Mechanical properties of thin Ag films on a silicon substrate studied using the nanoindentation technique

The mechanical properties of thin Ag films of equal thickness containing grains of various sizes were studied. The film hardness was measured using the Oliver-Pharr techniques based on indentation work calculations or on direct measurements of the area of pyramid imprints in AFM images. In order to avoid the influence of a substrate on the measured hardness, a technique was developed to determine the true values of the film hardness. It was established that the hardness of Ag films decreases with an increase in mean grain size, whereas the elastic modulus remains almost unchanged. It was shown that the dependence of the yield stress of Ag films on grain size does not obey the classical Hall-Petch law.     

Analysis of the substrate effects of strain-hardening thin films on silicon under nanoindentation

Mechanical properties of thin films on substrates can be evaluated directly through nanoindentation. For a comprehensive study, thin films should be characterized via Young’s modulus, yield stress and strain-hardening exponent at constant temperature. In this paper, we evaluate these effects of thin films on silicon substrate through finite element analysis. Thin films, from soft to hard relative to the silicon substrate, are investigated in three categories: soft films on hard substrates, soft to hard films on no elastic mismatch substrates, and hard films on soft substrates. In addition to examining the load-displacement curve, the normalized hardness versus normalized indentation depth is checked as well to characterize its substrate effect. We found that the intrinsic film hardness can be acquired with indentation depths of less than 12% and 20% of their film thickness for soft films on hard substrates and for soft to hard films on no elastic mismatch substrates, respectively. Nevertheless, nanoindentation of hard films on soft substrates cannot determine the intrinsic film hardness due to the fact that a soft substrate cannot support a hard film. By examining the von Mises stresses, we discovered a significant bending phenomenon in the hard film on the soft substrate. PACS 61.43.Bn; 62.20.-x; 68.03.Hj; 68.05.Cf; 68.08.De     

Nanoindentation measurements on modified diamond-like carbon thin films

In the present study, we explored the effect of metallic interlayers (Cu and Ti) and indentation loads (5-20 mN) on the mechanical properties of plasma produced diamond-like carbon (DLC) thin films. Also a comparison has been made for mechanical properties of these films with pure DLC and nitrogen incorporated DLC films. Introduction of N in DLC led to a drastic decrease in residual stress (S) from 1.8 to 0.7 GPa, but with expenses of hardness (H) and other mechanical properties. In contrast, addition of Cu and Ti interlayers between substrate Si and DLC, results in significant decrease in S with little enhancement of hardness and other mechanical properties. Among various DLC films, maximum hardness 30.8 GPa is observed in Ti-DLC film. Besides hardness and elastic modulus, various other mechanical parameters have also been estimated using load versus displacement curves.     

Ag implantation-induced modification of Ni–Ti shape memory alloy thin films

Nanocrystalline thin films of Ni–Ti shape memory alloy are deposited on an Si substrate by the DC-magnetron co-sputtering technique and 120?keV Ag ions are implanted at different fluences. The thickness and composition of the pristine films are determined by Rutherford Backscattering Spectrometry (RBS). X-Ray diffraction (XRD), atomic force microscopy (AFM) and four-point probe resistivity methods have been used to study the structural, morphological and electrical transport properties. XRD analysis has revealed the existence of martensitic and austenite phases in the pristine film and also evidenced the structural changes in Ag-implanted Ni–Ti films at different fluences. AFM studies have revealed that surface roughness and grain size of Ni–Ti films have decreased with an increase in ion fluence. The modifications in the mechanical behaviour of implanted Ni–Ti films w.r.t pristine film is determined by using a Nano-indentation tester at room temperature. Higher hardness and the ratio of higher hardness (H) to elastic modulus (E_r) are observed for the film implanted at an optimized fluence of 9?×?10¹⁵ ions/cm². This improvement in mechanical behaviour could be understood in terms of grain refinement and dislocation induced by the Ag ion implantation in the Ni–Ti thin films.     

Correlation between structural and mechanical properties of PbTiO3 thin films grown by pulsed-laser deposition

Tetragonal lead titanate (PbTiO₃, PT) thin films are grown on (1 0 0) MgO substrate by pulsed-laser deposition (PLD) for expected applications in integrated optics. The realisation of outstanding and reliable devices into integrated circuits requires sufficient mechanical resistance despite that the obtained PT films display interesting waveguiding properties associated with low optical losses. Two mechanical properties characteristic of elasticity and hardness of PT films are studied. The elastic modulus (E or Young's modulus) and the hardness (H) are measured by the nanoindentation technique. These mechanical properties are correlated to the crystalline quality of PT/MgO thin films. The films show epitaxial relationship with the MgO substrate and the orientation of crystallites perpendicularly to the surface substrate may be the consequence of a growth process along c-axis, a-axis or both. Differences on curves plotting hardness and elastic modulus as a function of indentation depth are observed as the curves are less dispersed for the films mainly c-axis oriented.     

High strain rate sensitivity of hardness in quinary Ti-Zr-Hf-Cu-Ni high entropy metallic glass thin films

Quinary Ti-Zr-Hf-Cu-Ni high-entropy metallic glass thin films were produced by magnetron sputter deposition. Nanoindentation tests indicate that the deposited film exhibits a relatively large hardness of 10.4±0.6 GPa and a high elastic modulus of 131±11 GPa under the strain rate of 0.5 s⁻¹. Specifically, the strain rate sensitivity of hardness measured for the thin film is 0.05, the highest value reported for metallic glasses so far. Such high strain rate sensitivity of hardness is likely due to the high-entropy effect which stabilizes the amorphous structure with enhanced homogeneity.     

氢化硅薄膜介观力学行为及其与微结构内禀关联特性

使用等离子体增强化学气相沉积系统，在射频和直流负偏压的双重激励下制备了本征和掺杂后的氢化硅薄膜.利用拉曼谱对薄膜进行了微结构分析，用纳米压痕系统研究了薄膜的介观力学行为.研究表明：制备于玻璃衬底上的氢化硅薄膜，由于存在非晶态的过渡缓冲层，弹性模量小于相应的制备于单晶硅衬底的薄膜.对于掺杂的氢化硅薄膜，由于磷的掺入使得薄膜晶粒细化、有序度提高，薄膜的晶态比一般在40％以上.而硼的掺入，薄膜晶态比减小，一般低于40％.同时发现，掺磷、本征和掺硼的氢化硅薄膜分别在晶态比为45％，30％和15％左右处，弹性模量较 关键词： 氢化硅薄膜 拉曼谱 弹性模量 晶态比     

Fracture force analysis at the interface of Pd and SrTiO3

The objective of this work is to develop an experimental indentation based method to determine the fracture force at the interface of Pd thin films and SrTiO₃ perovskite substrate. This paper reports on the results obtained for indentation into Pd thin films which were deposited in various thicknesses from 20 nm to 200 nm under vacuum and 300 °C substrate temperature by an electron beam physical vapor deposition. Initially, the relation between grain size, elastic module and hardness was considered as a function of film thickness. Thereafter, in developing new method, oscillating indentation was performed with different applied forces and oscillating times in order to measure the critical fracture force in each thickness. The effect of oscillating time on plastically deformed regions surrounding an indentation was schematically explained in conjunction with variation of oscillating time to determine the interfacial properties of the Pd thin film. Furthermore, the accuracy of the critical fracture force was ensured by applied force versus piling up height plot. The method is validated experimentally for the soft thin films over the hard substrate. However, further study would be essential to measure the film adhesion by means of fracture force at the interface.     

Surface characteristics and nanoindentation study of Ni-Mn-Ga ferromagnetic shape memory sputtered thin films

In present paper, the off-stoichiometric Ni-Mn-Ga ferromagnetic shape memory alloy thin films are fabricated using radio frequency magnetron sputtering method. The compositions, microstructures and mechanical properties of the thin films are characterized by energy dispersive X-ray spectrum (EDAX), X-ray photoelectron spectroscopy (XPS), scanning electronic microscope (SEM), atomic force microscope (AFM) and nanoindentation test, respectively. The results show that there is a thinner layer of oxides consisting of NiO, Ga₂O₃ and an unspecified manganese oxidation (Mn_xO_y) at the surface, whereas a small amount of MnO precipitates exist in internal layers of post-annealed Ni-Mn-Ga thin films. The hardness and elastic modulus decrease with increasing film thickness. Nanoindentation tests reveal that the hardness and elastic modulus of the films can be up to 5.5 and 155 GPa, respectively. The Ni-Mn-Ga thin films have remarkably improved the ductility of Ni-Mn-Ga ferromagnetic shape memory alloys bulk materials.     

Nanoindentation of hydrogenated amorphous silicon

Nanoindentation was carried out on thin films of hydrogenated amorphous silicon (a-Si:H) prepared by plasma-enhanced chemical vapor deposition. The composite values of elastic (Young's) modulus, E _c, and hardness, H _c, of the film/substrate system were evaluated from the load–displacement curves using the Oliver–Pharr approach. The film-only parameters were obtained employing the extrapolation of the depth profiles of E _c and H _c. Scanning probe microscopy was employed to image the nanoindenter impressions and to estimate the effect of film roughness and material pile-up on the testing results. It was established that the elastic modulus of thin a-Si:H films is in the range 117–131 GPa, which is lower than for crystalline silicon. In contrast, the values of hardness are in the range 12.2–12.7 GPa, which is comparable to crystalline silicon and higher than for hydrogen-free amorphous silicon. It is suggested that the plastic deformation of a-Si:H proceeds through plastic flow and it is the presence of hydrogen in the amorphous matrix that leads to a higher hardness.     

类金刚石薄膜力学特性的分子动力学模拟

基于Brenner的REBO势函数,利用分子动力学方法模拟了含氢量不同的类金刚石薄膜的纳米压痕过程,依据得到的加载卸载曲线,计算了薄膜的刚度、硬度以及弹性模量.结果表明:类金刚石薄膜的硬度由氢含量和sp³键含量两个因素共同决定;当薄膜中氢含量小于39% 时,薄膜硬度主要取决于sp³键含量,sp³键越多,硬度越高;当薄膜中氢含量达到52%,薄膜硬度则显著下降,此时氢的作用占据主导地位. 关键词： 类金刚石薄膜 分子动力学模拟 纳米压痕 硬度     

Reverse analysis in depth-sensing indentation for evaluation of the Young's modulus of thin films

This paper presents an approach to reverse analysis in depth-sensing indentation of composite film/substrate materials, which makes use of numerical simulation. This methodology allows the results of experimental hardness tests, acquired with pyramidal indenter geometry, to be used to determine the Young's modulus of thin film materials. Forward and reverse analyses were performing using three-dimensional numerical simulations of pyramidal and flat punch indentation tests to determine the Young's modulus of the thin films. The pyramidal indenter used in the numerical simulations takes into account the presence of the most common imperfection of the tip, so-called offset. The contact friction between the Vickers indenter and the deformable body is also considered. The forward analysis uses fictitious composite materials with different relationships between the values of the Young's modulus of the film and substrate. The proposed reverse analysis procedure provides a unique value for the film's Young's modulus. Depending on material properties, the value of the Young's modulus of the film can be more or less sensitive to the scatter of the experimental results obtained using the depth-sensing equipment. The validity of the proposed reverse analysis method is checked using four real cases of composite materials.     

Mechanical properties of thin films of hydrogenated silicon and their relationship with microstructure

Thin films of hydrogenated silicon were deposited on glass and single-crystalline silicon substrates using a capacitively coupled radio-frequency plasma-enhanced vapor-deposition system with the help of direct-current bias stimulation. Micro-Raman scattering was applied to investigate the microstructure of the thin films obtained. The crystalline volume fraction, X _c, was obtained from the Raman spectra. Microscopic mechanical characterization of the thin films was carried out by nanoindentation based on the conventional depth-sensing indentation method. An analytical relation between X _c and the elastic modulus was thereby established. The elastic modulus of the film on a glass substrate was found to be lower than that of the film on a monocrystalline silicon substrate with the same X _c. The grain size of a phosphorus-doped thin film was smaller than that of the intrinsic one, with greater ordering of the grains and X _c was found to be usually above 40%. A film with boron doping was on the opposite side, with X _c usually below 40%. In the phosphorus-doped, intrinsic, and boron-doped films, the elastic moduli were lower when the X _c values were 45%, 30%, and 15%, respectively.     

Effects of deposition parameters on the structure and mechanical properties of high-entropy alloy nitride films

High-entropy alloy (AlCrNbSiTiV)N nitride films are prepared using direct current (dc) reactive magnetron sputtering, with an equiatomic AlCrNbSiTiV alloy target. Experiments using the grey-Taguchi method are conducted to determine the effect of deposition parameters (dc power, substrate temperature, N₂/(N₂+Ar) flow rate and substrate bias) on the microstructure, mechanical and tribological properties. Orthogonal array (L₉ 3⁴), signal-to-noise ratio and analysis of variance are used to analyze the effect of the deposition parameters. The coated films are examined using scanning electron microscopy, an atomic force microscope, transmission electron microscopy (TEM), a tribometer and a nanoindenter. The TEM patterns confirm that the (AlCrNbSiTiV)N nitride films have a simple face-center-cubic structure. The experimental results show that a (AlCrNbSiTiV)N film coating significantly improves the mechanical properties. In the confirmation runs, using grey relational analysis, the improvement in friction coefficient is 32.5%, in corrosion current is 28.6%, in hardness H is 29.4%, in elastic modulus E is −18.3%, in H/E is 57.1 and in H³/E² is 225.0%. The samples with (AlCrNbSiTiV)N film coating are classified as HF1 and exhibit good adhesive strength.     

Structural, electrical and mechanical properties of NiO thin films grown by pulsed laser deposition

Nickel oxide (NiO) thin films were prepared by reactive pulsed laser deposition on thermally oxidized Si substrates in 10 Pa oxygen pressure. The substrate temperature during deposition was varied and its influence on the structural, electrical and nanomechanical properties was studied. It was proved that the structural properties were affected by the increase of substrate temperature improving the crystalline structure. Furthermore, a higher substrate temperature resulted in a thicker NiO film, which was attributed to an increased grain size. This effect influenced the electrical properties, too. Resistivity measurements showed that it increased with the increase of substrate temperature. For the first time, the nanomechanical properties of NiO films were studied. The formation and improvement of crystalline structure affected the nanomechanical properties. Nanoindentation testing of NiO thin films revealed an increase of hardness (H) and elastic modulus (E) and a decrease of surface roughness when increasing the substrate temperature.     

Numerical study on surface acoustic wave method for determining Young's modulus of low-k films involved in multi-layered structures

The surface acoustic waves (SAWs) technique is becoming an attractive tool for accurately and nondestructively characterizing the mechanical property of the brittle low dielectric constant (low-k) thin film. The theoretical equations for describing SAWs propagating on the multi-layered structure are derived in this study. The dispersion features of SAWs propagating on different structures of low-k/SiO₂/Si substrate, SiO₂/low-k/Si substrate, low-k/Si substrate, and low-k/Cu/Si substrate are investigated to instruct an accurate and facile fitting process for determining Young's modulus of low-k films. The dependence of dispersion relation on the film thickness, elastic modulus of low-k materials as well as frequency are provided and discussed in detail. The study shows an obvious influence of layered structure on the dispersion relation of SAWs. For a fixed structure, the dispersion curvature increases with the decrease of Young's modulus of low-k films.     

The role of the temperature and laser fluence on the properties of PLD bioactive glass films

The effect of the deposition temperature and laser fluence on the bonding configuration, morphology and mechanical properties of the PLD bioactive glass thin films in the system SiO₂P₂O₅CaONa₂OK₂OMgO is presented.Information on the IR active Si-O groups was obtained by Fourier Transform Infrared (FTIR) spectroscopy. Surface morphology changes were followed by Atomic Force Microscopy (AFM) and the film thickness was measured by profilometry. Hardness and elastic modulus were determined by nano-indentation.The frequency shifting and intensity variations of the IR absorption bands indicate that the substrate temperature plays an important role on the bonding configuration of the films. This effect is associated with a network rearrangement and the surface chemistry that occurs during the film growth.The main effects of the laser fluence on the film properties are the linear dependence on it of the growth rate and the changes induced on the surface morphology. Both results are discussed in terms of beam–matter interaction and plume–substrate interaction in the PLD process. Finally, the hardness and the elastic modulus of the films are in agreement with the values reported in the literature for the bulk material. PACS 81.15.Fg; 87.68.+z; 68.60.Bs; 68.37.Ps; 61.43.F1; 67.70.+n     

Annealing effect on microstructure and mechanical properties of amorphous Al-C-N films

Al-C-N thin films with different Al contents were deposited on Si (1 0 0) substrates by closed-field unbalanced reactive magnetron sputtering in the mixture of argon and nitrogen gases. These films were subsequently vacuum-annealed at 700 °C and 1000 °C, respectively. The microstructures of as-deposited and annealed films were characterized by X-ray diffraction (XRD) and high-resolution transmission electron microscopy (HRTEM); while the hardness and elastic modulus values were measured by nano-indention method. The results indicated that the microstructure of both as-deposited and annealed Al-C-N films strongly depended on Al content. For thin films at low Al content, film delamination rather than crystallization occurred after the sample was annealed at 1000 °C. For thin films at high Al content, annealing led to the formation of AlN nanocrystallites, which produced nanocomposites of AlN embedded into amorphous matrices. Both the density and size of AlN nanocrystallites were found to decrease with increasing depth from the film surface. With increasing of annealing temperature, both hardness and elastic modulus values were decreased; this trend was decreased at high Al content. Annealing did not change elastic recovery property of Al-C-N thin films.     

Mechanical properties of Al/a-C nanocomposite thin films synthesized using a plasma focus device

The Al/a-C nanocomposite thin films are synthesized on Si substrates using a dense plasma focus device with alu- minum fitted anode and operating with CH4/Ar admixture. X-ray diffractometer results confirm the formation of metallic crystalline Al phases using different numbers of focus shots. Raman analyses show the formation of D and G peaks for all thin film samples, confirming the presence of a-C in the nanocomposite thin films. The formation of Al/a-C nanocomposite thin films is further confirmed using X-ray photoelectron spectroscopy analysis. The scanning electron microscope results show that the deposited thin films consist of nanoparticles and their agglomerates. The sizes of th agglomerates increase with increasing numbers of focus deposition shots. The nanoindentation results show the variations in hardness and elastic modulus values of nanocomposite thin film with increasing the number of focus shots. Maximum values of hardness and elastic modulus of the composite thin film prepared using 20 focus shots are found to be about 10.7 GPa and 189.2 GPa, respectively.     

Effects of metal doping on the physical properties of ZnTe thin films

Zinc telluride (ZnTe) thin films were sublimated on a glass substrate using closed space sublimation (CSS) technique. ZnTe thin films of same thickness were tailored with copper (Cu) & silver (Ag) doping, considered for comparative study. X-ray diffraction (XRD) patterns of as-deposited ZnTe thin film and doped ZnTe samples exhibited polycrystalline behavior. The preferred orientation of (111) having cubic phase was observed. XRD patterns indicated that the crystallite size had increased after silver and copper immersion in as-deposited ZnTe thin films. Scanning electron microscopy (SEM) was used to observe the change of as-deposited and doped sample's grains sizes. EDX confirmed the presence of Cu and Ag in the ZnTe thin films after doping respectively. The optical studies showed the decreasing trend in energy band gap after Cu and Ag-doping. Transmission also decreased after doping. Resistivity of as-deposited ZnTe thin film was about 10⁶ Ω cm. The resistivity was reduced to 68.97 Ω cm after Cu immersion, and 10⁴ Ω cm after Ag immersion. Raman spectra were used to check the crystallinity of as-deposited, Cu and Ag-doped ZnTe thin film samples.