Epitaxial growth of a low-density framework form of crystalline silicon: a molecular-dynamics study

Crystal growth processes of low-density framework forms of crystalline silicon, named Si clathrates ( Si34 and Si46), during solid phase epitaxy (SPE) have been successfully observed in molecular-dynamics simulations using the Tersoff potential. The activation energy of SPE for Si34 has been found to correspond with the experimental value ( approximately 2.7 eV) for the cubic diamond phase, while the SPE rates of Si46 are much lower than that of Si34. The structural transition from Si46 to Si34 can be also observed during the Si46-[001] SPE. The present results suggest that new wide-gap Si semiconductors with clathrate structures can be prepared using epitaxial growth techniques.     

Heteroepitaxial GaN films on silicon substrates with porous buffer layers

New complex buffer layers based on a porous material have been developed for epitaxial growth of GaN films on Si substrates. The characteristics of gallium nitride heteroepitaxial layers grown on silicon substrates with new buffer layers by metal-organic vapor phase epitaxy are investigated. It is shown that the porous buffer layers improve the electric homogeneity and increase the photoluminescence intensity of epitaxial GaN films on Si substrates to the values comparable with those for reference GaN films on Al₂O₃ substrates. It is found that a fianite layer in a complex buffer is a barrier for silicon diffusion from the substrate into a GaN film.     

Thickness uniformity of silicon layers grown from a sublimation source by molecular-beam epitaxy

The thickness distributions of epitaxial layers over the substrate area are experimentally and theoretically studied for deposition from a molecular beam formed by a sublimation source in vacuum. The calculated data agree well with the experimental results for the molecular-beam epitaxy of silicon.     

The Epilift technique for Si solar cells

We present an overview of the Epilift technique, which allows the fabrication of single-crystal silicon films, suitable for photovoltaic purposes. Epitaxial layers are grown by liquid phase epitaxy on partially masked, single-crystal silicon substrates. The layers are detached from the substrate by selective chemical or electrochemical etching, allowing the substrate to be re-used. Epilayers grown on (100) substrates display highly textured surfaces as well as narrow overgrowth widths of the epitaxial layer over the oxide, making them particularly suitable for photovoltaic devices. Received: 1 March 1999 / Accepted: 28 March 1999 / Published online: 1 July 1999     

Molecular beam epitaxy of monotype CrSi2 on Si(111)

Low energy electron diffraction (LEED), angle-resolved ultraviolet (ARUPS), and X-ray (XPS) photoemission spectroscopy and work function measurements were used to investigate the growth of epitaxial CrSi₂ on a Si(111) surface. The CrSi₂layers ) (~ 100 Å) are formed by the MBE technique, in which Cr and Si are coevaporated in their stoichiometric ratio on the Si(111) substrate maintained at ~450°C. In comparison with the CrSi₂ epitaxy previously obtained by the SPE technique, where two kinds of CrSi₂ domains with equal formation probability are always observed, the epitaxial CrSi₂ layers obtained by the MBE technique essentially present one definite orientation characterized by CrSi₂(0001)∥Si(111) and CrSi₂[112̄0] ∥[112̄].     

Self-organization of germanium nanoislands obtained in silicon by molecular-beam epitaxy

Nanometer germanium islands in epitaxial layers of silicon are obtained by molecular-beam epitaxy. The dimensions and shapes of the islands are determined in an atomic-force microscope. The photoluminescence spectra are found to contain lines that can be interpreted as quasidirect optical transitions in the islands. It is concluded on the basis of optical and microprobe measurements and theoretical calculations of the energies of electronic states that silicon is dissolved in the germanium islands. Values of the germanium and silicon contents in the solid solution are presented. Pis’ma Zh. éksp. Teor. Fiz. 67, No. 1, 46–50 (10 January 1998)     

Mechanisms of dislocation generation in Si structures with strained layers: Intrinsic point defects in dislocation nucleation

The peculiarities of dislocation production in silicon compositions with elastically strained layers fabricated by the molecular-beam epitaxy technique (SiGe/Si heterostructures) and by direct bonding of Si(110)/Si(100) wafers are studied with transmission electron microscopy. The role of intrinsic point defects during the process of nucleation of misfit dislocations is explained. The surplus concentration of these defects in heterostructures was produced via low-temperature epitaxial growth of buffer layers or with ion implantation of elastically strained heterostructures. The model of “optimal” and “inverse” intrinsic point defects providing an explanation for the relaxation of misfit strains in heterostructures is proposed.     

Optical properties of bulk gallium nitride single crystals grown by chloride–hydride vapor-phase epitaxy

A gallium nitride crystal 5 mm in thickness was grown by chloride–hydride vapor-phase epitaxy on a sapphire substrate, from which the crystal separated during cooling. At an early stage, a three-dimensional growth mode was implemented, followed by a switch to a two-dimensional mode. Spectra of exciton reflection, exciton luminescence, and Raman scattering are studied in several regions characteristic of the sample. Analysis of these spectra and comparison with previously obtained data for thin epitaxial GaN layers with a wide range of silicon doping enabled conclusions about the quality of the crystal lattice in these characteristic regions.     

Synthesis of epitaxial silicon carbide films through the substitution of atoms in the silicon crystal lattice: A review

A review of recent advances in the field of epitaxial growth of SiC films on Si by means of a new method of epitaxial substitution of film atoms for substrate atoms has been presented. The basic statements of the theory of the new method used for synthesizing SiC on Si have been considered and extensive experimental data have been reported. The elastic energy relaxation mechanism implemented during the growth of epitaxial SiC films on Si by means of the new method of substitution of atoms has been described. This method consists in substituting a part of carbon atoms for silicon matrix atoms with the formation of silicon carbide molecules. It has been found experimentally that the substitution for matrix atoms occurs gradually without destroying the crystalline structure of the matrix. The orientation of the film is determined by the “old” crystalline structure of the initial silicon matrix rather than by the silicon substrate surface only, as is the case where conventional methods are used for growing the films. The new growth method has been compared with the classical mechanisms of thin film growth. The structure and composition of the grown SiC layers have been described in detail. A new mechanism of first-order phase transformations in solids with a chemical reaction through an intermediate state promoting the formation of a new-phase nuclei has been discussed. The mechanism providing the occurrence of a wide class of heterogeneous chemical reactions between the gas phase and a solid has been elucidated using the example of the chemical interaction of the CO gas with the single-crystal Si matrix. It has been shown that this mechanism makes it possible to grow a new type of templates, i.e., substrates with buffer transition layers for growing wide-band-gap semiconductor films on silicon. A number of heteroepitaxial films of wide-band-gap semiconductors, such as SiC, AlN, GaN, and AlGaN on silicon, whose quality is sufficient for the fabrication of a wide class of micro- and optoelectronic devices, have been grown on the SiC/Si substrate grown by solid-phase epitaxy.     

Heteroepitaxy of erbium-doped silicon layers on sapphire substrates

The possibility of using sublimation molecular-beam epitaxy as an efficient method for growing erbium-doped silicon layers on sapphire substrates for optoelectronic applications is analyzed. The advantage of this method is that the erbium-doped silicon layers can be grown at relatively low temperatures. The use of sublimation molecular-beam epitaxy makes it possible to grow silicon layers of good crystal quality. It is demonstrated that the growth temperature affects not only the structure of silicon-on-sapphire layers but also the crystallographic orientation of these layers. The electrical and luminescence properties of the erbium-doped silicon layers are discussed. It is revealed that structures of this type exhibit intense erbium photoluminescence at a wavelength of 1.54 μm.     

Epitaxial gallium oxide on a SiC/Si substrate

Well-textured gallium oxide β-Ga₂O₃ layers with a thickness of ~1 μm and a close to epitaxial layer structure were grown by the method of chloride vapor phase epitaxy on Si(111) wafers with a nano-SiC buffer layer. In order to improve the growth, a high-quality silicon carbide buffer layer ~100 nm thick was preliminarily synthesized by the substitution of atoms on the silicon surface. The β-Ga₂O₃ films were thoroughly investigated using reflection high-energy electron diffraction, ellipsometry, X-ray diffraction, scanning electron microscopy, and micro-Raman spectroscopy. The investigations revealed that the films are textured with a close to epitaxial structure and consist of a pure β-phase Ga₂O₃ with the (\(\overline 2 01\)) orientation. The dependence of the dielectric constant of epitaxial β-Ga₂O₃ on the photon energy ranging from 0.7 to 6.5 eV in the isotropic approximation was measured.     

Photoconductive response of GaAs epitaxial layers

In the present work the photoconductive response of low resistivity, n-type GaAs epitaxial layers is studied by experimentally monitoring the dependence of the photoconductive gain (PG) optoelectronic parameter upon incident photon flux and temperature. The characterized samples fall into three major categories: ion implanted (II) GaAs epilayers formed within undoped, semi-insulating GaAs substrates; GaAs epitaxial layers grown by liquid phase epitaxy (LPE) on Cr-doped, semi-insulating GaAs substrates; and ungated GaAs MESFETs.     

MBE growth of SiGe with high Ge content for optical applications

The molecular beam epitaxy is a powerful technology for integrating optoelectronic devices in standard Si microelectronics. The MBE growth of high speed germanium detectors is discussed. The necessary lattice accommodation between Si and Ge is realized by an ultra thin virtual substrate. Contact layers with very high doping concentration and very sharp transitions are grown with special doping strategies. As special growth method the differential epitaxy allows the growth of epitaxial layers in oxide windows.     

Evolution of epitaxial titanium silicide nanocrystals as a function of growth method and annealing treatments

Titanium silicide grows on silicon in a form of discontinuous layers, which is the most serious obstacle to the formation of high-quality epilayers for VLSI applications. At the same time, nanometric dimensions of the epitaxial silicide islands attract interest as quantum nanostructures. However, for this purpose, nanocrystals in a self-assembled array have to be defect-free, and exhibit high shape and size uniformity. In this work titanium silicide was grown on Si(1 1 1) substrates by reactive deposition epitaxy and by solid-phase epitaxy. Since the reaction and phase-formation kinetics depend on the growth method, accordingly different lattice matching and facet energies may result in different morphological shapes of the nanocrystals. Nanocrystals from reaction in a solid-state could be characterized as highly non-uniform in both shape and size, and their evolution due to post-deposition anneals increased that non-uniformity even further. Relaxation of epitaxial mismatch strain by misfit dislocations could be inferred from a gradual reduction of the nanocrystal vertical aspect ratio and development of flat top facets out of the initially sharp conical crests, in accord with generalized Wulf-Kaishew theorem. On the other hand, the silicide nanocrystals formed by reactive deposition exhibited high uniformity and thermal stability. Significant strain relaxation, as could be judged by the nanocrystal flattening, took place only at temperatures in excess of 650 °C, followed by progressive nanocrystal coalescence. It thus could be inferred, that better titanium silicide nanocrystal arrays (in the sense of uniformity and stability) are more easily obtained by reactive deposition epitaxy than by solid-phase epitaxy. While terminal, stable C54-TiSi₂ phase, did eventually form in the epilayers in both methods, different evolution pathways were manifested by different respective morphologies and orientations even in this final state.     

Quantum dot lasers and integrated optoelectronics on silicon platform Invited Paper

Chip-scale integration of optoelectronic devices such as lasers, waveguides, and modulators on silicon is prevailing as a promising approach to realize future ultrahigh speed optical interconnects. We review recent progress of the direct epitaxy and fabrication of quantum dot (QD) lasers and integrated guided-wave devices on silicon. This approach involves the development of molecular beam epitaxial growth of selforganized QD lasers directly on silicon substrates and their monolithic integration with amorphous silicon waveguides and quantum well electroabsorption modulators. Additionally, we report a preliminary study of long-wavelength (> 1.3 μm) QD lasers grown on silicon and integrated crystalline silicon waveguides using membrane transfer technology.     

Growth of single-crystalline GaN layers in a horizontal reactor by chloride epitaxy

Chloride epitaxy of GaN layers in a horizontal reactor is studied numerically. The steady 3D fluxes of the gas mixture in the reactor are simulated with allowance for heterogeneous reactions on the substrate (growth of epitaxial GaN layers) and on the reactor walls (growth of a polycrystalline GaN deposit). Experimental data on the growth rate distribution for polycrystalline and epitaxial GaN layers are explained. It is shown that, if the diameter of the reactor is not large enough, the growth of the deposit on the walls makes the GaN growth rate distribution over the substrate more nonuniform due to the parasitic diffusion of reagents from the gas phase to the reactor walls.     

Silicon-germanium nanostructures with high germanium concentration

The impact of nucleation conditions on the quality of epitaxial layers of germanium and GeSi alloys containing a high Ge mole fraction grown on (100) silicon substrates using electron-beam epitaxy is considered. The Ge_xS_{1 -x}/Ge superlattices are grown on a Ge_ySi_{1 -y} (x > y) relaxed buffer layer. X-ray diffractometry, atomic force microscopy and Auger spectroscopy are the main techniques used to study the properties of the grown structures.     

Liquid epitaxy growth of InP layers

This paper is concerned with the investigation of the process of liquid epitaxy of indium phosphide. The growth of epitaxial InP layers on (100), (111)In and (111) P oriented substrates is studied. It is shown that layers with best surface morphology are obtained on (111)In and (100) faces. The electrical parameteus of the nondoped material are preferable in layers grown on (111) In. It is shown that growth from supercooled solutions-melts leads to a considerable reduction in the thickness of the layers, an improvement in the quality of the epitaxial layer (EL) surface, and a rise in their reproducibility.Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 7, pp. 20–23, July, 1985.     

Properties of graded group IIa fluoride buffer layers for semiconductor heteroepitaxy

Composition graded epitaxial CaF₂-SrF₂-BaF₂ stacks with up to 14% lattice mismatch have been grown onto Si(111) by molecular beam epitaxy (MBE). Despite large lattice- and thermal expansion mismatch, the fluoride layers exhibit specular surfaces, are untwinned, and the minimum ion channeling yield is nearly as low as in bulk material. A unique feature is their ability to relax mechanical stress due to lattice- and thermal expansion mismatch even near room temperature in a nonthermal manner. They were applied as buffer layers to grow device-quality epitaxial lead chalcogenides and CdTe on Si, and may find further applications as epitaxial buffers for still other combinations of semiconductor materials with lattice mismatches of up to 20%.     

Study of the features of BaF<Subscript>2</Subscript> heteroepitaxy on CaF<Subscript>2</Subscript>/Si(100) layers obtained in the high-temperature growth mode

The surface morphology of BaF₂ epitaxial films grown by MBE (molecular beam epitaxy) in various modes on the surface of CaF₂/Si(100) is investigated by AFM. The CaF₂ layers on Si(100) are obtained in the high-temperature growth mode (Т _S = 750°C). It is shown that the epitaxy of BaF2 at a temperature of 600°C at the initial stage of growth leads to the formation of defects such as perforations in the epitaxial film, while epitaxy at a temperature of 750°C provides a defect-free film with a surface morphology suitable for the subsequent growth of semiconductors of IV–VI type and solid solutions based on them.