Synergistic effects of neutron and gamma ray irradiation of a commercial CHMOS microcontroller

This paper presents the experimental results of a combined irradiation environment of neutron and gamma rays on 80C196KC20,which is a 16-bit high performance member of the MCS96 microcontroller family.The electrical and functional tests were made in three irradiation environments:neutron,gamma rays,combined irradiation of neutron and gamma rays.The experimental results show that the neutron irradiation can affect the total ionizing dose behaviour.Compared with the single radiation environment,the microcontroller exhibits considerably more severe degradation in neutron and gamma ray synergistic irradiation.This phenomenon may cause a significant hardness assurance problem.     

10位CMOS数模转换器在中子和γ混合环境下的综合辐射效应

研究了在反应堆中子和γ射线综合辐照环境下CMOS工艺10位数模转换器（DAC）的辐射效应。通过对DAC在γ辐射环境、中子辐射环境、中子和γ混合辐射环境以及中子预辐照后进行γ射线辐照下的效应对比发现,在中子和γ混合辐射环境下会产生电离总剂量效应加剧现象,即一定混合程度的中子和γ同时辐照会增强CMOS器件的辐射效应。     

10位CMOS数模转换器在中子和γ混合环境下的综合辐射效应

研究了在反应堆中子和γ射线综合辐照环境下CMOS工艺10位数模转换器(DAC)的辐射效应。通过对DAC在γ辐射环境、中子辐射环境、中子和γ混合辐射环境以及中子预辐照后进行γ射线辐照下的效应对比发现,在中子和γ混合辐射环境下会产生电离总剂量效应加剧现象,即一定混合程度的中子和γ同时辐照会增强CMOS器件的辐射效应。     

沟道宽长比对深亚微米NMOSFET总剂量辐射与热载流子损伤的影响

本文对不同沟道宽长比的NMOSFET进行了辐射与热载流子应力的试验研究,电参数测量数据表明: 虽然两种损伤的原理具有相似之处,但总剂量辐射与热载流子的损伤表现形式及对沟道宽长比的依赖关系均不同.辐射损伤的最大特点是关态泄漏电流增加,并且损伤与沟道宽长比成反比;热载流子损伤会造成跨导等参数的显著变化,但关态泄漏电流无明显改变,并且损伤随沟道长度与宽度的减小而增大.从二者基本原理出发,结合宏观参数的表现形式,文中对辐射与热载流子损伤进行了详细分析,认为造成二者损伤差异及对沟道宽长比不同依赖关系的原因在于辐射与热载子注入引入的陷阱电荷部位不同.因此对两种损伤进行加固时应重点从器件设计尺寸、结构等方面综合考虑.     

The effects of fast neutron irradiation on oxygen in Czochralski silicon

The effects of fast neutron irradiation on oxygen atoms in Czochralski silicon (CZ-Si) are investigated systemically by using Fourier transform infrared (FTIR) spectrometer and positron annihilation technique (PAT). Through isochronal annealing, it is found that the trend of variation in interstitial oxygen concentration ([O_i]) in fast neutrons irradiated CZ-Si fluctuates largely with temperature increasing, especially between 500 and 700℃. After the CZ-Si is annealed at 600℃, the V₄ appearing as three-dimensional vacancy clusters causes the formation of the molecule-like oxygen clusters, and more importantly these dimers with small binding energies (0.1--1.0eV) can diffuse into the Si lattices more easily than single oxygen atoms, thereby leading to the strong oxygen agglomerations. When the CZ-Si is annealed at temperature increasing up to 700℃, three-dimensional vacancy clusters disappear and the oxygen agglomerations decompose into single oxygen atoms (O) at interstitial sites. Results from FTIR spectrometer and PAT provide an insight into the nature of the [O_i] at temperatures between 500 and 700℃. It turns out that the large fluctuation of [O_i] after short-time annealing from 500 to 700℃ results from the transformation of fast neutron irradiation defects.     

Investigation solution to improve the irradiation reliability of SOI NMOSFET

A solution is developed to improve the irradiation reliability of SOI NMOSFET(N-type Metal Oxide Semiconductor Field Effect Transistor).This solution,including SOI(Silicon On Insulator)wafer hardening and transistor structure hardening,protects the SOI circuit from total dose irradiation effect.     

Investigation on a solution to improve the irradiation reliability of SOI NMOSFET

A solution is developed to improve the irradiation reliability of SOI NMOSFET (N-type Metal Oxide Semiconductor Field Effect Transistor). This solution, including SOI (Silicon On Insulator) wafer hardening and transistor structure hardening, protects the SOI circuit from total dose irradiation effect.     

Effect of neutron irradiation on optical spectra of α-Al2O3 and α-SiO2 single crystals

Using two crystal dielectrics (α-Al₂O₃ and α-SiO₂) as examples, the author studied the effect of large neutron-radiation doses on their optical spectra. The variation in IR spectra in the region of α-SiO₂ stretching and deformation vibrations is investigated; its relation to changes in the structure of the irradiated crystal is discussed. Institute of Nuclear Physics, Academy of Sciences of the Republic of Uzbekistan, Ulugbek Settlement, Tashkent, 702132. Translated from Zhurnal Prikladnoi Spektroskopii, Vol. 66, No. 1, pp. 135–138, January–February, 1999.     

双极线性稳压器电离辐射剂量率效应及其损伤分析

为了对双极线性稳压器在电离辐射环境下损伤变化特征及其剂量率效应进行研究,选择一组器件进行⁶⁰Co γ高低剂量率的辐照和退火试验. 结果表明线性稳压器的输出电压、最大负载电流、线性调整率、压降电压等多个关键参数都有不同程度的蜕变. 且各器件在高低剂量率下的辐照响应略有不同,表现出不同的剂量率效应. 文中通过多种形式的测试结果分析,系统地讨论了各参数变化的原因及其内部各模块对稳压器功能的影响. 结合电离损伤退火特性,探讨了各剂量率效应形成的原因. 这不但对工程应用考核提供了参考,而且为设 关键词： 双极线性稳压器 总剂量效应 剂量率效应 辐射损伤     

质子与中子辐照对电荷耦合器件暗信号参数的影响及其效应分析

对科学级电荷耦合器件(charge-coupled device, CCD)进行了质子和中子辐照试验及退火试验, 应用蒙特卡洛方法计算了质子和中子在CCD中的能量沉积, 分析了器件的辐射损伤机理. 仿真计算了N⁺埋层内沉积的位移损伤剂量, 辐照与退火试验过程中主要考察暗信号的变化规律. 研究结果显示, 质子与中子辐照均会引发暗信号退化, 其退化的规律与位移损伤剂量变化一致; 退火后, 质子辐照所致CCD暗信号大幅度恢复, 其体暗信号增加量占总暗信号增加量的比例最多为22%; 中子辐照引发的暗信号增长主要为体暗信号. 质子和中子在N⁺埋层产生相同位移损伤剂量的情况下, 两者导致的体暗信号增长量相同, 质子与中子辐照产生的体缺陷对体暗信号增长的贡献是同质的.     

Experimental study on radiation effects in floating gate read-only-memories and static random access memories

Radiation effects of the floating gate read-only-memory (FG ROM) and the static random access memory (SRAM) have been evaluated using the 14~MeV neutron and 31.9MeV proton beams and Co-60 $\gamma $-rays. The neutron fluence, when the first error occurs in the FG ROMs, is at least 5 orders of magnitude higher than that in the SRAMs, and the proton fluence, 4 orders of magnitude higher. The total dose threshold for Co-60 $\gamma $-ray irradiation is about 10$^{4}$~rad (Si) for both memories. The difference and similarity are attributed to the structure of the memory cells and the mechanism of radiation effects. It is concluded that the FG ROMs are more reliable as semiconductor memories for storing data than the SRAMs, when they are used in the satellites or space crafts exposed to high energy particle radiation.     

Synergistic effects of total ionizing dose on single event upset sensitivity in static random access memory under proton irradiation

Nitrogen plasma passivation （NPP） on （111） germanium （Ge） was studied in terms of the interface trap density, roughness, and interfacial layer thickness using plasma-enhanced chemical vapor deposition （PECVD）. The results show that NPP not only reduces the interface states, but also improves the surface roughness of Ge, which is beneficial for suppressing the channel scattering at both low and high field regions of Ge MOSFETs. However, the interracial layer thickness is also increased by the NPP treatment, which will impact the equivalent oxide thickness （EOT） scaling and thus degrade the device performance gain from the improvement of the surface morphology and the interface passivation. To obtain better device performance of Ge MOSFETs, suppressing the interfacial layer regrowth as well as a trade-off with reducing the interface states and roughness should be considered carefully when using the NPP process.     

基于环形栅和半环形栅N沟道金属氧化物半导体晶体管的总剂量辐射效应研究

在商用0.35 μm互补金属氧化物半导体工艺上制备了两种栅氧化层厚度(t_ox)的条形栅、环形栅和半环形栅N沟道金属氧化物半导体 (n-channel metal oxide semiconductor, 简记为NMOS) 晶体管, 并进行了2000 Gy(Si)的总剂量辐射效应实验. 实验结果显示, 栅氧厚度对阈值电压漂移的影响大于栅氧厚度的3次方. 对于t_ox为11 nm的低压NMOS晶体管, 通过环形栅或半环形栅的加固方式能将其抗总剂量辐射能力从300 Gy(Si)提高到2000 Gy(Si)以上; 而对于t_ox为26 nm的高压NMOS晶体管, 通过环栅或半环栅的加固方式, 则只能在低于1000 Gy(Si)的总剂量下, 一定程度地抑制截止漏电流的增加. 作为两种不同的版图加固方式, 环形栅和半环形栅对同一t_ox的NMOS器件加固效果类似, 环形栅的加固效果略优于半环形栅. 对于上述实验结果, 进行了理论分析并阐释了产生这些现象的原因. 关键词： 环形栅 半环形栅 总剂量 辐射效应     

The effect of thermal reactor neutron irradiation on semi-insulating GaN

Semi-insulating Gallium nitride was irradiated by fast and thermal neutrons with fluences from 10¹⁴ to 10¹⁶ n/cm². Depth-resolved cathodoluminescence spectroscopy was used to determine defects changes before and after irradiation. The results revealed two kinds of defects affected near-band emission recombination from two opposite directions. One was attributed to irradiation-induced N vacancies that contribute to near-band emission recombination. Another was attributed to irradiation-induced deep level defects that contribute to sub-band gap recombination and thus decrease the near-band emission recombination.     

光电倍增管对14 MeV脉冲中子的直照响应

采用ING-103型DPF脉冲中子源产生的14.1 MeV脉冲中子对EMI两个不同型号的光电倍增管EMI-9815B和EMI-9850B进行了直照实验。针对DPF脉冲中子源产生中子脉冲的同时也会产生X射线脉冲的特点,采取了飞行时间法及吸收衰减法来消除X射线对中子脉冲的干扰。利用中子及X射线速度的差异,将光电倍增管放置在离源较远的测点位置,测得了X射线脉冲和中子脉冲时间上错开的双峰波形。通过在辐射通道内添加5 cm厚的铅吸收体有效地抑制了X射线峰,在离源较近的测量位置测到了干净的脉冲中子波形。根据实测波形,得到的光电倍增管EMI-9815B和EMI-9850B中子直照灵敏度分别为10-13与10-15量级,该结果与理论计算结果在量级上一致。     

55 nm硅-氧化硅-氮化硅-氧化硅-硅闪存单元的γ射线和X射线电离总剂量效应研究

基于~(60)Co-γ射线和10 keV X射线辐射源,系统地研究了55 nm硅-氧化硅-氮化硅-氧化硅-硅闪存单元的电离总剂量效应,并特别关注其电学特性退化的规律与物理机制.总剂量辐照引起闪存单元I-V特性曲线漂移、存储窗口变小和静态电流增大等电学特性的退化现象,并对其数据保持能力产生影响.编程态闪存单元的I_d-V_g曲线在辐照后显著负向漂移,而擦除态负向漂移幅度较小.对比两种射线辐照,擦除态的I_d-V_g曲线漂移方向不同.相比于擦除态,富含存储电子的编程态对总剂量辐照更为敏感;且相比于~(60)Co-γ射线,本文观测到了显著的X射线剂量增强效应.利用TCAD和Geant 4工具,从能带理论详细讨论了55 nm硅-氧化硅-氮化硅-氧化硅-硅闪存单元电离总剂量效应和损伤的物理机制,并模拟和深入分析了X射线的剂量增强效应.     

铁电存储器~(60)Co γ射线及电子总剂量效应研究

以型号为FM28 V100的铁电存储器为研究对象,进行了~(60)Co γ射线和2 Me V电子辐照实验.研究了铁电存储器不同工作方式、不同辐射源下的总剂量辐射损伤规律,用J-750测试部分直流参数和交流参数,分析了存储器敏感参数的变化规律.实验结果表明:对动态、静态加电、静态不加电三种工作方式下的结果进行比较.其中静态加电工作方式下产生的陷阱电荷最多,是存储器最恶劣的工作方式;器件的一些电参数随总剂量发生变化,在功能失效之前部分参数已经失效;在静态加电这种最恶劣的工作方式下,得到~(60)Co γ射线比电子造成更加严重的辐照损伤.     

Analysis of the relationship between neutron dose and Cerenkov photons under neutron irradiation through Monte Carlo method

To theoretically explore the feasibility of neutron dose characterized by Cerenkov photons, the relationship between Cerenkov photons and neutron dose in a water phantom was quantified using the Monte Carlo toolkit Geant4. Results showed that the ratio of the neutron dose deposited by secondary electrons above Cerenkov threshold energy to the total neutron dose is approximately a constant for monoenergetic neutrons from 0.01 eV to 100 eV. With the initial neutron beam energy from 0.01 eV to 100 eV, the number of Cerenkov photons has a good correlation with the total neutron dose along the central axis of the water phantom. The changes of neutron energy spectrum and mechanism analysis also explored at different depths. And the ratio of total neutron dose to the intensity of Cerenkov photons is independent of neutron energy for neutrons from 0.01 eV to 100 eV. These findings indicate that Cerenkov radiation also has potential in the application of neutron dose measurement in some specific fields.     

Radiation damage in triglycine sulphate due to fast neutron irradiation

Abstract

The change in electrical properties of TGS crystals due to induced defects created by fast neutron irradiation of two different energies (2 and 14 MeV) and different integrated neutron fluxes have been studied in the vicinity of phase transition. It is observed that the electrical conductivity increases with increase of neutron fluence up to 1.7 × 10¹⁰ n · cm^?2 and the values of the relative change of electrical conductivity in case of 2 MeV are higher than that of 14 MeV neutrons at the same neutron fluence (φ)     

一种252Cf裂变中子源的中子、γ射线飞行时间谱测量新方法

 针对²⁵²Cf快中子、γ射线的飞行时间谱测量要求,提出并建立一种基于高速数据采集卡的新型测量系统。采用1 GHz高速A/D转换单元和现场可编程门阵列高速处理单元,进行脉冲时间序列的在线检测,时间精度为1 ns。使用相关函数法,通过PC机的数据处理、互相关函数计算和数值统计等实现中子、γ射线飞行时间谱的测量。实验结果表明,该系统可以获得²⁵²Cf自发裂变中子源的中子、γ射线飞行时间谱,与经典的飞行时间谱测量方法相比较,其图谱表达及数值结果有着很高的吻合度。