Correlation between hydrogen‐bonding interaction and mechanical properties of polyimide fibers

Novel co‐polymerization polyimide (PI) fibers based on 4,4′‐oxydianiline (ODA)‐pyromellitic dianhydride (PMDA) were prepared. 2‐(4‐Aminophenyl)‐5‐aminobenzimidazole (PABZ) containing the N? H group was introduced into the structure of the fibers as the proton donor. The results of Fourier transform infrared (FTIR) and dynamic mechanical analysis (DMA) showed that hydrogen bonding occured between the N? H group and chains, which strongly enhanced interchain interaction. This hydrogen bonding interaction increased the tensile strength and initial modulus of the PI fibers up to 2.5 times and 26 times, respectively, compared to those of homo‐PI PMDA‐ODA fibers with no hydrogen‐bonding interaction because of the absence of proton donors after the imidization process. In the mean time, glass transition temperature (T_g) of the modified PI fibers was found to be 410–440°C, which was higher than that of the homo‐PI PMDA‐ODA fibers. From the result, a novel access to molecular design and manufacture of high performance PI fibers with good properties could be provided. Copyright © 2009 John Wiley & Sons, Ltd.     

Influence of Steric Hindrance Between Hydrogen Atoms of Linkage Groups and Adjacent Phenyls on Properties of Polyimide

A diamine monomer 4,4′-methylenedianiline(MDA) was introduced to modify the polyimide of pyromellitic dianhydride(PMDA) and 4,4′-oxydianiline(ODA) by polycondensation. A series of polyamic acids was synthesized from MDA and ODA of different molar ratios with PMDA of sum mole of moles of MDA and ODA, and polyimide films were obtained by thermal imidization. Polyimide(PI) films were characterized by tensile testing, dynamic mechanical analysis(DMA), thermal gravimetry analysis(TGA), Fourier transform infrared spectroscopy (FTIR), wide X-ray diffraction(WAXD) and molecular simulation. With the increase of MDA content, the tensile strength and thermal decomposition temperature remained generally stable compared with those of PMDA/ODA polyimide. Unexpectedly, the glass transition temperature(T_g) and Young’s modulus increased from 388.7 ℃ and 2.37 GPa to 408.3 ℃ and 5.74 GPa, respectively. The results of WAXD and molecular simulation indicate the steric hindrance among hydrogen atoms of the linkage groups and adjacent phenyls enhanced the properties of the polyimide modified with MDA.     

Enhancement of properties of polyimide/silica hybrid nanocomposites by benzimidazole formed hydrogen bond

Polyimide/silica hybrid nanocomposites were prepared by sol–gel method without coupling agent. A novel diamine with a benzimidazole group, 2‐(4‐aminophenyl)‐5‐aminobenzimidazole (PABZ), was introduced to copolymerize with 4,4'‐oxydianiline (ODA) and pyromellitic dianhydride (PMDA) to synthesize polyimide (PI) matrix. The compatibility between PI and silica was improved by hydrogen bonds formed between silica phase and the –NH– group on benzimidazole of the new diamine. Highly transparent hybrid films were obtained when silica content reached as high as 30 wt%. SEM results show that silica particles with sizes much smaller than that in PMDA‐ODA/silica system disperse homogeneously in the PI matrix. Differing from most hybrid systems without coupling agent, the tensile strength of PABZ system increases from 152 MPa to 165 MPa with silica content increasing from 0 to 20 wt%, while, it decreases linearly in PMDA‐ODA system. DMA analysis shows that the introduction of PABZ largely increases the glass transition temperature (Tg) for all silica contents, which is suggested to be due to the more rigid structures and stronger interaction between the two phases. Meanwhile, the decomposition temperature and char yields at 800 °C are both higher than that of pure PIs. The structures of the hybrid films were identified by FTIR spectra, which indicate that different silica morphologies are developed, resulted from the hydrogen bonds between benzimidazole and silica phase. Copyright © 2011 John Wiley & Sons, Ltd.     

Nanotechnological method to control the molecular weight cut-off and/or pore diameter of organic–inorganic composite membrane

Polyimide–alumina composite membranes were fabricated by the nanotechnological copolymerization method of co-polymer which has a constant repeating unit chemically bound by primer on the wall and/or surface of the porous ceramic support. By changing the number of repeating unit (n) in the polymer, the fabricated pyromellitic dianhydride (PMDA)- diaminodiphenylether (ODA) composite membranes have separation factor α_CO2/CH4 in the range 1.0–6.4 and molecular weight cut-off (MWCO) ranging 400–4000. As for the composite membranes of n=20, the separation factor α_CO2/CH4 of the 4,4′-(hexafluoroisopropylidene)-diphathalic anhydride (6FDA)-diaminodiphenylether (ODA) composite membrane was approximately 1.6 times larger than that of the PMDA–ODA composite membranes, and these values were 7.5 and 4.7 at 323 K, respectively. With the increase of temperature, the separation factor decreased, and the value obtained was 4.8 at 423 K. The pure gas permeances through the carbon membrane (PMDA–ODA: n=20) was approximately 75–260 times larger than the values through the PMDA–ODA (n=20) composite membranes. But this membrane did not show any gas separation ability.     

Novel method for the preparation of poly(urethane–imide)s and their properties

A polymer blend consisting of polyimide (PI) and polyurethane (PU) was prepared by means of a novel approach. PU prepolymer was prepared by the reaction of polyester polyol and 2,4-tolylenediisocyanate (2,4-TDI) and then end-capped with phenol. Poly(amide acid) was prepared from pyromellitic dianhydride (PMDA) and oxydianiline (ODA). A series of oligo(amide acid)s were also prepared by controlling the molar ratio of PMDA and ODA. The PU prepolymer and poly(amide acid) or oligo(amide acid) solution were blended at room temperature in various weight ratios. The cast films were obtained from the blend solution and treated at various temperatures. With the increase of polyurethane component, the films changed from plastic to brittle and then to elastic. The poly(urethane–imide) elastomers showed excellent mechanical properties and moderate thermal stability. The elongation of films with elasticity was more than 300%. The elongation set after the breaking of films was small. From the dynamic mechanical analysis, all the samples showed a glass transition temperature (T_g) at ca. −15°C, corresponding to T_g of the urethane component, suggesting that phase separation occurred between the two polymer components, irrespective of polyimide content. TGA and DSC studies indicated that the thermal degradation of poly(urethane–imide) was in the temperature range 250–270°C. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 3745–3753, 1997     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

The effect of orientation on thermal expansion behavior in polyimide films

The anisotropy of the thermal expansion of polyimide films was investigated . Out-of-plane or thickness direction coefficients of linear thermal expansion (CTE) were calculated from the difference between the coefficient of volumetric expansion (CVE) and the sum of the in-plane or film direction coefficients of linear thermal expansion for commercial and spin-coated PMDA//ODA and BPDA//PPD films and spin coated BTDA//ODA/MPD films. The CVEs were obtained from a pressure-volume-temperature (PVT) technique based on Bridgeman bellows. The CVE was shown to be essentially constant, independent of molecular orientation and thickness. A decrease in the in-plane CTEs therefore occurs at the expense of an increase in the out-of-plane CTE. In all cases the calculated out-of-plane CTE was higher than the measured in-plane CTE. The ratio of the out-of-plane CTE to the in-plane CTE was 1.2, 3.8, and 49.3 for the spin-coated BTDA//ODA/MPD, PMDA//ODA, and BPDA//PPD films, respectively. © 1994 John Wiley & Sons, Inc.     

Structural characterization of silica modified polyimide membranes

Polyimide and hybrid polyimide‐siloxane were synthesized by polycondensation, imidization, and sol‐gel reaction. The polyimides were prepared from pyromellitic dianhydride (PMDA) and 4,4‐oxydianiline (ODA) in N‐methyl‐2‐pyrollidone (NMP). Trimethoxyvinyl silane (TMVS) was used as a source of silica. Their surface morphologies, structures and thermal performances were determined using scanning electron microscopy (SEM), infrared spectroscopy (IR), thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The results showed that the silica particles were finely and rather homogeneously dispersed in polymers. The glass transition temperature (T_g) of hybrid membrane materials increased with the increasing silica content. TGA analysis showed that polyimides were thermally stable with silica. Modified polyimide‐siloxane films, thermal characteristics were found to be better than the polyimide films without silica. Copyright © 2006 John Wiley & Sons, Ltd.     

Dramatic enhancement of carbon nanotube dispersion in polyimide composites by a two‐step amino functionalization approach

Amino modified multiwall carbon nanotubes (MWNTs) are prepared, respectively, by two ways: the conventional one‐step method that directly treats acyl chloride functionalized MWNTs with 4, 4′‐diaminodiphenyl ether (ODA), giving the amino modified MWNT (Di‐MWNT), as well as an improved two‐step method in which acyl chloride functionalized MWNT react with mono‐Boc protected ODA first and then the Boc‐groups are deprotected to provide the amino modified MWNT (NH₂‐MWNT). Anhydride‐terminated polyimide (PI) composite films based on NH₂‐MWNT and Di‐MWNT are fabricated by solution blending and consequent planar casting. The exposed amino groups of NH₂‐MWNT create strong covalent bonds with the anhydride‐terminated polyamide acid in the course of N‐acylation and curing chemical reactions. Solubility examinations of nanotubes and morphologies of the composite films indicate that the dispersion of NH₂‐MWNT is significantly better than Di‐MWNT in PI matrix and NH₂‐MWNT can form connected network throughout the PI matrix which makes the NH₂‐MWNT/PI film presenting superior conductivity. Both morphologies and mechanical properties of the composites show that NH₂‐MWNT has stronger interfacial interaction with the PI matrix. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 3449–3457     

Preparation and characterization of polyimide/pure silica zeolite hybrid films

In this study, amino derivative of pure silica zeolite nanocrystal (A‐PSZN) was dispersed into polyimide (PI) matrix to prepare PI/A‐PSZN hybrid films, and their thermal and mechanical properties, as well as hydrophobicity, were characterized scientifically. The test results show that PI/A‐PSZN hybrid films possess higher glass transition temperature, higher thermal stability and lower in‐plane coefficient of thermal expansion than pristine PI. The mechanical property data suggest that the incorporation of A‐PSZN results in an increase in Young's modulus and tensile strength of the hybrid films, but as its content exceeds the critical value (maybe 5 wt%), its enhancement effect on the hybrid's strength and toughness gets weaker. Furthermore, liquid dripping imaging analysis results indicate that the film's hydrophobicity is clearly improved by the introduction of A‐PSZN. As compared with PSZN, A‐PSZN exhibits better effect on enhancing the overall performance of pristine PI films. A comparison with other studies suggests that PI/A‐PSZN is a hybrid film with superior comprehensive properties. Copyright © 2013 John Wiley & Sons, Ltd.     

(Co)polyimides from commonly used monomers, and their nanocomposites

Synthesis of (co)polyimides from aromatic dianhydrides (pyromellitic dianhydride (PMDA), symmetric 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA)) and diamines (4,4′-oxydianiline (ODA), p-phenylenediamine (PDA)) commonly used for the production of commercial polyimides, as well as the preparation of their nanocomposites with SiO₂ nanoparticles were performed with the aim to find ways to control technical performance of polyimides. The (co)polyimide films prepared under mild thermal imidization conditions were analyzed by FTIR, WAXD, DSC and TG, and characterized by transition temperatures and the temperatures of 5% and 10% mass loss, as well as tensile parameters.Films of PMDA/sBPDA–ODA copolyimides at the ambient temperature had a 20% higher ultimate strength and exhibited a higher tensile modulus than the reference polyimide (PMDA–ODA). However, lowering the transition temperature of the polyimide by partial substitution of an sBPDA monomeric unit for PMDA resulted in lowering the modulus at higher temperatures. The best performance was exhibited by semi-crystalline films of sBPDA–ODA/PDA copolyimide, which had a 35% higher ultimate strength and a 64% higher elongation at break at the ambient temperature than the reference polyimide (sBPDA–PDA), and also retained the strength and exhibited a 200% higher elongation at a temperature of 200 °C.Unexpectedly, the elongation at break of PMDA–ODA based (co)polyimide nanocomposites with hydrophobic SiO₂ nanoparticles was greater than that of the baseline (co)polyimides. It was neither the case with PMDA–ODA nanocomposites with hydrophilic SiO₂ nanoparticles, nor with sBPDA–PDA (co)polyimide based nanocomposites with hydrophobic SiO₂ nanoparticles.     

Preparation, morphology and properties of nano-sized Al2O3/polyimide hybrid films

Nano-sized Al₂O₃/polyimide (PI) hybrid films based on 4,4′-oxydianiline (ODA) and pyromellitic dianhydride (PMDA) were prepared by incorporation with different content of nano-sized Al₂O₃ via in situ polymerization. The TEM and SEM micrographs indicated that the Al₂O₃ particles were homogenously dispersed in the polyimide matrix by means of the ultrasonic treatment and the addition of coupling agent. The mechanical properties and thermal stability of the pure PI film can be improved by adequate addition of Al₂O₃. The PI hybrid film was strengthened and toughened simultaneously by the introduction of the well-dispersed Al₂O₃ particles. The PI hybrid films showed improved electrical aging performance as compared with pure PI film. Especially, the PI hybrid films with 10 wt.% of Al₂O₃ content exhibited obviously enhanced electrical aging performance with the time to failure of 3.4 times longer than that of pure PI film. The improved electrical aging performance of the hybrid film was attributed to the nano-sized Al₂O₃ particles highly dispersed in the hybrid film, which confirmed by the investigation of the morphology and the surface composition of PI hybrid film before and after electrical aging.     

Preparation and properties of polyimide/chopped carbon fiber composite foams

In this study, a series of reinforced polyimide (PI)/carbon fiber (CF) composite foams were fabricated through thermal foaming of polyester ammonium salt (PEAS) precursor powders. The PEAS precursor powders containing different contents of chopped CF were synthesized from benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride (BTDA) and 4,4′‐diaminodiphenyl ether (ODA). The effects of different CF loadings on foaming behavior of PEAS/CF composite precursor powders, final cellular morphology, and physical properties of PI composite foams were investigated. The results revealed that the chopped CF acted as nucleation agent in the foaming process. The dispersion of CF can be evaluated using digital microscope. It is interesting to find that the chopped CF were highly oriented along the direction of cell arrises. As a result, the mechanical properties of PI foams were significantly enhanced owing to the incorporation of chopped CF. Furthermore, the thermal stability of PI composite foams were also slightly improved owing to fine dispersion of CF. In addition, the PI/CF composite foam shows uniform cell size distribution and the best comprehensive physical properties as chopped CF loading at around 6 wt%. Copyright © 2016 John Wiley & Sons, Ltd.     

Pretilt angle for BTDA,PMDA and CPDA series polyimides with various side chain lengths

Polyamic acid precursors were prepared by mixing dianhydride of 3,3',4,4'-benzophenone-tetracarboxylic dianhydride (BTDA), 1,2,3,4-benzene-tetracarboxylic dianhydride (pyrromellitic dianhydride PMDA), cis-1,2,3,4-cyclopentane-tetracarboxylic dianhydride (CPDA), the diamine (alkyl 3,5-diaminobenzoate) with side chain, and 4,4'-oxydianiline (ODA) without side chain. Copolyimide films with various side chain lengths were prepared by thermal imidization of polyamic acid precursors. The roughness of rubbed polyimide surface increased with increase in the side chain length. The pretilt angle for the BTDA and PMDA series polyimide (PI) increased exponentially with increase in side chain length. Various pretilt angles were obtained on the synthesized polyimides. In the case of CPDA series PI, the pretilt angle was nearly constant at 0 until the alkyl side chain length reached 12 (C12) and then increased markedly at C18. Models of pretilt angle generation were tested.     

Significant enhancement of electrical and thermal conductivities of polyethylene carbon nanotube composites by the addition of a low amount of silver nanoparticles

Electrically and thermally conductive high‐density polyethylene composites filled with hybrid fillers, multiwall carbon nanotubes (MWCNTs) and silver nanoparticles (Ag‐NPs), have been prepared in the melt state. The investigation of their electrical and thermal conductivities while comparing with high‐density polyethylene/MWCNT binary composites shows that the addition of only 3 vol% of Ag‐NPs does not reduce the electrical percolation threshold (P_c) that remains as low as 0.40 vol% of MWCNTs but leads to an increase in the maximum dc electrical conductivity of PE/MWCNT composites by two orders of magnitudes. Moreover, the association of both Ag‐NPs and carbon nanotube particles improved our composite's thermal conductivity. Copyright © 2014 John Wiley & Sons, Ltd.     

Solution‐processable colorless polyimides derived from hydrogenated pyromellitic dianhydride with controlled steric structure

This work presents novel colorless polyimides (PIs) derived from 1R,2S,4S,5R‐cyclohexanetetracarboxylic dianhydride (H″‐PMDA). Isomer effects were also discussed by comparing with PI systems derived from conventional hydrogenated pyromellitic dianhydride, that is, 1S,2R,4S,5R‐cyclohexanetetracarboxylic dianhydride (H‐PMDA). H″‐PMDA was much more reactive with various diamines than H‐PMDA, and the former led to PI precursors with much higher molecular weights. The results can be explained from the quite different steric structures of these isomers. The thermally imidized H″‐PMDA‐based films were colorless regardless of diamines because of inhibited charge‐transfer interaction. In particular, the H″‐PMDA/4,4′‐oxydianiline system simultaneously achieved a very high T_g exceeding 300 °C, high toughness (elongation at break > 70%), and good solution processability. In contrast, the H‐PMDA‐based counterparts were essentially insoluble. The outstanding solubility of the former probably results from disturbed chain stacking by its nonplanar steric structure. An advantage of chemical imidization process is also proposed. In some cases, a copolymerization approach with an aromatic tetracarboxylic dianhydride was effective to improve the thermal expansion property. The results suggest that the H″‐PMDA‐based PI systems can be promising candidates for novel high‐temperature plastic substrate materials in electronic paper displays. A potential application as optical compensation film materials in liquid crystal displays (LCD) is also proposed in this work. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2013     

Water sorption and activation energy in polyimide thin films

The water sorption behavior and the activation energy were investigated for various chemical structure polyimide thin films; BPDA‐PDA, BPDA‐ODA, PMDA‐ODA, and 6FDA‐ODA. The activation energy for the water diffusion varied in the range of 5.53 to 9.27kcal/mol, and was in the increasing order: BPDA‐PDA < BPDA‐ODA < PMDA‐ODA < 6FDA‐ODA. BPDA‐PDA and BPDA‐ODA polyimide films showed relatively well‐ordered morphological structure, which results in relatively low diffusion coefficient and high activation energy. It was found that the diffusion coefficient and the activation energy are significantly related to the in‐plane orientation, crystallinity, and packing order in the polyimide thin films. The morphological structure was predominant factors for the water diffusion coefficient and activation energy in the polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2714–2720, 2000     

Synthesis and characterization of high nitrile content polyimides as dielectric films for electrical energy storage

Three new isomeric diamines containing three, oxy‐linked benzonitriles (3BCN), one of which is asymmetric (meta, para, or m, p), are synthesized in a 3‐step sequence. Polycondensation of these diamines and four common dianhydrides (6FDA, OPDA, BTDA, and PMDA) in N,N‐dimethylacetamide via poly(amic acid) precursors and thermal curing at temperatures up to 300 °C lead to three series of tough, creasable polyimide (PI) films (tensile moduli = 1.63 ? 2.86 GPa). Among these PIs, two PMDA‐based PIs possess relatively high crystallinity and two OPDA‐based PIs, low crystallinity, whereas all 6FDA‐ and BTDA‐based PIs, and m,m‐3BCN‐OPDA‐PI are amorphous, readily soluble in common polar aprotic solvents. Thermally stable and having high T_g (216 ? 341 °C), these PIs lose 5% weight around 493–503 °C in air and 463–492 °C in nitrogen. Dielectric properties have been evaluated by broadband dielectric spectroscopy (BDS) and electric displacement‐electric‐field (D‐E) loop measurements. D‐E loop results show an increase in high temperature permittivity (at 190 °C/1 kHz) from 2.9 (for parent PI CP2 with no nitrile group) to as high as 4.9 for these PIs, while keeping their dielectric loss relatively low. Thus, an increase in dipole moment density by the presence of three neighboring CN per repeat unit can increase the overall permittivity, which could be further enhanced by sub‐T_g mobility of para‐phenylene linkages (BDS results). Published 2014. J. Polym. Sci., Part A: Polym. Chem. 2014 J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 422–436     

Water‐sorption behaviors of poly(3,4′‐oxydiphenylene pyromellitimide) films depending on the thickness variation

The effect of film thickness on the water‐sorption behaviors of poly(3,4′‐oxydiphenylene pyromellitimide) (PMDA‐3,4′ODA) films was gravimetrically investigated and interpreted with a Fickian diffusion model in films. The diffusion coefficient increased with increasing film thickness, whereas the water uptake and the activation energy decreased. Overall, the water‐sorption behaviors of PMDA‐3,4′ODA films are strongly dependent on the changes in morphological structure, which originated from the variation in the film thickness. As the film thickness increased, the molecular in‐plane orientation decreased, consequently leading to the increased diffusion coefficient and decreased activation energy. In contrast, the water uptake decreased with increasing film thickness because of the increase in the out‐of‐plane packing order. The diffusion coefficient and activation energy were strongly dependent on the in‐plane orientation in the films. © 2001 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 669–676, 2001     

Enhanced surface free energy of UHMWPE fibers and its interfacial adhesion behavior to PI resins

Mechanical properties of composites made up of ultra‐high‐molecular‐weight polyethylene (UHMWPE) fiber, polyimide (PI), and TiO₂ particles were investigated. The hybrid composite of 20 vol% of UHMWPE fiber with TiO₂ showed tensile strength greater than UHMWPE fiber/PI composite. A positive hybrid effect in tensile strength is obtained. It is observed that addition of small amount of TiO₂ to UHMWPE fiber/PI increased the tensile strength of the composite by 28%. With increase in TiO₂ loading to 1 to 3 vol%, the impact strength of the hybrid composite is increased from 55 KJ/m² to 69 KJ/m². This maximum value is more than one and a half times greater than the impact strength of neat UHMWPE fiber/PI composite.