Oligomeric aliphatic–aromatic ether containing phthalonitrile resins

A versatile synthetic method has been developed for oligomeric aliphatic–aromatic ether containing phthalonitrile (PN) resins and applied to the preparation of three unique resin systems. The oligomeric PN monomers were prepared from the reaction of an excess amount of bisphenol A with a dihalo‐aliphatic containing compound in the presence of K₂CO₃ in dimethylsulfoxide, followed by end‐capping with 4‐nitrophthalonitrile in a two‐step, one‐pot reaction. These PN resin systems exhibited excellent viscosities for molding various shaped articles after thermal curing to yield crosslinked polymers. These polymers offered more mechanical flexibility, when compared with an all aromatic backbone, while still maintaining good thermal stability, dielectric properties, and low water absorption. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 2186–2191     

Alkyne‐containing phthalonitrile resins: Controlling mechanical properties by selective curing

An alkyne‐containing multiple aromatic ether‐linked phthalonitrile has been synthesized and characterized. The oligomeric phthalonitrile monomer was prepared from the reaction of an excess amount of bisphenol A with 4,4′‐dibromotolane in the presence of K₂CO₃ in a N,N‐dimethylformamide/toluene solvent mixture, followed by end‐capping with 4‐nitrophthalonitrile in a two‐step, one‐pot reaction. After being cured in the presence of bis(4‐[4‐aminophenoxy]phenyl)sulfone, the polymeric properties of the alkyne‐ and non‐alkyne‐containing oligomeric phthalonitrile resins were compared. Rheometric measurements and thermogravimetric analysis showed that the alkyne‐containing oligomeric phthalonitrile resin had better mechanical properties than an analogous non‐alkyne‐containing resin cured under identical conditions and exhibited excellent thermal and oxidative properties. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 4774–4778     

Synthesis and properties of a novel high temperature pyridine‐containing phthalonitrile polymer

A novel pyridine‐containing aromatic phthalonitrile monomer, 2,6‐bis[4‐(3,4‐dicyanophenoxy)benzoyl]pyridine (BCBP) was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide of 2,6‐bis (4‐hydroxybenzoyl)pyridine (BHBP). 4‐(Aminophenoxy) phthalonitrile (APPH) was selected to promote the curing reaction, and the curing behavior has been investigated by differential scanning calorimetric (DSC), suggesting a wide processing window about 64 °C. Different curing additive concentrations resulted in polymers with different crosslinking degrees and subsequently influenced the performance of resins. The resulting BCBP polymer exhibited high glass transition temperatures exceeding 400 °C, outstanding thermo‐oxidative stability with weight retention of 95% at 530 °C, indicating a significant improvement in thermal properties endowed by pyridine units. Additionally, it also showed a lower overall water absorption after submersion in boiling water for 50 hours. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3819–3825     

Improved synthesis of oligomeric phthalonitriles and studies designed for low temperature cure

An improved synthetic method has been developed for oligomeric aromatic ether ketone‐based phthalonitrile (PN) resins. A new curing additive was studied that lowers the cure temperature of the PN resin to around 150 °C and compared to the traditional high‐temperature aromatic diamine. Mechanical and thermo‐oxidative analyses of polymeric samples from both systems were determined and compared under various curing conditions. The PN polymer exhibited low water absorption regardless of the chosen cure system. Published 2014. This article is a U.S. Government work and is in the public domain in the USA. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 1662–1668     

Synthesis and characterization of self‐catalyzed imide‐containing pthalonitrile resins

Some new amino‐ and imide‐containing phthalonitrile compounds with 1:1 molar ratio of amino group to pthalonitrile unit were successfully synthesized. The molecular structures were characterized by spectroscopic techniques. They were thermally polymerized under nitrogen/air, even in the absence of curing additives. The thermal properties of the cured products were characterized by thermogravimetric analysis and differential scanning calorimetry. The 5% weight loss temperatures ranged from 525 to 528 °C and 513 to 520 °C under nitrogen and air, respectively. Char yields (900 °C) were in the range of 62–70%. Rheometric measurements showed that the rate of the cure reaction differs for all the three monomers. The glass transition temperature advances with increasing extent of cure and disappears on postcure at 375 °C. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Fluorinated phthalonitrile resins with improved thermal oxidative stability

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Oligomeric bisphenol A‐based PEEK‐like phthalonitrile‐cure and polymer properties

The cure behavior and properties of oligomeric bisphenol A‐based PEEK‐like phthalonitrile (PN) are thoroughly examined in this article. The resin is easily processed from the melt at a relatively low temperature (150–200 °C) and the monomer cure occurs in a controlled manner as a function of the amine content and processing thermal conditions. Dynamic mechanical measurements and thermogravimetric analysis show that the polymer properties improve as the maximum PN postcure temperature is increased to 415 °C. The effects of the amine and polymer postcure conditions on the flexural and tensile properties of the PN polymer are investigated. The mechanical properties of the polymer are maximized after postcuring to moderate temperatures (330–350 °C). The polymer exhibits an average flexural strength and tensile strength at break of 117 and 71 MPa, respectively. After oxidative aging at 302 °C for 100 h, the polymer retains excellent mechanical properties. The average flexural and tensile strength retention of the polymers are 81 and 75%, respectively. Microscale calorimetric measurements reveal that the flammability parameters of the oligomeric PN are low compared to other thermosets. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3769–3777     

Physical gelation of water‐borne thermosetting resins by percolation theory—Urea‐formaldehyde,melamine‐urea‐formaldehyde,and melamine‐formaldehyde resins

Percolation and effective‐medium theories are applied for calculating the connectivity threshold of colloid particles of given shapes, observed during the physical gelation, distinguished from chemical gelation, of aminoplastic resins. The rigidity threshold, being the critical solid fraction at which a rigid network is first formed, was also calculated. For that purpose, it was assumed that the central forces that act between the colloidal particles and aggregates were not alone, thus corresponding to the case of physical gelation. It was shown that the observed change of morphology exhibited by such particles and aggregates as a function of time, from elongated to spherical, significantly delays the gel point. Consequently, the latter occurs only after a rather high fraction of solid phase (typically from 30 to 60%) is formed. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 971–978, 2008     

Thermal and electrical behavior of hybrid thermosets based on epoxy and maleimide resins cured with p-aminobenzoic acid

Two thermoset systems based on maleimides and diglycidyl ether of bisphenol A (DGEBA) cured with p-aminobenzoic acid were characterized in terms of thermal and electrical behavior. Thermal characterization has been undertaken by means of thermogravimetric analysis in nitrogen atmosphere up to 600°C using simultaneous thermogravimetric/Fourier transform infrared/mass spectrometry (TG/FT-IR/MS) analysis. In the first stage of thermal degradation, the global kinetic parameters [activation energy (E_a) and preexponential factor (log A₁ (s⁻¹))] were calculated using the isoconversional method of Friedman. The energies variation as well as the shape of the differential thermal analysis curves suggests that the thermal decomposition process occurred in multiple stages. The evolved gases analysis was conducted by simultaneous TG/FT-IR/MS coupled techniques. Dielectric relaxation spectroscopy characterization was also made.     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Novel flame‐retardant thermosets: Phosphine oxide‐containing diglycidylether as curing agent of phenolic novolac resins

Phosphorus‐containing novolac–epoxy systems were prepared from novolac resins and isobutyl bis(glycidylpropylether) phosphine oxide (IHPOGly) as crosslinking agent. Their curing behavior was studied and the thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured. The T_g and decomposition temperatures of the resulting thermosets are moderate and decrease when the phosphorous content increases. Whereas the phosphorous species decrease the thermal stability, at higher temperatures the degradation rates are lower than the degradation rate of the phosphorous‐free resin. V‐O materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3516–3526, 2004     

Synthesis and characterization of halogen‐containing poly(ether ketone ketone)s

A series of novel poly(ether ketone ketone)s (PEKKs) were synthesized from diphenyl ether and isophthaloyl chloride derivatives such as 5‐halo‐ and 5‐tert‐butyl‐isophthaloyl chloride. The aromatic electrophilic substitution route to polyketones was a convenient route for the preparation of the polymers in high yields via precipitation polycondensation at a low temperature with aluminum trichloride as a catalyst. High molecular weight PEKKs were achieved with number‐average molecular weights of 15,000–100,000 g/mol for polymers that showed good solubility in organic solvents. The presence of substituents greatly modified the spectroscopic features in comparison with those of unsubstituted isophthaloyl poly(ether ketone ketone)s, particularly for the series containing halogens, for which significant variations of the chemical shifts in both ¹H and ¹³C NMR spectra were observed; these shifts could be related to the nature of the halogen. Thermal properties were also affected by the presence of pendent substituents, with clear enhancements of the glass‐transition temperatures, which could be ascribed to the nature and bulkiness of the substituents. Thermogravimetric analyses showed that the new polymers had good thermal resistance, although an important drop in thermal resistance was observed for polymers bearing large halogen atoms, such as bromine and iodine. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2601–2608, 2002     

Deprotection‐free preparation of propargyl ether‐containing phosphinated benzoxazine and the structure–property relationship of the resulting thermosets

Generally, protection and deprotection procedures of amino groups are required in preparing propargyl ether‐containing benzoxazines. In this study, we report a facile, deprotection‐free preparation of a propargyl ether‐containing phosphinated benzoxazine (2) from the nucleophilic substitution of a phenolic OH‐containing phosphinated benzoxazine (1) and propargyl bromide in the catalysis of potassium carbonate. The structure of (2) was characterized and confirmed by a high‐resolution mass spectrum, ¹H, ¹³C, ¹H‐¹H, ¹H‐¹³C nuclear magnetic resonance (NMR) spectra, and X‐ray single crystal diffractogram. infrared (IR) and differential scanning calorimetry were used to monitor the ring‐opening of benzoxazine and crosslinking of propargyl ether. The microstructure and the structure–property relationship of the resulting homopolymers and copolymers are discussed. The T_g of homopolymer of (2) is 208 °C by dynamic mechanical analysis, the coefficient of thermal expansion is 43 ppm/°C, and T_d 5% (N₂) is 393 °C, respectively, which are higher than those of the homopolymer of (1) . Similar trends were observed in the copolymerization system. The results demonstrate the beneficial effect of crosslinking afforded by the propargyl ether group is higher than that by the phenolic OH group. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Advanced flame‐retardant epoxy resins from phosphorus‐containing diol

Phosphorus‐containing epoxy systems were prepared from isobutylbis(hydroxypropyl)phosphine oxide (IHPO) and diglycidyl ether of bisphenol A (DGEBA). Diethyl‐N,N‐bis(2‐hydroxyethyl) aminomethyl phosphonate (Fyrol 6) could not be incorporated into the epoxy backbone by a reaction with either epichlorohydrin or DGEBA because intramolecular cyclization took place. The curing behavior of the IHPO–DGEBA prepolymer with two primary amines was studied, and materials with moderate glass‐transition temperatures were obtained. V‐0 materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 3510–3515, 2005     

N,N‐dimethylaminopyridine as initiator in the copolymerization of diglycidylether of bisphenol A with six‐membered cyclic carbonates

N,N‐Dimethylaminopyridine (DMAP) was used as initiator to cure mixtures of diglycidylether of bisphenol A (DGEBA) and 1,3‐dioxan‐2‐one (TMC) or 5,5‐dimethyl‐1,3‐dioxan‐2‐one (DMTMC). The curing was studied by differential scanning calorimetry (DSC) and Fourier transform infrared in the attenuated‐total‐reflection mode (FTIR/ATR). FTIR/ATR was used to monitor the competitive reactive processes and to quantify the evolution of the groups involved in the curing. We observed the formation of five‐membered cyclic carbonates and anionic carbonate groups that remain unreacted at the chain ends. The formation of these groups was explained by the attack of the anionic propagation species on the methylene carbon of the carbonate group, which leads to an alkyl‐oxygen rupture. By performing the cure in the thermobalance we could evaluate the loss of CO₂ produced in the samples containing carbonates. The kinetics were studied by DSC and analyzed with isoconversional procedures. The addition of carbonates slows down the curing rate. Thermogravimetric analysis (TGA) and dynamic mechanical thermal analysis (DMTA) experiments were used to evaluate the properties of the materials obtained. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2873–2882, 2006     

Cationic copolymerization of diglycidyl ether of bisphenol A with phthalide or 3,3′‐diphtalide catalyzed by lanthanide triflates

Mixtures of the diglycidylether of bisphenol A (DGEBA) and phthalide (PT) or 3,3′‐diphthalide (DPT) were cured using ytterbium or lanthanum triflate as catalyst. The curing was studied by differential scanning calorimetry (DSC) and Fourier transform infrared in attenuated‐total‐reflection mode (FTIR/ATR). FTIR/ATR was used to monitor the competitive reactive processes and quantify the evolution of the epoxide and lactone groups. The T_g of the crosslinked materials increased when the proportion of lactone in the curing mixture decreased. The kinetics was studied with DSC experiments and isoconversional procedures. The differences in the reactivity of the systems were related to the Lewis acidity of the lanthanide salt used as initiator. The increase in the proportion of lactone leads to an increase in the reaction rate. The shrinkage was determined from the densities before and after curing and its evolution was studied by thermomechanical analysis. The materials obtained were characterized by thermogravimetry and dynamic mechanical thermal analysis. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1711–1721, 2006     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Synthesis and properties of amine‐containing poly(arylene ether sulfone) as an anion‐exchange matrix

Poly(arylene ether sulfone) (PSF), showing good thermal stability and excellent mechanical properties, was synthesized as an anion‐exchange matrix. It was synthesized by the condensation polymerization between bisphenol A and 4,4′‐dichlorodiphenylsulfone. 1°‐Amine‐containing poly(arylene ether sulfone) (1°‐APSF) was synthesized by the reduction reaction of a nitrated PSF. Then, it was transferred to 3°‐amine‐containing poly(arylene ether sulfone) (3°‐APSF) by the alkylation of the amine of 1°‐APSF. The properties of PSF, 1°‐APSF, and 3°‐APSF were investigated by Fourier transform infrared, ¹H NMR spectroscopy, differential scanning calorimetry, and thermogravimetric analysis. The introduction of the 3°‐amine group into PSF increased the glass‐transition temperature but decreased thermooxidative stability. The ion‐exchange capacities of 1°‐APSF and 3°‐APSF were shown to be 2.24 and 2.86 mequiv/g, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4281–4287, 2002