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This paper presents an efficient automatic test pattern generation technique for loop-free circuits. A partial scan technique is used to convert a sequential circuit (finite state machine) with arbitrary feedback paths into a pipelined circuit for testing. Test generation for these modified circuits can be performed with a modified combinational automatic test pattern generator (ATPG), which is much faster than a sequential ATPG. A combinational model is obtained by replacing all flipflops by buffers. It is shown that a test vector for a fault in this model obtained by a combinational test generator can be expanded into a sequence of identical vectors to detect the same fault in the original sequential circuit. This technique may abort a few faults which can then be resolved with a sequential ATPG. Experiments on the ISCAS89 circuits show that only 30% to 70% of flipflops require scanning in larger circuits and 96% to 100% fault coverage for almost all the circuits without resorting to a sequential ATPG.This research was sponsored by the Semiconductor Research Corporation, Contract 90-DP-142. 相似文献
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A new hierarchical modeling and test generation technique for digital circuits is presented. First, a high-level circuit model and a bus fault model are introduced—these generalize the classical gate-level circuit model and the single-stuck-line (SSL) fault model. Faults are represented by vectors allowing many faults to be implicitly tested in parallel. This is illustrated in detail for the special case of array circuits using a new high-level representation, called the modified pseudo-sequential model, which allows simultaneous test generation for faults on individual lines of a multiline bus. A test generation algorithm called VPODEM is then developed to generate tests for bus faults in high-level models of arbitrary combinational circuits. VPODEM reduces to standard PODEM if gate-level circuit and fault models are used. This method can be used to generate tests for general circuits in a hierarchical fashion, with both high- and low-level fault types, yielding 100 percent SSL fault coverage with significantly fewer test patterns and less test generation effort than conventional one-level approaches. Experimental results are presented for representative circuits to compare VPODEM to standard PODEM and to random test generation techniques, demonstrating the advantages of the proposed hierarchical approach. 相似文献
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This paper presents a partial scan algorithm, calledPARES (PartialscanAlgorithm based onREduced Scan shift), for designing partial scan circuits. PARES is based on the reduced scan shift that has been previously proposed for generating short test sequences for full scan circuits. In the reduced scan shift method, one determines proch FFs must be controlled and observed for each test vector. According to the results of similar analysis, PARES selects these FFs that must be controlled or observed for a large number of test vectors, as scanned FFs. Short test sequences are generated by reducing scan shift operations using a static test compaction method. To minimize the loss of fault coverage, the order of test vectors is so determined that the unscanned FFs are in the state required by the next test vector. If there are any faults undetected yet by a test sequence derived from the test vectors, then PARES uses a sequential circuit test generator to detect the faults. Experimental results for ISCAS'89 benchmark circuits are given to demonstrate the effectiveness of PARES. 相似文献
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This paper presents a partial scan methodology suited for (pipelined) data paths described at the Register-Transfer level. The method is based on feedback elimination by making existing registers scannable or by adding extra transparent scan registers An optimal set (in terms of area cost) of scan registers is selected using an exact branch and bound algorithm. This approach can deal with complex realistic data paths requiring orders of magnitude lower CPU times than gate devel techniques. Furthermore, our symbolic test pattern generation technique can very effectively deal with the delay in the remaining acyclic sequential circuit parts. This symbolic test method makes various scan schemes possible which ensure a correct assembly and application of the test vectors. They are discussed and compared in terms of hardware requirements, test application times and test accuracy. 相似文献
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From humble beginnings, boundary scan has emerged as a major topic in the area of design-for-test applied to electronic devices, boards, and systems. This article reviews the literature in the field, and outlines the historical development of the new IEEE standard 1149.1–1990.Formerly with Philips CFT Automation, Eindhoven, NL. 相似文献
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Ashok Kumar Suhag Satdev Ahlawat Vivek Shrivastava Rahul Raj Choudhary 《International Journal of Electronics》2013,100(7):1244-1252
Switching activity is much higher in test mode as compared to normal mode of operation which causes higher power dissipation, and this leads to several reliability issues. Output gating is proposed as a very effective low-power test technique, which is used to eliminate redundant switching activity in the combinational logic of circuit under test (CUT) during the shifting of test vectors in a scan chain. This method reduces the average power significantly, but it introduces performance overhead in normal mode of operation. In this work, a new output gating technique is proposed which eliminates redundant switching activity in combinational logic of CUT during shifting of test vectors without any negative impact on performance as compared to earlier proposed output gating techniques. The proposed design also improves the performance of the scan flop in functional mode with negligible area overhead incurred due to extra transistors. Experimental results show that our design has a more robust performance over wide range of capacitive load as compared to earlier designs. 相似文献
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Brendan Davis 《Journal of Electronic Testing》1994,5(2-3):157-169
A long and deep recession, coupled with continuous competitive pressure to reduce costs, is forcing many companies to review their test strategies. Testing costs have become a more significant proportion of the overall manufacturing cost even though manufacturing yields have increased dramatically over the past ten or twelve years. This causes attention to be focused on testing costs as a key source of cost reduction. The increased use of DFT and the integration of design and test are very positive moves towards controlling testing costs but other methods employed can often backfire. The increased use of low priced testers is one such method. The pressure to reduce costs, higher process yields and exhortations that testing adds no value can lead the test engineering manager to take the cheap route. In reality this can often turn out to be an expensive decision. The only way to avoid expensive mistakes is to perform an economic analysis of the alternative courses of action. In most cases this is done, but not always in the right manner or with the necessary amount of detail to make the comparisons meaningful. This article discusses the need for effective cost analysis of test strategies and highlights some of the pitfalls. 相似文献
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This article is concerned with the role of I
DDQ
testing, in conjunction with other types of tests, in achieving high quality. In particular, the argument is made that rather than use a single fault coverage, it is better to obtain a number of different coverages, for different types of faults. To demonstrate the need for increasingly stringent fault coverage requirements, an analysis is given of the relationship between quality, fault coverage and chip area. This analysis shows that as chip area increases, fault coverage must also increase to maintain constant quality levels. Data are then presented from a production part tested with I
DDQ
, scan, timing and functional tests. To realistically fault grade I
DDQ
tests, three different coverage metrics are considered. The data show differences in tester failures compared to these coverage metrics, depending on whether one uses total I
DDQ
failures (parts which fail I
DDQ
regardless of whether they fail other tests as well) or unique I
DDQ
failures (parts which fail only I
DDQ
). The relative effectiveness of the different components of the full test suite are analyzed and it is demonstrated that no component can be removed without suffering a reduction in quality. 相似文献
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