SiC Schottky结反向特性的研究

对Ti/6H-SiC Schottky结的反向特性进行了测试和理论分析，提出了一种综合的包括SiC Schottky结主要反向漏电流产生机理的反向隧穿电流模型，该模型考虑了Schottky势垒不均匀性、Ti/SiC界面层电压降和镜像力对SiC Schottky结反向特性的影响，模拟结果和测量值的相符说明了以上所考虑因素是引起SiC Schottky结反向漏电流高于常规计算值的主要原因.分析结果表明在一般工作条件下SiC Schottky结的反向特性主要是由场发射和热电子场发射电流决定的.     

Evaluation of Schottky junction parameters from current-voltage characteristics exhibiting large excess currents

A new method is presented to extract the junction parameters from current-voltage characteristics of Schottky junctions exhibiting high leakage or other excess currents at low bias and current levels, for reduction of errors and uncertainity of the evaluation. In contrary to the Richardson plot, using the new method presented here, the Schottky junction parameters are evaluated from the measured experimental points directly instead of the extrapolated values of saturation current. The temperature dependence of forward bias, which is necessary for a given thermionic emission current level, is used. After transformation of the data, a linear plot is obtained, which yields both the barrier height and effective Richardson constant.     

GaN肖特基二极管的正向电流输运和低频噪声行为

首先测量了GaN肖特基二极管的正向变温电流-电压特性,研究了其电流输运机制,然后分析了在不同注入电流条件下的低频噪声行为.结果表明:1)在正向高电压区,热发射机制占主导,有效势垒高度约为1.25 eV;2)在正向低偏压区(V <0.8 V),与位错相关的缺陷辅助隧穿电流占主导,有效势垒高度约为0.92 eV (T=300 K);3)在极小电流(I <1μA)和极低频率(f <10 Hz)下,洛伦兹型噪声才会出现;电子的渡越时间取决于多个缺陷对电子的不断捕获和释放过程,典型时间常数约为30 ms (I=1μA);4)在更高频率和电流下,低频1/f噪声占主导;电流的输运主要受到势垒高度的随机波动的影响,所对应的系数约为1.1.     

Pt/Au/n-InGaN肖特基接触的电流输运机理

基于热电子发射和热电子场发射模式,利用I-V方法研究了Pt/Au/n-InGaN肖特基接触的势垒特性和电流输运机理,结果表明,在不同背景载流子浓度下,Pt/Au/n-InGaN肖特基势垒特性差异明显.研究发现,较低生长温度制备的InGaN中存在的高密度施主态氮空位（V_N）缺陷导致背景载流子浓度增高,同时通过热电子发射模式拟合得到高背景载流子浓度的InGaN肖特基势垒高度和理想因子与热电子场发射模式下的结果差别很大,表明V_N缺陷诱发了隧穿机理并降低了肖特基势垒高度,相应的隧穿电流显著增大了肖特基势垒总的输运电流,证实热电子发射和缺陷辅助的隧穿机理共同构成了肖特基势垒的电流输运机理.低背景载流子浓度的InGaN肖特基势垒在热电子发射和热电子场发射模式下拟合的结果接近一致,表明热电子发射是其主导的电流输运机理.     

钛－镍－硅固相反应形成的镍硅化物/n-硅(100)接触的I-V-T研究

在不同退火温度下，有一薄层钛覆盖层的镍－硅经过固相反应生成了镍硅化物/n-硅(100)接触，研究了其在80K到室温的电流－电压（I-V）特性。低温I-V曲线在低偏压区的电流显著地比传统的热电子发射（TE）模型预计的要大。用基于Tung的夹断模型简化得到的双肖特基势垒模型分析了实测的I-V曲线，从中可以得到肖特基势垒不均匀性的量度。较高温度退火导致较大的势垒不均匀性，意味着硅化物薄膜均匀性的变坏。钛覆盖薄层可以稍微提高硅化镍的相转变温度，以及形成的一硅化镍的热稳定性。     

Barrier height inhomogeneities in InN/GaN heterostructure based Schottky junctions

The electrical transport properties of InN/GaN heterostructure based Schottky junctions were studied over a wide temperature range of 200-500 K. The barrier height and the ideality factor were calculated from current-voltage (I-V) characteristics based on thermionic emission (TE), and found to be temperature dependent. The barrier height was found to increase and the ideality factor to decrease with increasing temperature. The observed temperature dependence of the barrier height indicates that the Schottky barrier height is inhomogeneous in nature at the heterostructure interface. Such inhomogeneous behavior was modeled by assuming the existence of a Gaussian distribution of barrier heights at the heterostructure interface.     

晶格匹配InAlN/GaN异质结肖特基接触反向电流的电压与温度依赖关系

测量了晶格匹配InAlN/GaN异质结肖特基接触的反向变温电流-电压特性曲线,研究了反向漏电流的偏压与温度依赖关系.结果表明:1)电流是电压和温度的强函数,饱和电流远大于理论值,无法采用经典热发射模型解释;2)在低偏压区,数据满足ln(I/E)-E^1/2线性依赖关系,电流斜率和激活能与Frenkel-Poole模型的理论值接近,表明电流应该为FP机制占主导;3)在高偏压区,数据满足ln(I/E)-E^1/2线性依赖关系,电流斜率不随温度改变,表明Fowler-Nordheim隧穿机制占主导;4)反向电流势垒高度约为0.60 eV,远低于热发射势垒高度2.91 eV,表明可导位错应是反向漏电流的主要输运通道,局域势垒由于潜能级施主态电离而被极大降低.     

Double threshold behaviour of I－V characteristics of CoSi2/Si Schottky contacts

The forward current－voltage (I－V) characteristics of polycrystalline CoSi₂/n-Si(100) Schottky contacts have been measured in a wide temperature range. At low temperatures (≤200K), a plateau-like section is observed in the I－V characteristics around 10^-4A·cm^-2. The current in the small bias region significantly exceeds that expected by the model based on thermionic emission (TE) and a Gaussian distribution of Schottky barrier height (SBH). Such a double threshold behaviour can be explained by the barrier height inhomogeneity, i.e. at low temperatures the current through some patches with low SBH dominates at small bias region. With increasing bias voltage, the Ohmic effect becomes important and the current through the whole junction area exceeds the patch current, thus resulting in a plateau-like section in the I－V curves at moderate bias. For the polycrystalline CoSi₂/Si contacts studied in this paper, the apparent ideality factor of the patch current is much larger than that calculated from the TE model taking the pinch-off effect into account. This suggests that the current flowing through these patches is of the tunnelling type, rather than the thermionic emission type. The experimental I－V characteristics can be fitted reasonably well in the whole temperature region using the model based on tunnelling and pinch-off.     

How do electronic carriers cross Si-bound alkyl monolayers?

Electron transport through Si-C bound alkyl chains, sandwiched between and Hg, is characterized by two distinct types of barriers, each dominating in a different voltage range. At low voltage, the current depends strongly on temperature but not on molecular length, suggesting transport by thermionic emission over a barrier in the Si. At higher voltage, the current decreases exponentially with molecular length, suggesting transport limited by tunneling through the molecules. The tunnel barrier is estimated, from transport and photoemission data, to be approximately 1.5 eV with a 0.25m(e) effective mass.     

基区重掺杂突变HBT带阶的扰动对电流影响研究

重掺杂禁带变窄效应引起异质结导带、价带带阶的扰动，从而使突变HBT异质结界面势垒的形状和高度发生了变化，这将对电流传输特性产生重要的影响.基于热场发射-扩散模型，对这一现象进行了深入的研究.得到的结论是：异质结界面势垒的扰动引起内建势的变化对电流影响的重要性远大于其引起隧道效应发生区域的变化，这是由于内建势的变化对电流的影响反映在指数项；因此对于突变HBT，精确考虑禁带变窄在导带与价带之间的分布对于器件性能的分析是非常重要的. 关键词： HBT 能带带阶 内建势 隧穿因子     

Majority carrier transistor based on voltage-controlled thermionic emission

A new type of transistor is proposed based on gate-controlled charge injection in unipolar semiconductor structures. Its design has some similarity with the recently fabricated triangular barrier diodes but contains an additional input circuit which allows an independent control of the barrier height for thermionic emission. This circuit is provided by a MOS gate on the semiconductor surface. In the proposed device the current flows perpendicular to the semiconductor surface over a planar potential barrier controlled by the gate. The static transconductance characteristics and dynamical response are analyzed. The characteristic response time is limited by the time of flight of electrons across the structure and can be in the picosecond range. The gate voltage required to switch the output current at room temperature is of order 0.2 V.     

Numerical analysis of gate leakage current in AlGaN Schottky diodes

We studied theoretically the influence of the tunneling current on the leakage current in AlGaN Schottky diodes. It is shown that the most important conductance mechanism in these structures is the tunneling. The thermionic emission has lower influence on the total current practically throughout the whole reverse bias range and doping concentrations studied. For high doping concentrations we found very slow temperature dependence of the diode current.     

InAs量子点在肖特基势垒二极管输运特性中的影响

在77到292K的范围内,系统研究了含InAs自组装量子点的金属-半导体-金属双肖特基势垒二极管的输运特性.随着温度上升,量子点的存储效应引起的电流回路逐渐减小.在测试温度范围内,通过量子点的共振隧穿过程在电流电压(I-V)曲线中造成台阶结构,且使电流回路随温度的上升急剧减小.根据肖特基势垒的反向I-V曲线,计算了势垒的反向饱和电流密度和平均理想因子.发现共振随穿效应使肖特基势垒在更大的程度上偏离了理想情况,而量子点的电子存储效应主要改变了肖特基势垒的有效势垒高度,从而影响了势垒的反向饱和电流密度 关键词： 自组装量子点 肖特基势垒 电流-电压特性     

Analysis of thermionic emission from electrodeposited Ni–Si Schottky barriers

Ni–Si Schottky barriers are fabricated by electrodeposition using n on n+ Si substrates. I–V, C–V and low temperature I–V measurements are presented. A high-quality Schottky barrier with extremely low reverse leakage current is revealed. The results are shown to fit an inhomogeneous barrier model for thermionic emission over a Schottky barrier proposed by Werner and Guttler [J.H. Werner, H.H. Guttler, Barrier inhomogeneities at Schottky contacts, J. Appl. Phys. 69 (3) (1991) 1522–1533]. A mean value of 0.76 V and a standard deviation of 66 mV is obtained for the Schottky barrier height at room temperature with a linear bias dependence. X-ray diffraction and scanning electron microscopy measurements reveal a polycrystalline Ni film with grains that span from the Ni–Si interface to the top of the Ni layer. The variation in Ni orientation is suggested as a possible source of the spatial distribution of the Schottky barrier height.     

Analysis of the electrical properties of p–n GaAs homojunction under dc and ac fields

In this work, the n-type GaAs films were grown on p-type GaAs single crystalline substrate by metal organic chemical vapor deposition (MOCVD). The temperature dependence of the current density–voltage (J–V) characteristics of n-GaAs/p-GaAs homojunction contacts were measured in the temperature range 293–413 K. These characteristics showed a rectifying behavior consistent with a potential barrier formed at the interface. The forward current density–voltage characteristics under low voltage biasing were explained on the basis of thermionic emission mechanism. The high values of ideality factor (n) may be ascribed to the presence of an interfacial layer. Analysis of the experimental data under the reverse voltage biasing suggests a dominant mechanism was found to be a Schottky effect. The impedance properties and the alternating current (ac) conductivity of n-GaAs/p-GaAs homojunction were investigated as a function of frequency and temperature. The ac conductivity was found to obey the universal power law. The variation of the exponent s with the temperature suggested that the conduction mechanism is an overlapping large-polaron tunneling (OLPT) model associated with correlated barrier hopping (CBH) model at the higher temperature.     

Scattering mechanisms of charge carriers in transparent conducting oxide films

Scattering mechanisms of charge carriers in Transparent Conducting Oxide (TCO) films have been analyzed theoretically. For the degenerate polycrystalline TCO films with relatively large crystallite sizes and high carrier concentrations (higher than 5 × 10¹⁸ cm^–3), the depletion layers between crystallites are very thin compared to the crystallite sizes, and the grain boundary scattering on electrical carriers makes a small contribution to limit the mobility of the films. Instead of thermionic emission current, a tunneling current dominates the electron transport over grain boundaries. The Petritz model which is based on thermionic emission and extensively quoted in literature should not be applicable. The main scattering mechanisms for the TCO films are ionized impurity scattering in the low-temperature range and lattice vibration scattering in the high-temperature range. The ionized impurity scattering mobility is independent of temperature and the mobility due to thermal lattice vibration scattering is inversely proportional to the temperature. The results obtained from Hall measurements on our ZnO, ITO, SnO₂ and SnO₂:F films prepared with various methods supports the analysis.     

Field electron emission from an aluminum oxide covered tungsten {112} plane at temperatures up to 1700°K

Field electron emission from an aluminum oxide mono-layer, face specifically adsorbed on a tungsten {112} plane, was measured between 1670°K and room temperature and at local field strength ranging from 17 MV/cm to 35 MV/cm. In a Fowler-Nordheim plot straight lines were obtained up to about 820°K. The work function at 650°K was determined to be 3.2 eV. The experimental values were compared with those determined by Christov's unified theory of field and thermionic emission. Deviations are attributed to the change in the shape of the potential barrier, which is caused by the aluminum oxide adsorption.     

Real-space transfer by hot electron resonant tunneling

Demonstrations of real-space transfer transistors have primarily shown real-space transfer current due to thermionic emission of heated channel electrons over low heterostructure barriers. In this paper we demonstrate real-space transfer of hot electrons due to resonant tunneling through multiple AlAs/GaAs/AlAs double barrier structures.     

Investigation of the inhomogeneous barrier height of an Au/Bi4Ti3O12/n-Si structure through Gaussian distribution of barrier height

<正>A Au/Bi₄Ti₃O₁₂/n-Si structure is fabricated in order to investigate its current-voltage（I-V） characteristics in a temperature range of 300 K-400 K.Obtained I-V data are evaluated by the thermionic emission（TE） theory.Zero-bias barrier height(Φ_B0) and ideality factor（n） calculated from I-V characteristics,are found to be temperature-dependent such thatΦ_B0 increases with temperature increasing,whereas n decreases.The obtained temperature dependence ofΦ_B0 and linearity inΦ_B0 versus the n plot,together with a lower barrier height and Richardson constant values obtained from the Richardson plot,indicate that the barrier height of the structure is inhomogeneous in nature.Therefore,I-V characteristics are explained on the basis of Gaussian distribution of barrier height.     

Investigation of inhomogeneous barrier height of Au/Bi4Ti3O12/n-Si structure through Gaussian distribution of barrier height

Au/Bi₄Ti₃O₁₂/n-Si structure is fabricated in order to investigate its current-voltage (I-V) characteristics in a temperature range of 300 K-400 K. Obtained I-V data are evaluated by thermionic emission (TE) theory. Zero-bias barrier height (Φ_B0) and ideality factor (n) calculated from I-V characteristics, are found to be temperature-dependent such that Φ_B0 increases with temperature increasing, whereas n decreases. Obtained temperature dependence of Φ_B0 and linearity in Φ_B0 versus n plot, together with lower barrier height and Richardson constant values obtained from Richardson plot, indicate that the barrier height of the structure is inhomogeneous in nature. Therefore, I-V characteristics are explained on the basis of Gaussian distribution of barrier height.