AlGaAs/InGaAs PHEMT栅电流参数退化模型研究

为定量研究在PHEMT栅电流退化过程中, 不同失效机理对应的参数退化时间常数及退化比例, 本文基于退化过程中物理化学反应中反应量浓度与反应速率的关系, 建立了PHEMT栅电流参数退化模型. 利用在线实验的方法获得PHEMT电学参数的退化规律, 分析参数随时间的退化规律, 得到不同时间段内影响栅电流退化的失效机理, 并基于栅电流参数退化模型, 得到了不同的失效机理对应的参数退化时间常数及退化比例. 关键词： PHEMT 栅电流 肖特基接触 退化模型     

基于Kolmogorov-Smirnov检验的LED可靠性评估

提出一种对光参量呈非单调下降规律的LED灯珠可靠性进行评价的方法.采用加速寿命实验获得光通量退化数据,利用指数叠加形式的退化模型对光通维持率退化数据进行拟合,与指数模型拟合效果相比,该模型具有更好的效果.用MATLAB软件计算样品的伪失效寿命,通过KolmogorovSmirnov检验法得到两个公司样本伪失效寿命分布分别服从对数正态分布和威布尔分布,以相应分布参量评估产品可靠性得到两个公司样本的伪失效寿命分别为5 328.37h和4 758.35h.该方法对参量呈非单调下降规律的LED器件可靠性的评估具有参考价值.     

人体模式静电对GaN基蓝光LED载流子运动及其可靠性的影响

对GaN基蓝光发光二极管(LED)分别施加-400,-800,-1 200,-1 500 V的反向人体模式静电打击,每次静电打击后,测量LED样品电学参数和光学参数的变化,从理论上分析了静电对LED可靠性的影响。实验发现:对GaN基蓝光LED进行人体模式下的静电打击后,其I-V特性曲线发生变形,光通量减小,老化时性能衰减的速率加快,这是由于受静电打击后在LED芯片内部产生了二次缺陷和熔融通道。对LED在不同温度下进行了I-V特性曲线的测量。实验结论认为未受静电打击的LED中浅能级离化占主导地位,受静电打击的LED中深能级离化占主导地位。静电引起的失效机理可以概述为二次缺陷和熔融通道的产生、深浅能级载流子的运动和辐射复合、非辐射复合之间的转变等因素引起的LED性能退化。     

序进应力在线加速退化模型研究

针对线下参数退化模型由于温度冲击而引入误差的问题,基于在线序进应力加速退化实验,建立了在线参数退化模型,提高了以参数变化为计算基础的参数退化模型的准确性.并以3CG120型高频晶体管为例,在150–230 ℃范围内进行了在线序进应力加速实验.利用建立的在线参数退化模型,得到3CG120型高频晶体管的寿命误差为6.5%,比线下参数退化模型的误差(23.2%)要小. 关键词： 序进应力加速实验 参数退化 在线测量     

晶圆键合和激光剥离工艺对GaN基垂直结构发光二极管芯片残余应力的影响

GaN基发光二极管(LED)中的残余应力状态对器件的性能和稳定性有很大影响. 通过使用三种不同的键合衬底(Al₂O₃衬底, CuW衬底和Si衬底)以及改变键合温度(290 ℃, 320 ℃, 350 ℃和380 ℃), 并且使用不同的激光能量密度(875, 945和1015 mJ·cm^-2) 进行激光剥离, 制备了不同应力状态的GaN基LED器件. 对不同条件下GaN LED进行弯曲度、Raman 散射谱测试. 实验结果表明, 垂直结构LED中的残余应力的状态是键合衬底和键合金属共同作用的结果, 而键合温度影响着垂直结构LED中的残余应力的大小. 激光剥离过程中, 一定能量密度下激光剥离工艺一般不会对芯片中的残余应力造成影响, 但是如果该工艺对GaN 层造成了微裂缝, 则会在一定程度上起到释放残余应力的作用. 使用Si衬底键合后, 外延蓝宝石衬底翘曲变大, 对应制备的GaN基垂直结构 LED中的残余应力为张应力, 并且随着键合温度的上升而变大; 而Al₂O₃和CuW衬底制备的LED中的残余应力为压应力, 但使用Al₂O₃衬底键合制备的LED中压应力随键合温度上升而一定程度变大, CuW 衬底制备的LED中压应力随键合温度上升而下降.     

辐射与发光 发光与发光器件

TN312.8 2006042820GaN基发光二极管的可靠性研究进展=Research and pro-gress in reliability of GaN-based LED[刊,中]/艾伟伟(北京工业大学光电子技术实验室.北京(100022)) ,郭霞…∥半导体技术.—2006 ,31(3) .—161-165从封装材料退化、金属的电迁移、p型欧姆接触退化、深能级与非辐射复合中心增加等方面介绍了GaN基LED的退化机理以及提高器件可靠性的措施,并对GaN基LED的应用前景进行了展望。图5参23(于晓光)TN312.8 2006042821空间交会对接标志灯发光器件的选择与分析=Selectionand analyses for the luminous devices of …     

GaN基白光发光二极管失效机理分析

对小功率白光GaN基发光二极管(LED)在室温、40 ℃和70 ℃下进行温度加速老化寿命实验,通过对老化前后不同时间段器件的电学、光学和热学特性进行测量来分析器件的失效机理,着重分析器件的芯片和荧光粉的失效机理.器件老化前后的I-V特性表明:老化过程中,器件的串联电阻和低正向偏压下的隧道电流增大,这是由于器件工作时其芯片的欧姆接触退化和半导体材料的缺陷密度升高而引起的.器件的热特性表明:高温度应力下器件的热阻迅速变大,封装材料迅速退化,这是器件退化的主要原因;光谱曲线表明温度加速了器件的     

基于电容和电导特性分析GaN蓝光发光二极管老化机理

采用正向交流小信号方法测试和分析老化前后GaN发光二极管（LED）的电容-电压特性,结合串联电阻、理想因子、隧穿电流参数讨论负电容以及电导变化情况.基于L-V曲线定性分析老化前后负电容的阈值电压,老化之后样管的受主浓度降低,辐射复合概率下降,大量缺陷以及非辐射复合中心出现,对载流子俘获作用增强,造成负电容降低.反向偏压以及小正向偏压下,隧穿效应导致老化之后样管的电导增大;正向偏压大于2.2 V区域,考虑串联电阻效应,老化后样管电导减小.在分析LED电容-电压、光输出、电学特性曲线与老化机理基础上,通过实验论证以及理论解释表明,负电容以及电导特性可作为分析LED老化特性的参考依据. 关键词： GaN发光二极管 负电容 电导 老化机理     

恒定温度应力加速实验失效机理一致性快速判别方法

针对加速实验中因失效机理发生改变而导致的无效实验问题, 对失效机理一致性和分别在不同应力下器件的初期退化参数分布的关系进行了研究. 研究证明了判断加速实验失效机理一致的条件: 1) 不同应力下失效分布的形状参数服从一致, 即m_i=m, i=1,2,3,···, 2) 尺度参数 η_i服从η_i= AF_i·η. 从而提供一种在实验初期即可根据参数退化分布快速判别不同应力下失效机理是否一致的方法, 避免了因失效机理发生改变而造成的无效加速实验. 最后对加速实验初期理论退化数据和多芯片组件厚膜电阻初期退化数据进行了威布尔分布参数估计, 并对其在不同应力下的失效机理一致性进行了判别. 关键词： 失效机理一致性 恒定温度应力加速实验 威布尔分布     

基于加速性能退化的LED灯具可靠性评估

提出了一种基于加速性能退化的LED灯具可靠性快速评估方法。以LED灯具的使用寿命评估为目标,设计了温度和电应力的恒定应力加速退化试验及其加速模型,给出了基于性能退化的LED灯具可靠性评估一般流程。以国内某型LED灯管为试验对象,对其可靠性进行了评价:在正常应力水平下,该型LED灯管的寿命评估值为31 571 h。结果表明该方法能够快速、有效地评估LED灯管的可靠性。该方法不仅节省实验时间,而且对LED灯具的可靠性评估及产品质量管理有一定的参考价值。     

High power and high reliability GaN/InGaN flip-chip light-emitting diodes

High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes (FCLEDs) have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge (ESD) damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard (human body model), the FCLEDs tolerated at least 10\,kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3\,V is 144.68\,mW, and 236.59\,mW at 1.0\,A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0\,A without significant power degradation or failure. The life test of FCLEDs is performed at forward current of 200\,mA at room temperature. The degradation of the light output power is no more than 9\% after 1010.75\,h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.     

GaN外延片中载流子浓度的纵向分布

采用适合宽禁带半导体材料的电化学电容电压(ECV)分析仪,对掺硅GaN外延片用硫酸逐层进行了精密腐蚀后,在此基础上得到了在进口MOCVD设备上生产的GaN基外延片的载流子浓度纵向分布.探讨了该分布与晶体生长过程及晶体质量的关系,测量分析结果可为生长工艺参数的优化提供参考.还采用主扩散模型对测量结果进行高斯拟合,得出了高温时(1030℃)硅在GaN中的扩散系数,并由此估算了硅在GaN外延片中的扩散宽度.该结果可为GaN外延层结构设计提供参考.     

硅衬底生长的InGaN/GaN多层量子阱中δ型硅掺杂n-GaN层对载流子复合过程的调节作用

为了解决在单晶硅衬底上生长的InGaN/GaN多层量子阱发光二极管器件发光效率显著降低的问题,使用周期性δ型Si掺杂的GaN取代Si均匀掺杂的GaN作为n型层释放多层界面间的张应力。采用稳态荧光谱及时间分辨荧光谱测量,提取并分析了使用该方案前后的多层量子阱中辐射/非辐射复合速率随温度（10~300 K）的变化规律。实验结果表明引入δ-Si掺杂的n-GaN层后,非辐射复合平均激活能由（18±3）meV升高到（38±10）meV,对应非辐射复合速率随温度升高而上升的趋势变缓,室温下非辐射复合速率下降,体系中与阱宽涨落有关的浅能级复合中心浓度减小,PL峰位由531 nm左右红移至579 nm左右,样品PL效率随温度的衰减受到抑制。使用周期性δ型Si掺杂的GaN取代Si均匀掺杂的GaN作为生长在Si衬底上的InGaN/GaN多层量子阱LED器件n型层,由于应力释放,降低了多层量子阱与n-GaN界面、InGaN/GaN界面的缺陷密度,使得器件性能得到了改善。     

Reliability analysis of GaN-based light emitting diodes for solid state illumination

In this paper, we have discussed the effect of electrical stress on GaN light emitting diode （LED）. With the lapse of time, the LED with an applied large current stress can reduce its current more than without such a stress under a large forward-voltage drop. Its scanning electron microscopy （SEM） image shows that there exist several pits on the surface of the p-metal. With an electrical stress applied, the number of pits greatly increases. We also find that the degradation of GaN LED is related to the oxidized Ni/Au ohmic contact to p-GaN. The electrical activation of H-passivated Mg acceptors is described in detail. Annealing is performed in ambient air for 10 min and the differential resistances at a forward-voltage drop of 5 V are taken to evaluate the activation of the Mg acceptors. These results suggest some mechanisms of degradation responsible for these phenomena, which are described in the paper.     

量子阱结构对含V形坑InGaN/GaN蓝光LED效率衰减的影响

使用MOCVD在图形化Si衬底上生长了含V形坑的InGaN/GaN蓝光LED。通过改变生长温度,生长了禁带宽度稍大的载流子限制阱和禁带宽度稍小的发光阱,研究了两类量子阱组合对含V形坑InG aN/GaN基蓝光LED效率衰减的影响。使用高分辨率X射线衍射仪和LED电致发光测试系统对LED外延结构和LED光电性能进行了表征。结果表明:限制阱靠近n层、发光阱靠近p层的新型量子阱结构,在室温75 A/cm~2时的外量子效率相对于其最高点仅衰减12.7%,明显优于其他量子阱结构的16.3%、16.0%、28.4%效率衰减,且只有这种结构在低温时(T≤150 K)未出现内量子效率随电流增大而剧烈衰减的现象。结果表明,合理的量子阱结构设计能够显著提高电子空穴在含V形坑量子阱中的有效交叠,促进载流子在阱间交互,提高载流子匹配度,抑制电子泄漏,从而减缓效率衰减、提升器件光电性能。     

硅衬底氮化镓基LED薄膜转移至柔性黏结层基板后其应力及发光性能变化的研究

本文将硅(Si)衬底上外延生长的氮化镓(GaN)基发光二极管(LED)薄膜转移至含有柔性黏结层的基板上, 获得了不受衬底和支撑基板束缚的LED薄膜. 利用高分辨率X射线衍射仪(HRXRD)研究了薄膜转移前后的应力变化, 同时对其光致发光(PL)光谱的特性进行了研究. 结果表明: 硅衬底GaN基LED薄膜转移至柔性基板后, GaN受到的应力会由转移前巨大的张应力变为转移后微小的压应力, InGaN/GaN量子阱受到的压应力则增大; 尽管LED薄膜室温无损转移至柔性基板其InGaN阱层的In组分不会改变, 然而按照HRXRD倒易空间图谱通用计算方法会得出平均铟组发生了变化; GaN基LED薄膜从外延片转移至柔性基板时其PL谱会发生明显红移.     

Quasi-homoepitaxial GaN-based blue light emitting diode on thick GaN template

The high power GaN-based blue light emitting diode (LED) on an 80-μ-thick GaN template is proposed and even realized by several technical methods like metal organic chemical vapor deposition (MOCVD), hydride vapor-phase epitaxial (HVPE), and laser lift-off (LLO). Its advantages are demonstrated from material quality and chip processing. It is investigated by high resolution X-ray diffraction (XRD), high resolution transmission electron microscope (HRTEM), Rutherford back-scattering (RBS), photoluminescence, current-voltage and light output-current measurements. The width of (0002) reflection in XRD rocking curve, which reaches 173" for the thick GaN template LED, is less than that for the conventional one, which reaches 258". The HRTEM images show that the multiple quantum wells (MQWs) in 80-μm-thick GaN template LED have a generally higher crystal quality. The light output at 350 mA from the thick GaN template LED is doubled compared to traditional LEDs and the forward bias is also substantially reduced. The high performance of 80-μm-thick GaN template LED depends on the high crystal quality. However, although the intensity of MQWs emission in PL spectra is doubled, both the wavelength and the width of the emission from thick GaN template LED are increased. This is due to the strain relaxation on the surface of 80-μm-thick GaN template, which changes the strain in InGaN QWs and leads to InGaN phase separation.     

Dual-blue light-emitting diode based on strain-compensated InGaN-AlGaN/GaN quantum wells

Strain-compensated InGaN quantum well (QW) active region employing tensile AlGaN barrier is analyzed. Its spectral stability and efficiency droop for dual-blue light-emitting diode (LED) are improved compared with those of the conventional InGaN/GaN QW dual-blue LED based on stacking structure of two In_0.18Ga_0.82N/GaN QWs and two In_0.12Ga_0.88N/GaN QWs on the same sapphire substrate. It is found that the optimal performance is achieved when the Al composition of strain-compensated AlGaN layer is 0.12 in blue QW and 0.21 in blue-violet QW. The improvement performance can be attributed to the strain-compensated InGaN-AlGaN/GaN QW that can provide a better carrier confinement and effectively reduce leakage current.     

Accelerated Stochastic Simulation of Large Chemical Systems

For efficient simulation of chemical systems with large number of reactions, we report a fast and exact algorithm for direct simulation of chemical discrete Markov processes. The approach adopts the scheme of organizing the reactions into hierarchical groups. By generating a random number, the selection of the next reaction that actually occurs is accomplished by a few successive selections in the hierarchical groups. The algorithm which is suited for simulating systems with large number of reactions is much faster than the direct method or the optimized direct method. For a demonstration of its efficiency, the accelerated algorithm is applied to simulate the reaction-diffusion Brusselator model on a discretized space.     

GaN基蓝绿光LED电应力老化分析

对InGaN/GaN多量子阱蓝光和绿光LED进行了室温20,40,60 mA加速电流下的电应力老化研究,发现蓝光与绿光样品经过60 mA电流老化424 h后,其电学性能表现出一定的共性与差异性:在小测量电流下,绿光样品的光衰减幅度较蓝光样品大~9%;而在较大测量电流 (20 mA)下,两者的光衰减幅度基本相同 (18%)。同时,蓝绿光样品的正向电学性能随老化时间的变化幅度基本一致,反映出它们具有相似的退化机制,绿光样品老化后增多的缺陷大部分体现为简单的漏电行为,而并非贡献于非辐射复合中心。在此基础上对GaN基外延结构进行了优化,优化后的LED长期老化的光衰减幅度较参考样品降低了3%。