The nature of the structural gradient in epoxy curing at a glass fiber/epoxy matrix interface using FTIR imaging

The curing process of an epoxide system was studied at the interface formed between a silane-coated glass fiber and an epoxy matrix. The gradient in the structure of the epoxy resin as a result of the cure process at the fiber/matrix interfacial region was monitored by FTIR imaging. For comparison, the epoxy curing at the interface formed between the epoxy resin and (a) an uncoated glass fiber and (b) a polyorganosiloxane (obtained from the silane used for the glass-fiber coating) were also monitored. Chemically specific images of the OH and the H-N-H groups near the interface region were obtained. These images suggest that there is a chemical gradient in the structure of the matrix from the fiber surface to the polymer bulk due to different conversions. The basis of the different kinetics of the curing reactions is a result of amino group inactivation at the interface. This deactivation translates into an off-stoichiometry of the reaction mixture, which is a function of the distance from the surface of the glass fiber.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Effect of filler on kinetic characteristics of glass transition in polymer composite materials

Dynamic mechanical spectroscopy and differential scanning calorimetry were used to study the effect of various fillers (carbon fiber, glass fiber, and aramid fiber) on the kinetic characteristics of glass transition in polymer composite materials based on epoxy resin. It is shown that the composite based on carbon fiber is the most fragile among the materials studied, whereas the polymer composite material based on aramid fiber exhibits the lowest rate of variation of the relaxation time above the glass-transition temperature. A relationship is determined between the heat conductivity and fragility of polymer composite materials. The effect of various fillers on the curing kinetics of the epoxy matrix upon glass transition is prognosticated, with the difference in the degree of curing reaching a value of 4–5%. The strongest filler effect on the curing kinetics is observed in the chemically controlled region, which may be due to the catalytic effect of functional groups on the fiber surface.     

偶联剂对玻璃纤维/环氧树脂基复合材料介电性能的影响

偶联剂对玻璃纤维／环氧树脂基复合材料介电性能的影响陈平刘胜平张明艳（哈尔滨理工大学电工材料系哈尔滨１５００４０）关键词环氧树脂基复合材料，介电性能，偶联剂，浸润性玻璃纤维／环氧树脂基复合材料（ＧＦＲＰ）具有优异的电气和力学性能．然而孔隙的存在强烈地...     

Curing reaction of o-cresol novolac epoxy resin according to hardener change

The investigations of cure kinetics and glass transition temperature (T_g) versus reaction conversion (α) of o-cresol novolac epoxy resin with the change of hardener were performed. All kinetic parameters of the curing reaction such as the reaction rate order, activation energy, and frequency factor were calculated. The curing mechanisms were classified into two types. One was an autocatalytic mechanism and the other was a nth order kinetic mechanism. The constants related to the chain mobility of polymer segments were obtained by using the DiBenedetto equation. We have tried to correlate the relationships between curing mechanism and molecular structures of hardeners from these results. © 1993 John Wiley & Sons, Inc.     

Morphologic and kinetic study of an epoxy-poly(ethyleneoxide) system. The fluorescence to predict miscibility

The kinetic of the curing process in the ethylenediamine (EDA)-poly (bisphenol A-co-epichlorohydrin) glycidyl end-capped (DGEBA) mixture modified with poly(ethylene oxide) (PEO) was studied. The epoxy component was labeled with a fluorescence group (dansyl) treating the DGEBA with the reactive dansyl derivative DNS-EDA. Dynamic DSC experiments were carried out and from their results the effect of the PEO composition on the epoxy curing was discussed. Furthermore, the effect of cure temperature and PEO composition on the morphology and crystallinity of the blend were studied as well. The morphologic study was carried out using complementarily optical transmission (TOM) and epifluorescence (EFM) microscopy. It was observed that: i) the addition of a non-reactive thermoplastic leads to a dilution effect of the reactive groups and therefore a decrease of the epoxy amine reaction rate; ii) the PEO composition does not seem to affect the non catalyzed process of the epoxy curing, while an increase in the PEO fraction within the epoxy/PEO mixture seems to change the mechanism of the cure reaction; iii) dynamic DSC scans, TOM and EFM images and steady state fluorescence spectra of the cured samples suggest that when the curing temperature increases there is an increase in the miscibility between PEO and the epoxy-amine reaction mixture; and iv) a reduction in the PEO/cured epoxy miscibility as the fraction of PEO increases was observed.     

The curing kinetics and mechanical properties of epoxy resin composites reinforced by PEEK microparticles

In this paper, a polyether-ether-ketone (PEEK)/epoxy composite was prepared by using PEEK microparticles as the reinforcement. The nonisothermal differential scanning calorimetry (DSC) test was used to evaluate the curing reaction of PEEK/epoxy resin system. The curing kinetics of this system were examined utilizing nonisothermal kinetic analyses (Kissinger and Ozawa), isoconversional methods (Flynn-Wall-Ozawa and Kissinger-Akahira-Sunose) and an autocatalytic reaction model. During these analyses, the kinetic parameters and models were obtained, the curing behavior of PEEK/epoxy resin system under dynamic conditions was predicted. The results show that isoconversional methods can adequately interpret the curing behavior of PEEK/epoxy resin system and that the theoretical DSC curves calculated by the autocatalytic reaction model are in good agreement with experimental data. Furthermore, the tensile elongation at break, tensile strength, flexural strength, compression strength and compression modulus increased by 81.6%, 33.66%, 36.53%, 10.98% and 15.14%, respectively, when PEEK microparticles were added in epoxy resin composites.     

The effects of glass beads and silane treatments on the curing behavior of a brominated epoxy resin: DSC analyses

The curing characteristics of a brominated epoxy resin/dicyandiamide (DICY) system filled with silane-treated glass beads are studied using isothermal differential scanning calorimetry (DSC). Three different silane coupling agents, N-(2-aminoethyl)-3-aminopropyl-trimethoxysilane, N-[2-(vinylbenzylamino)-ethyl]-3-aminopropyl-trimethoxysilane, and 3-glycidoxypropyl-trimethoxysilane, are applied. It is found that the reaction heats of the epoxy system are little affected by the curing temperature and the untreated glass fillers, but changed with the addition of silane-coated glass beads. The effect of glass beads on the curing reaction is more significant at the low curing temperature and conversion. The silane treatment results in changes in T_g, activation energy, reaction heat, reaction rate, and reaction order. Three silanes respond differently because of their differences in the activated reaction with the matrix system. Regardless of the various curing mechanisms involved, a simple kinetic expression can describe the curing extent at 170 and 180°C with a good accuracy for all systems studied. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35: 2063–2071, 1997     

Investigation of the curing reactions of some multifunctional epoxy resins using differential scanning calorimetry

Curing reaction of three tetrafunctional epoxy resins in the presence of tetraethylene tetramine was examined by differential scanning calorimetry at different heating rates. The kinetic parameters of the curing reaction were determined using various computational methods (Barrett, Borchardt–Daniels and Kissinger). The heating rate shows a great influence on the curing process. The activation energy varied in the range 43–80 kJ/mol, and the order of the curing reaction is observed to be ≈1.0 with slight variations.     

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

A novel green surface modification was successfully implemented on alumina nanoparticles using chitosan (CS) to prevent nanoparticles' aggregation. To evaluate the surface changes of nanoparticles, FTIR, TGA, TEM, and SEM analyses were used. The cure kinetics of the uncured samples was analyzed by DSC. Different methods such as KAS, Friedman, Starink, and FWO were applied to measure the activation energy. The activation energy of epoxy reinforced with chitosan-functionalized alumina (epoxy/[CS-EPO-alumina]) was less than that of epoxy reinforced with alumina (epoxy/alumina), which was a confirmation of the positive effect of CS on curing reaction kinetics. Using the Malek method, the Sestak-Berggren autocatalytic equation was chosen to investigate the cure kinetics of the epoxy. It was found that the Sestak-Berggren equation is well matched with the experimental data and the model was suitable to predict the epoxy curing reaction reliably. Moreover, the glass transition temperatures of all samples were approximately the same. The effect of surface modification of alumina on the electrical insulating behavior of epoxy was also studied. It was found that CS functionalized alumina (CS-EPO-alumina) increased volume resistivity of epoxy at a temperature range of 30 to 80°C more than that of alumina. Electric stability and breakdown strength of epoxy/alumina and epoxy/(CS-EPO-alumina) also enhanced, where epoxy/(CS-EPO-alumina) experienced a further increase compared to epoxy.     

Cure kinetics of epoxy resin-natural zeolite composites

The cure kinetics of epoxy resin and epoxy resin containing 10 mass% of natural zeolite were investigated using differential scanning calorimetry (DSC). The conformity of the cure kinetic data of epoxy and epoxy-zeolite system was checked with the auto-catalytic cure rate model. The results indicated that the hydroxyl group on the zeolite surface played a significant role in the autocatalytic reaction mechanism. This group was able to form a new transition state between anhydride hardener and epoxide group. The natural zeolite particles acted as catalyst for the epoxy system by promoting its curing rate.     

Mechanism Studies on Water Sorption and Permeation in Epoxy Resin by Impedance Spectroscopy. II. Cure Kinetics of O-Cresol Novolac Resin with Esterfied Phenol Novolac Resin

Abstract

To study the effect of water affinity of the cured epoxy resin on water sorption and permeation in the cured epoxy resin, a novel hardener (esterfied phenol novolac was synthesized and used for obtaining the cured product without free hydroxyl group. Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FT-IR) were used to study the cure kinetics of o-cresol novolac epoxy resin using esterfied phenol novolac resin as curing agent in the presence of 2-methylimidazole as accelerator. Some kinetic parameters of the curing reaction such as the reaction order, activation energy, and frequency factor were obtained in the temperature range studied. The results show that this curing process is a first-order kinetic mechanism, which was different with that cured with phenol novolac resin.     

Cure of epoxy resins with cyanoacetamides

Cyanoacetamides are a novel class of curing agents for epoxy resins. Since reaction products of epoxy compounds with cyanoacetamides have not yet been described, we investigated the reaction of phenyl-glycidylether (PGE) and N-isobutylcyanoacetamide (NICA) under the conditions of the epoxy cure (120–150°C). Twenty-two fractions of the reaction product have been separated by preparative TLC and characterized by FD and MS mass spectroscopy. The structures of 10 reaction product have been elucidated by MS, NMR, and IR techniques. They belong to the classes of cyclic urethanes, spiro-dilactones, cyclo-oxa-1-hepten-4-one-2, pyrimidones, aminocrotononitrile, and tertiary amine. This complex model reaction mixture does not enable us to propose a curing mechanism. However practical cure of Bisphenol A diglycidylether (BADGE) yields clear and tough solids with a glass transition temperature up to 200°C, good mechanical strength, and high adhesion to metal surface. Cyanoacetamides are latent hardeners requiring a curing initiator. Since N-4-chlorophenyl-N′-dimethylurea is a latent initiator, liquid, homogeneous, storage stable “one shot” systems can be formulated which harden quickly above 120°C. Heat aging properties of cured specimens are reported. A series of novel liquid, resinous, and crystalline cyanoacetamides and their potential as curing agent are described.     

Isothermal differential scanning calorimetry study of a glass/epoxy prepreg

Isothermal differential scanning calorimetry (DSC) was used to study the curing behavior of epoxy prepreg Hexply®1454 system, based on diglycidyl ether of bisphenol A (DEGBA)/dicyandiamid (DICY) reinforced by glass fiber. Cure kinetics of an autocatalytic‐type reaction were analyzed by general form of conversion‐dependent function. The characteristic feature of conversion‐dependent function was determined using a reduced‐plot method where the temperature‐dependent reaction rate constant was analytically separated from the isothermal data. An autocatalytic kinetic model was used; it can predict the overall kinetic behavior in the whole studied cure temperature range (115–130°C). The activation energy and pre‐exponential factor were determined as: E = 94.8 kJ/mol and A = 1.75 × 10¹⁰ sec^?1 and reaction order as 2.11 (m + n = 0.65 + 1.46 = 2.11). A kinetic model based on these values was developed by which the prediction is in good agreement with experimental values. Copyright © 2009 John Wiley & Sons, Ltd.     

Kinetics of curing and thermal degradation of hyperbranched epoxy (HTDE)/diglycidyl ether of bisphenol-A epoxy hybrid resin

Hyperbranched epoxy resin (HTDE) has relatively low viscosity and high molecular mass and holds great promise as a functional additive for enhancing the strength and toughness of thermosetting resins. In this work, the curing and thermal degradation kinetics of HTDE/diglycidyl ether of bisphenol-A epoxy (DGEBA) hybrid resin were studied in detail using differential scanning calorimetry (DSC) and thermogravimetric analysis (TG) techniques by Coats–Redfern model. The effect of molecular mass or generation and content of HTME on the activation energy, reaction order, and curing time were discussed; the results indicated that HTDE could accelerate the curing speed and reduce the activation energy and reaction order of the curing reaction.     

Organic/inorganic hybrid epoxy nanocomposites based on octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was used as the curing agent of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4′-diaminodiphenyl sulfone (DDS) epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn’t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.     

Thermal analysis and gelation property of multifunctional epoxy resins used for pultruded composite ropes

Non-isothermal curing reactions of three different multifunctional epoxy resin systems were investigated by differential scanning calorimetry. The Kissinger equation was applied to calculate the apparent activation energy, and the Levenberg–Marquardt algorithm was used to fit the curing kinetic data. It was observed that the two-parameter model was in good match with the curing kinetics. In addition, dynamic mechanical thermal analysis was used to obtain the glass transition temperature (T _g). Furthermore, the thermal stabilities of the systems were studied by thermogravimetric (TG) analysis, the integral procedure decomposition temperature and temperature index T _s were used to characterize the thermal stability. Finally, the gelation time was measured by plate–knife method of a home-made device, and the relationship between gelation time and temperature was established, according to which the pultrusion process parameters were predicted.     

Kinetic study of an epoxy system badge (n=0)/1, 2 dch modified with an epoxy reactive diluent

The curing reaction of an epoxy system consisting of a diglycidyl ether of bisphenol A (n=0) and 1, 2 diaminecyclohexane (DCH) with an epoxy reactive diluent vinylcyclohexane dioxide was studied by temperature modulated differential scanning calorimetry (TMDSC). The models proposed by Kamal and by Horie et al. were employed in the kinetic study. From these studies reaction orders, rate constants, and activation energies were determined. The technique of TMDSC allows to include in the kinetic study the effect of diffusion by means of the mobility factor, calculated from the curves of the complex heat capacity registered during the curing isothermal experiments. The results were compared to those obtained for the same system employing the reaction rate data. This revised version was published online in July 2006 with corrections to the Cover Date.     

Toughening of a highly cross-linked epoxy resin by reactive blending with bisphenol A polycarbonate. I. FTIR spectroscopy

A highly cross-linked thermosetting epoxy resin was modified by a reactive blending process carried out in the presence of bisphenol A polycarbonate (PC). Prior to the curing process the PC component was dissolved at high temperature in the uncured epoxy matrix. FTIR investigation of this reactive mixture demonstrated the occurrence of physical and chemical interactions among the blend components. Isothermal kinetic measurements performed by FTIR spectroscopy showed that the presence of PC does not affect the overall curing mechanism but decreases both the initial reaction rate and the final conversion of reactants. © 1994 John Wiley & Sons, Inc.     

非等温法研究TGDDM/DDS体系固化反应动力学

采用DSC对4,4′-四缩水甘油基二氨基二苯基甲烷(TGDDM)和3,3′-二氨基二苯基砜(DDS)体系的固化反应动力学进行了研究.分别通过n级反应法和Malek的最大概然机理函数法确定了固化反应机理函数,求解了固化反应动力学参数,得到了固化反应动力学模型.结果表明,通过Kissinger,Crane方法求解动力学参数所得到的n级反应模型与实验值差别较大;而采用Malek方法判别机理,表明该固化反应按照自催化反应机理进行,实验得到的DSC曲线与模型计算所得到的曲线吻合的较好,所确立的模型在5~20K/min的升温速率下能较好地描述TGDDM/DDS体系的固化反应过程,并为工艺参数的选择和工艺窗口的优化提供了理论依据.