High-frequency broadband transducers of ultrasonic oscillations

The amplitude-frequency responses (AFRs) of ultrasonic oscillation transducers based on piezoelectric lithium iodate crystals of hexagonal modification and on magnetic soft ferrite powders are experimentally studied. The possibility to control the efficiency of magnetostriction powder transducers (MPTs) by variation in the value and orientation of the external magnetic field is shown. Results of measurements of the transformation efficiency for ferrites of various chemical compositions are presented.     

High-frequency conductance of a thin rectangular metal wire

The high-frequency conductance of a straight metal wire of rectangular cross section is calculated. The case when the transverse dimensions of the wire are several times smaller than its length is considered. The condition of diffuse reflection of electrons from the internal surfaces of the wire are taken as the boundary conditions for the problem. The limiting cases are considered, and the results are discussed.     

High-frequency ultrasonic transducer based on lead-free BSZT piezoceramics

This paper describes the fabrication and evaluation of a high-frequency (40 MHz) transducer based on lead-free piezoceramics for ultrasonic imaging. The transducer with an aperture size of 0.9 mm has been fabricated using barium strontium zirconate titanate ((Ba_0.95Sr_0.05)(Zr_0.05Ti_0.95)O₃, abbreviated as BSZT) ceramics. The lead-free BSZT has a piezoelectric d₃₃ coefficient of 300 pC/N and an electromechanical coupling factor k_t of 0.45. High-frequency ultrasound transducers were fabricated and a bandwidth of 76.4% has been achieved with an insertion loss of −26 dB. Applications in high resolution biological and medical imaging could be possible with this lead-free material.     

High-frequency guided ultrasonic waves for hidden defect detection in multi-layered aircraft structures

Aerospace structures often contain multi-layered metallic components where hidden defects such as fatigue cracks and localized disbonds can develop, necessitating non-destructive testing. Employing standard wedge transducers, high frequency guided ultrasonic waves that penetrate through the complete thickness were generated in a model structure consisting of two adhesively bonded aluminium plates. Interference occurs between the wave modes during propagation along the structure, resulting in a frequency dependent variation of the energy through the thickness with distance. The wave propagation along the specimen was measured experimentally using a laser interferometer. Good agreement with theoretical predictions and two-dimensional finite element simulations was found. Significant propagation distance with a strong, non-dispersive main wave pulse was achieved. The interaction of the high frequency guided ultrasonic waves with small notches in the aluminium layer facing the sealant and on the bottom surface of the multilayer structure was investigated. Standard pulse-echo measurements were conducted to verify the detection sensitivity and the influence of the stand-off distance predicted from the finite element simulations. The results demonstrated the potential of high frequency guided waves for hidden defect detection at critical and difficult to access locations in aerospace structures from a stand-off distance.     

The wire drawing process with axial ultrasonic vibration of the die

The influence of ultrasound on the behaviour of metals drawn through a conical converging die has been analysed by means of an energy method. The effect of the ultrasonic field is considered on the basis of experimental data and used to determine the drawing stress, the coefficient of friction, the viscosity coefficient, the drawing velocity effects, the area reduction and the die geometry. Results obtained by the given formulae used to calculate the drawing stress, are in good agreement with the experimental data. A detailed treatment is given for the drawing of aluminium through vibrated die.     

Process monitoring using ultrasonic sensor systems

Continuous in-line measurement of substance concentration in liquid mixtures is valuable in improving industrial processes in terms of material properties, energy efficiency and process safety. Ultrasonic sensor systems meet the practical requirements of a chemical sensor quite well. Currently ultrasonic sensor systems are widely used as acoustic chemical sensors to measure concentration of selected substances or to monitor the course of polymerisation, crystallisation or fermentation processes. Useable acoustic properties for the characterisation of liquid mixtures are sound velocity, sound absorption and acoustic impedance. This contribution will give a short overview of the state of the art and several trends for the use of ultrasonic sensor systems in process applications. Novel investigations show the very promising possibility to analyse liquid multi-phase mixtures like suspensions, emulsions and dispersions.     

Novel pad structures for the improvement of wire bonding strength in DXD panel

New pad structures are suggested to improve the wire bonding strength in the TFT panels suitable for the flat panel X-ray detector application. Several candidates of bonding pad structure are tested and one of them is chosen which shows the strongest and the most stable bonding with aluminum wire. Some morphological consideration was adopted to the surface of AlNd (Nd 2 at.%) pads whose thickness are 4000 Å. To avoid the defect of signal lines such as hillocks due to increased thickness of AlNd, we selectively increased the thickness of AlNd on the bonding area only.     

Cu/Al引线键合界面金属间化合物生长过程的原位实验研究

铜引线键合由于在价格、电导率和热导率等方面的优势有望取代传统的金引线键合, 然而Cu/Al引线键合界面的金属间化合物(intermetallic compounds, IMC)的过量生长将增大接触电阻和降低键合强度, 从而影响器件的性能和可靠性. 针对以上问题, 本文基于原位高分辨透射电子显微镜技术, 研究了在50–220 ℃退火温度下, Cu/Al引线键合界面IMC的生长问题, 实时观测到了Cu/Al IMC的动态生长及结构演变过程. 实验结果表明, 退火前颗粒状的Cu/Al IMC 分布在键合界面, 主要成分为Cu₉Al₄, 少量成分为CuAl₂. 退火后Cu/Al IMC的成分是: 靠近Cu一端为Cu₉Al₄, 远离Cu的一端为CuAl₂. 同时基于原位观测Cu/Al IMC的动态生长过程, 计算得到了Cu/Al IMC 不同温度下的反应速率和激活能, 给出了基于原位实验结果的Cu/Al IMC的生长公式, 为优化Cu/Al引线键合工艺和提高Cu/Al引线键合的可靠性提供了指导.     

High-frequency gratings for applications to microoptical ellipsometer/polarimeter systems

We report on experimental results which we conducted on manufactured microretarder arrays. The array consists of miniaturized retarder elements with different orientations of their fast axes. Diffractive phase retardation elements are chosen as microretarder elements since nanostructuring techniques such as electron beam lithography and successive reactive ion etching allow in principle an effortless way to arrange the microretarders as desired by the application. In this paper, we discuss the fabrication and the experimental results of manufactured retarder arrays. Furthermore, their use for potential applications in the fields of polarimetry is discussed.     

High-frequency power spectra of systems described by non-linear Langevin equations

We show that, for systems described by non-linear first- and second-order Langevin equations, the high-frequency correlations always have respectively, an ω^?2 and ω^?4 asymptotic behavior, irrespective of the shape and strength of the non-linearities, and whether detailed balance is obeyed in the stationary state or not.     

循环温度疲劳作用下粘接界面损伤的非线性超声评价

材料损伤以及性能退化与超声波的非线性效应密切相关.为研究循环温度疲劳作用下粘接界面的损伤情况,本文采用超声波透射法,研究了6061型铝合金/改性丙烯酸酯胶粘接界面的声学非线性系数随高温、低温循环次数的变化情况.结果表明,在高温循环疲劳作用的初始阶段,试件的非线性系数变化不明显,但随着高温循环次数的不断增加,非线性系数随循环次数的变化十分明显;对于低温循环疲劳作用的初始阶段,试件的非线性系数迅速增大,随着循环次数的增加,其值增速减缓.在低温循环疲劳寿命的后期,试件的非线性系数随循环次数的增加而继续增大.进一步的讨论结果表明,胶层三阶弹性常数的变化是造成高温循环疲劳时非线性系数变化的主要原因,而对于低温循环疲劳,粘接界面拉伸刚度的变化是引起非线性系数变化的主要原因.     

The complex-mode vibration of ultrasonic vibration systems

The longitudinal-flexural and torsional-flexural vibrations are studied for the ultrasonic solid horn and the ultrasonic vibration system comprised of a sandwich transducer and a solid horn. The discussed solid horn is of arbitrary non-uniform cross-section. The analysis on flexural-mode vibration is based on Timoshenko theory. The theoretical results are verified by experiment.     

A simulation model for ultrasonic pulse-echo systems

Echo patterns obtained by using an ultrasonic pulse-echo system are mainly determined by the structure of an object, but are influenced by many other factors such as the directivity and damping characteristics of the ultrasonic transducer, the dynamic range of the display unit and so on. A simulation model has been developed in which if these factors are specified numerically and fed to the simulator, then an A- or B-mode display pattern is obtained as its output. In this paper the principles of the simulator are presented first and some results of the simulation are given and they are compared with echo patterns obtained experimentally.     

热超声倒装键合中换能杆末端多维振动的相关性研究

换能杆末端的振动情况对于超声键合机理的研究有着重要意义；换能杆末端的实际振动模式直接影响着芯片键合的质量。利用高精度非接触式激光多普勒测振仪采集了换能杆末端俯仰、水平、轴向振动速度，用相干函数方法分析了3个方向的相互耦合关系。分别对换能杆末端有未安装劈刀的情况做了比较，得出了在换能系统工作频率附近，换能杆末端轴向振速与水平、俯仰振速的相关程度。这对实际键合中，换能系统末端的劈刀安装长度的选择以及换能杆工作频率的选择有指导意义。     

Enhanced electron field emission characteristics of single-walled carbon nanotube films by ultrasonic bonding

A novel ultrasonic bonding process was used to fabricate the electron field emission cathode of single-walled nanotube film, which was deposited on an Al plate substrate by electrophoretic deposition. Electron field emission properties were improved remarkably after the cathode carbon nanotubes nanobonded with the Al substrate. Turn-on voltage showed a significant decrease and the emission current was much stabilized. This can be attributed to the reduction of the contact resistance in bonding area and easily moving electrons for field emission after ultrasonic bonding. In addition, the field emission performances of SWCNTs films formed at different bonding conditions were also studied. With a simple nano-bonding apparatus, this technique has low cost, and can be utilized for extensively roboticized fabrication of high performance field emission cathodes with short process time.     

Mechanism of microweld formation and breakage during Cu-Cu wire bonding investigated by molecular dynamics simulation

Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been completely evaluated.Therefore,fundamental research is still needed.In this study,the mechanism of microweld formation and breakage during Cu-Cu wire bonding was investigated by using molecular dynamics simulation.The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate.Elastic contact and plastic instability were investigated through the loading and unloading processes.Moreover,the evolution of the indentation morphology and distributions of the atomic stress were also investigated.It was shown that the loading and unloading curves do not coincide,and the unloading curve exhibited hysteresis.For the substrate,in the loading process,the main force changed from attractive to repulsive.The maximum von Mises stress increased and shifted from the center toward the edge of the contact area.During the unloading process,the main force changed from repulsive to attractive.The Mises stress reduced first and then increased.Stress concentration occurs around dislocations in the middle area of the Cu wire.     

功率超声振动系统的研究进展

功率超声振动系统是功率超声技术中的关键部分,其主要部分包括功率超声换能器、超声变幅杆以及超声工具头或超声辐射器。本文就功率超声换能振动系统设计中经常遇到的一些关键问题进行了简要的归纳和总结,目的在于为功率超声换能器的优化设计和性能改善提供一些有用的设计指南和解决措施。同时,对一些新的功率超声振动系统进行了介绍,并简要分析了其发展趋势和应用领域。     

Characterization of ultrasonic imaging systems using transfer functions

The transfer functions for focussed and defocussed, coherent and confocal optical imaging systems have been applied to the equivalent ultrasonic imaging systems. The transfer functions with varying degrees of defocus were calculated to show the defocus effects for ultrasonic imaging systems. Assuming that the acoustic waves are reflected perfectly on the surface of the step edge, the theoretical line-scans for small amplitude signals across a step edge, with various degrees of defocus, were generated. The first derivative of the line-scan for a step edge is shown theoretically to yield the same impulse response as that calculated using the inverse Fourier transform applied to the original transfer function. These results show how the real and imaginary parts of the transfer functions contribute to ultrasonic image formation. A method for the experimental determination of the impulse response, and the transfer functions for the characterization of an ultrasonic imaging system, such as an acoustic microscope, is provided.