基于辛Runge-Kutta方法的棋盘形褶皱二维薄膜-基底结构动力学特性研究

基于力学屈曲原理的褶皱薄膜-基底结构已成功应用于制备可延展无机电子器件。然而,该类电子器件在应用时需要服役于复杂动态环境中,针对棋盘形褶皱薄膜结构的动力学问题鲜有研究,此问题又是该类电子器件走向实际应用需要解决的关键问题之一。本文首先采用能量方法,分别计算了二维薄膜的弯曲能、膜弹性能和柔性基底中的弹性能以及薄膜动能;然后采用拉格朗日方程,推导出了该结构的振动控制方程;而该方程为非线性动力学方程,无法给出其解析解;因此,本文采用辛Runge-Kutta方法对其进行数值求解;数值结果表明,辛数值方法具有长期稳定的特性和系统结构特性,为高精度的可延展电子器件的动力学问题研究提供了优异的数值方法。     

三维波纹型可延展结构振动特性的辛分析

基于三维组装技术的可延展结构具备优异的延展性和可调控性,使其成功应用于各类可延展电子器件的制备中。为了评估该类电子器件的稳定性,本文研究三维波纹型可延展结构的振动行为。首先,基于非线性的Euler-Bernoulli梁理论、Kelvin-Voigt粘弹性理论和考虑压电材料的表面压电效应,建立三维波纹结构的理论分析模型;其次,基于能量原理和扩展拉格朗日运动原理,推导出该结构的动力学控制方程;然后采用二级四阶辛Runge-Kutta求解该动力学方程。通过数值仿真实验验证了辛算法的优越性,同时,还发现随着三维波纹型可延展结构外界激励及其结构参数的变化,该结构的振动特性会从倍周期向分岔和混沌转化;本文结果为三维波纹型可延展结构的优化设计及应用提供理论基础。     

聚硅氧烷硅胶的黏超弹性力学行为研究

聚硅氧烷硅胶是一类以Si——O键为主链、硅原子上直接连接有机基团的无色透明高分子聚合物, 因其具有优异的超弹性性能而广泛应用于精密减震结构、柔性电子器件等领域. 在聚硅氧烷硅胶减震结构和柔性电子器件的设计中, 材料在大变形和动态加载下的黏超弹性力学行为的精确描述至关重要. 本文针对该问题进行了系统的研究:首先, 将该硅胶的超弹性和黏弹性行为进行解耦, 确定其黏超弹性本构方程的基本框架;其次, 基于单轴拉压、平面拉伸试验确定其准静态超弹性模型的各项参数;再次, 利用霍普金森压杆冲击试验确定其黏弹性模型的各项参数;在此基础上, 将超弹性和黏弹性模型合并为适用于大应变和大应变率的黏超弹性动态本构模型;最后, 利用落锤冲击试验对该硅胶薄片的冲击变形行为进行了研究, 并利用上述建立的动态本构模型对落锤冲击过程进行了有限元模拟. 结果表明:本文建立的黏超弹性本构模型可有效预测该硅胶在冲击载荷下的力学行为, 从而为聚硅氧烷硅胶减震结构和柔性电子器件的优化设计提供了理论和应用基础.      

柔性电子器件的应用、结构、力学及展望

新的结构布局在延展性要求极高的器件中具有很大的应用潜力, 而使用较成熟的刚性技术制成的器件很难达到延展性要求. 将柔性技术应用到刚性电路中产生具有相同性能且能拉伸、压缩和弯曲的柔性集成电路, 这在健康监测器和表皮电子系统等领域具有重要的应用. 优化柔性电路结构, 研究其力学性能能提高系统的延展性. 本文对这些系统的应用、柔性电路的结构布局、力学行为进行总结概述. 最后, 就柔性电子器件未来研究的方向提出几点观点.     

聚硅氧烷硅胶的黏超弹性力学行为研究

聚硅氧烷硅胶是一类以Si—O键为主链、硅原子上直接连接有机基团的无色透明高分子聚合物,因其具有优异的超弹性性能而广泛应用于精密减震结构、柔性电子器件等领域.在聚硅氧烷硅胶减震结构和柔性电子器件的设计中,材料在大变形和动态加载下的黏超弹性力学行为的精确描述至关重要.本文针对该问题进行了系统的研究:首先,将该硅胶的超弹性和黏弹性行为进行解耦,确定其黏超弹性本构方程的基本框架;其次,基于单轴拉压、平面拉伸试验确定其准静态超弹性模型的各项参数;再次,利用霍普金森压杆冲击试验确定其黏弹性模型的各项参数;在此基础上,将超弹性和黏弹性模型合并为适用于大应变和大应变率的黏超弹性动态本构模型;最后,利用落锤冲击试验对该硅胶薄片的冲击变形行为进行了研究,并利用上述建立的动态本构模型对落锤冲击过程进行了有限元模拟.结果表明:本文建立的黏超弹性本构模型可有效预测该硅胶在冲击载荷下的力学行为,从而为聚硅氧烷硅胶减震结构和柔性电子器件的优化设计提供了理论和应用基础.     

LNG耐超低温柔性管道研究进展综述

LNG (液化天然气)耐超低温柔性管道是开采、运输、存储LNG过程中的关键装备之一, 被誉为是LNG外输系统的“血管”. 近年来, 随着LNG的开发逐渐由近海走向深远海, 耐超低温柔性管道作为LNG外输系统中的核心输运装备迎来了更加广阔的发展前景, 同时也面临着由更加严苛的海洋环境带来的结构失效的挑战. 本文针对LNG耐超低温柔性管道的工程应用背景、结构设计、内流分析等方面进行了调研与综述, 总结了LNG耐超低温柔性管道上述各项技术的研究进展. 分析了LNG耐超低温柔性管道的波纹管状结构、螺旋缠绕结构和高分子材料的柔顺性结构特征的力学机理, 总结了实现柔顺性结构的方法, 梳理了LNG耐超低温柔性管道管内流体计算分析的规律, 并对LNG耐超低温柔性管道相关技术的未来研究热点提出了展望. 我国在LNG耐超低温柔性管道相关技术的研究工作中起步相对较晚, 突破LNG耐超低温柔性管道的结构设计分析与工业应用中的关键力学问题, 实现LNG耐超低温柔性管道的国产化研制, 对于实现我国深远海天然气资源开发的“卡脖子”技术的自主可控, 助力“碳达峰”国家战略目标的实现具有重要意义.      

智柔超材料及其力学性能的研究进展

力学超材料(或超结构)因其独特的微观结构设计而展现超常的物理和力学特性.将力学超材料设计思想与智能柔性(简称智柔)材料相结合,可以制备出具有自感知和自驱动功能的智柔力学超材料(简称智柔超材料).本文对近年来智柔超材料的研究现状和进展进行了评述,分析了此类材料的基本设计思想、变形机理及力学特性,重点关注了基于形状记忆聚合物和水凝胶智柔超材料的设计原理和性能分析方法;阐释了先进制造技术为智柔超材料发展带来的机遇,并讨论了此类材料在设计和开发方面面临的关键问题以及未来发展趋势.     

温度场下岛-桥结构屈曲薄膜的动力学分析

基于岛-桥结构的柔性电子器件已被用于健康监测和皮肤电子等领域。但是柔性电子器件在工作中极易受工作温度变化等激励产生振动,进而影响器件的灵敏度与可靠性。因此本文研究在温度场作用下岛-桥结构屈曲薄膜的动力学问题。首先,基于Euler-Bernoulli梁理论,建立温度场作用下岛-桥结构屈曲薄膜的动力学控制方程。其次,通过引入新变量,将原动力学方程引入Hamilton体系中,得到相应的Hamilton正则方程。随后,采用辛Runge-Kutta方法求解该Hamilton正则方程,并与经典Runge-Kutta方法对比,数值结果显示了辛算法在求解非线性动力学方程时高精度、高数值稳定性的优势,进一步讨论了温度变化量、预应变、阻尼系数等对屈曲薄膜动力学响应的影响。本文研究为柔性电子器件动力学设计提供了理论参考。     

柔性电子封装结构中夹杂对延展性的影响分析

以岛-桥型柔性电子封装结构为研究对象,从封装材料中夹杂的刚度、位置、封装方式三个方面探讨了夹杂对柔性电子结构延展性的影响。有限元分析结果表明:随着夹杂刚度的增大,桥的最大主应变增大,整体结构最大延伸量可减小30%;夹杂埋藏位置越深,桥顶局部的整体应变水平越大,最大延伸量可减小20%;相对"硬"封装情形,相同的夹杂对"软"封装中桥的最大延伸量的影响更严重。本文所得结论对于柔性电子器件结构的设计和材料选用具有参考和指导意义。     

高精度石英振梁加速度计挠性支承设计研究

分析了石英振梁加速度计的工作原理和结构设计,确定出挠性支承的结构形式.根据力学原理给出了挠性支承的设计计算公式,并依据挠性支承的结构设计原则,确定了加速度计基本结构参数.利用有限元分析软件对该加速度计建模并进行整体的位移分布、应力特性等有限元力学分析,软件仿真结果与理论计算的摆片端部位移相差小于3%,支承在极限范围内不会断裂,证明了所建立的支承力学模型正确,这为优化结构设计提供了理论依据和方法.     

A theoretical model of reversible adhesion in shape memory surface relief structures and its application in transfer printing

Transfer printing is an important and versatile tool for deterministic assembly and integration of micro/nanomaterials on unusual substrates, with promising applications in fabrication of stretchable and flexible electronics. The shape memory polymers (SMP) with triangular surface relief structures are introduced to achieve large, reversible adhesion, thereby with potential applications in temperature-controlled transfer printing. An analytic model is established, and it identifies two mechanisms to increase the adhesion: (1) transition of contact mode from the triangular to trapezoidal configurations, and (2) explicit enhancement in the contact area. The surface relief structures are optimized to achieve reversible adhesion and transfer printing. The theoretical model and results presented can be exploited as design guidelines for future applications of SMP in reversible adhesion and stretchable electronics.     

Finite width effect of thin-films buckling on compliant substrate: Experimental and theoretical studies

Buckling of stiff thin films on compliant substrates has many important applications ranging from stretchable electronics to precision metrology and sensors. Mechanics plays an indispensable role in the fundamental understanding of such systems. Some existing mechanics models assume plane-strain deformation, which do not agree with experimental observations for narrow thin films. Systematic experimental and analytical studies are presented in this paper for finite-width stiff thin films buckling on compliant substrates. Both experiments and analytical solution show that the buckling amplitude and wavelength increase with the film width. The analytical solution agrees very well with experiments and therefore provides valuable guide to the precise design and control of the buckling profile in many applications. The effect of film spacing is studied via the analytical solutions for two thin films and for periodic thin films.     

Mechanics of bioinspired imaging systems

Imaging systems in nature have attracted a lot of research interest due to their superior optical and imaging characteristics. Recent advancements in materials science, mechanics, and stretchable electronics have led to successful development of bioinspired cameras that resemble the structures and functions of biological light-sensing organs. In this review, we discuss some recent progresses in mechanics of bioinspired imaging systems, including tunable hemispherical eyeball camera and artificial compound eye camera. The mechanics models and results reviewed in this article can provide efficient tools for design and optimization of such systems, as well as other related optoelectronic systems that combine rigid elements with soft substrates.     

Controlled buckling of thin film on elastomeric substrate in large deformation

Electronic systems with large stretchability have many applications. A precisely controlled buckling strategy to increase the stretchability has been demonstrated by combining lithographically patterned surface bonding chemistry and a buckling process. The buckled geometry was assumed to have a sinusoidal form, which may result in errors to determine the strains in the film. A theoretical model is presented in this letter to study the mechanics of this type of thin film/substrate system by discarding the assumption of sinusoidal buckling geometry. It is shown that the previous model overestimates the deflection and curvature in the thin film. The results from the model agree well with finite element simulations and therefore provide design guidelines in many applications ranging from stretchable electronics to micro/nano scale surface patterning and precision metrology.     

Buckling of a stiff thin film on a pre-strained bi-layer substrate

Controlled buckling can impart stretchable mechanics to brittle materials when integrated as thin films on soft, elastomeric substrates. Typical elastomers are permeable to fluids, however, and therefor unable to provide robust barriers to entry of water, for instance, into devices built with the supported thin films. In addition, the mechanical strength of a system dominated by a soft substrate is often unsatisfactory for realistic applications. We show that introduction of a bi-layer substrate yields a robust, high strength system that maintains stretchable characteristics, with a soft layer on top of a relatively stiff layer in the substrate. As a mechanical protection, a soft encapsulation layer can be used on top of the device and the stretchability of the encapsulated system is smaller than that of the system without encapsulation. A simple, analytic model, validated by numerical analysis and FEA, is established for stiff thin films on a bi-layer substrate, and is useful to the design of stretchable systems.     

Switchable dry adhesive based on shape memory polymer with hemispherical indenters for transfer printing

Transfer printing based on switchable adhesive is essential for developing unconventional systems, including flexible electronics, stretchable electronics, and micro light-emitting diode (LED) displays. Here we report a design of switchable dry adhesive based on shape memory polymer (SMP) with hemispherical indenters, which offers a continuously tunable and reversible adhesion through the combination of the preloading effect and the thermal actuation of SMP. Experimental and numerical studies reveal the fundamental aspects of design, fabrication, and operation of the switchable dry adhesive. Demonstrations of this adhesive concept in transfer printing of flat objects (e.g., silicon wafers), three-dimensional (3D) objects (e.g., stainless steel balls), and rough objects (e.g., frosted glasses) in two-dimensional (2D) or 3D layouts illustrate its unusual manipulation capabilities in heterogeneous material integration applications.     

Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates

The precisely controlled buckling of stiff thin films (e.g., Si or GaAs nano ribbons) on the patterned surface of elastomeric substrate (e.g., poly(dimethylsiloxane) (PDMS)) with periodic inactivated and activated regions was designed by Sun et al. [Sun, Y., Choi, W.M., Jiang, H., Huang, Y.Y., Rogers, J.A., 2006. Controlled buckling of semiconductor nanoribbons for stretchable electronics. Nature Nanotechnology 1, 201–207] for important applications of stretchable electronics. We have developed a post-buckling model based on the energy method for the precisely controlled buckling to study the system stretchability. The results agree with Sun et al.’s (2006) experiments without any parameter fitting, and the system can reach 120% stretchability.     

Reprint of “Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates” [In. J. Solids Struct. 45 (2008) 2014–2023]

The precisely controlled buckling of stiff thin films (e.g., Si or GaAs nano ribbons) on the patterned surface of elastomeric substrate (e.g., poly(dimethylsiloxane) (PDMS)) with periodic inactivated and activated regions was designed by Sun et al. [Sun, Y., Choi, W.M., Jiang, H., Huang, Y.Y., Rogers, J.A., 2006. Controlled buckling of semiconductor nanoribbons for stretchable electronics. Nature Nanotechnology 1, 201–207] for important applications of stretchable electronics. We have developed a post-buckling model based on the energy method for the precisely controlled buckling to study the system stretchability. The results agree with Sun et al.’s (2006) experiments without any parameter fitting, and the system can reach 120% stretchability.