Preparation and properties of hollow silica tubes/bismaleimide/diallylbisphenol A composites with improved toughness,dielectric properties,and flame retardancy

New high performance insulating composites based on hollow silica tubes (mHST) and bismaleimide/diallylbisphenol A (BDM/DBA) resin, which exhibit improved toughness, dielectric properties, and flame retardancy, were successfully developed. The effect of the amount of mHST on the properties of composites was systematically studied. Results show that the impact strength of the composite with 0.5 wt% mHST is about 2.2 times that of BDM/DBA resin. In addition, compared with BDM/DBA resin, the composites show lower and stable dielectric constant, better frequency stability of dielectric loss, significantly improved flame retardancy, and similarly outstanding thermal resistance. The reasons behind these attractive integrated properties are discussed from the view of structure–property relationship. Copyright © 2011 John Wiley & Sons, Ltd.     

Epoxy nanocomposites with high thermal conductivity and low loss factor: Realize 3D thermal conductivity network at low content through core-shell structure and micro-nano technology

Dielectric polymers with high thermal conductivity are very promising in the fields of aerospace and electronic device packaging. However, composites with excellent dielectric properties usually have low thermal conductivity. It is usually to fill the polymer with thermal conductivity particles to improve the thermal conductivity, but the high content of filler often reduces the mechanical properties of the polymer. In this paper, the traditional insulating polymer epoxy resin was used as the matrix, by covering the surface of silicon carbide with graphene to form a core-shell structure and co-filled with nano diamonds to achieve the preparation of high-performance epoxy resin at low content. The results showed that at the filling content of 30 wt%, the thermal conductivity of epoxy nanocomposites showed a dramatic thermal conductivity enhancement of 1263%, the energy storage modulus increased by 1.1 GPa, and the dielectric loss remained unchanged at 50 Hz. The advantages of the composite are the structural design and surface modification of the filler, which not only take advantage of its inherent advantages, but also improve the interface area with the epoxy matrix. The composite materials with excellent properties are expected to provide theoretical guidance for the application of high thermal conductivity dielectric materials.     

Novel high performance RTM bismaleimide resin with low cure temperature for advanced composites

A novel performance matrix, coded as LCRTM, with low cure and post‐cure temperature (≤ 200°C) for fabricating advanced polymer composites via resin transfer molding (RTM), was successfully developed, made up of 4,4′‐bismaleimidodiphenylmethane (BDM) and N‐allyl diaminodiphenylether (ADDE). Investigations show that the stoichiometry of BDM and ADDE has great effect on the processing and performance parameters of the resultant resins. In the case of the optimum formulation (the mole ratio of BDM and ADDE is 1:0.55), the injection temperature range is between 70–82°C, and the pot life at 80°C is 300 min, moreover, the cured resin has desirable thermal and mechanical properties after being cured at 200°C for 6 hr, reflecting a great potential as high performance matrices for fabricating advanced composites via the RTM technique. Copyright © 2005 John Wiley & Sons, Ltd.     

Synergetic effect of thermal conductivity and flame retardancy of cyanate ester composites containing DOPO and BN with great dielectric properties

DOPO and boron nitride (BN) fillers with different particle sizes and several loadings were employed to improve the properties of cyanate ester (CE) resin. The effects of BN content and particle size on the thermal conductivity of the BN‐DOPO/CE ternary composites were discussed. The influence of enhancing the thermal conductivity of the ternary composites on their flame retardancy was studied. The consequences showed that increasing the thermal conductivity of BN‐DOPO/CE composites had an active impact on their flame retardancy. Approving flame retardancy of the ternary composites was certified by the high limiting oxygen index (LOI), UL‐94 rating of V‐0, and low heat release rate (HRR) and total heat release (THR). For instance, in contrast with pure CE matrix, peak of HRR (pk‐HRR), average of HRR (av‐HRR), THR, and average of effective heat of combustion (av‐EHC) of CEP/BN_{0.5 μm}/10 composite were decreased by 51.7%, 33.8%, 18.7%, and 18.9%, respectively. Thermal gravimetry analysis (TGA) showed that the addition of BN fillers improves the thermal stability of the composites. Moreover, the ternary composites possess good dielectric properties. Their dielectric constants (ε) are less than 3, and dielectric loss tangent (tgδ) values are lower than neat CE resin.     

超支化聚硅氧烷改性双马来酰亚胺树脂的研究

将共聚改性与端氨基超支化聚硅氧烷(HBPSi(N))的合成一步完成,建立了一步法制备改性双马来酰亚胺树脂(记为B/D/H(N))的方法.以N,N′-4,4′-二苯甲烷双马来酰亚胺(BMI)、二烯丙基双酚A(DBA)组成的体系(记为B/D)为对比,探讨了HBPSi(N)含量对B/D/H(N)树脂性能的影响.研究结果表明,HBPSi(N)含量对B/D/H(N)树脂的性能有重要影响.少量HBPSi(N)的加入不仅可以显著提高固化物的韧性,而且能有效加快树脂的凝胶时间,同时大幅度提高固化树脂的耐热性、介电性能和耐湿性.这些性能的改善主要缘于HBPSi(N)的加入改变了交联网络的分子结构.B/D/H(N)体系优异的综合性能使之在制备先进树脂基复合材料、胶黏剂方面显示出很大的应用潜力.     

Effects on the thermal expansion coefficient and dielectric properties of CLST/PTFE filled with modified glass fiber as microwave material

The CLST/PTFE/5%GF composite sharply decreases the CTE in both X&Y and Z directions, obtained a promising microwave dielectric material for microwave communication.     

Dielectric properties of self‐catalytic interpenetrating polymer network based on modified bismaleimide and cyanate ester resins

Bismaleimide (BMI) resins with good thermal stability, fire resistance, low water absorption, and good retention of mechanical properties at elevated temperatures, especially in hot/wet environments, have attracted more attention in the electronic and aerospace industries. However, their relatively high dielectric constant limits their application in the aforementioned fields. In this work, a new promising approach is presented that consists of the formation of a self‐catalytic thermoset/thermoset interpenetrating polymer network. Interpenetrating polymer networks (IPNs) based on modified BMI resin (BMI/DBA) and cyanate ester (b10) were synthesized via prepolymerization followed by thermal curing. The self‐catalytic curing mechanism of BMI/DBA‐CE IPN resin systems was examined by differential scanning calorimetry. The dielectric properties of the cured BMI/DBA‐CE IPN resin systems were evaluated by a dielectric analyzer and shown in dielectric properties‐temperature‐log frequency three‐dimensional plots. The effect of temperature and frequency on the dielectric constant of the cured BMI/DBA‐CE IPN resin systems is discussed. The composition effect on the dielectric constant of the cured IPN resin systems was analyzed on the basis of Maxwell's equation and rule of mixture. The obtained BMI/DBA‐CE IPN resin systems have the combined advantages of low dielectric constant and loss, high‐temperature resistance, and good processability, which have many applications in the microelectronic and aerospace industries. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1123–1134, 2003     

Preparation of high thermal conductive aluminum nitride/cyanate ester nanocomposite using a new macromolecular coupling agent

Novel glycidyl methacrylate–butyl acrylate–maleic anhydride (GBM) terpolymers with different molecular weights were synthesized by radical polymerization and characterized using fourier transform infrared, nuclear magnetic resonance (¹H‐NMR and ¹³ C‐NMR), and gel permeation chromatography. Each GBM terpolymer was used to modify aluminum nitride (AlN), and the modified AlN, coded as AlN(GBM), was added to 2,2′‐bis(4‐cyanatophenyl)isopropylidene (CE) resin for preparing composites. Composites based on original AlN or γ‐(2,3‐epoxypropoxy)propyltrimethoxysilane‐modified AlN (AlN(K)) were also prepared for comparison. Although GBM and γ‐(2,3‐epoxypropoxy)propyltrimethoxysilane have similar reactive groups, the results indicate that GBM shows more attractive integrated advantages, reflected by the fact that CE/AlN(GBM) composites have better thermal stability, higher thermal conductivity, and higher glass transition temperature than those of CE/AlN(K). These properties result from better dispersion of fillers, improved interfacial adhesion between fillers and CE resin, and increased cross‐linking density. This study demonstrates that the nature of the coupling agents is an important factor to develop high performance composites for cutting‐edge industries. Copyright © 2011 John Wiley & Sons, Ltd.     

Modified cyanate ester resins with lower dielectric loss,improved thermal stability,and flame retardancy

Novel modified cyanate ester (CE) resins with decreased dielectric loss, improved thermal stability, and flame retardancy were developed by copolymerizing CE with hyperbranched phenyl polysiloxane (HBPPSi). HBPPSi was synthesized through the hydrolysis of phenyltrimethoxysilane, and its structure was characterized by ¹H‐NMR, ²⁹Si‐NMR, and Fourier transform infrared spectra. The effect of the incorporation of HBPPSi into CE resin on the curing behavior, chemical structure of cured networks, and typical performance of HBPPSi/CE resins were systemically evaluated. It is found that the incorporation of HBPPSi into CE network obviously not only catalyzes the curing of CE, but also changes the chemical structure of resultant networks, and thus results in significantly decreased dielectric loss, improved thermal stability, and flame retardancy as well as water absorption resistance. For example, in the case of the modified CE resin with 10 wt% HBPPSi, its limited oxygen index is about 36.0, about 1.3 times of that of neat CE resin, its char yield at 800°C increases from 31.6 to 35.4 wt%; in addition, its dielectric loss is only about 61% of that of neat CE resin at 1 kHz. All these changes of properties are discussed from the view of the structure–property relationship. The significantly improved integrated properties of CE resin provide a great potential to be used as structural and functional materials for many cutting‐edges fields. Copyright © 2011 John Wiley & Sons, Ltd.     

Novel toughened cyanate ester resin with good dielectric properties and thermal stability by copolymerizing with hyperbranched polysiloxane and epoxy resin

A novel toughened cyanate ester (CE) resin with good dielectric properties and thermal stability was developed by copolymerizing 2,2′‐bis(4‐cyanatophenyl)iso‐propylidene (BCE) with a combined modifier (HBPSiEP) made up of hyperbranched polysiloxane (HBPSi) and epoxy (EP) resin. HBPSi was synthesized through the hydrolysis of 3‐(trimethoxysilyl)propyl methacrylate. The effect of differing stoichiometries of HBPSiEP on the curing characteristics and performance of BCE resin is discussed. Results show that the incorporation of HBPSiEP can not only effectively promote the curing reaction of BCE, but can also significantly improve the toughness of the cured BCE resin. In addition, the toughening effect of HBPSiEP is greater than single EP resin. For example, the impact strength of modified BCE resin with 30 wt% of HBPSiEP is 23.3 KJ/m², which is more than 2.5 times of that of pure BCE resin, while the maximum impact strength of EP/BCE resin is about 2 times of pure BCE resin. It is worthy to note that HBPSiEP/BCE resins also exhibit improved thermal stability, dielectric properties, and flame retardancy, suggesting that the novel toughened CE resins have great potentiality to be used as a matrix for advanced functional composites or electronic packing resins. Copyright © 2009 John Wiley & Sons, Ltd.     

Thermal conductivity epoxy resin composites filled with boron nitride

Boron nitride (BN) micro particles modified by silane coupling agent, γ‐aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052 W/mK, five times higher than that of native EP (0.202 W/mK). The mechanical properties of the composites are optimal with 10 wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright © 2011 John Wiley & Sons, Ltd.     

High efficiency synthesis of octavinylsilsesquioxanes and its high performance hybrids based on bismaleimide‐triazine resin

An improved method is developed to synthesize octavinylsilsesquioxanes (VPOSS) with shorter time and higher yield, and then VPOSS is used to prepare new hybrids based on bismaleimide‐triazine (BD/CE) resin, coded as VPOSS/BD/CE. The effect of the content of VPOSS on the key properties including curing behavior, thermal, mechanical, and dielectric properties as well as water resistance of VPOSS/BD/CE hybrids were systematically discussed. Compared with BD/CE resin, hybrids show similar curing behavior but different chemical structures and thus macro‐performance. These key properties of hybrids are dependent on the content of VPOSS, all hybrids show significantly improved dielectric properties, water resistance, and dimensional stability; moreover, the hybrids with suitable content of VPOSS have bigger impact strengths. Specifically, with the addition of 7 wt% VPOSS to BD/CE resin, the dielectric constant decreases from 3.7 to 3.2, the dielectric loss decreases 55%, and the coefficient of thermal expansion reduces 23%; moreover, the glass transition temperature and initial decomposition temperature increase about 15°C. The attractive integrated properties suggest that VPOSS/BD/CE hybrids have great potential to be used as structural and functional materials for many cutting‐edge fields. Copyright © 2011 John Wiley & Sons, Ltd.     

Preparation and properties of new high performance maleimide‐triazine resins for resin transfer molding

High performance matrix is the key base for preparing advanced composites via resin transfer molding (RTM). A novel high performance modified maleimide‐triazine (BT) resin system (coded as MBT) for RTM was developed, which is made of 4,4′‐bismaleimidodi‐ phenylmethane, o,o'‐diallylbisphenol A, 2,2′‐bis (4‐cyanatophenyl) isopropylidene, and hyperbranched polysiloxane (HBPSi). The effects of HBPSi on the processing and performance parameters of MBT system are evaluated. Results show that the processing characteristics of the MBT system are greatly dependent on the content of HBPSi in the system, while three MBT resins developed in this paper have significantly better integrated properties than BT resin. For example, compared to original BT resin, MBT resins have enlarged pot life (>8 hr) and good reactivity; more interestingly, cured MBT resins exhibit better dielectric properties and moisture resistance; in addition, MBT resins with suitable content of HBPSi have improved flexural and impact strengths as well as outstanding thermal property, suggesting that MBT system is the right kind of matrices with great potentiality for fabricating advanced structural and functional composites via RTM technique. Copyright © 2010 John Wiley & Sons, Ltd.     

Synthesis of mesoporous silica and its modification of bismaleimide/cyanate ester resin with improved thermal and dielectric properties

A novel method is proposed to synthesize new mesoporous silica containing amine groups (MPSA), and it was further employed to modify bismaleimide‐dialllyl bisphenol (BD)/cyanate ester (CE) resin to form novel MPSA/BD/CE hybrids; in addition, the typical properties of MPSA/BD/CE were systematically investigated. Results show that these hybrids have very low dielectric constant and loss as well as good thermal properties. Compared with BD/CE resin, all hybrids have not only decreased dielectric constant and loss but also similar dependence of dielectric properties on frequency over the whole frequency from 10 to 10⁶ Hz. Specifically, with the addition of MPSA to BD/CE resin, the dielectric constant reduces from 3.5 to 3.0, and the dielectric loss is only 85% of that of BD/CE resin. Note that all hybrids show better thermal resistance (reflected by higher glass transition temperature, decreased maximum degradation rate, and higher char yield at 800°C) than BD/CE resin. All these differences in macro‐properties are attributed to the different structure between MPSA/BD/CE hybrids and BD/CE resin. Copyright © 2011 John Wiley & Sons, Ltd.     

Synthesis and characterization of novel epoxy resins‐filled microcapsules with organic/inorganic hybrid shell for the self‐healing of high performance resins

Novel microcapsules (MCs) with organic/inorganic hybrid shell were successfully fabricated using epoxy resin as core material and nano boron nitride (BN) and mesoporous silica (SBA‐15) as inorganic shell materials in aqueous solution containing a water‐compatible epoxy resin curing agent. The morphologies, thermal properties and Young's moduli of MCs were investigated. The results indicated that epoxy resins were encapsulated by BN/SBA‐15/epoxy polymer hybrid layer, the resulting MCs were spherical in shape and the introduction of inorganic particles made MCs had rough surface morphology. The mean modulus value of MCs was from 2.8 to 3.1 GPa. The initial decomposition temperature (T_di) of MCs at 5 wt% weight loss was from 309 to 312°C. MCs showed excellent thermal stability below 260°C. The structures and properties of MCs could be tailored by controlling the weight ratio of inorganic particle. When the weight ratio of BN to SBA‐15 was 0.15:0.10, MCs had the highest T_di and modulus. The resulting MCs were applied to high performance 4,4′‐bismaleimidodiphenylmethane/O,O′‐diallylbisphenol A (BMI/DBA) system to design high performance BMI/DBA/MC systems. Appropriate content of MCs could improve the fracture toughness and maintain the glass transition temperature (T_g) of BMI/DBA system. The core materials released from fractured MCs could bond the fracture surfaces of the BMI/DBA matrix through the polymerization of epoxy resins. When the healing temperature schedule of 100°C/2h+150°C/1h was applied, 15 wt% MCs recovered 98% of the virgin fracture toughness of BMI/DBA. Copyright © 2016 John Wiley & Sons, Ltd.     

Effect of nano/micro‐mixed ceramic fillers on the dielectric and thermal properties of epoxy polymer composites

Nano/micro ceramic‐filled epoxy composite materials have been processed with various percentage additions of SiO₂, Al₂O₃ ceramic fillers as reinforcements selected from the nano and micro origin sources. Different types of filler combinations, viz. only nano, only micro, nano/micro, and micro/micro particles, were designed to investigate their influence on the thermal expansion, thermal conductivity, and dielectric properties of epoxy polymers. Thermal expansion studies were conducted using thermomechanical analysis that revealed a two‐step expansion pattern consecutively before and after vitreous transition temperatures. The presence of micro fillers have shown vitreous transition temperature in the range 70–80°C compared with that of nano structured composites in which the same was observed as ~90°C. Similarly, the bulk thermal conductivity is found to increase with increasing percentage of micron‐size Al₂O₃. It was established that the addition of micro fillers lead to epoxy composite materials that exhibited lower thermal expansion and higher thermal conductivity compared with nano fillers. Moreover, nano fillers have a significantly decisive role in having low bulk dielectric permittivity. In this study, epoxy composites with a thermal expansion coefficient of 2.5 × 10^?5/K, thermal conductivity of 1.18 W/m · K and dielectric permittivity in the range 4–5 at 1 kHz have been obtained. The study confirms that although the micro fillers seem to exhibit good thermal conductivity and low expansion coefficient, the nano‐size ceramic fillers are candidate as cofillers for low dielectric permittivity. However, a suitable proportion of nano/micro‐mixed fillers is necessary for achieving epoxy composites with promising thermal conductivity, controlled coefficient of thermal expansion and dielectric permittivity. Copyright © 2013 John Wiley & Sons, Ltd.     

Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes

Silicone rubber filled with thermally conductive, but electrically insulating Al₂O₃ or ZnO fillers were investigated to be used as elastomeric thermal pads, a class of thermal interface materials. The effect of Al₂O₃ or ZnO fillers on the thermal conductivity and coefficient of thermal expansion (CTE) of the silicone rubber were investigated, and it was found that with increasing Al₂O₃ or ZnO fillers, the thermal conductivity of the thermal pads increases, while the coefficient of thermal expansion (CTE) decreases. The thermal conductivity results obtained were also analyzed using the Agari model to explain the effect of Al₂O₃ or ZnO fillers on the formation of thermal conductive networks. Thermal gravimetry analysis (TGA) showed that the addition of either Al₂O₃ or ZnO fillers increases the thermal stability of the silicone rubber, while the scanning electron microscope (SEM) showed that at 10 vol.% filler loading percolation threshold has yet to be reached.     

Investigation of the dielectric,mechanical, and thermal properties of noncovalent functionalized MWCNTs/polyvinylidene fluoride (PVDF) composites

To improve the dispersion of multi‐walled walled carbon nanotubes (MWCNTs) and investigate the effect of dispersant for MWCNTs functionalization on the dielectric, mechanical, and thermal properties of Polyvinylidene fluoride (PVDF) composites, two different dispersants (Chitosan and TritonX‐100) with different dispersion capability and dielectric properties were used to noncovalently functionalize MWCNTs and prepare PVDF composites via solution blending. Fourier transform infrared, X‐Ray diffraction, and Raman spectroscopy indicated that TritonX‐100 and Chitosan were noncovalent functionalized successfully on the surface of MWCNTs. With the functionalization of Chitosan and TritonX‐100, the dispersion of MWCNTs changed in different extent, which was investigated by dynamic light scattering and confocal laser scan microscopy. The dielectric, mechanical, and thermal properties of PVDF composites were also improved. Meanwhile, it was also found that the dielectric properties of PVDF composites are closely related to the dielectric properties of dispersant. High dielectric constant of dispersant contributes to the grant dielectric constant of PVDF composites. The mechanical and thermal properties of MWCNTs/PVDF composites largely depend on the dispersion of MWCNTs in PVDF, interfacial interactions and the residual solvent. Copyright © 2016 John Wiley & Sons, Ltd.     

The effect of fiber content on the mechanical and thermal expansion properties of biocomposites based on microfibrillated cellulose

A new method to obtain composites of phenolic resin reinforced with microfibrillated cellulose with a wide fiber content was established and the mechanical properties were evaluated by tensile test. A linear increase in Young’s modulus was observed at fiber contents up to 40 wt%, with a stabilizing tendency for higher fiber percentages. These results were ratified by measurements of the coefficient of thermal expansion (CTE) relative to fiber content, which indicated a strong thermal expansion restriction rate below 60 wt% fiber content, indicating the effective reinforcement attained by the cellulose microfibrils. The low CTE achieved of 10 ppm/K is one of the important properties of cellulose composites.     

Natural rubber–based composites filled with bioglasses from a CaO‐SiO2‐P2O5‐Ag2O system. Effect of Ag2O concentration in the filler on composite properties

Bioactive glass was first synthesized by L. Hench in 1971. There are many studies on the properties of several metals and metal ions dopants used in the SiO₂‐CaO‐P₂O₅ system of bioglasses, such as Ag, Cu, Zn, and Fe. A number of authors have carried out research related to the influence of silver oxide on the properties of bioglasses . However, publications on the properties of elastomer‐based composites containing bioactive glasses are relatively scarce. We have not found in the literature studies discussing how silver oxide concentration in bioglasses of the CaO‐SiO₂‐P₂O₅‐Ag₂O system affects the significant properties of a natural rubber biocomposite. In this regard, the purpose of the present work is to investigate the aforementioned influence on the properties of this type of composites, namely, vulcanization, physicomechanical, thermal, dynamic, dielectric, electric, and thermoconductive characteristics. We have established those parameters of the composites to be impacted considerably by both degree of filling with bioglass and the silver oxide content in the latter. The improvement in the composites thermostability and some of their physicomechanical performance is the most significant. The volume resistance decreases, and the thermal conductivity coefficients increase. Results from scanning electron microscopy and energy‐dispersive X‐ray (EDX) analyses have confirmed the influence of silver oxide initially on the phase composition of the bioglass, hence on the properties of the biocomposites through changes in the bioglass used as filler. The dielectric characteristics of some of the biocomposites suggest that they can be used as substrates and insulating layers in flexible antennas for short‐range wireless communications.