Si衬底GaN基LED外延薄膜转移至金属基板的应力变化

采用电镀金属基板及湿法腐蚀衬底的方法将硅衬底上外延生长的GaNMQWLED薄膜转移至不同结构的金属基板,通过高分辨X射线衍射(HRXRD)和光致发光(PL)研究了转移的GaN薄膜应力变化。研究发现:(1)转移至铜基板、铬基板、铜/镍/铜叠层基板等三种基板的GaN薄膜张应力均减小,其中转移至铬基板的GaN薄膜张应力最小。(2)随着铬基板中铬主体层厚度的增加,转移后的GaN薄膜应力不发生明显变化。     

图形硅衬底GaN基发光二极管薄膜去除衬底及AlN缓冲层后单个图形内微区发光及 应力变化的研究

研究了图形硅衬底上外延生长的氮化镓(GaN)基发光二极管(LED)薄膜、去除硅衬底后的无损自由状态LED薄膜以及去除氮化铝(AlN)缓冲层后的自由状态LED薄膜单个图形内的微区光致发光(PL)性能, 用荧光显微镜与扫描电镜观测了去除AlN缓冲层前后LED薄膜断面弯曲状况的变化. 研究结果表明: 1)去除硅衬底后, 自由支撑的LED薄膜朝衬底方向呈柱面弯曲状态, 且相邻图形的柱面弯曲方向不一致, 当进一步去除AlN缓冲层后薄膜会由弯曲变为平整; 2)LED薄膜在去除硅衬底前后同一图形内不同位置的PL谱具有显著差异, 而当去除AlN缓冲层后不同位置的PL谱会基本趋于一致; LED薄膜每一位置的PL 谱在去除硅衬底后均出现明显红移, 进一步去除AlN缓冲层后PL谱出现程度不一的微小蓝移; 3)自由支撑的LED薄膜去除AlN缓冲层后, PL光强随激光激发密度变化的线性关系增强, 光衰减得到改善.     

转移基板材质对Si衬底GaN基LED芯片性能的影响

在Si衬底上生长了GaN基LED外延材料,分别转移到新的硅基板和铜基板上,制备了垂直结构蓝光LED芯片。研究了这两种基板GaN基LED芯片的光电性能。在切割成单个芯片之前,对大量尺寸为(300μm×300μm)的这两种芯片分别通高达1 A的大电流在测试台上加速老化1 h。结果显示,铜基板Si衬底GaN基LED芯片有更大的饱和电流,光输出效率更高,工作电压随驱动电流的变化不大,光输出在老化过程中衰减更小。铜基板芯片比硅基板芯片可靠性更高,在大功率半导体照明器件中前景诱人。     

电致发光的完全悬空超薄硅衬底氮化镓基蓝光LED器件的制备与表征

为提升硅衬底氮化镓基LED(发光二极管)器件的光电性能和出光效率,本文提出了一种利用背后工艺实现的悬空薄膜蓝光LED器件.结合光刻工艺、深反应离子刻蚀和电感耦合等离子体反应离子刻蚀的背后工艺,制备了发光区域和大部分正负电极区域的硅衬底完全掏空,并减薄大部分氮化镓外延层的悬空薄膜LED器件.对悬空薄膜LED器件进行三维形...     

硅衬底GaN基LED薄膜芯片的应力调制

将Si衬底GaN基LED外延薄膜经晶圆键合、去硅衬底等工艺制作成垂直结构GaN基LED薄膜芯片,并对其进行不同温度的连续退火,通过高分辨X射线衍射(HRXRD)研究了连续退火过程中GaN薄膜芯片的应力变化。研究发现:垂直结构LED薄膜芯片在160~180℃下退火应力释放明显,200℃时应力释放充分,GaN的晶格常数接近标准值。继续升温应力不再发生明显变化,GaN薄膜的晶格常数只在标准晶格常数值附近波动。扫描电子显微镜给出的bonding层中Ag-In合金情况很好地解释了薄膜芯片应力的变化。     

硅衬底GaN蓝色发光材料转移前后应力变化研究

利用外延片压焊和湿法腐蚀技术将硅衬底上生长的InGaN多量子阱发光二极管(LED)薄膜材料转移到了新衬底上. 研究结果表明, 转移后的LED薄膜中GaN层受到的张应力变小,InGaN层受的压应力变大. 去除转移后LED薄膜中过渡层后,GaN层受到的张应力变大,而铟镓氮层受到的压应力基本不变. 将转移后的薄膜做成垂直结构的LED芯片后,其光电性能明显改善. 关键词： GaN 发光二极管 硅衬底 应力     

硅基板和铜基板垂直结构GaN基LED变温变电流发光性能的研究

本文将硅(Si)衬底上外延生长的氮化镓(GaN)基发光二极管(LED)薄膜剥离转移到新的硅基板和紫铜基板上,并获得了垂直结构的LED芯片,对其变温变电流电致发光(EL)特性进行了研究. 结果表明:当环境温度不变时,在13 K低温状态下铜基板芯片的EL波长始终大于硅基板芯片约6 nm,在300 K 状态下随着驱动电流的加大铜基板芯片的EL波长会由大于硅基板芯片3 nm左右而逐渐变为与硅基板芯片重合;当驱动电流不变时,环境温度由13 K升高到320 K,两种基板芯片的EL波长随温度升高呈现S形变化并且波谱逐渐趋于重合;在100 K以下温度时铜基板芯片的Droop效应比硅基板芯片明显,在100 K 以上温度时硅基板芯片的Droop效应比铜基板芯片明显. 可能是由于两种芯片的基板具有不同的热膨胀系数和热导率导致了其变温变电流的EL特性不同. 关键词： GaN 热膨胀系数 内量子效率 热导率     

柔性PI衬底上ITO薄膜的制备及性能研究

利用射频磁控溅射的方法在柔性PI衬底上制备ITO薄膜,通过SEM(扫描电子显微镜)、XRD(X射线衍射仪)、四探针测试仪、分光光度计,分析了通氧量、溅射功率、工作气压及衬底温度对ITO薄膜表面形貌、成膜质量和光电特性的影响。结果显示:在纯氩气环境下,溅射功率为200W,工作气压为1.5Pa,在衬底温度为185℃~225℃时,薄膜的光电特性最好,ITO薄膜的电阻率为3.64×10-4Ω·cm,透过率为97%。     

高柔性PVA-co-PE纳米纤维基复合导电透明膜的制备及性能研究

将具有独特叠层结构的聚乙烯醇-聚乙烯共聚物纳米纤维膜材料与环氧树脂复合,并引入紫外光吸收剂2,4-二羟基二苯甲酮,利用多相之间的强界面相互作用,制备得到了具有高柔韧性、高透明度和高紫外光过滤效果的复合透明膜.在该柔性基底上,通过压力转移法相继复合银纳米线层和还原氧化石墨烯层,形成了相互渗透的导电网络.最终得到面电阻为147Ω/Sq、可见光透过率约80%、紫外吸收率达90%的透明导电复合膜.该导电复合膜显示出良好的拉伸和弯曲性能,并在循环弯曲变形测试下保持良好的电学稳定性.     

以MgO为缓冲层的硅基铌酸锶钡薄膜取向特性与其波导结构的设计研究

采用溶胶－凝胶法在Si(100)基片上制备出择优取向的MgO薄膜,随后在其上生长出具有择优取向的铌酸锶钡铁电薄膜.实验发现,MgO缓冲层的应用可以大大提高SBN薄膜的择优取向性能.同时,用五层对称理想波导耦合模理论,以SBN为波导层,分析了波导损耗与厚度的关系. 通过对计算出的理想结果与实际相结合,以及对SBN在生长过程工艺与损耗关系的研究,制备出高质量、低损耗的SBN薄膜,为其在电光波导调制器等微系统中的应用打下良好的基础.     

Effects of electrical stress on the characteristics and defect behaviors in GaN-based near-ultraviolet light emitting diodes

The degradation mechanism of GaN-based near-ultraviolet (NUV, 320-400 nm) light emitting diodes (LEDs) with low-indium content under electrical stress is studied from the aspect of defects. A decrease in the optical power and an increase in the leakage current are observed after electrical stress. The defect behaviors are characterized using deep level transient spectroscopy (DLTS) measurement under different filling pulse widths. After stress, the concentration of defects with the energy level of 0.47-0.56 eV increases, accompanied by decrease in the concentration of 0.72-0.84 eV defects. Combing the defect energy level with the increased yellow luminescence in photoluminescence spectra, the device degradation can be attributed to the activation of the gallium vacancy and oxygen related complex defect along dislocation, which was previously passivated with hydrogen. This study reveals the evolution process of defects under electrical stress and their spatial location, laying a foundation for manufacture of GaN-based NUV LEDs with high reliability.     

Effect of substrate temperature on the growth and properties of boron-doped microcrystalline silicon films

Highly conductive boron-doped hydrogenated microcrystalline silicon (\mu c-Si:H) films are prepared by very high frequency plasma enhanced chemical vapour deposition (VHF PECVD) at the substrate temperatures $T_{\rm S})$ ranging from 90$^\circ$C to 270$^\circ$C. The effects of $T_{\rm S}$ on the growth and properties of the films are investigated. Results indicate that the growth rate, the electrical (dark conductivity, carrier concentration and Hall mobility) and structural (crystallinity and grain size) properties are all strongly dependent on $T_{\rm S}$. As $T_{\rm S}$ increases, it is observed that 1) the growth rate initially increases and then arrives at a maximum value of 13.3 nm/min at $T_{\rm S}$=210$^\circ$C, 2) the crystalline volume fraction ($X_{\rm c})$ and the grain size increase initially, then reach their maximum values at $T_{\rm S}$=140$^\circ$C, and finally decrease, 3) the dark conductivity ($\sigma _{\rm d})$, carrier concentration and Hall mobility have a similar dependence on $T_{\rm S}$ and arrive at their maximum values at $T_{\rm S}$=190$^\circ$C. In addition, it is also observed that at a lower substrate temperature $T_{\rm S}$, a higher dopant concentration is required in order to obtain a maximum $\sigma _{\rm d}$.     

Influence of layer thickness on the structure and the magnetic properties of Co/Pd epitaxial multilayer films

Co/Pd epitaxial multilayer films were prepared on Pd(111)_fcc underlayers hetero-epitaxially grown on MgO(111)_B1 single-crystal substrates at room temperature by ultra-high vacuum RF magnetron sputtering. In-situ reflection high energy electron diffraction shows that the in-plane lattice spacing of Co on Pd layer gradually decreases with increasing the Co layer thickness, whereas that of Pd on Co layer remains unchanged during the Pd layer formation. The CoPd alloy phase formation is observed around the Co/Pd interface. The atomic mixing is enhanced for thinner Co and Pd layers in multilayer structure. With decreasing the Co and the Pd layer thicknesses and increasing the repetition number of Co/Pd multilayer film, stronger perpendicular magnetic anisotropy is observed. The relationships between the film structure and the magnetic properties are discussed.     

Effect of post-thermal annealing on the structural and optical properties of ZnO thin films prepared from a polymer precursor

ZnO thin films were synthesised by a new method which uses polyvinyl alcohol (PVA) as the polymer precursor. The films are annealed at different temperatures and for different annealing times. The structural parameters, like grain size, lattice constants, optical band gap, and Urbach energy, depend on the annealing temperature and time. All the films possess tensile strain, which relaxes as the annealing temperature and time increase. The photoluminescence (PL) spectra contain only ultraviolet (UV) peaks at low temperature, but as the annealing temperature and time increase, we observe peaks at the blue and green regions with a variation in the intensities of these peaks with annealing temperature and time.     

Effect of post-thermal and optical properties annealing on the structural of ZnO thin films prepared from a polymer precursor

ZnO thin films were synthesised by a new method which uses polyvinyl alcohol （PVA） as the polymer precursor. The films are annealed at different temperatures and for different annealing times. The structural parameters, like grain size, lattice constants, optical band gap, and Urbach energy, depend on the annealing temperature and time. All the films possess tensile strain, which relaxes as the annealing temperature and time increase. The photoluminescence （PL） spectra contain only ultraviolet （UV） peaks at low temperature, but as the annealing temperature and time increase, we observe peaks at the blue and green regions with a variation in the intensities of these peaks with annealing temperature and time.     

Effect of crystallinity of ZnO buffer layer on the properties of epitaxial (ZnO:Al)/(ZnO:Ga) bi-layer films deposited on c-sapphire substrate

Bi-layer ZnO films with 2 wt.% Al (AZO; ZnO:Al) and 4 wt.% Ga-doped (GZO; ZnO:Ga) were deposited on the ZnO buffered and annealed ZnO buffered c(0 0 0 1)-sapphire(Al₂O₃) substrates respectively by Pulsed Laser Deposition (PLD). The effect of crystallinity of ZnO buffer layer on the crystallinity and electrical properties of the AZO/GZO bi-layer thin films was investigated. It was seen that the crystallinity of ZnO buffer layer had a great influence on the orientation and defect density of AZO/GZO bi-layer thin films from X-ray Diffraction (XRD) peaks and High Resolution Transmission Electron Microscopy (HRTEM) images. In a word, it was found in the films that more preferred c-axis orientation texture and reduction of the defects such as stacking faults and dislocations, with increasing of the crystallinity of ZnO buffer layer.