Nitrogen implantation in GaAs1−xPx (x=0.4; 0.65)

Nitrogen ions were implanted in GaAs_1−xP_x (x=0.4; 0.65) at room temperature at various doses from 5×10¹² cm⁻² to 5×10¹⁵ cm⁻² and annealed at temperatures from 600°C up to 950°C using a sputtered SiO₂ encapsulation to investigate the possibility of creating isoelectronic traps by ion implantation. Photoluminescence and channeling measurements were performed to characterize implanted layers. The effects of damage induced by optically inactive neon ion implantation on photoluminescence spectrum were also investigated. By channeling measurements it was found that damage induced by nitrogen implantation is removed by annealing at 800°C. A nitrogen induced emission intensity comparable to the intensity of band gap emission for unimplanted material was observed for implanted GaAs_0.6P_0.4 after annealing at 850°C, while an enhancement of the emission intensity by a factor of 180 as compared with an unimplanted material was observed for implanted GaAs_0.35P_0.65 after annealing at 950°C. An anomalous diffusion of nitrogen atoms was found for implanted GaAs_0.6P_0.4 after annealing at and above 900°C.     

Radiation hardening in Zircaloy-2

Annealed Zircaloy-2 was exposed to fast neutron fluences in the range 0.46 to 6.71 × 10¹⁹ nvt, E > 1 MeV, at temperatures of up to 450°C. The level of radiation hardening, as measured by the change in yield stress after irradiation, increased with irradiation temperature at least up to 380°C.

Post-irradiation annealing treatments showed that radiation anneal hardening occurred after irradiation at temperatures up to 325°C. After irradiation at 375°C, annealing treatments did not produce a further increase in the yield stress above that produced by the irradiation, however the radiation hardening persisted to 450°C. The uniform strain tended to decrease as the amount of radiation anneal hardening increased and as the fast neutron fluence increased above ～5 × 10¹⁸ nvt, E > 1 MeV.

The effects of irradiation temperature and post-irradiation annealing on the yield stress and on uniform strain are explained in terms of the strengthening of radiation damage defect clusters and their increased effectiveness to impede dislocation movement.     

Development of conductive transparent indium tin oxide (ITO) thin films deposited by direct current (DC) magnetron sputtering for photon-STM applications

Highly conductive and transparent indium tin oxide (ITO) thin films, each with a thickness of 100 nm, were deposited on glass and Si(100) by direct current (DC) magnetron sputtering under an argon (Ar) atmosphere using an ITO target composed of 95% indium oxide and 5% tin oxide for photon-STM use. X-ray diffraction, STM observations, resistivity and transmission measurements were carried out to study the formation of the films at substrate temperatures between 40 and 400 °C and the effects of thermal annealing in air between 200 and 400 °C for between1 and 5 h. The film properties were highly dependent on deposition conditions and on post-deposition film treatment. The films deposited under an Ar atmosphere pressure of ∼1.7×10^-3 Torr by DC power sputtering (100 W) at substrate temperatures between 40 and 400 °C exhibited resistivities in the range 3.0–5.7×10^-5 Ω m and transmissions in the range 71–79%. After deposition and annealing in air at 300 °C for 1 h, the films showed resistivities in the range 2.9–4.0×10^-5 Ω m and transmissions in the range 78–81%. Resistivity and transmission measurements showed that in order to improve conductive and transparent properties, 2 h annealing in air at 300 °C was necessary. X-ray diffraction data supported the experimental measurements of resistivity and transmission on the studies of annealing time. The surface roughness and film uniformity improve with increasing substrate temperature. STM observations found the ITO films deposited at a substrate temperature of 325 °C, and up to 400 °C, had domains with crystalline structures. After deposition and annealing in air at 300 °C for 1 h the films still exhibited similar domains. However, after deposition at substrate temperatures from 40 °C to 300 °C, and annealing in air at 300 °C for 1 h, the films were shown to be amorphous. More importantly, the STM studies found that the ITO film surfaces were most likely to break after deposition at a substrate temperature of 325 °C and annealing in air at 300 °C for 2 or 3 h. Such findings give some inspiration to us in interpreting the effects of annealing on the improvement of conductive and transparent properties and on the transition of phases. In addition, correlations between the conductive/transparent properties and the phase transition, the annealing time and the phase transition, and the conductive/transparent properties and the annealing time have been investigated. Received: 10 July 2000 / Accepted: 27 October 2000 / Published online: 9 February 2001     

Mössbauer and XRD Comparative Study of Host Rock and Iron Rich Mineral Samples from Paz del Rio Iron Ore Mineral Mine in Colombia

The local environment of implanted ¹¹¹Ag (t _1/2 = 7.45 d) in single-crystalline [0001] ZnO was evaluated by means of the perturbed angular correlation (PAC) technique. Following the 60 keV low dose (1 × 10¹³ cm⁻²) ¹¹¹Ag implantation, the PAC measurements were performed for the as-implanted state and following 30 min air annealing steps, at temperatures ranging from 200 to 1050°C. The results revealed that 42% of the probes are located at defect-free S_Zn sites (ν _Q ∼ 32 MHz, η = 0) in the as-implanted state and that this fraction did not significantly change with annealing. Moreover, a progressive lattice recovery in the near vicinity of the probes was observed. Different EFGs assigned to point defects were furthermore measured and a general modification of their parameters occurred after 600°C. The 900°C annealing induced the loss of 30% of the ¹¹¹Ag atoms, 7% of which were located in regions of high defects concentration.     

Trap characterization for Bi4Ti3O12 thin films by thermally stimulated currents

Thermally stimulated current (TSC) measurements performed in the 100 K–400 K temperature range on Bi₄Ti₃O₁₂ (BiT) thin films annealed at 550 °C and 700 °C had revealed two trapping levels having activation energies of 0.55 eV and 0.6 eV. The total trap concentration was estimated at 10¹⁵ cm⁻³ for the samples annealed at 550 °C and 3×10¹⁵ cm⁻³ for a 700 °C annealing and the trap capture cross-section was estimated about 10⁻¹⁸ cm². From the temperature dependence of the dark current in the temperature range 20 °C–120 °C the conduction mechanism activation energy was found to be about 0.956–0.978 eV. The electrical conductivity depends not only on the sample annealing temperature but also whether the measurement is performed in vacuum or air. The results on the dark conductivity are discussed considering the influence of oxygen atoms and oxygen vacancies. Received: 28 January 1998 / Accepted: 8 January 1999 / Published online: 5 May 1999     

Nitrogen centers in GaP produced by hot implantation

Backscattering yields of 1.5 MeV?He⁺ ions and low temperature photoluminescence (PL) spectra were measured in GaP crystals implanted with 200 keV?N⁺ ions as functions of ion-dose, temperature during implantation and annealing temperature after implantation. Backscattering results indicate that hot implantation at 500°C greatly reduces radiation damage. The PL intensities of NN lines become maximum in the sample implanted with N⁺ ions of 3 × 10¹⁴cm^?2 at 500°C, and annealed at 1000°C for 1 hr with aluminum glass. The PL intensity is comparable to that of the nitrogen-doped sample during liquid phase epitaxy which is widely accepted as the best method of introducing nitrogen into GaP crystals. In the case of 500°C—hot implantation, the radiation damage produced during implantation is annealed out at 700 ~ 800°C and the implanted nitrogen substitutes for the phosphorous sites after annealing at 900 ~ 1000°C. Some kinds of defects or strains remain around the NN centers even in implanted samples with a maximum PL efficiency. These defects or strains don't seem to reduce the PL efficiency. In the case of room temperature implantation, PL efficiency decreases to one-hundredth or one-thousandth due to the formation of the non-crystalline state compared with hot implantation.     

Pac studies of neutron irradiated Li2HfO3

The influence of defects, created in the reaction⁶Li (n,α)³H on the perturbed angular correlation (PAC) of 133–482 keV cascade of¹⁸¹Ta in Li HfO₃ has been studied. Two different types of defects were identified. Its concentration remains constant during the isochronal annealing up to 300°C. 10 min annealing at 350°C leads to its disappearing.     

Electrical activation of boron-implanted silicon during rapid thermal annealing

The electrical activation of boron implanted in crystalline and preamorphized silicon has been investigated during rapid thermal annealing performed with halogen lamps. Samples implanted with B⁺ fluences ranging between 5×10¹⁴ and 1×10¹⁶cm⁻² and treated at temperatures between 900°C and 1100°C have been examined. When boron is implanted in crystalline Si, activation proceeds slowly atT<1000°C and cannot be completed in times typical of rapid thermal annealing (a few tens of seconds). The analysis of carrier profiles indicates that the time constant for activation is strongly affected by local damage and dopant concentration. If the total boron concentration exceeds equilibrium solubility, precipitation occurs concomitant to activation, even if the substitutional boron fraction is still lower than equilibrium solubility. ForT≧1000°C complete activation is obtained in times of about 10 s. In the case of preamorphized Si the activation occurs very quickly, during the recrystallization of the amorphous layer, for all the examined temperatures.     

Recrystallization of amorphous nanotracks and uniform layers generated by swift-ion-beam irradiation in lithium niobate

The thermal annealing of amorphous tracks of nanometer-size diameter generated in lithium niobate (LiNbO₃) by Bromine ions at 45 MeV, i.e., in the electronic stopping regime, has been investigated by RBS/C spectrometry in the temperature range from 250°C to 350°C. Relatively low fluences have been used (<10¹² cm⁻²) to produce isolated tracks. However, the possible effect of track overlapping has been investigated by varying the fluence between 3×10¹¹ cm⁻² and 10¹² cm⁻². The annealing process follows a two-step kinetics. In a first stage (I) the track radius decreases linearly with the annealing time. It obeys an Arrhenius-type dependence on annealing temperature with activation energy around 1.5 eV. The second stage (II) operates after the track radius has decreased down to around 2.5 nm and shows a much lower radial velocity. The data for stage I appear consistent with a solid-phase epitaxial process that yields a constant recrystallization rate at the amorphous-crystalline boundary. HRTEM has been used to monitor the existence and the size of the annealed isolated tracks in the second stage. On the other hand, the thermal annealing of homogeneous (buried) amorphous layers has been investigated within the same temperature range, on samples irradiated with Fluorine at 20 MeV and fluences of ∼10¹⁴ cm⁻². Optical techniques are very suitable for this case and have been used to monitor the recrystallization of the layers. The annealing process induces a displacement of the crystalline-amorphous boundary that is also linear with annealing time, and the recrystallization rates are consistent with those measured for tracks. The comparison of these data with those previously obtained for the heavily damaged (amorphous) layers produced by elastic nuclear collisions is summarily discussed.     

Structural state of III nitride layers implanted with erbium ions

The defect structure of AlGaN/GaN superlattices and GaN layers grown through vapor-phase epitaxy from organometallic compounds is investigated using x-ray diffraction analysis before and after implantation with erbium ions at an energy of 1 MeV and a dose of 3 × 10¹⁵ cm^?2, as well as after annealing. For a superlattice with a total thickness larger than the implantation depth, the satellites of the superlattice region strained under the action of ions disappear in the x-ray diffraction pattern after annealing at temperatures higher than 900°C. This suggests that the radiation-induced defects responsible for the positive deformation in the layer are annealed at these temperatures. However, annealing even at a temperature of 1050°C does not lead to complete recovery of the initial state and the positive deformation in the remaining regions is caused by residual defects. An analysis of the x-ray diffraction patterns demonstrates that, in samples with thin superlattices located at the depth corresponding to maximum radiation damage, the periodic structure that disappears after implantation at a dose of 3 × 10¹⁵ cm^?2 is not recovered even after annealing at a temperature of 1050°C. This inference is confirmed by the results of examinations with an electron microscope.     

Secondary defects in low-energy As-implanted Si

14 /cm² dose of As ions followed by both isochronal and isothermal annealing. The elementary defects generated first during solid-phase epitaxial recovery of implantation-induced amorphous layers at temperatures of 550 °C and/or 600 °C are {311} defects 2–3 nm long. They are considered to be transformed into {111} and {100} defects after annealing at temperatures higher than 750 °C. These secondary defects show the opposite annealing behavior to the dissolution and growth by the difference of their depth positions at 800 °C. This phenomenon is explained by the diffusion of self-interstitials contained in defects. With regard to the formation and dissolution of defects, there is no significant difference between the effects of rapid thermal annealing (950 °C for 10 s) and furnace annealing (800 °C for 10 min). Received: 14 November 1997/Accepted: 16 November 1997     

Plasticization of neutron-irradiated LiF crystals upon thermal stimulation of a single-system dislocation glide

It has been shown that post-radiation annealing of LiF crystals irradiated by high neutron fluences (10¹⁵–10¹⁸ neutrons/cm²) at comparative low temperatures (300–400°C) creates optimal conditions for single-system dislocation glide, which favors a complete recovery of the plasticity with conservation of a significant fraction of radiation hardening.     

Hot electron studies of lattice damage created in silicon by implantation of 2.8 MeV protons

Abstract

In this paper we report the results of a study of the annealing properties of the ionized defect density associated with the damage created in the silicon lattice by implantation of 2.8 MeV protons at room temperature. In particular, the annealing of damage created by implanting to a level of 4.43 × 10¹² protons/cm² is reported. The resulting isochronal annealing curve covered the temperature range from 70°C to 460°C. Two major annealing stages are discussed, one a broad stage between 70°C to 200°C and the other an abrupt annealing stage between 440°C to 460°C. Between the temperature range 200°C to 440°C the number of ionized defects remained relatively constant. Above 460°C no detectable effects of the proton implantation remained.     

Effect of annealing on structure and magnetic properties of Fe-N and Fe-Ti-N thin films

The structure and magnetic properties of Fe-N and Fe-Ti-N films have been studied as a function of annealing temperature T_a with a transmission electron microscope and a vibrating sample magnetometer. The as-prepared Fe-N films consist of the γ^′-Fe₄N and α^′′-Fe₁₆N₂ phases, and the Fe-Ti-N films are composed of the γ^′-Fe₄N, α^′′-Fe₁₆N₂, and TiN phases. The structural changes with annealing temperature in the Fe-N films are distinct. The α^′′-Fe₁₆N₂ decomposes into α+γ^′ phases in the Fe-N film annealed at about 300 °C, and it disappears in the film annealed at 350 °C. Annealing of the Fe-Ti-N films shows no structural changes between room temperature (RT) and 500 °C. The saturation magnetization 4πM_S and coercivity H_c of the Fe-N films change drastically with the annealing temperature T_a, whereas those of the Fe-Ti-N films do not change with T_a up to 500 °C. These results indicate that the additon of Ti may improve the thermal stability of Fe-N films. Recieved: 6 Juli 1998 / Accepted: 19 Oktober 1998 / Published online: 10 March 1999     

CW CO2-laser annealing of arsenic implanted silicon

CW CO₂-laser annealing of arsenic implanted silicon was investigated in comparison with thermal annealing. Ion channeling, ellipsometry, and Hall effect measurements were performed to characterize the annealed layers and a correlation among the different methods was made. The laser annealing was done with power densities of 100 to 640 W cm⁻² for 1 to 20 s. It was found that the lattice disorder produced during implantation can be completely annealed out by laser annealing with a power density of 500 W cm⁻² and the arsenic atoms are brought on lattice sites up to 96±2%. The maximum sheet carrier concentration of 6×10¹⁵ cm⁻² was obtained for 1×10¹⁶ cm⁻² implantation after laser annealing, which was up to 33% higher than that after thermal annealing at 600 to 900°C for 30 min.     

High concentration effects of ion implanted boron in silicon

The diffusion behaviour of implanted boron in silicon was investigated using the¹⁰B(n,α)⁷ Li nuclear reaction. An anomalous behavior with a strong reduction of the diffusivity above an effective solubility limit at 1.5×10¹⁹, 6×10¹⁹, and 1.1×10²⁰ cm⁻³ was found for annealing temperatures of 800, 900, and 1,000°C, respectively.     

Implantation doping of germanium with Sb,As, and P

The ions of Sb, As, and P have been implanted into germanium at energies ranging from 200 keV to 700 keV. Annealing was performed at 400°C, 550°C, and 650°C. The doping profile was determined by differentialCV-measurements. Strong outdiffusion (80%) and diffusion into the bulk material was observed after annealing. The remaining doping concentration and the diffusion constants were determined by a computer fit at 650°C. We foundD _Sb=1.8×10⁻¹³ cm²/s,D _As=9×10⁻¹⁴ cm²/s andD _P=4×10⁻¹⁴ cm²/s. Lower values of the diffusion constant were determined when the samples were covered with a SiO₂ layer.     

Annealing characteristics of highly doped ion implanted phosphorus layers in silicon

A combination of sheet resistance, stripping and Hall effect measurements have been made on phosphorus layers implanted into silicon at 40 and 100 keV with doses between 1 × 10¹⁵ and 5 × 10¹⁶ atoms/cm². The implants were made at room temperature and 450°C. After annealing at 650°C, the profile of electrically active phosphorus following a high dose room temperature implant, was found to be flat topped with a concentration of approximately 5 × 10²⁰/cm³. Very little diffusion occurred when annealing to 850°C where the free electron concentration increased to approximately 1.5 × 10²¹/cm³. Highly doped channeled tails were found when implanting at 450°C along the 〈110〉 direction and damage was being continuously annealed out preventing the formation of an amorphous phase. The rapid diffusion of the profile into the bulk found when annealing between 650°C and 850°C was speculated to be due to the presence of a dense dislocation entanglement in these layers following a hot implant.     

57Fe conversion electron Mössbauer spectrometric study of boron and carbon ion implanted irons

Amorphous layers produced at the surface of iron by B⁺ and C⁺ implantation (50 kV, 1×10¹⁸ ions cm⁻²) were analyzed by CEMS. The CEM spectrum of B⁺ implanted layer was composed of broad doublet and sextet. Spread hyperfine field distribution, P(H), indicates the formation of extremely disordered FeB layer. Annealing at 400°C brought about precipitation of FeB, which was converted to Fe₂B by annealing at 500°C. The P(H) for C⁺ implanted iron was resolved to 3 subpeaks with H values of 11.0, 18.0 and 22.5 T. The amorphous FeC phase was strongly correlated to crystalline Fe₅C₂ and Fe₂C, which precipitated at 300°C and were transformed into Fe₃C at 500°C. The amorphous layer disappeared by annealing at 600°C.     

Mg+注入对GaN晶体辐射损伤的研究

在蓝宝石衬底上通过金属有机物化学气相沉积(metal-organic chemical vapor deposition，MOCVD)方法外延生长的GaN薄膜具有良好的结晶品质，χ_min达到2.00%. 结合卢瑟福背散射/沟道(Rutherford backscattering/channeling，RBS/C)和高分辨X射线衍射(high-resolution X-ray diffraction，HXRD)的实验测量，研究了不同剂量和不同角度Mg⁺注入GaN所造成的辐射损伤. 实验结果表明，随注入剂量的增大，晶体的辐射损伤也增大，注入剂量在1×10¹⁵atom/cm²以下，χ_min小于4.78%，1×10¹⁶atom/cm²是Mg⁺注入GaN的剂量阈值，超过这个阈值，结晶品质急剧变差，χ_min达到29.5%；随机注入比沟道注入的辐射损伤大，且在一定范围内随注入角度的增大，损伤也增大，在4×10¹⁵atom/cm²剂量下偏离〈0001〉沟道0°，4°，6°，9°时的χ_min(%)分别为6.28，8.46，10.06，10.85；经过700℃/10min+1050℃/20s两步退火和1000℃/30s高温快速退火后，晶体的辐射损伤都有一定程度的恢复，而且1000℃/30s高温快速退火的效果更好，晶体的辐射损伤可以得到更好的恢复. 关键词： GaN 卢瑟福被散射/沟道 高分辨X射线衍射 辐射损伤