observed in the additive‐free bath was changed to a more progressive one when [BMIM]HSO₄ was present in the bath. Surface morphology analysis indicated that [BMIM]HSO₄ can induce the formation of finer grained deposits by the adsorption of additive in the first stages of deposition. The corrosion behavior of Q235 steel with coating by a thin layer of zinc in the absence and presence of [BMIM]HSO₄ was examined in 3.5% NaCl solution. The Zn coating obtained from the additive‐containing baths exhibited more excellent protection of the base metal in comparison to the additive‐free one. Copyright © 2012 John Wiley & Sons, Ltd.     

The peculiarities of the effect of mercury ions on the kinetics of gold electrodeposition from cyanide solutions

The peculiarity of the catalytic effect of complex mercury ions (in the concentration of 10^?5 to 10^?4 M) on the gold electrodeposition from cyanide solutions are studied. It is shown that, all other conditions being the same, the catalytic activity of mercury ions is much lower than that of earlier studied thallium and lead ions. Another peculiarity of catalytic effect of mercury ions is the necessity of prolonged (for tens minutes) contact of gold with the mercury-containing solution. Possible explanation for the obtained regularities is proposed.