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随着CMOS图像传感器(CIS)向片上系统化、高度集成化方向发展,片内锁相环(PLL)成为系统不可或缺的片上时钟模块,而高速高集成的CIS对PLL的高频时钟输出能力提出了新的挑战。介绍了一种基于0.13μm CIS工艺设计的电荷泵PLL模块,该模块工作于1.5V电压,利于控制功耗;具备压控振荡器(VCO)电流自偏置和自校准技术,可提供最高频率为480MHz的输出信号和更好的噪声性能;多种输入输出倍频可选功能使其能够满足多样化的片上时钟生成需求,提高可复用性。仿真结果表明,当实现12倍频且输出频率为480MHz时,该PLL模块输出信号的均方根周期抖动为837fs,功耗为2.817mW,满足高速CIS对时钟速度的需求,同时保证了输出时钟的低噪声和模块本身的低功耗。 相似文献
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随着科技的不断发展,我国高速摄影技术水平得到了明显提高,CMOS图像传感器在传统传感器的基础技能上不断革新,因为具备诸多优点,受到了广大用户的欢迎。CMOS图像传感器与普通的传感器相比,只有在切换启动和停止时才会消耗电能,因此符合我国节能环保的概念,而且CMOS图像传感器在实际的使用过程中,由于散热少、污染少,被广泛的应用于我国各类工业的图像传输过程中。因此为了提升我国工业水平,使我国工业发展更加迅速,努力的提升高速CMOS图像传感器的技术研发水平,因此设计更加合理的信号处理电路非常必要。 相似文献
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基于LUPA1300-2型CMOS图像传感器设计了一套高速、高分辨率、小型化,低功耗的成像系统。以FPGA作为系统的时序控制程序开发平台,采用Verilog硬件描述语言设计了传感器驱动、数据处理、通信和数据传输等模块程序,并对各模块的功能与结构进行了分析和说明。基于本文提出的成像系统框架开发了硬件电路,然后对整个系统进行了成像实验。结果表明,该成像系统驱动时序合理,与计算机通信正常,数据传输准确,图像质量高,系统运行稳定。 相似文献
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设计了一种适用于CMOS图像传感器的列并行Single-slopeADC。采用的列并行ADC,同时对多数据源并行处理,增强了数据吞吐量,特别适用于CMOS图像传感器大像素阵列的数据处理。分析了影响ADC精度的因素,并给出了减小失调的方法。该ADC在0.35μm工艺下成功流片验证,测试结果表明,该ADC,在50MS/s的高数据吞吐量下,实现了CMOS图像传感器的8bit精度的设计要求和17.35mW的低功耗,以及0.62mm2的芯片面积。ADC的DNL=0.8LSB,INL=1.096LSB。 相似文献
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设计了一种用于CMOS图像传感器时钟产生的电荷泵锁相环(CPPLL)电路.基于0.18μm CMOS工艺,系统采用常规鉴频鉴相器、电流型电荷泵、二阶无源阻抗型低通滤波器、差分环形压控振荡器以及真单相时钟结构分频器与CMOS图像传感器片内集成.系统电路结构简洁实用、功耗低,满足CMOS图像传感器对锁相环低功耗、低噪声、输出频率高及稳定的要求.在输入参考频率为5 MHz时,压控振荡器(VOC)输出频率范围为40~217 MHz,系统锁定频率为160MHz,锁定时间为16.6μs,功耗为2.5 mW,环路带宽为567 kHz,相位裕度为57°,相位噪声为一105 dBc/Hz@1 MHz. 相似文献
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一种用于CMOS图像传感器的Column-Level模数转换器 总被引:6,自引:6,他引:0
设计了一种用于CMOS图像传感器(CIS)的column-level模数转换器(ADC)。它由一种新型斜坡发生器构成,具有分辨率可调的特点,而且以简单的结构实现了高精度和低功耗,占用较小的版图面积。基于0.35μm2P4M标准CMOS工艺,8bit ADC转换时间约50μs,最大线性误差小于±0.5LSB。在分辨率为640×480pixel的CIS中,每列共用1个比较器,提高了传感器的吞吐速率,帧频约40fps;3.3V电压下ADC总功耗不超过27mW,占用版图面积约0.5mm2。 相似文献
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针对CMOS图像传感器的高速化设计提出了一种列级ADC电路,其采用单斜式ADC与TDC结合的方式,通过时钟信号约束比较器输出,在量化的最后一个时钟周期内产生与电压对应的时间差值。利用TDC将该差值转换为相应的数字码并与单斜式ADC的量化结果做差,实现高精度转换的同时显著提高了ADC的量化速度。基于0.18 μm CMOS工艺,完成电路的具体设计、版图实现和性能验证。在模拟电压3.3 V、数字电压1.8 V、时钟频率250 MHz、输入信号范围1.5 V的条件下,10 bit ADC的信噪失真比(SNDR)达到55.74 dB,无杂散动态范围SFDR为66.79 dB,有效转换位数达到8.9 bit,DNL不超过0.3 LSB,INL不超过0.6 LSB,列级电路功耗仅为79 μW,行读出量化时间压缩至1 μs。为大面阵CMOS图像传感器的帧频提升提供了一种有效的ADC设计方案。 相似文献
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提出了一种易于硬件实现的、用于图像版权保护的自适应盲水印算法。利用R、G和B分量在图像信息中各自的不同特点做不同处理;根据人眼的视觉特性,通过对图像G分量纹理强度分析自适应地选择合适的水印拉伸因子,从R分量中提取图像内容来加密水印,对B分量进行DCT变换来嵌入不可见盲水印。采用伪随机序列发生器实现水印置乱,基于DCT中低频系数求均值来嵌入盲水印,大大降低了硬件消耗。实验结果表明,算法对噪声干扰、滤波、锐化、剪裁和模糊处理具有很好的鲁棒性,提取出的水印的归一化相关系数均在0.5之上,大于人眼可识别的检测阈值。 相似文献
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设计了一种用于CMOS图像传感器的列并行RSD循环ADC.转换和采样同步进行,速度比传统的循环ADC提高了1倍,适用于高速实时系统的应用.将采样保持,精确乘2和像素信号的FPN噪声消除功能用1个运放和6个电容来实现,大大缩小了面积.采用RSD算法,不但降低了对比较器的精度要求,并且实现了较高的线性度.通过失调反向存储,基本消除运放失调引入的列FPN噪声.该ADC在0.18μm工艺下,实现了10位精度和500 KS/S的高转换速度.ADC的DNL= 0.5/-0.5 LsB,INL= 0.1/-1.5 LSB. 相似文献
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A method to judge complete charger transfer is proposed for a four-transistor CMOS image sensor with a large pixel size.Based on the emission current theory,a qualitative photoresponse model is established to the preliminary prediction.Further analysis of noise for incomplete charge transfer predicts the noise variation.The test pixels were fabricated in a specialized 0.18μm CMOS image sensor process and two different processes of buried N layer implantation are compared.The trend prediction corresponds with the test results,especially as it can distinguish an unobvious incomplete charge transfer.The method helps us judge whether the charge transfer time satisfies the requirements of the readout circuit for the given process especially for pixels of a large size. 相似文献
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The charge transfer potential barrier (CTPB) formed beneath the transfer gate causes a noticeable image lag issue in pinned photodiode (PPD) CMOS image sensors (CIS), and is difficult to measure straightforwardly since it is embedded inside the device. From an understanding of the CTPB formation mechanism, we report on an alternative method to feasibly measure the CTPB height by performing a linear extrapolation coupled with a horizontal left-shift on the sensor photoresponse curve under the steady-state illumination. The theoretical study was performed in detail on the principle of the proposed method. Application of the measurements on a prototype PPD-CIS chip with an array of 160 × 160 pixels is demonstrated. Such a method intends to shine new light on the guidance for the lag-free and high-speed sensors optimization based on PPD devices. 相似文献
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A design of an inverse U-shape buried doping in a pinned photodiode(PPD) of CMOS image sensors is proposed for electrical crosstalk suppression between adjacent pixels.The architecture achieves no extra fill factor consumption,and proper built-in electric fields can be established according to the doping gradient created by the injections of the extremely low P-type doping buried regions in the epitaxial layer,causing the excess electrons to easily drift back to the photosensitive area rarely with a diffusion probability; the overall junction capacitance and photosensitive area extensions for a full well capacity(FWC) and internal quantum efficiency(IQE) improving are achieved by the injection of a buried N-type doping.By considering the image lag issue,the process parameters of all the injections have been precisely optimized.Optical simulation results based on the finite difference time domain method show that compared to the conventional PPD,the electrical crosstalk rate of the proposed architecture can be decreased by 60%–80% at an incident wavelength beyond 450 nm,IQE can be clearly improved at an incident wavelength between 400 and 600 nm,and the FWC can be enhanced by 107.5%.Furthermore,the image lag performance is sustained to a perfect low level.The present study provides important guidance on the design of ultra high resolution image sensors. 相似文献
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In order to increase collection efficiency and eliminate image lag,multi n-type implants were introduced into the process of a pinned-photodiode.For the purpose of improving the collection efficiency, multi n-type implants with different implant energies were proposed,which expanded the vertical collection region. To reduce the image lag,a horizontal gradient doping concentration eliminating the potential barrier waalso formed by multi n-type implants.The simulation result shows that the collection efficiency can be improved by about 10%in the long wavelength range and the density of the residual charge is reduced from 2.59×109 to 2.62×107 cm-3. 相似文献
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Wenjing Xu Jie Chen Zhangqu Kuang Li Zhou Ming Chen Chengbin Zhang 《半导体学报》2022,43(8):082401-1-082401-7
This paper presents a low-power high-quality CMOS image sensor (CIS) using 1.5 V 4T pinned photodiode (4T-PPD) and dual correlated double sampling (dual-CDS) column-parallel single-slope ADC. A five-finger shaped pixel layer is proposed to solve image lag caused by low-voltage 4T-PPD. Dual-CDS is used to reduce random noise and the nonuniformity between columns. Dual-mode counting method is proposed to improve circuit robustness. A prototype sensor was fabricated using a 0.11 µm CMOS process. Measurement results show that the lag of the five-finger shaped pixel is reduced by 80% compared with the conventional rectangular pixel, the chip power consumption is only 36 mW, the dynamic range is 67.3 dB, the random noise is only 1.55 e–rms, and the figure-of-merit is only 1.98 e–·nJ, thus realizing low-power and high-quality imaging. 相似文献
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优化传输栅下电势分布改善四管像素的电荷转移效率 总被引:3,自引:3,他引:0
提出了一种通过优化传输栅下沿电荷转移路径的电势分布来提高电荷转移效率的方法。通过使用非均匀掺杂传输管沟道,形成了传输管沟道内部的电势分布梯度。通过对R1区与传输栅的交叠长度,R1区的掺杂剂量,防穿通注入(APT)与传输栅交叠长度的调整,减小了传输管沟道与箝位光电二极管(PPD)连接区域的电子势垒与电子势阱,增强了二者的电势连接。仿真结果显示,剩余电荷占总电荷的比例由1/104减小至1/107,转移时间由500 ns缩短为110 ns。这意味电荷转移效率得到了提高。 相似文献
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设计了一款高帧频高灵敏度双通道16元线列PIN-CMOS图像传感器。相对于传统的pn结光电二极管,PIN光电二极管具有结电容小和量子效率高的优点,可以降低CTIA像素电路的噪声,提高信噪比;同时采用一种新型的相关双采样电路结构,可以在边积分边读出的模式下实现相关双采样,抑制像素复位带来的KTC噪声。基于0.35μm PIN-CMOS工艺进行了线列CMOS图像传感器流片,并对器件的光电性能进行了测试。测试结果表明:在像元尺寸为90μm×90μm,700nm波长下,器件灵敏度达3000V/(lx·s),量子效率为96%;在40kHz高帧频、0.05lx光照条件下器件信噪比为7,适于弱信号下的高速探测。 相似文献
20.
Xi Lu Changju Liu Pinyuan Zhao Yu Zhang Bei Li Zhenzhen Zhang Jiangtao Xu 《半导体学报》2023,44(11):114104-1-114104-8
CMOS image sensors produced by the existing CMOS manufacturing process usually have difficulty achieving complete charge transfer owing to the introduction of potential barriers or Si/SiO2 interface state traps in the charge transfer path, which reduces the charge transfer efficiency and image quality. Until now, scholars have only considered mechanisms that limit charge transfer from the perspectives of potential barriers and spill back effect under high illumination condition. However, the existing models have thus far ignored the charge transfer limitation due to Si/SiO2 interface state traps in the transfer gate channel, particularly under low illumination. Therefore, this paper proposes, for the first time, an analytical model for quantifying the incomplete charge transfer caused by Si/SiO2 interface state traps in the transfer gate channel under low illumination. This model can predict the variation rules of the number of untransferred charges and charge transfer efficiency when the trap energy level follows Gaussian distribution, exponential distribution and measured distribution. The model was verified with technology computer-aided design simulations, and the results showed that the simulation results exhibit the consistency with the proposed model. 相似文献