沉积温度对HfO2薄膜残余应力的影响

 用电子束蒸发方法制备了HfO₂薄膜，根据镀膜前后基片曲率半径的变化，用Stoney公式计算了薄膜应力，讨论了沉积温度对薄膜残余应力的影响。结果发现，HfO₂薄膜的残余应力均为张应力，应力值随沉积温度的升高先增大后减小，在280 ℃左右出现极大值。对样品进行了XRD测试，从微观结构上对实验结果进行了分析，发现微结构演变引起的内应力变化是引起薄膜残余应力改变的主要因素，HfO2薄膜在所选沉积温度60~350 ℃内出现了晶态转变，堆积密度随温度升高而增大。     

化学法制备的HfO2薄膜的激光损伤阈值研究

 采用化学法制备了HfO₂介质膜，研究了热处理、紫外辐照以及Al₂O₃复合对HfO₂介质膜激光损伤阈值的影响。采用红外光谱（FTIR）和X射线衍射仪对薄膜进行了表征，并用输出波长为1.064 μm、脉宽为10 ns的电光调Q激光系统测试薄膜的激光损伤阈值。实验结果表明：采用150 ℃左右的温度对薄膜进行热处理可以提高薄膜的激光损伤阈值，所获得的薄膜的激光损伤阈值高达42.32 J/cm²，比热处理前的激光损伤阈值提高了82%；无机材料Al₂O₃的适量添加能够提高薄膜的激光损伤阈值，其中HfO₂与Al₂O₃的最佳质量配比约为95∶5；另外，对薄膜进行适当的紫外辐照也可改善HfO₂ 薄膜以及HfO₂-Al₂O₃复合薄膜的抗激光损伤性能。紫外辐照对提高HfO₂-Al₂O₃复合薄膜的激光损伤阈值效果尤为显著，辐照40 min后的激光损伤阈值达到44.33 J/cm²，比紫外辐照前的激光损伤阈值提高了90%。     

波长1064nm脉冲激光高阈值反射膜的研制

 研究HfO₂/SiO₂高反射膜的制备工艺及其激光诱导损伤阈值的比较测试,分别采用了反应蒸镀HfO₂、反应离子辅助蒸镀HfO₂、反应离子辅助蒸镀金属Hf的源材料形成HfO₂薄膜。采用这三种工艺制备了HfO₂/SiO₂高反射膜,在中心波长1064nm处,反射率 R≥99.5%,其中反应蒸镀HfO₂/SiO₂高反射膜损伤阈值最高,可达60J/cm²(1064nm,5ns)。     

对基于磁控溅射方法沉积的HfO2薄膜的紫外光学特性及薄膜结构的研究

本文基于磁控溅射方法,功率从160 W增加到240 W,在石英衬底上沉积氧化铪薄膜(HfO₂),并对沉积后的薄膜进行退火处理. 利用X射线衍射谱、X射线光电子能谱、紫外-可见-近红外透射谱和椭圆偏振仪对HfO₂薄膜进行研究,对比了退火前后HfO₂薄膜的光学特性及薄膜结构的变化. 实验结果显示,HfO₂薄膜对波长大于200 nm的入射光具有很低的吸收系数. 优化退火温度和时间,可以将沉积后的HfO₂薄膜从非晶态转化成多晶态. 退火有助于结晶生成和内应力的增加,同时退火可以优化薄膜的化学计量比,提升薄膜的光学密度及折射率. 对功率在220 W左右沉积的薄膜进行退火,获得的HfO₂薄膜具有较高并且稳定的光学折射率(>2)和紫外光透射率,可在紫外波段减反膜系统中得到应用.     

SiO2半波覆盖层对HfO2/SiO2高反膜激光损伤的影响

 研究了SiO₂半波覆盖层对HfO₂/SiO₂高反射膜1064nm激光损伤的影响,分析薄膜的激光损伤特性及图貌得出, 对于单脉冲（1-ON-1）激光损伤,SiO₂半波覆盖层能提高HfO₂/SiO₂高反膜的激光损伤阈值;可显著降低激光损伤程度,减小灾难性损伤发生的概率;可大幅度提高HfO₂/SiO₂高反膜膜的抗激光损伤能力。     

氧分压对HfO2薄膜残余应力的影响及有限元分析

 利用电子束蒸发法制备了单层HfO₂膜,控制氧气流量从0 mL/min以步长5 mL/min递增至25 mL/min(标况下)。利用ZYGO干涉仪测量基片镀膜前后的面形变化,代入Stoney公式计算出残余应力,分析了不同氧压下残余应力的变化情况。随着氧压的增大,残余应力由张应力逐渐过渡到压应力,当氧压过大时,压应力减小。因此可以通过改变氧压来控制应力。应力的变化与薄膜的微观结构密切相关,分析了所有样品的X射线衍射图（XRD）,发现均为非晶结构。利用Ansys建立基片-薄膜有限元模型,将应力作用下基片的形变与实验结果进行对比,验证所建立的模型,为分析HfO₂/SiO₂膜堆应力的匹配设计提供参考。     

TeOx薄膜结构及短波长静态记录特性的研究

以真空蒸镀法在K9玻璃基底上制备了TeO_x单层薄膜.使用X射线光电子能谱仪(XPS)、X射线衍射仪(XRD)、原子力显微镜(AFM)对薄膜的结构进行了分析.实验结果表明,薄膜是由晶态Te分散在非晶态TeO₂基体中形成的混合体系,TeO₂基体的存在增强了Te的抗氧化性能;薄膜具有精细粒状结构和粗糙的表面;退火后薄膜的反射率增加和Te向表面的偏析、重聚集及表面粗糙度的降低有关.采用波长为514.4nm的短波长静态记录仪对薄膜静态记录性能的测试结果表明:薄膜具有良好的记录灵敏性,在记录功率1.5mW、脉宽50ns时就可产生较高的反射率衬比(度).研究结果为选择合适掺和物使TeO_x薄膜实际用作高密度光存储介质有重要意义.     

不同氧气流量对直流磁控溅射TiO2薄膜的影响

采用直流反应磁控溅射法,以高纯Ti为靶材,高纯O₂为反应气体,制备了TiO₂薄膜.研究了氧气流量对薄膜结晶取向、表面形貌和光学性能的影响.研究发现,TiO₂薄膜主要呈锐钛矿TiO₂(101)择优取向,当氧气流量较小时,薄膜中还含有金属Ti(100),氧气流量较大时,薄膜含TiO₂(101)和TiO₂(004),成多晶态;薄膜的粗糙度和颗粒大小都随氧气流量的增大而增大;薄膜在400~1100nm可见-近红外波段有较高的透射率并且其吸收峰随着氧气流量的增大而红移,当氧气流量为5sccm时,平均透射率最高.     

用1064nm激光增强HfO2/SiO2薄膜的抗激光损伤能力的实验研究

 用1 064nm激光实验研究了HfO₂/SiO₂薄膜的激光损伤增强效应，实验以薄膜激光损伤阈值70%的激光能量开始，采用N-ON-1方式处理薄膜，激光脉冲的能量增量为5J/cm²。实验结果表明，激光处理薄膜表面能使激光损伤阈值平均提高到3倍左右，并且薄膜的损伤尺度也明显减小。对有缺陷的薄膜，其缺陷经低能量激光后熔和消除，其抗激光损伤能力得到增强，但增强得并不显著，而薄膜本身的激光预处理，可以使其激光损伤阈值大大提高。     

溶胶-凝胶法MgF2紫外增透膜的制备和性能研究

 采用溶胶-凝胶法,以醋酸镁和氟化氢为原料,以甲醇为溶剂制备了MgF₂溶胶,利用浸渍提拉法在洁净石英基片上镀膜,考察了反应温度对溶胶微结构、薄膜结构和性能的影响。样品采用激光动态光散射、透射电镜、X射线粉体衍射仪、紫外-可见光谱仪、原子力显微镜进行表征。结果表明：通过该方法制备的表面平整的低折射率MgF₂薄膜,在紫外区具有很好的增透性能,同时在紫外波长355 nm激光的辐照下（脉宽6 ns）,薄膜具有较高的抗激光损伤性能,激光损伤阈值达10.85 J·cm^-2。     

Influence of APS bias voltage on properties of HfO_2 and SiO_2 single layer deposited by plasma ion-assisted deposition

HfO2 and SiO2 single layer is deposited on glass substrate with plasma ion assistance provided by Leybold advanced plasma source (APS). The deposition is performed with a bias voltage in the range of 70-130 V for HfO2, and 70-170 V for SiO2. Optical, structural, mechanical properties, as well as absorption and laser induced damage threshold at 1064 nm of HfO2 and SiO2 single layer deposited with the plasma ion assistance are systematically investigated. With the increase of APS bias voltage, coatings with higher refractive index, reduced surface roughness, and higher laser-induced damage threshold (LIDT) are obtained, and no significant change of the absorption at 1064 nm is observed. For HfO2, a bias voltage can be identified to achieve coatings without any stress. However, too-high bias voltage can cause the increase of surface roughness and stress, and decrease the LIDT. The bias voltage can be properly identified to achieve coatings with desired properties.     

Effect of Bias Voltage on Microstructure and Mechanical Properties of Nanocomposite ZrCN Films Deposited by Filtered Cathodic Vacuum Arc

Nanocomposite ZrCN films consisting of nanocrystalline ZrCN grains embedded in nitrogen-doped amorphous carbon film are deposited by filtered cathodic vacuum arc technology under different bias voltages ranging from 50to 400 V.The influence of bias voltage on the characterization and the mechanical properties of the ZrCN films are investigated by x-ray diffraction,x-ray photoelectron spectroscopy,scanning electron microscopy,transmission electron microscopy,Raman spectroscopy and nano-indentation.The bias voltage has a subtle effect on the ZrCN grain size,which is around 9.5 nm and keeps almost constant.A slight increase of the bias voltage induces a relatively high sp~3 fraction about 40%in N-doped amorphous C films but leads to the graphitization of the films under a higher voltage.The best mechanical property of the ZrCN film with the hardness of 41 GPa is obtained under the bias voltage of 200 V,indicating the positive effect of slight increase of ion bombardment on the hardness of the films.     

脉冲偏压电弧离子镀Cr-O薄膜结构及光学性能研究

采用脉冲偏压电弧离子镀技术在单晶硅基片及石英玻璃上制备了一系列均匀透明的Cr-O薄膜. 用场发射扫描电子显微镜、X射线衍射仪、X射线光电子谱、纳米压痕仪、紫外可见光分光光度计等方法对薄膜的表面形貌、膜厚、相结构、成分、元素的化学价态、硬度和光学性能等进行表征, 主要研究了偏压幅值对薄膜结构和性能的影响. 结果表明, 施加偏压可使薄膜的沉积质量明显提高, 其相结构由非晶态转变为晶体态, 并随着偏压幅值的增加, 由Cr₂O₃相向CrO相转变; 薄膜的硬度先增大后减小, 当偏压为-300 V时, 硬度达到最大值24.4 GPa; 薄膜具有良好的透光率, 最高可达72%; 当偏压为-200 V时, 薄膜的最大光学帯隙为1.88 eV.     

Effect of substrate bias voltage on the structure, electric and dielectric properties of TiO2 thin films by DC magnetron sputtering

Titanium dioxide (TiO₂) films have been deposited on glass and p-silicon (1 0 0) substrates by DC magnetron sputtering technique to investigate their structural, electrical and optical properties. The surface composition of the TiO₂ films has been analyzed by X-ray photoelectron spectroscopy. The TiO₂ films formed on unbiased substrates were amorphous. Application of negative bias voltage to the substrate transformed the amorphous TiO₂ into polycrystalline as confirmed by Raman spectroscopic studies. Thin film capacitors with configuration of Al/TiO₂/p-Si have been fabricated. The leakage current density of unbiased films was 1 × 10⁻⁶ A/cm² at a gate bias voltage of 1.5 V and it was decreased to 1.41 × 10⁻⁷ A/cm² with the increase of substrate bias voltage to −150 V owing to the increase in thickness of interfacial layer of SiO₂. Dielectric properties and AC electrical conductivity of the films were studied at various frequencies for unbiased and biased at −150 V. The capacitance at 1 MHz for unbiased films was 2.42 × 10⁻¹⁰ F and it increased to 5.8 × 10⁻¹⁰ F in the films formed at substrate bias voltage of −150 V. Dielectric constant of TiO₂ films were calculated from capacitance–voltage measurements at 1 MHz frequency. The dielectric constant of unbiased films was 6.2 while those formed at −150 V it increased to 19. The optical band gap of the films decreased from 3.50 to 3.42 eV with the increase of substrate bias voltage from 0 to −150 V.     

Influence of substrate bias voltage on structure and properties of the CrAlN films deposited by unbalanced magnetron sputtering

The CrAlN films were deposited on silicon and stainless steel substrates by unbalanced magnetron sputtering system. The influence of substrate bias on deposition rate, composition, structure, morphology and properties of the CrAlN films was investigated. The results showed that, with the increase of the substrate bias voltage, the deposition rate decreased accompanied by a change of the preferred orientation of the CrAlN film from (2 2 0) to (2 0 0). The grain size and the average surface roughness of the CrAlN films declined as the bias voltage increases above −100 V. The morphology of the films changed from obviously columnar to dense glass-like structure with the increase of the bias voltage from −50 to −250 V. Meanwhile, the films deposited at moderate bias voltage had better mechanical and tribological properties, while the films deposited at higher bias voltage showed better corrosion resistance. It was found that the corrosion resistance improvement was not only attributed to the low pinhole density of the film, but also to chemical composition of films.     

氧回旋离子束刻蚀化学气相沉积金刚石膜

利用非对称磁镜场电子回旋共振等离子体产生的氧回旋离子束刻蚀了化学气相沉积金刚石膜,研究了工作气压和磁电加热电压对金刚石样品附近的离子温度和密度的影响,并分析了金刚石膜的刻蚀和机械抛光效果。结果表明:当工作气压为0.03 Pa,磁电加热电压为200 V时,离子温度和密度最大,分别为7.38 eV和 23.81010 cm-3 。在此优化条件下刻蚀金刚石膜4 h后,其表面粗糙度由刻蚀前的3.525 m降为2.512 m,机械抛光15 min后,表面粗糙度降低为0.517 m,即金刚石膜经离子束刻蚀后可显著提高机械抛光效率。     

The effect of applied negative bias voltage on the structure of Ti-doped a-C:H films deposited by FCVA

Ti-doped hydrogenated diamond-like carbon (DLC) films were deposited on Si(1 0 0) substrates by a filtered cathodic vacuum arc (FCVA) method using Ar and CH₄ as the feedstock. The composition and microstructure of the films were investigated by Raman spectroscopy, X-ray photoelectron spectroscopy and IR spectroscopy. The internal stress was determined by the radius of curvature technique. The influence of the bias voltage on the microstructure of the as-deposited films was investigated. It was found that the graphite-like bonds was dominated in the Ti-doped DLC film deposited at 0 V bias voltage. When bias voltage was increased to −150 V, more diamond-like bond were produced and the sp³ content in film reached the maximum value, after which it decreased and more graphite-like bonds feature produced with further increase of the negative bias voltage. The compressive internal in the Ti-doped DLC films also exhibited a maximum value at −150 V bias voltage. IR results indicated that CH bonded intensity reduced, and H atoms bonded with C atoms were substituted for the Ti atoms as the negative bias voltage increasing. All the composition and microstructure change can be explained by considering the plasma conditions and the effect of negative bias voltage applied to the substrate.     

Metal-semiconductor-metal ultraviolet photodetector based on GaN

A metal-semiconductor-metal (MSM) ultraviolet photodetector has been fabricated using unintentionally doped n-GaN films grown on sapphire substrates. Its dark current, photocurrent under the illumination with λ = 360 nm light, responsivity, and the dependence of responsivity on bias voltage were measured at room temperature. The dark current of the photodetector is 1.03 Na under 5 V bias, and is 15.3 Na under 10 V bias. A maximum responsivity of 0.166 A/W has been achieved under the illumination with λ= 366 nm light and 15 V bias. It exhibits a typical sharp band-edge cutoff at the wavelength of 366 nm, and a high responsivity at the wavelength from 320 nm to 366 nm. Its responsivity under the illumination with λ= 360 nm light increases when the bias voltage increases.     

Indium tin oxide thin films by bias magnetron rf sputtering for heterojunction solar cells application

In this investigation ITO thin films were prepared by bias magnetron rf sputtering technique at substrate temperature of 180 °C and low substrate-target distance for future a-Si:H/c-Si heterojunction (HJ) solar cells application. Microstructure, surface morphology, electrical and optical properties of these films were characterized and analyzed. The effects of ion bombardments on growing ITO films are well discussed. XRD analysis revealed a change in preferential orientation of polycrystalline structure from (2 2 2) to (4 0 0) plane with the increase of negative bias voltage. Textured surface were observed on AFM graphs of samples prepared at high negative bias. Hall measurements showed that the carrier density and Hall mobility of these ITO films are sensitive to the bias voltage applied. We attributed these effects to the sensitivity of energy of Ar⁺ ions bombarding on growing films to the applied bias voltage in our experiments. At last the figure of merit was calculated to evaluate the quality of ITO thin films, the results of which show that sample prepared at bias voltage of −75 V is good to be used in HJ cells application.     

The fabrication and characterization of ZnO UV detector

ZnO films were deposited on GaAs substrates by radio frequency (rf) magnetron sputtering followed by an ambient-controlled heat treatment process for arsenic doping. In Hall measurements, the As-doped ZnO films showed the characteristics of p-type semiconductor. The ZnO thin film p–n homojuctions were then fabricated to investigate the electrical properties of the films. The p–n homojunctions exhibited the distinct rectifying current–voltage (I–V) characteristics. The turn-on voltage was measured to be 3.0 V under the forward bias. When ultraviolet (UV) light (λ = 325 nm) was irradiated on the p–n homojunction, photocurrent of 2 mA was detected. Based on these results, it is proposed that the p–n homojunction herein is a potential candidate for UV photodetector and optical devices.